Yeung; Tak Sang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yeung; Tak Sang.The latest application filed is for "flexural plate wave device for chip cooling".
- Yeung; Tak Sang - Irvine CA
- Yeung; Tak Sang - Tin Shui Wai HK
| Patent | Date |
|---|---|
| Flexural Plate Wave Device For Chip Cooling App 20150318230 - Bhagavat; Milind S. ; et al. | 2015-11-05 |
| Flexural plate wave device for chip cooling Grant 9,123,698 - Bhagavat , et al. September 1, 2 | 2015-09-01 |
| Flexural Plate Wave Device For Chip Cooling App 20120050989 - Bhagavat; Milind S. ; et al. | 2012-03-01 |
| Flip chip ball grid array package Grant 7,224,048 - McLellan , et al. May 29, 2 | 2007-05-29 |
| Ball grid array package Grant 6,818,472 - Fan , et al. November 16, 2 | 2004-11-16 |
| Ball grid array package Grant 6,800,948 - Fan , et al. October 5, 2 | 2004-10-05 |
| Chip scale integrated circuit package Grant 6,667,191 - McLellan , et al. December 23, 2 | 2003-12-23 |
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