| Patent | Date |
|---|
High Pressure Rf-dc Sputtering And Methods To Improve Film Uniformity And Step-coverage Of This Process
App 20200357616 - ALLEN; Adolph Miller ; et al. | 2020-11-12 |
High pressure RF-DC sputtering and methods to improve film uniformity and step-coverage of this process
Grant 10,763,090 - Allen , et al. Sep | 2020-09-01 |
Process kit with plasma-limiting gap
Grant 9,695,502 - Ritchie , et al. July 4, 2 | 2017-07-04 |
Pre-coated Shield Using In Vhf-rf Pvd Chambers
App 20170145553 - LIU; Zhendong ; et al. | 2017-05-25 |
High Pressure Rf-dc Sputtering And Methods To Improve Film Uniformity And Step-coverage Of This Process
App 20170029941 - ALLEN; Adolph Miller ; et al. | 2017-02-02 |
PVD target for self-centering process shield
Grant 9,534,286 - Yoshidome , et al. January 3, 2 | 2017-01-03 |
Pinned target design for RF capacitive coupled plasma
Grant 9,404,174 - Young , et al. August 2, 2 | 2016-08-02 |
Process kit shield for plasma enhanced processing chamber
Grant 9,343,274 - Rasheed , et al. May 17, 2 | 2016-05-17 |
Substrate support with radio frequency (RF) return path
Grant 9,340,866 - Ritchie , et al. May 17, 2 | 2016-05-17 |
Substrate processing system with mechanically floating target assembly
Grant 9,303,311 - Young , et al. April 5, 2 | 2016-04-05 |
Substrate processing system having symmetric RF distribution and return paths
Grant 9,255,322 - Young , et al. February 9, 2 | 2016-02-09 |
Process kit for RF physical vapor deposition
Grant 9,123,511 - Young , et al. September 1, 2 | 2015-09-01 |
Pvd Target For Self-centering Process Shield
App 20140261180 - YOSHIDOME; GOICHI ; et al. | 2014-09-18 |
Apparatus for physical vapor deposition having centrally fed RF energy
Grant 8,795,488 - Rasheed , et al. August 5, 2 | 2014-08-05 |
Process kit components for titanium sputtering chamber
Grant 8,790,499 - Young , et al. July 29, 2 | 2014-07-29 |
Process Kit Shield For Plasma Enhanced Processing Chamber
App 20140158049 - RASHEED; MUHAMMAD ; et al. | 2014-06-12 |
Apparatus for enabling concentricity of plasma dark space
Grant 8,702,918 - Ritchie , et al. April 22, 2 | 2014-04-22 |
Process kit for RF physical vapor deposition
Grant 8,668,815 - Young , et al. March 11, 2 | 2014-03-11 |
Process kit shield for plasma enhanced processing chamber
Grant 8,647,485 - Rasheed , et al. February 11, 2 | 2014-02-11 |
Target for sputtering chamber
Grant 8,647,484 - Ritchie , et al. February 11, 2 | 2014-02-11 |
Substrate Processing System With Mechanically Floating Target Assembly
App 20130256125 - YOUNG; DONNY ; et al. | 2013-10-03 |
Process Kit With Plasma-limiting Gap
App 20130256128 - RITCHIE; ALAN ; et al. | 2013-10-03 |
Process Kit Shield For Plasma Enhanced Processing Chamber
App 20130255576 - RASHEED; MUHAMMAD ; et al. | 2013-10-03 |
Substrate Processing System Having Symmetric Rf Distribution And Return Paths
App 20130256127 - YOUNG; DONNY ; et al. | 2013-10-03 |
Substrate Support With Radio Frequency (rf) Return Path
App 20130256126 - RITCHIE; ALAN ; et al. | 2013-10-03 |
Pinned Target Design For Rf Capacitive Coupled Plasma
App 20130186751 - YOUNG; DONNY ; et al. | 2013-07-25 |
Apparatus For Enabling Concentricity Of Plasma Dark Space
App 20130153412 - RITCHIE; ALAN ; et al. | 2013-06-20 |
Process Kit For Rf Physical Vapor Deposition
App 20120205241 - Young; Donny ; et al. | 2012-08-16 |
Apparatus For Physical Vapor Deposition Having Centrally Fed Rf Energy
App 20110240464 - RASHEED; MUHAMMAD ; et al. | 2011-10-06 |
Physical Vapor Deposition With A Variable Capacitive Tuner and Feedback Circuit
App 20110209995 - Rasheed; Muhammad M. ; et al. | 2011-09-01 |
High Pressure Rf-dc Sputtering And Methods To Improve Film Uniformity And Step-coverage Of This Process
App 20100252417 - Allen; Adolph Miller ; et al. | 2010-10-07 |
Mechanism for varying the spacing between sputter magnetron and target
Grant 7,674,360 - Hong , et al. March 9, 2 | 2010-03-09 |
Process Kit For Rf Physical Vapor Deposition
App 20090272647 - Young; Donny ; et al. | 2009-11-05 |
Magnet secured in a two part shell
Grant 7,561,015 - Vesci , et al. July 14, 2 | 2009-07-14 |
Target For Sputtering Chamber
App 20070170052 - Ritchie; Alan Alexander ; et al. | 2007-07-26 |
Process Kit Components For Titanium Sputtering Chamber
App 20070173059 - Young; Donny ; et al. | 2007-07-26 |
Sputtering Target For Titanium Sputtering Chamber
App 20070125646 - Young; Donny ; et al. | 2007-06-07 |
Mechanism for varying the spacing between sputter magnetron and target
App 20050133365 - Hong, Ilyoung Richard ; et al. | 2005-06-23 |
Magnet secured in a two part shell
App 20050116392 - Vesci, Anthony ; et al. | 2005-06-02 |
High temperature DC chucking and RF biasing cable with high voltage isolation for biasable electrostatic chuck applications
Grant 6,875,927 - Brown , et al. April 5, 2 | 2005-04-05 |
High temperature DC chucking and RF biasing cable with high voltage isolation for biasable electrostatic chuck applications
App 20030169553 - Brown, Karl ; et al. | 2003-09-11 |
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