YOKOYAMA; Toshiyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for YOKOYAMA; Toshiyuki.The latest application filed is for "focus control device, imaging device, and focus control method".

Company Profile

0.17.29

YOKOYAMA; Toshiyuki - Ibaraki JP
Yokoyama; Toshiyuki - Yokohama JP
YOKOYAMA; Toshiyuki - Hitachi-shi JP
Yokoyama; Toshiyuki - Hitachinaka N/A JP
Yokoyama; Toshiyuki - Mitaka JP
Yokoyama; Toshiyuki - Tokyo JP
Yokoyama; Toshiyuki - Koto-Ku JP
Yokoyama; Toshiyuki - Kyoto JP
Yokoyama; Toshiyuki - Saitama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Focus Control Device, Imaging Device, And Focus Control Method App 20170276902 - UMEZAWA; Iori ; et al.	2017-09-28
Imaging apparatus, imaging method, and focus control apparatus Grant 9,426,352 - Nishiguchi , et al. August 23, 2	2016-08-23
Focus Control Device And Method And Imaging Apparatus App 20160173756 - UMEZAWA; Iori ; et al.	2016-06-16
Imaging Apparatus, Imaging Method, And Focus Control Apparatus App 20150215518 - NISHIGUCHI; Tomoaki ; et al.	2015-07-30
Imaging Device, Motor Driving Device And Imaging Method App 20140253788 - Saito; Hiroki ; et al.	2014-09-11
Image sensing device, image sensing device control method, and program for the control method Grant 8,611,736 - Ando , et al. December 17, 2	2013-12-17
Imaging device Grant 8,228,623 - Ando , et al. July 24, 2	2012-07-24
Image Sensing Device, Image Sensing Device Control Method, And Program For The Control Method App 20120155847 - ANDO; Akira ; et al.	2012-06-21
Wafer polish monitoring method and device Grant 8,173,037 - Fujita , et al. May 8, 2	2012-05-08
Imaging Device App 20110292525 - Ando; Akira ; et al.	2011-12-01
Film thickness measuring apparatus and film thickness measuring method Grant 7,830,141 - Fujita , et al. November 9, 2	2010-11-09
Method and device for forecasting/detecting polishing end point and method and device for monitoring real-time film thickness Grant 7,821,257 - Fujita , et al. October 26, 2	2010-10-26
Method for thermo-molding a footed and bottomed cylindrical container Grant 7,799,265 - Nakazato , et al. September 21, 2	2010-09-21
Method of forecasting and detecting polishing endpoint and the device thereof and real time film thickness monitoring method and the device thereof Grant 7,795,865 - Fujita , et al. September 14, 2	2010-09-14
Container, thermo-molding apparatus and method for thermo-molding the same Grant 7,762,803 - Nakazato , et al. July 27, 2	2010-07-27
Film thickness measuring apparatus and film thickness measuring method App 20090256558 - Fujita; Takashi ; et al.	2009-10-15
Container, thermo-molding apparatus and method for thermo-molding the same App 20090194916 - Nakazato; Shinsaku ; et al.	2009-08-06
Method and device for forecasting/detecting polishing end point and method and device for monitoring real-time film thickness App 20090061733 - Fujita; Takashi ; et al.	2009-03-05
Method of forecasting and detecting polishing endpoint and the device thereof and real time film thickness monitoring method and the device thereof App 20080290865 - Fujita; Takashi ; et al.	2008-11-27
Polishing condition control apparatus and polishing condition control method of CMP apparatus App 20080268751 - Yokoyama; Toshiyuki ; et al.	2008-10-30
Polishing condition control apparatus and polishing condition control method of CMP apparatus App 20080248723 - Yokoyama; Toshiyuki ; et al.	2008-10-09
Wafer polish monitoring method and device App 20080242197 - Fujita; Takashi ; et al.	2008-10-02
Unevenness elimination end-point detecting apparatus and unevenness elimination end-point detecting method for CMP apparatus App 20080180695 - Komiyama; Takashi ; et al.	2008-07-31
End point detection method applying resonance phenomenon, end point detection apparatus, chemical mechanical polishing apparatus on which the detection apparatus is loaded, and semiconductor device fabricated by the chemical mechanical polishing apparatus App 20080156773 - Kitade; Keita ; et al.	2008-07-03
Container, thermo-molding apparatus and method for thermo-molding the same App 20080118597 - Nakazato; Shinsaku ; et al.	2008-05-22
LSI design method and verification method App 20080028233 - Shiomi; Kentaro ; et al.	2008-01-31
LSI design method and verification method Grant 7,281,136 - Shiomi , et al. October 9, 2	2007-10-09
LSI design method and verification method App 20070011468 - Shiomi; Kentaro ; et al.	2007-01-11
Semiconductor device, function setting method thereof, and evaluation method thereof Grant 7,148,503 - Fujimura , et al. December 12, 2	2006-12-12
Semiconductor device, function setting method thereof, and evaluation method thereof App 20060275932 - Fujimura; Katsuya ; et al.	2006-12-07
Method and system for recording and reproducing data App 20060098952 - Fujimoto; Masahiro ; et al.	2006-05-11
Method for designing integrated circuit device Grant 6,886,150 - Fujiwara , et al. April 26, 2	2005-04-26
Database for design of integrated circuit device and method for designing integrated circuit device Grant 6,845,489 - Mizuno , et al. January 18, 2	2005-01-18
Container, and thermal forming device and thermal forming method therefor App 20040256397 - Nakazato, Shinsaku ; et al.	2004-12-23
Method of designing integrated circuit device and database App 20040054976 - Takahashi, Miwaka ; et al.	2004-03-18
Method of designing integrated circuit device using common parameter at different design levels, and database thereof Grant 6,671,857 - Takahashi , et al. December 30, 2	2003-12-30
Database For Designing Integrated Circuit Device And Method For Designing Integrated Circuit Device App 20030014729 - YOKOYAMA, TOSHIYUKI ; et al.	2003-01-16
Database for designing integrated circuit device, and method for designing integrated circuit device App 20020184602 - Yokoyama, Toshiyuki ; et al.	2002-12-05
Method for improving the efficiency of designing a system-on-chip integrated circuit device Grant 6,415,416 - Fujiwara , et al. July 2, 2	2002-07-02
LSI design method and verification method App 20020083330 - Shiomi, Kentaro ; et al.	2002-06-27
Method for designing integrated circuit device App 20020073381 - Fujiwara, Makoto ; et al.	2002-06-13
Semiconductor device and testing method therefor App 20020063251 - Sugiura, Sadashige ; et al.	2002-05-30
Semiconductor integrated circuit device and control method therefor App 20020041528 - Takahashi, Miwaka ; et al.	2002-04-11
Semiconductor device, function setting method thereof, and evaluation method thereof App 20020014699 - Fujimura, Katsuya ; et al.	2002-02-07
Method and apparatus for bending a metallic flanged member Grant 6,253,591 - Sayama , et al. July 3, 2	2001-07-03

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