Yoo; Do Jae
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yoo; Do Jae.The latest application filed is for "image sensor package".
Company Profile
5.35.53
- Yoo; Do Jae - Suwon-si KR
- Yoo; Do Jae - Suwon KR
- Yoo; Do Jae - Gyunggi-do N/A KR
- Yoo; Do-Jae - Gyeonggi-do KR
- Yoo; Do-Jae - Seoul KR
Patent Activity
| Patent | Date |
|---|---|
| Image sensor package including reflector Grant 11,387,270 - Yoo , et al. July 12, 2 | 2022-07-12 |
| Image Sensor Package App 20200395396 - YOO; Do Jae ; et al. | 2020-12-17 |
| Image Sensor Package App 20200350351 - YOO; Do Jae ; et al. | 2020-11-05 |
| Manufacturing method of an electronic component module Grant 10,667,419 - Yoo , et al. | 2020-05-26 |
| Electronic device module and method of manufacturing the same Grant 10,356,911 - Yoo , et al. July 16, 2 | 2019-07-16 |
| Electronic device module and manufacturing method thereof Grant 10,219,380 - Yoo , et al. Feb | 2019-02-26 |
| Semiconductor package with improved signal stability and method of manufacturing the same Grant 10,163,746 - Ryu , et al. Dec | 2018-12-25 |
| Double-sided package module and substrate strip Grant 10,109,595 - Yoo , et al. October 23, 2 | 2018-10-23 |
| Electronic Component Module And Manufacturing Method Thereof App 20180110147 - YOO; Do Jae ; et al. | 2018-04-19 |
| Electronic component module and manufacturing method thereof Grant 9,894,790 - Yoo , et al. February 13, 2 | 2018-02-13 |
| Package And Method Of Manufacturing The Same App 20170301632 - YOO; Do Jae ; et al. | 2017-10-19 |
| Package and method of manufacturing the same Grant 9,748,179 - Yoo , et al. August 29, 2 | 2017-08-29 |
| Double-sided Package Module And Substrate Strip App 20170221835 - YOO; Do Jae ; et al. | 2017-08-03 |
| Electronic device module and manufacturing method thereof Grant 9,633,923 - Yoo , et al. April 25, 2 | 2017-04-25 |
| Electronic component module and manufacturing method thereof Grant 9,585,260 - Lim , et al. February 28, 2 | 2017-02-28 |
| Semiconductor Package Including An Antenna Formed In A Groove Within A Sealing Element App 20170018513 - YOO; Do Jae ; et al. | 2017-01-19 |
| Semiconductor package and method of manufacturing the same Grant 9,508,565 - Lim , et al. November 29, 2 | 2016-11-29 |
| Semiconductor package including an antenna formed in a groove within a sealing element Grant 9,496,219 - Yoo , et al. November 15, 2 | 2016-11-15 |
| Semiconductor Package And Method Of Manufacturing The Same App 20160315027 - RYU; Jong In ; et al. | 2016-10-27 |
| Semiconductor package and method of manufacturing the same Grant 9,343,391 - Oh , et al. May 17, 2 | 2016-05-17 |
| Semiconductor Device Package With Integrated Antenna For Wireless Applications App 20160126200 - HAN; Myeong Woo ; et al. | 2016-05-05 |
| Semiconductor Package And Method Of Manufacturing The Same App 20160035678 - YOO; Do Jae ; et al. | 2016-02-04 |
| Semiconductor device package with integrated antenna for wireless applications Grant 9,245,858 - Han , et al. January 26, 2 | 2016-01-26 |
| Semiconductor Package And Method Of Manufacturing The Same App 20160020171 - LIM; Jae Hyun ; et al. | 2016-01-21 |
| Electric Device Module And Method Of Manufacturing The Same App 20160021737 - OH; Kyu Hwan ; et al. | 2016-01-21 |
| Electronic Device Module And Method Of Manufacturing The Same App 20160007463 - YOO; Do Jae ; et al. | 2016-01-07 |
| Semiconductor package with a conductive shielding member Grant 9,209,101 - Yoo , et al. December 8, 2 | 2015-12-08 |
| Power module package with a fastening unit including a non-conductive portion Grant 9,209,114 - Yoo , et al. December 8, 2 | 2015-12-08 |
| Power module package and method for manufacturing the same Grant 9,202,798 - Yoo , et al. December 1, 2 | 2015-12-01 |
| Electronic Device Module And Manufacturing Method Thereof App 20150289392 - YOO; Do Jae ; et al. | 2015-10-08 |
| Unit power module and power module package comprising the same Grant 9,123,683 - Kim , et al. September 1, 2 | 2015-09-01 |
| Semiconductor Package And Method Of Manufacturing The Same App 20150228625 - Lim; Jae Hyun ; et al. | 2015-08-13 |
| Power module package Grant 9,105,601 - Kim , et al. August 11, 2 | 2015-08-11 |
| Electronic Component Module And Manufacturing Method Thereof App 20150223361 - LIM; Jae Hyun ; et al. | 2015-08-06 |
| Power module package Grant 9,076,660 - Kim , et al. July 7, 2 | 2015-07-07 |
| Semiconductor Package Module App 20150181708 - Ryu; Jong In ; et al. | 2015-06-25 |
| Semiconductor package and method of manufacturing the semiconductor package Grant 9,048,199 - Yoo , et al. June 2, 2 | 2015-06-02 |
| Electronic Component Module App 20150136451 - PARK; Heung Woo ; et al. | 2015-05-21 |
| Semiconductor Package And Method Of Manufacturing The Same App 20150137339 - OH; Kyu Hwan ; et al. | 2015-05-21 |
| Electronic Component Module And Manufacturing Method Thereof App 20150131235 - YOO; Do Jae ; et al. | 2015-05-14 |
| Electronic Component Module And Manufacturing Method Thereof App 20150131231 - YOO; Do Jae ; et al. | 2015-05-14 |
| Heat dissipation system for power module Grant 9,030,823 - Kim , et al. May 12, 2 | 2015-05-12 |
| Semiconductor Package App 20150115443 - OH; Kyu Hwan ; et al. | 2015-04-30 |
| Power Semiconductor Package App 20150091146 - Oh; Kyu Hwan ; et al. | 2015-04-02 |
| Electronic Device Module And Manufacturing Method Thereof App 20150062829 - YOO; Do Jae ; et al. | 2015-03-05 |
| Semiconductor Package, Method Of Manufacturing Semiconductor Package And Stack Type Semiconductor Package App 20150054173 - KIM; Tae Hyun ; et al. | 2015-02-26 |
| Electronic Component Package App 20140313676 - KANG; Joon-Seok ; et al. | 2014-10-23 |
| Power Module Package And Method For Manufacturing The Same App 20140220743 - Yoo; Do Jae ; et al. | 2014-08-07 |
| Electronic component package and manufacturing method thereof Grant 8,779,580 - Kang , et al. July 15, 2 | 2014-07-15 |
| Terminal pin Grant D708,578 - Yoo , et al. July 8, 2 | 2014-07-08 |
| Terminal pin Grant D708,139 - Yoo , et al. July 1, 2 | 2014-07-01 |
| Power Module Package App 20140167239 - Kim; Tae Hyun ; et al. | 2014-06-19 |
| Power Module Package App 20140167237 - Yoo; Do Jae ; et al. | 2014-06-19 |
| Power Module Package App 20140167242 - Kim; Tae Hyun ; et al. | 2014-06-19 |
| Semiconductor package Grant 8,736,031 - Lee , et al. May 27, 2 | 2014-05-27 |
| Unit Power Module And Power Module Package Comprising The Same App 20140117408 - Kim; Tae Hyun ; et al. | 2014-05-01 |
| Power Module Package App 20140110833 - Yoo; Do Jae ; et al. | 2014-04-24 |
| Power Package Module And Manufacturing Method Thereof App 20140029201 - YANG; Si Joong ; et al. | 2014-01-30 |
| Power Module Package And Method For Manufacturing The Same App 20140003013 - Yoo; Do Jae ; et al. | 2014-01-02 |
| Power Module Package And Method For Manufacturing The Same App 20140001619 - Yoo; Do Jae ; et al. | 2014-01-02 |
| Heat Dissipation System For Power Module App 20130343002 - Kim; Kwang Soo ; et al. | 2013-12-26 |
| Semiconductor Package App 20130292809 - YOO; Do Jae ; et al. | 2013-11-07 |
| Method Of Manufacturing Semiconductor Package App 20130217181 - YOO; Do Jae ; et al. | 2013-08-22 |
| Semiconductor Package And Method Of Manufacturing The Semiconductor Package App 20130045574 - YOO; Do-Jae ; et al. | 2013-02-21 |
| Semiconductor Package And Method Of Manufacturing The Same App 20130015544 - HAN; Myeong Woo ; et al. | 2013-01-17 |
| Semiconductor package App 20130015563 - Lee; Jung Aun ; et al. | 2013-01-17 |
| Semiconductor package and method of manufacturing the same App 20130009320 - Yoo; Do Jae ; et al. | 2013-01-10 |
| Semiconductor Package And Method Of Manufacturing The Semiconductor Package App 20110298102 - Yoo; Do-Jae ; et al. | 2011-12-08 |
| Semiconductor Package And Method Of Manufacturing The Semiconductor Package App 20110298103 - YOO; Do-Jae ; et al. | 2011-12-08 |
| Method for manufacturing a semiconductor package Grant 8,017,437 - Yoo , et al. September 13, 2 | 2011-09-13 |
| Semiconductor package Grant 7,875,983 - Yoo , et al. January 25, 2 | 2011-01-25 |
| Method of manufacturing a semiconductor package Grant 7,875,497 - Yoo , et al. January 25, 2 | 2011-01-25 |
| Power Semiconductor Module App 20100295172 - Gao; Shan ; et al. | 2010-11-25 |
| Semiconductor package App 20100084754 - Yoo; Do-Jae ; et al. | 2010-04-08 |
| Method for manufacturing a semiconductor package App 20100087035 - Yoo; Do-Jae ; et al. | 2010-04-08 |
| Method of manufacturing a semicondictor package App 20100087034 - Yoo; Do-Jae ; et al. | 2010-04-08 |
| Semiconductor package and method for manufacturing thereof Grant 7,642,656 - Yoo , et al. January 5, 2 | 2010-01-05 |
| Semiconductor package and method for manufacturing thereof App 20080308950 - Yoo; Do Jae ; et al. | 2008-12-18 |
| Electronic component package and manufacturing method thereof App 20080212288 - Kang; Joon-Seok ; et al. | 2008-09-04 |
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