| Patent | Date |
|---|
Push pin bearing mechanism for actuators
Grant 11,371,721 - Chan , et al. June 28, 2 | 2022-06-28 |
High Voltage Edge Termination Structure For Power Semicondcutor Devices And Manufacturing Method Thereof
App 20220157951 - YILMAZ; Hamza ; et al. | 2022-05-19 |
Shielded Gate Trench Mosfet Devices
App 20220131001 - YILMAZ; HAMZA ; et al. | 2022-04-28 |
Shielded Gate Trench Mosfet Devices
App 20220130999 - YILMAZ; HAMZA ; et al. | 2022-04-28 |
Shielded Gate Trench Mosfet Devices
App 20220131000 - YILMAZ; HAMZA ; et al. | 2022-04-28 |
Shielded gate trench MOSFET devices
Grant 11,251,297 - Yilmaz , et al. February 15, 2 | 2022-02-15 |
Self-aligned and robust IGBT devices
Grant 11,239,352 - Yilmaz February 1, 2 | 2022-02-01 |
Self-aligned and robust IGBT devices
Grant 11,233,141 - Yilmaz January 25, 2 | 2022-01-25 |
Small Pitch Super Junction Mosfet Structure And Method
App 20210336051 - YILMAZ; HAMZA | 2021-10-28 |
Back Side Dopant Activation In Field Stop Igbt
App 20210313423 - Yilmaz; Hamza | 2021-10-07 |
Sawtooh Electric Field Drift Region Structure For Planar And Trench Power Semiconductor Devices
App 20210305406 - Bobde; Madhur ; et al. | 2021-09-30 |
Self-aligned Trench Mosfet And Igbt Structures And Methods Of Fabrication
App 20210226041 - YILMAZ; HAMZA ; et al. | 2021-07-22 |
Carrier injection control fast recovery diode structures
Grant 11,069,770 - Yilmaz July 20, 2 | 2021-07-20 |
Small pitch super junction MOSFET structure and method
Grant 11,056,585 - Yilmaz July 6, 2 | 2021-07-06 |
Sawtooh electric field drift region structure for planar and trench power semiconductor devices
Grant 11,038,037 - Bobde , et al. June 15, 2 | 2021-06-15 |
Scalable Smart Environment with Gateway Thermostat
App 20210144025 - Choi; Hung Bun ; et al. | 2021-05-13 |
Self-aligned trench MOSFET structures and methods
Grant 10,998,438 - Yilmaz May 4, 2 | 2021-05-04 |
Dual-gate trench IGBT with buried floating P-type shield
Grant 10,998,264 - Hu , et al. May 4, 2 | 2021-05-04 |
Smart and robust wall socket with integrated universal serial bus (USB)
Grant 10,958,019 - Yilmaz , et al. March 23, 2 | 2021-03-23 |
Igbt Devices With 3d Backside Structures For Field Stop And Reverse Conduction
App 20210057556 - YILMAZ; HAMZA | 2021-02-25 |
Igbt Devices With 3d Backside Structures For Field Stop And Reverse Conduction
App 20210057557 - YILMAZ; HAMZA | 2021-02-25 |
Push Pin Bearing Mechanism for Actuators
App 20210055006 - Chan; Dick Kwai ; et al. | 2021-02-25 |
New Dual-gate Trench Igbt With Buried Floating P-type Shield
App 20210020567 - Hu; Jun ; et al. | 2021-01-21 |
Scalable smart environment for controlling a plurality of controlled apparatuses using a connection hub to route a processed subset of control data received from a cloud computing resource to terminal units
Grant 10,897,374 - Choi , et al. January 19, 2 | 2021-01-19 |
Push pin bearing mechanism for actuators
Grant 10,871,293 - Chan , et al. December 22, 2 | 2020-12-22 |
Dual-gate trench IGBT with buried floating P-type shield
Grant 10,804,355 - Hu , et al. October 13, 2 | 2020-10-13 |
Shielded Trench Devices
App 20200303507 - Yilmaz; Hamza | 2020-09-24 |
Sawtooh Electric Field Drift Region Structure For Planar And Trench Power Semiconductor Devices
App 20200303513 - Bobde; Madhur ; et al. | 2020-09-24 |
Method of manufacturing shielded gate trench MOSFET devices
Grant 10,777,661 - Yilmaz Sept | 2020-09-15 |
Lateral Semiconductor Power Devices
App 20200279926 - Darwish; Mohamed N. ; et al. | 2020-09-03 |
Semiconductor device and method of forming including superjunction structure formed using angled implant process
Grant 10,755,931 - Padmanabhan , et al. A | 2020-08-25 |
Shielded trench devices
Grant 10,714,574 - Yilmaz | 2020-07-14 |
Self-aligned And Robust Igbt Devices
App 20200203514 - YILMAZ; HAMZA | 2020-06-25 |
Nano-tube MOSFET technology and devices
Grant 10,686,035 - Yilmaz , et al. | 2020-06-16 |
MOSFET device and fabrication
Grant 10,680,097 - Chen , et al. | 2020-06-09 |
Carrier Injection Control Fast Recovery Diode Structures And Methods Of Fabrication
App 20200105866 - Yilmaz; Hamza | 2020-04-02 |
Back Side Dopant Activation In Field Stop Igbt
App 20200105874 - Yilmaz; Hamza | 2020-04-02 |
Semiconductor power devices manufactured with self-aligned processes and more reliable electrical contacts
Grant 10,608,092 - Yilmaz , et al. | 2020-03-31 |
Nanotube semiconductor devices
Grant 10,593,759 - Yilmaz , et al. | 2020-03-17 |
Shielded Gate Trench Mosfet Devices
App 20200044078 - YILMAZ; HAMZA ; et al. | 2020-02-06 |
Lateral semiconductor power devices
Grant 10,529,810 - Darwish , et al. J | 2020-01-07 |
Lateral Semiconductor Power Devices
App 20200006499 - Darwish; Mohamed N. ; et al. | 2020-01-02 |
Shielded Trench Devices
App 20190348510 - Yilmaz; Hamza | 2019-11-14 |
Nanotube Semiconductor Devices
App 20190333994 - Yilmaz; Hamza ; et al. | 2019-10-31 |
Small Pitch Super Junction Mosfet Structure And Method
App 20190326431 - YILMAZ; HAMZA | 2019-10-24 |
Method for forming a lateral super-junction MOSFET device and termination structure
Grant 10,446,679 - Bobde , et al. Oc | 2019-10-15 |
Method Of Manufacturing Shielded Gate Trench Mosfet Devices
App 20190273152 - YILMAZ; HAMZA | 2019-09-05 |
Self-aligned Trench Mosfet Structures And Methods
App 20190273157 - YILMAZ; HAMZA | 2019-09-05 |
Vertical power transistor die with etched beveled edges for increasing breakdown voltage
Grant 10,396,150 - Yilmaz A | 2019-08-27 |
Termination structure for nanotube semiconductor devices
Grant 10,396,158 - Yilmaz , et al. A | 2019-08-27 |
Igbt Devices With 3d Backside Structures For Field Stop And Reverse Conduction
App 20190245070 - YILMAZ; HAMZA | 2019-08-08 |
Self-aligned And Robust Igbt Devices
App 20190221657 - YILMAZ; HAMZA | 2019-07-18 |
Semiconductor Device And Method Of Forming Including Superjunction Structure Formed Using Angled Implant Process
App 20190214261 - Padmanabhan; Karthik ; et al. | 2019-07-11 |
Method For Forming A Lateral Super-junction Mosfet Device And Termination Structure
App 20190165169 - Bobde; Madhur ; et al. | 2019-05-30 |
New Dual-gate Trench Igbt With Buried Floating P-type Shield
App 20190157384 - Hu; Jun ; et al. | 2019-05-23 |
Robust and high current smart-plug
Grant 10,291,065 - Chan , et al. | 2019-05-14 |
Scalable Smart Environment Using a Gateway Thermostat
App 20190140856 - Choi; Hung Bun ; et al. | 2019-05-09 |
Semiconductor device including superjunction structure formed using angled implant process
Grant 10,276,387 - Padmanabhan , et al. | 2019-04-30 |
Nano-tube Mosfet Technology And Devices
App 20190115427 - Yilmaz; Hamza ; et al. | 2019-04-18 |
Method for forming a lateral super-junction MOSFET device and termination structure
Grant 10,243,072 - Bobde , et al. | 2019-03-26 |
Sawtooh Electric Field Drift Region Structure For Planar And Trench Power Semiconductor Devices
App 20190088761 - Bobde; Madhur ; et al. | 2019-03-21 |
Smart and Robust Wall Socket with Integrated Universal Serial Bus (USB)
App 20190067883 - Yilmaz; Hamza ; et al. | 2019-02-28 |
Nanotube Semiconductor Devices
App 20190043947 - Yilmaz; Hamza ; et al. | 2019-02-07 |
Dual-gate trench IGBT with buried floating P-type shield
Grant 10,199,455 - Hu , et al. Fe | 2019-02-05 |
Nano MOSFET with trench bottom oxide shielded and third dimensional P-body contact
Grant 10,192,982 - Yilmaz , et al. Ja | 2019-01-29 |
Lateral power MOSFET with non-horizontal RESURF structure
Grant 10,186,573 - Yilmaz , et al. Ja | 2019-01-22 |
Push Pin Bearing Mechanism for Actuators
App 20180372342 - Chan; Dick Kwai ; et al. | 2018-12-27 |
Nano-tube MOSFET technology and devices
Grant 10,121,857 - Yilmaz , et al. November 6, 2 | 2018-11-06 |
Lateral super junction device with high substrate-gate breakdown and built-in avalanche clamp diode
Grant 10,103,240 - Bobde , et al. October 16, 2 | 2018-10-16 |
Semiconductor Power Devices Manufactured With Self-aligned Processes And More Reliable Electrical Contacts
App 20180269293 - Yilmaz; Hamza ; et al. | 2018-09-20 |
Method For Forming A Lateral Super-junction Mosfet Device And Termination Structure
App 20180254342 - Bobde; Madhur ; et al. | 2018-09-06 |
Termination design for high voltage device
Grant 10,069,005 - Guan , et al. September 4, 2 | 2018-09-04 |
Nanotube termination structure for power semiconductor devices
Grant 10,062,755 - Yilmaz , et al. August 28, 2 | 2018-08-28 |
Nano-tube Mosfet Technology And Devices
App 20180240872 - Yilmaz; Hamza ; et al. | 2018-08-23 |
Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures
Grant 10,043,736 - Yilmaz , et al. August 7, 2 | 2018-08-07 |
Semiconductor device with field threshold MOSFET for high voltage termination
Grant 10,032,861 - Yilmaz , et al. July 24, 2 | 2018-07-24 |
Semiconductor power devices manufactured with self-aligned processes and more reliable electrical contacts
Grant 10,014,381 - Yilmaz , et al. July 3, 2 | 2018-07-03 |
Power trench MOSFET with improved unclamped inductive switching (UIS) performance and preparation method thereof
Grant 9,997,593 - Ding , et al. June 12, 2 | 2018-06-12 |
Lateral super-junction MOSFET device and termination structure
Grant 9,991,380 - Bobde , et al. June 5, 2 | 2018-06-05 |
Vertical power transistor with termination area having doped trenches with variable pitches
Grant 9,978,831 - Yilmaz May 22, 2 | 2018-05-22 |
Nanotube Termination Structure For Power Semiconductor Devices
App 20180130880 - Yilmaz; Hamza ; et al. | 2018-05-10 |
Termination structure with multiple embedded potential spreading capacitive structures for trench MOSFET
Grant 9,960,237 - Wang , et al. May 1, 2 | 2018-05-01 |
Vertical power transistor with deep trenches and deep regions surrounding cell array
Grant 9,941,351 - Yilmaz April 10, 2 | 2018-04-10 |
Semiconductor package of a flipped MOSFET chip and a multi-based die paddle with top surface groove-divided multiple connecting areas for connection to the flipped MOSFET electrodes
Grant 9,929,076 - Xue , et al. March 27, 2 | 2018-03-27 |
Nanotube semiconductor devices
Grant 9,899,474 - Yilmaz , et al. February 20, 2 | 2018-02-20 |
Semiconductor Device With Field Threshold Mosfet For High Voltage Termination
App 20180026094 - Yilmaz; Hamza ; et al. | 2018-01-25 |
Integrating enhancement mode depleted accumulation/inversion channel devices with MOSFETs
Grant 9,876,096 - Bobde , et al. January 23, 2 | 2018-01-23 |
High voltage field balance metal oxide field effect transistor (FBM)
Grant 9,865,678 - Bhalla , et al. January 9, 2 | 2018-01-09 |
Split-gate trench power mosfet with protected shield oxide
Grant 9,865,694 - Lee , et al. January 9, 2 | 2018-01-09 |
Nano Mosfet With Trench Bottom Oxide Shielded And Third Dimensional P-body Contact
App 20170373185 - Yilmaz; Hamza ; et al. | 2017-12-28 |
Mosfet Device And Fabrication
App 20170373186 - Chen; John ; et al. | 2017-12-28 |
Power Trench Mosfet With Improved Unclamped Inductive Switching (uis) Performance And Preparation Method Thereof
App 20170373139 - Ding; Yongping ; et al. | 2017-12-28 |
Vertical power transistor with dual buffer regions
Grant 9,852,910 - Yilmaz December 26, 2 | 2017-12-26 |
Preparation method of a thin power device
Grant 9,854,686 - Gong , et al. December 26, 2 | 2017-12-26 |
Lateral Super-junction Mosfet Device And Termination Structure
App 20170365710 - Bobde; Madhur ; et al. | 2017-12-21 |
Nanotube Semiconductor Devices
App 20170338307 - Yilmaz; Hamza ; et al. | 2017-11-23 |
Vertical power transistor with thin bottom emitter layer and dopants implanted in trenches in shield area and termination rings
Grant 9,825,128 - Yilmaz November 21, 2 | 2017-11-21 |
Split poly connection via through-poly-contact (TPC) in split-gate based power MOSFETs
Grant 9,818,829 - Lee , et al. November 14, 2 | 2017-11-14 |
Vertical power transistor with deep floating termination regions
Grant 9,805,933 - Yilmaz October 31, 2 | 2017-10-31 |
Semiconductor device with threshold MOSFET for high voltage termination
Grant 9,793,346 - Yilmaz , et al. October 17, 2 | 2017-10-17 |
MOSFET device and fabrication
Grant 9,793,393 - Chen , et al. October 17, 2 | 2017-10-17 |
Power semiconductor package device having locking mechanism, and preparation method thereof
Grant 9,786,583 - Xue , et al. October 10, 2 | 2017-10-10 |
Robust and High Current Smart-Plug
App 20170288456 - Chan; Dick Kwai ; et al. | 2017-10-05 |
Dual-gate Trench Igbt With Buried Floating P-type Shield
App 20170271441 - Hu; Jun ; et al. | 2017-09-21 |
Battery protection package and process of making the same
Grant 9,768,146 - Niu , et al. September 19, 2 | 2017-09-19 |
Vertical Power Transistor With Termination Area Having Doped Trenches With Variable Pitches
App 20170250246 - Yilmaz; Hamza | 2017-08-31 |
Vertical Power Transistor With Deep Trenches And Deep Regions Surrounding Cell Array
App 20170250270 - Yilmaz; Hamza | 2017-08-31 |
Vertical Power Transistor Die With Etched Beveled Edges For Increasing Breakdown Voltage
App 20170250173 - Yilmaz; Hamza | 2017-08-31 |
Nano MOSFET with trench bottom oxide shielded and third dimensional P-body contact
Grant 9,748,375 - Yilmaz , et al. August 29, 2 | 2017-08-29 |
Vertical Power Transistor With Dual Buffer Regions
App 20170243746 - Yilmaz; Hamza | 2017-08-24 |
Vertical Power Transistor With Deep Floating Termination Regions
App 20170243745 - Yilmaz; Hamza | 2017-08-24 |
Split-gate trench power MOSFET with protected shield oxide
Grant 9,741,808 - Lee , et al. August 22, 2 | 2017-08-22 |
Semiconductor Device With Thresholdmosfet For High Voltage Termination
App 20170236895 - Yilmaz; Hamza ; et al. | 2017-08-17 |
Combined packaged power semiconductor device
Grant 9,735,094 - Ho , et al. August 15, 2 | 2017-08-15 |
Lateral super-junction MOSFET device and termination structure
Grant 9,722,073 - Bobde , et al. August 1, 2 | 2017-08-01 |
Power trench MOSFET with improved unclamped inductive switching (UIS) performance and preparation method thereof
Grant 9,704,948 - Ding , et al. July 11, 2 | 2017-07-11 |
Nanotube semiconductor devices
Grant 9,704,955 - Yilmaz , et al. July 11, 2 | 2017-07-11 |
Semiconductor package with small gate clip and assembly method
Grant 9,679,833 - Xue , et al. June 13, 2 | 2017-06-13 |
Dual-gate trench IGBT with buried floating P-type shield
Grant 9,666,666 - Hu , et al. May 30, 2 | 2017-05-30 |
Termination Design For High Voltage Device
App 20170148910 - Guan; Lingpeng ; et al. | 2017-05-25 |
Semiconductor Device Including Superjunction Structure Formed Using Angled Implant Process
App 20170148632 - Padmanabhan; Karthik ; et al. | 2017-05-25 |
Semiconductor device with thick bottom metal and preparation method thereof
Grant 9,653,383 - Yilmaz , et al. May 16, 2 | 2017-05-16 |
Split-gate Trench Power Mosfet With Protected Shield Oxide
App 20170133473 - Lee; Yeeheng ; et al. | 2017-05-11 |
Lateral Super Junction Device With High Substrate-gate Breakdown And Built-in Avalanche Clamp Diode
App 20170117386 - Bobde; Madhur ; et al. | 2017-04-27 |
Vertical Power Transistor With Thin Bottom Emitter Layer And Dopants Implanted In Trenches In Shield Area And Termination Rings
App 20170110535 - Yilmaz; Hamza | 2017-04-20 |
Injection control in semiconductor power devices
Grant 9,620,630 - Bobde , et al. April 11, 2 | 2017-04-11 |
Battery Protection Package And Process Of Making The Same
App 20170098626 - Niu; Zhiqiang ; et al. | 2017-04-06 |
Nanotube Semiconductor Devices
App 20170084694 - Yilmaz; Hamza ; et al. | 2017-03-23 |
Lateral Power Mosfet With Non-horizontal Resurf Structure
App 20170077221 - Yilmaz; Hamza ; et al. | 2017-03-16 |
Semiconductor device including superjunction structure formed using angled implant process
Grant 9,595,609 - Padmanabhan , et al. March 14, 2 | 2017-03-14 |
Split poly connection via through-poly-contact (TPC) in split-gate based power MOSFETs
Grant 9,595,587 - Lee , et al. March 14, 2 | 2017-03-14 |
Termination Structure With Multiple Embedded Potential Spreading Capacitive Structures For Trench Mosfet
App 20170053989 - Wang; Xiaobin ; et al. | 2017-02-23 |
Termination design for high voltage device
Grant 9,577,072 - Guan , et al. February 21, 2 | 2017-02-21 |
Integrating Enhancement Mode Depleted Accumulation/inversion Channel Devices With Mosfets
App 20170047431 - Bobde; Madhur ; et al. | 2017-02-16 |
Battery protection package and process of making the same
Grant 9,564,406 - Niu , et al. February 7, 2 | 2017-02-07 |
Battery Protection Package And Process Of Making The Same
App 20170033060 - Niu; Zhiqiang ; et al. | 2017-02-02 |
Semiconductor device with field threshold MOSFET for high voltage termination
Grant 9,548,352 - Yilmaz , et al. January 17, 2 | 2017-01-17 |
Lateral Super-junction Mosfet Device And Termination Structure
App 20160380097 - Bobde; Madhur ; et al. | 2016-12-29 |
Semiconductor Package With Small Gate Clip And Assembly Method
App 20160379918 - Xue; Yan Xun ; et al. | 2016-12-29 |
Power Semiconductor Package Device Having Locking Mechanism, And Preparation Method Thereof
App 20160379917 - Xue; Yan Xun ; et al. | 2016-12-29 |
Normally on high voltage switch
Grant 9,530,885 - Bobde , et al. December 27, 2 | 2016-12-27 |
Configuration and method to generate saddle junction electric field in edge termination
Grant 9,520,464 - Bobde , et al. December 13, 2 | 2016-12-13 |
Wafer process for molded chip scale package (MCSP) with thick backside metallization
Grant 9,520,380 - Xue , et al. December 13, 2 | 2016-12-13 |
High Voltage Field Balance Metal Oxide Field Effect Transistor (fbm)
App 20160351659 - Bhalla; Anup ; et al. | 2016-12-01 |
Termination design for nanotube MOSFET
Grant 9,508,805 - Guan , et al. November 29, 2 | 2016-11-29 |
Nanotube semiconductor devices
Grant 9,502,503 - Yilmaz , et al. November 22, 2 | 2016-11-22 |
High frequency switching MOSFETs with low output capacitance using a depletable P-shield
Grant 9,502,554 - Bobde , et al. November 22, 2 | 2016-11-22 |
New Dual-gate Trench Igbt With Buried Floating P-type Shield
App 20160336394 - Hu; Jun ; et al. | 2016-11-17 |
Split Poly Connection Via Through-poly-contact (tpc) In Split-gate Based Power Mosfets
App 20160329426 - Lee; Yeeheng ; et al. | 2016-11-10 |
Nano-tube Mosfet Technology And Devices
App 20160322459 - Yilmaz; Hamza ; et al. | 2016-11-03 |
Integrating enhancement mode depleted accumulation/inversion channel devices with MOSFETs
Grant 9,484,452 - Bobde , et al. November 1, 2 | 2016-11-01 |
Device structure and methods of making high density MOSFETs for load switch and DC-DC applications
Grant 9,484,453 - Yilmaz , et al. November 1, 2 | 2016-11-01 |
Hybrid Packaged Lead Frame Based Multi-Chip Semiconductor Device with Multiple Interconnecting Structures
App 20160315039 - Yilmaz; Hamza ; et al. | 2016-10-27 |
Combined Packaged Power Semiconductor Device
App 20160307830 - Ho; Yueh-Se ; et al. | 2016-10-20 |
Semiconductor package with small gate clip and assembly method
Grant 9,472,491 - Xue , et al. October 18, 2 | 2016-10-18 |
Nanotube Semiconductor Devices
App 20160300909 - Yilmaz; Hamza ; et al. | 2016-10-13 |
Configuration And Method To Generate Saddle Junction Electric Field In Edge Termination
App 20160284794 - Bobde; Madhur ; et al. | 2016-09-29 |
Lateral super junctions with high substrate breakdown and build in avalanche clamp diode
Grant 9,450,050 - Bobde , et al. September 20, 2 | 2016-09-20 |
High density trench-based power MOSFETs with self-aligned active contacts and method for making such devices
Grant 9,450,088 - Lee , et al. September 20, 2 | 2016-09-20 |
High voltage field balance metal oxide field effect transistor (FBM)
Grant 9,450,083 - Bhalla , et al. September 20, 2 | 2016-09-20 |
Method for forming lateral super-junction structure
Grant 9,450,045 - Bobde , et al. September 20, 2 | 2016-09-20 |
Semiconductor Power Devices Manufactured With Self-aligned Processes And More Reliable Electrical Contacts
App 20160260814 - Yilmaz; Hamza ; et al. | 2016-09-08 |
Flip chip semiconductor device
Grant 9,437,587 - Zhang , et al. September 6, 2 | 2016-09-06 |
Combined packaged power semiconductor device
Grant 9,437,530 - Ho , et al. September 6, 2 | 2016-09-06 |
Power device and preparation method thereof
Grant 9,431,328 - Yilmaz , et al. August 30, 2 | 2016-08-30 |
Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structures
Grant 9,425,181 - Yilmaz , et al. August 23, 2 | 2016-08-23 |
Top exposed semiconductor chip package
Grant 9,412,684 - Xue , et al. August 9, 2 | 2016-08-09 |
Power semiconductor package device having locking mechanism, and preparation method thereof
Grant 9,397,029 - Xue , et al. July 19, 2 | 2016-07-19 |
Method for packaging a power device with bottom source electrode
Grant 9,391,005 - Xue , et al. July 12, 2 | 2016-07-12 |
Injection Control In Semiconductor Power Devices
App 20160197169 - Bobde; Madhur ; et al. | 2016-07-07 |
Split-gate Trench Power Mosfet With Protected Shield Oxide
App 20160190265 - Lee; Yeeheng ; et al. | 2016-06-30 |
Nano Mosfet With Trench Bottom Oxide Shielded And Third Dimensional P-body Contact
App 20160190309 - Yilmaz; Hamza ; et al. | 2016-06-30 |
Integrating Enhancement Mode Depleted Accumulation/inversion Channel Devices With Mosfets
App 20160172482 - Bobde; Madhur ; et al. | 2016-06-16 |
Method For Packaging A Power Device With Bottom Source Electrode
App 20160155688 - Xue; Yan Xun ; et al. | 2016-06-02 |
Semiconductor device with termination structure for power MOSFET applications
Grant 9,356,022 - Lee , et al. May 31, 2 | 2016-05-31 |
Nanotube semiconductor devices
Grant 9,349,796 - Yilmaz , et al. May 24, 2 | 2016-05-24 |
High Frequency Switching Mosfets With Low Output Capacitance Using A Depletable P-shield
App 20160141411 - Bobde; Madhur ; et al. | 2016-05-19 |
Power semiconductor device and the preparation method
Grant 9,337,131 - Huo , et al. May 10, 2 | 2016-05-10 |
Injection control in semiconductor power devices
Grant 9,318,587 - Bobde , et al. April 19, 2 | 2016-04-19 |
MCSP power semiconductor devices and preparation methods thereof
Grant 9,318,424 - Niu , et al. April 19, 2 | 2016-04-19 |
A Semiconductor Package Of A Flipped Mosfet
App 20160104661 - Xue; Yan Xun ; et al. | 2016-04-14 |
Lateral super-junction MOSFET device and termination structure
Grant 9,312,381 - Bobde , et al. April 12, 2 | 2016-04-12 |
Nanotube Semiconductor Devices
App 20160099315 - Yilmaz; Hamza ; et al. | 2016-04-07 |
Power semiconductor device and preparation method thereof
Grant 9,305,870 - Xue , et al. April 5, 2 | 2016-04-05 |
Semiconductor Package With Small Gate Clip And Assembly Method
App 20160093559 - Xue; Yan Xun ; et al. | 2016-03-31 |
Power Semiconductor Device And The Preparation Method
App 20160093560 - Huo; Yan ; et al. | 2016-03-31 |
Semiconductor Device Including Superjunction Structure Formed Using Angled Implant Process
App 20160087095 - Padmanabhan; Karthik ; et al. | 2016-03-24 |
Power device and preparation method thereof
Grant 9,293,397 - Yilmaz , et al. March 22, 2 | 2016-03-22 |
Wafer Process For Molded Chip Scale Package (mcsp) With Thick Backside Metallization
App 20160079203 - Xue; Yan Xun ; et al. | 2016-03-17 |
Nano MOSFET with trench bottom oxide shielded and third dimensional P-body contact
Grant 9,281,394 - Yilmaz , et al. March 8, 2 | 2016-03-08 |
Split-gate trench power MOSFET with protected shield oxide
Grant 9,281,368 - Lee , et al. March 8, 2 | 2016-03-08 |
Trench MOSFET with integrated Schottky barrier diode
Grant 9,281,416 - Calafut , et al. March 8, 2 | 2016-03-08 |
High Density Trench-based Power Mosfets With Self-aligned Active Contacts And Method For Making Such Devices
App 20160064551 - Lee; Yeeheng ; et al. | 2016-03-03 |
Power Semiconductor Device And Preparation Method Thereof
App 20160056096 - Xue; Yan Xun ; et al. | 2016-02-25 |
Power Trench Mosfet With Improved Unclamped Inductive Switching (uis) Performance And Preparation Method Thereof
App 20160043168 - Ding; Yongping ; et al. | 2016-02-11 |
Mcsp Power Semiconductor Devices And Preparation Methods Thereof
App 20160035653 - Niu; Zhiqiang ; et al. | 2016-02-04 |
Semiconductor power devices manufactured with self-aligned processes and more reliable electrical contacts
Grant 9,252,239 - Yilmaz , et al. February 2, 2 | 2016-02-02 |
High frequency switching MOSFETs with low output capacitance using a depletable P-shield
Grant 9,252,264 - Bobde , et al. February 2, 2 | 2016-02-02 |
Nanotube semiconductor devices
Grant 9,245,949 - Yilmaz , et al. January 26, 2 | 2016-01-26 |
Wafer process for molded chip scale package (MCSP) with thick backside metallization
Grant 9,245,861 - Xue , et al. January 26, 2 | 2016-01-26 |
Semiconductor Device With Field Threshold Mosfet For High Voltage Termination
App 20160013265 - Yilmaz; Hamza ; et al. | 2016-01-14 |
Configuration And Method To Generate Saddle Junction Electric Field In Edge Termination
App 20160005809 - Bobde; Madhur ; et al. | 2016-01-07 |
Configuration and method to generate saddle junction electric field in edge termination
Grant 9,231,050 - Bobde , et al. January 5, 2 | 2016-01-05 |
Method of making stacked multi-chip packaging structure
Grant 9,230,949 - Zhang , et al. January 5, 2 | 2016-01-05 |
Device Structure And Methods Of Making High Density Mosfets For Load Switch And Dc-dc Applications
App 20150380544 - Yilmaz; Hamza ; et al. | 2015-12-31 |
Method of fabricating power transistor with protected channel
Grant 9,224,603 - Lu , et al. December 29, 2 | 2015-12-29 |
High Voltage Field Balance Metal Oxide Field Effect Transistor (fbm)
App 20150372129 - Bhalla; Anup ; et al. | 2015-12-24 |
Combined packaged power semiconductor device
Grant 9,214,417 - Ho , et al. December 15, 2 | 2015-12-15 |
Power semiconductor device and preparation method thereof
Grant 9,214,419 - Xue , et al. December 15, 2 | 2015-12-15 |
Combined Packaged Power Semiconductor Device
App 20150357267 - Ho; Yueh-Se ; et al. | 2015-12-10 |
Semiconductor Power Devices Manufactured With Self-aligned Processes And More Reliable Electrical Contacts
App 20150349091 - Yilmaz; Hamza ; et al. | 2015-12-03 |
Injection Control In Semiconductor Power Devices
App 20150349101 - Bobde; Madhur ; et al. | 2015-12-03 |
Method for preparing semiconductor devices applied in flip chip technology
Grant 9,196,534 - Xue , et al. November 24, 2 | 2015-11-24 |
Semiconductor Device With Termination Structure For Power Mosfet Applications
App 20150333174 - Lee; Yeeheng ; et al. | 2015-11-19 |
High density trench-based power MOSFETs with self-aligned active contacts and method for making such devices
Grant 9,190,512 - Lee , et al. November 17, 2 | 2015-11-17 |
Stacked dual-chip packaging structure and preparation method thereof
Grant 9,184,117 - Ho , et al. November 10, 2 | 2015-11-10 |
Split Poly Connection Via Through-poly-contact (tpc) In Split-gate Based Power Mosfets
App 20150311295 - Lee; Yeeheng ; et al. | 2015-10-29 |
Semiconductor device including superjunction structure formed using angled implant process
Grant 9,171,949 - Padmanabhan , et al. October 27, 2 | 2015-10-27 |
Semiconductor package with small gate clip and assembly method
Grant 9,171,788 - Xue , et al. October 27, 2 | 2015-10-27 |
Stacked dual chip package having leveling projections
Grant 9,165,866 - Yilmaz , et al. October 20, 2 | 2015-10-20 |
Termination Design For High Voltage Device
App 20150279984 - Guan; Lingpeng ; et al. | 2015-10-01 |
Normally On High Voltage Switch
App 20150279989 - Bobde; Madhur ; et al. | 2015-10-01 |
Semiconductor Device With Thick Bottom Metal And Preparation Method Thereof
App 20150279766 - Yilmaz; Hamza ; et al. | 2015-10-01 |
Multi-die power semiconductor device packaged on a lead frame unit with multiple carrier pins and a metal clip
Grant 9,147,648 - Xue , et al. September 29, 2 | 2015-09-29 |
Device structure and methods of making high density MOSFETs for load switch and DC-DC applications
Grant 9,136,380 - Yilmaz , et al. September 15, 2 | 2015-09-15 |
High voltage field balance metal oxide field effect transistor (FBM)
Grant 9,129,822 - Bhalla , et al. September 8, 2 | 2015-09-08 |
Power Semiconductor Device And Preparation Method Thereof
App 20150249045 - Xue; Yan Xun ; et al. | 2015-09-03 |
Combined Packaged Power Semiconductor Device
App 20150243589 - Ho; Yueh-Se ; et al. | 2015-08-27 |
Method of Hybrid Packaging a Lead Frame Based Multi-Chip Semiconductor Device with Multiple Interconnecting Structures
App 20150236005 - Yilmaz; Hamza ; et al. | 2015-08-20 |
Termination trench for power MOSFET applications
Grant 9,105,494 - Lee , et al. August 11, 2 | 2015-08-11 |
Termination Structure With Multiple Embedded Potential Spreading Capacitive Structures For Trench Mosfet
App 20150214312 - Wang; Xiaobin ; et al. | 2015-07-30 |
Semiconductor device with thick bottom metal and preparation method thereof
Grant 9,087,828 - Yilmaz , et al. July 21, 2 | 2015-07-21 |
Normally on high voltage switch
Grant 9,082,790 - Bobde , et al. July 14, 2 | 2015-07-14 |
Preparation Method Of A Thin Power Device
App 20150189764 - Gong; Yuping ; et al. | 2015-07-02 |
Method Of Making Stacked Multi-chip Packaging Structure
App 20150179626 - Zhang; Xiaotian ; et al. | 2015-06-25 |
Termination design for high voltage device
Grant 9,064,897 - Guan , et al. June 23, 2 | 2015-06-23 |
Semiconductor Device For Restraining Creep-age Phenomenon And Fabricating Method Thereof
App 20150171000 - Niu; Zhi Qiang ; et al. | 2015-06-18 |
Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures
Grant 9,054,091 - Yilmaz , et al. June 9, 2 | 2015-06-09 |
Nanotube Semiconductor Devices
App 20150155354 - Yilmaz; Hamza ; et al. | 2015-06-04 |
Dual-gate trench IGBT with buried floating P-type shield
Grant 9,048,282 - Hu , et al. June 2, 2 | 2015-06-02 |
High Density Trench-based Power Mosfets With Self-aligned Active Contacts And Method For Making Such Devices
App 20150145037 - Lee; Yeeheng ; et al. | 2015-05-28 |
Semiconductor device for restraining creep-age phenomenon and fabricating method thereof
Grant 9,041,172 - Niu , et al. May 26, 2 | 2015-05-26 |
High Frequency Switching Mosfets With Low Output Capacitance Using A Depletable P-shield
App 20150137227 - Bobde; Madhur ; et al. | 2015-05-21 |
Termination structure with multiple embedded potential spreading capacitive for trench MOSFET and method
Grant 9,029,236 - Wang , et al. May 12, 2 | 2015-05-12 |
Nano-tube MOSFET technology and devices
Grant 9,024,375 - Yilmaz , et al. May 5, 2 | 2015-05-05 |
Buried Field Ring Field Effect Transistor (buf-fet) Integrated With Cells Implanted With Hole Supply Path
App 20150118810 - Bobde; Madhur ; et al. | 2015-04-30 |
Lateral Super Junctions With High Substrate Breakdown And Build In Avalanche Clamp Diode
App 20150115333 - Bobde; Madhur ; et al. | 2015-04-30 |
Stacked multi-chip packaging structure and manufacturing method thereof
Grant 9,006,870 - Zhang , et al. April 14, 2 | 2015-04-14 |
Thin power device and preparation method thereof
Grant 9,006,901 - Gong , et al. April 14, 2 | 2015-04-14 |
Method For Packaging A Power Device With Bottom Source Electrode
App 20150087114 - Xue; Yan Xun ; et al. | 2015-03-26 |
Packaged power semiconductor with interconnection of dies and metal clips on lead frame
Grant 8,981,539 - Xue , et al. March 17, 2 | 2015-03-17 |
Superjunction Structures For Power Devices And Methods Of Manufacture
App 20150069567 - Yedinak; Joseph A. ; et al. | 2015-03-12 |
Multi-Die Power Semiconductor Device Packaged On a Lead Frame Unit with Multiple Carrier Pins and a Metal Clip
App 20150069590 - Xue; Yan Xun ; et al. | 2015-03-12 |
Method of forming a self-aligned charge balanced power DMOS
Grant 8,969,953 - Chen , et al. March 3, 2 | 2015-03-03 |
High density trench-based power MOSFETs with self-aligned active contacts and method for making such devices
Grant 8,951,867 - Lee , et al. February 10, 2 | 2015-02-10 |
Stacked multi-chip bottom source semiconductor device and preparation method thereof
Grant 8,952,509 - Yilmaz , et al. February 10, 2 | 2015-02-10 |
Stacked Multi - Chip Packaging Structure And Manufacturing Method Thereof
App 20150035129 - Zhang; Xiaotian ; et al. | 2015-02-05 |
High frequency switching MOSFETs with low output capacitance using a depletable P-shield
Grant 8,946,816 - Bobde , et al. February 3, 2 | 2015-02-03 |
Normally On High Voltage Switch
App 20150021682 - Bobde; Madhur ; et al. | 2015-01-22 |
Thin Power Device And Preparation Method Thereof
App 20150021780 - Gong; Yuping ; et al. | 2015-01-22 |
Nanotube semiconductor devices
Grant 8,928,031 - Yilmaz , et al. January 6, 2 | 2015-01-06 |
Trench Mosfet With Integrated Schottky Barrier Diode
App 20150001616 - Calafut; Daniel ; et al. | 2015-01-01 |
Hybrid Packaging Multi-chip Semiconductor Device And Preparation Method Thereof
App 20140361420 - Yilmaz; Hamza ; et al. | 2014-12-11 |
Power Control Device And Preparation Method Thereof
App 20140361419 - Xue; Yan Xun ; et al. | 2014-12-11 |
A Semiconductor Package Of A Flipped Mosfet
App 20140361418 - Xue; Yan Xun ; et al. | 2014-12-11 |
High voltage fast recovery trench diode
Grant 8,907,414 - Hu , et al. December 9, 2 | 2014-12-09 |
Staggered column superjunction
Grant 8,900,949 - Guan , et al. December 2, 2 | 2014-12-02 |
Device Structure And Methods Of Making High Density Mosfets For Load Switch And Dc-dc Applications
App 20140339630 - Yilmaz; Hamza ; et al. | 2014-11-20 |
Termination Design For Nanotube Mosfet
App 20140332919 - Guan; Lingpeng ; et al. | 2014-11-13 |
Trench-gate field effect transistor
Grant 8,884,365 - Yilmaz , et al. November 11, 2 | 2014-11-11 |
High Voltage Field Balance Metal Oxide Field Effect Transistor (fbm)
App 20140319604 - Bhalla; Anup ; et al. | 2014-10-30 |
Nano Mosfet With Trench Bottom Oxide Shielded And Third Dimensional P-body Contact
App 20140319605 - Yilmaz; Hamza ; et al. | 2014-10-30 |
Wafer Process For Molded Chip Scale Package (mcsp) With Thick Backside Metallization
App 20140315350 - Xue; Yan Xun ; et al. | 2014-10-23 |
Method for forming a schottky barrier diode integrated with a trench MOSFET
Grant 8,865,540 - Calafut , et al. October 21, 2 | 2014-10-21 |
Nanotube Semiconductor Devices
App 20140299914 - Yilmaz; Hamza ; et al. | 2014-10-09 |
Direct contact in trench with three-mask shield gate process
Grant 8,847,306 - Tai , et al. September 30, 2 | 2014-09-30 |
Semiconductor Device with Thick Bottom Metal and Preparation Method Thereof
App 20140264802 - Yilmaz; Hamza ; et al. | 2014-09-18 |
Dual-gate Trench Igbt With Buried Floating P-type Shield
App 20140264433 - Hu; Jun ; et al. | 2014-09-18 |
Configuration and method to generate saddle junction electric field in edge termination
Grant 8,829,640 - Bobde , et al. September 9, 2 | 2014-09-09 |
Method For Preparing Semiconductor Devices Applied In Flip Chip Technology
App 20140242756 - Xue; Yan Xun ; et al. | 2014-08-28 |
High Frequency Switching Mosfets With Low Output Capacitance Using A Depletable P-shield
App 20140239382 - Bobde; Madhur ; et al. | 2014-08-28 |
High Voltage Fast Recovery Trench Diode
App 20140239436 - Hu; Jun ; et al. | 2014-08-28 |
Termination Trench For Power Mosfet Applications
App 20140239388 - Lee; Yeeheng ; et al. | 2014-08-28 |
Device structure and methods of making high density MOSFETs for load switch and DC-DC applications
Grant 8,809,948 - Yilmaz , et al. August 19, 2 | 2014-08-19 |
Lateral Super Junction Device With High Substrate-gate Breakdown And Built-in Avalanche Clamp Diode
App 20140227837 - Bobde; Madhur ; et al. | 2014-08-14 |
Semiconductor device with field threshold MOSFET for high voltage termination
Grant 8,802,529 - Yilmaz , et al. August 12, 2 | 2014-08-12 |
Field Effect Transistor And Schottky Diode Structures
App 20140203355 - Kocon; Christopher Boguslaw ; et al. | 2014-07-24 |
Superjunction structures for power devices and methods of manufacture
Grant 8,786,010 - Yedinak , et al. July 22, 2 | 2014-07-22 |
High voltage field balance metal oxide field effect transistor (FBM)
Grant 8,785,279 - Bhalla , et al. July 22, 2 | 2014-07-22 |
Nano MOSFET with trench bottom oxide shielded and third dimensional P-body contact
Grant 8,785,278 - Yilmaz , et al. July 22, 2 | 2014-07-22 |
Semiconductor power devices manufactured with self-aligned processes and more reliable electrical contacts
Grant 8,779,510 - Yilmaz , et al. July 15, 2 | 2014-07-15 |
Packaging method of molded wafer level chip scale package (WLCSP)
Grant 8,778,735 - Xue , et al. July 15, 2 | 2014-07-15 |
Termination Design For High Voltage Device
App 20140193958 - Guan; Lingpeng ; et al. | 2014-07-10 |
Superjunction structures for power devices and methods of manufacture
Grant 8,772,868 - Yedinak , et al. July 8, 2 | 2014-07-08 |
High Density Trench-based Power Mosfets With Self-aligned Active Contacts And Method For Making Such Devices
App 20140175536 - Lee; Yeeheng ; et al. | 2014-06-26 |
High Frequency Switching Mosfets With Low Output Capacitance Using A Depletable P-shield
App 20140175540 - Bobde; Madhur ; et al. | 2014-06-26 |
Termination Structure with Multiple Embedded Potential Spreading Capacitive Structures for Trench MOSFET and Method
App 20140167212 - Wang; Xiaobin ; et al. | 2014-06-19 |
High frequency switching MOSFETs with low output capacitance using a depletable P-shield
Grant 8,753,935 - Bobde , et al. June 17, 2 | 2014-06-17 |
Field effect transistor with gated and non-gated trenches
Grant 8,742,401 - Yilmaz , et al. June 3, 2 | 2014-06-03 |
Nanotube semiconductor devices
Grant 8,729,601 - Yilmaz , et al. May 20, 2 | 2014-05-20 |
Method of Fabricating Power Transistor with Protected Channel
App 20140134834 - Lu; Yang ; et al. | 2014-05-15 |
Stacked Dual-chip Packaging Structure And Preparation Method Thereof
App 20140117523 - Ho; Yueh-Se ; et al. | 2014-05-01 |
High voltage fast recovery trench diode
Grant 8,710,585 - Hu , et al. April 29, 2 | 2014-04-29 |
Mosfet Device And Fabrication
App 20140091386 - Chen; John ; et al. | 2014-04-03 |
Combined packaged power semiconductor device
Grant 8,686,546 - Ho , et al. April 1, 2 | 2014-04-01 |
Termination design for high voltage device
Grant 8,680,613 - Guan , et al. March 25, 2 | 2014-03-25 |
Field effect transistor and schottky diode structures
Grant 8,680,611 - Kocon , et al. March 25, 2 | 2014-03-25 |
Method For Forming A Schottky Barrier Diode Integrated With A Trench Mosfet
App 20140073098 - Calafut; Daniel ; et al. | 2014-03-13 |
Flip chip semiconductor device
Grant 8,669,650 - Zhang , et al. March 11, 2 | 2014-03-11 |
Power transistor with protected channel
Grant 8,664,728 - Lu , et al. March 4, 2 | 2014-03-04 |
Stacked Dual Chip Package Having Leveling Projections
App 20140054758 - Yilmaz; Hamza ; et al. | 2014-02-27 |
Field Effect Transistor With Gated And Non-gated Trenches
App 20140054691 - Yilmaz; Hamza ; et al. | 2014-02-27 |
Nanotube Semiconductor Devices
App 20140042490 - Yilmaz; Hamza ; et al. | 2014-02-13 |
Top Exposed Semiconductor Chip Package
App 20140035116 - Xue; Yan Xun ; et al. | 2014-02-06 |
Wafer level package structure and the fabrication method thereof
Grant 8,642,385 - Xue , et al. February 4, 2 | 2014-02-04 |
High Voltage Field Balance Metal Oxide Field Effect Transistor (fbm)
App 20140027841 - Bhalla; Anup ; et al. | 2014-01-30 |
Termination Design For High Voltage Device
App 20140027840 - Guan; Lingpeng ; et al. | 2014-01-30 |
Method Of Forming A Self-aligned Charge Balanced Power Dmos
App 20130341689 - Chen; John ; et al. | 2013-12-26 |
Staggered Column Superjunction
App 20130260522 - Guan; Lingpeng ; et al. | 2013-10-03 |
Structure And Method For Forming Trench-gate Field Effect Transistor
App 20130248991 - YILMAZ; Hamza ; et al. | 2013-09-26 |
Nano-tube Mosfet Technology And Devices
App 20130221430 - Yilmaz; Hamza ; et al. | 2013-08-29 |
Packaging Method Of Molded Wafer Level Chip Scale Package (wlcsp)
App 20130210195 - Xue; Yan Xun ; et al. | 2013-08-15 |
Nano Mosfet With Trench Bottom Oxide Shielded And Third Dimensional P-body Contact
App 20130200451 - Yilmaz; Hamza ; et al. | 2013-08-08 |
Field Effect Transistor With Self-aligned Source And Heavy Body Regions
App 20130181282 - Yilmaz; Hamza ; et al. | 2013-07-18 |
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