| Patent | Date |
|---|
Integrated Circuit Package and Method
App 20220310470 - Chen; Hsien-Wei ; et al. | 2022-09-29 |
Semiconductor device and method of manufacture
Grant 11,456,240 - Yu , et al. September 27, 2 | 2022-09-27 |
Package Structure
App 20220302070 - Yeh; Sung-Feng ; et al. | 2022-09-22 |
Package Structure For Heat Dissipation
App 20220301973 - Yu; Chen-Hua ; et al. | 2022-09-22 |
Semiconductor Package And Manufacturing Method Thereof
App 20220302034 - Chen; Ming-Fa ; et al. | 2022-09-22 |
Die Stack Structure And Manufacturing Method Thereof
App 20220293568 - Yu; Chen-Hua ; et al. | 2022-09-15 |
Semiconductor Structure And Method Of Manufacturing The Same
App 20220293560 - Chen; Ming-Fa ; et al. | 2022-09-15 |
Integrated circuit package and method
Grant 11,443,995 - Yu , et al. September 13, 2 | 2022-09-13 |
Semiconductor Device and Method of Manufacturing
App 20220278063 - Hu; Chih-Chia ; et al. | 2022-09-01 |
Wafer on Wafer Bonding Structure
App 20220278074 - Chen; Ming-Fa ; et al. | 2022-09-01 |
Manufacturing Method Of Package
App 20220271012 - Chen; Ming-Fa ; et al. | 2022-08-25 |
Semiconductor Package With Shared Barrier Layer In Redistribution And Via And Method Of Manufacturing The Same
App 20220262772 - Chen; Hsien-Wei ; et al. | 2022-08-18 |
Inactive Structure On Soic
App 20220262768 - Chen; Ming-Fa ; et al. | 2022-08-18 |
Through-Dielectric Vias for Direct Connection and Method Forming Same
App 20220262766 - Chen; Ming-Fa ; et al. | 2022-08-18 |
Package and manufacturing method thereof
Grant 11,417,619 - Chen , et al. August 16, 2 | 2022-08-16 |
Three-dimensional stacking structure and manufacturing method thereof
Grant 11,417,629 - Chen , et al. August 16, 2 | 2022-08-16 |
Package structure and method of fabricating the same
Grant 11,417,587 - Chen , et al. August 16, 2 | 2022-08-16 |
Package Structure And Manufacturing Method Thereof
App 20220246573 - Chen; Ming-Fa ; et al. | 2022-08-04 |
Methods of Forming Semiconductor Device Packages
App 20220238398 - Yu; Chen-Hua ; et al. | 2022-07-28 |
Die Stack Structure And Manufacturing Method Thereof
App 20220230996 - Chen; Hsien-Wei ; et al. | 2022-07-21 |
Semiconductor Packages And Methods Of Forming The Same
App 20220223553 - Chen; Ming-Fa ; et al. | 2022-07-14 |
Package structure
Grant 11,387,209 - Yeh , et al. July 12, 2 | 2022-07-12 |
Semiconductor Package And Manufacturing Method Of The Same
App 20220216146 - CHEN; MING-FA ; et al. | 2022-07-07 |
Die stack structure and manufacturing method thereof
Grant 11,380,653 - Yu , et al. July 5, 2 | 2022-07-05 |
Method Of Manufacturing Semiconductor Structure
App 20220208725 - CHEN; MING-FA ; et al. | 2022-06-30 |
Package and manufacturing method thereof
Grant 11,373,981 - Chen , et al. June 28, 2 | 2022-06-28 |
Package Structure And Method Of Fabricating The Same
App 20220189918 - Chen; Ming-Fa ; et al. | 2022-06-16 |
Package structure for heat dissipation
Grant 11,362,013 - Yu , et al. June 14, 2 | 2022-06-14 |
Semiconductor package with shared barrier layer in redistribution and via
Grant 11,362,064 - Chen , et al. June 14, 2 | 2022-06-14 |
Die Stack Structure, Semiconductor Structure And Method Of Fabricating The Same
App 20220181301 - Chen; Ming-Fa ; et al. | 2022-06-09 |
Package Structure
App 20220173070 - Chen; Hsien-Wei ; et al. | 2022-06-02 |
Bonding Structure And Method Of Forming Same
App 20220173059 - Chen; Ming-Fa ; et al. | 2022-06-02 |
Package structure and manufacturing method thereof
Grant 11,342,297 - Chen , et al. May 24, 2 | 2022-05-24 |
Semiconductor device and method of manufacturing
Grant 11,335,656 - Hu , et al. May 17, 2 | 2022-05-17 |
Methods Of Manufacturing Three-dimensional Integrated Circuit Structures
App 20220139898 - Chen; Hsien-Wei ; et al. | 2022-05-05 |
Package Structure And Method Of Manufacturing The Same
App 20220139882 - Chen; Ming-Fa ; et al. | 2022-05-05 |
Package And Manufacturing Method Thereof
App 20220139807 - Chen; Ming-Fa ; et al. | 2022-05-05 |
Package structure and method of fabricating the same
Grant 11,322,477 - Chen , et al. May 3, 2 | 2022-05-03 |
Die stack structure and manufacturing method thereof
Grant 11,309,291 - Chen , et al. April 19, 2 | 2022-04-19 |
Method of forming semiconductor device package having dummy devices on a first die
Grant 11,309,223 - Yu , et al. April 19, 2 | 2022-04-19 |
Semiconductor structure and manufacturing method thereof
Grant 11,289,450 - Chen , et al. March 29, 2 | 2022-03-29 |
Die Stack Structure And Manufacturing Method Thereof
App 20220093564 - Chen; Hsien-Wei ; et al. | 2022-03-24 |
Semiconductor package and manufacturing method of the same
Grant 11,282,784 - Chen , et al. March 22, 2 | 2022-03-22 |
System Formed Through Package-In-Package Formation
App 20220077117 - Yu; Chen-Hua ; et al. | 2022-03-10 |
Bond pad structure for semiconductor device and method of forming same
Grant 11,264,343 - Chen , et al. March 1, 2 | 2022-03-01 |
Semiconductor structure and method of fabricating the same
Grant 11,264,362 - Chen , et al. March 1, 2 | 2022-03-01 |
Package structure and method of fabricating the same
Grant 11,257,787 - Chen , et al. February 22, 2 | 2022-02-22 |
Three-dimensional integrated circuit structures and methods of manufacturing the same
Grant 11,239,225 - Chen , et al. February 1, 2 | 2022-02-01 |
Package structure and method of manufacturing the same
Grant 11,233,035 - Chen , et al. January 25, 2 | 2022-01-25 |
Package and manufacturing method thereof
Grant 11,227,812 - Chen , et al. January 18, 2 | 2022-01-18 |
Package Structures And Methods Of Fabricating The Same
App 20210391322 - Chen; Ming-Fa ; et al. | 2021-12-16 |
Stacking Structure, Package Structure And Method Of Fabricating The Same
App 20210384164 - Chen; Ming-Fa ; et al. | 2021-12-09 |
Package Structure And Method Of Manufacturing The Same
App 20210375827 - Chen; Ming-Fa ; et al. | 2021-12-02 |
Multi-level Stacking Of Wafers And Chips
App 20210375819 - Chen; Ming-Fa ; et al. | 2021-12-02 |
Semiconductor Structure And Method Of Fabricating The Same
App 20210375826 - Chen; Ming-Fa ; et al. | 2021-12-02 |
System formed through package-in-package formation
Grant 11,189,599 - Yu , et al. November 30, 2 | 2021-11-30 |
System on Integrated Chips and Methods of Forming Same
App 20210343680 - Yeh; Sung-Feng ; et al. | 2021-11-04 |
Semiconductor structure and method manufacturing the same
Grant 11,164,848 - Chen , et al. November 2, 2 | 2021-11-02 |
Integrated Circuits
App 20210335735 - Chen; Hsien-Wei ; et al. | 2021-10-28 |
Manufacturing Method Of Semiconductor Structure
App 20210327807 - Chen; Ming-Fa ; et al. | 2021-10-21 |
Package
App 20210305214 - Chen; Ming-Fa ; et al. | 2021-09-30 |
Package Structure, Chip Structure And Method Of Fabricating The Same
App 20210296288 - Chen; Ming-Fa ; et al. | 2021-09-23 |
Semiconductor Packages
App 20210296251 - Chen; Ming-Fa ; et al. | 2021-09-23 |
Integrated Circuit Package and Method
App 20210288030 - Chen; Ming-Fa ; et al. | 2021-09-16 |
Stacking structure, package structure and method of fabricating the same
Grant 11,114,413 - Chen , et al. September 7, 2 | 2021-09-07 |
Three-dimensional Stacking Structure And Manufacturing Method Thereof
App 20210249380 - Chen; Ming-Fa ; et al. | 2021-08-12 |
Packages with Si-Substrate-Free Interposer and Method Forming Same
App 20210225750 - Yu; Chen-Hua ; et al. | 2021-07-22 |
Semiconductor structure and manufacturing method thereof
Grant 11,069,608 - Chen , et al. July 20, 2 | 2021-07-20 |
System on integrated chips and methods of forming same
Grant 11,069,658 - Yeh , et al. July 20, 2 | 2021-07-20 |
Package structure, chip structure and method of fabricating the same
Grant 11,063,019 - Chen , et al. July 13, 2 | 2021-07-13 |
Package and manufacturing method of reconstructed wafer
Grant 11,063,022 - Chen , et al. July 13, 2 | 2021-07-13 |
Semiconductor packages and method of forming the same
Grant 11,056,438 - Chen , et al. July 6, 2 | 2021-07-06 |
Semiconductor component, package structure and manufacturing method thereof
Grant 11,043,482 - Chen , et al. June 22, 2 | 2021-06-22 |
Package Structure for Heat Dissipation
App 20210175143 - Yu; Chen-Hua ; et al. | 2021-06-10 |
Integrated circuit package and method
Grant 11,024,605 - Chen , et al. June 1, 2 | 2021-06-01 |
3DIC formation with dies bonded to formed RDLs
Grant 11,004,826 - Yu , et al. May 11, 2 | 2021-05-11 |
Semiconductor Structures and Methods of Forming the Same
App 20210134730 - Yu; Chen-Hua ; et al. | 2021-05-06 |
Package Structure And Method Of Fabricating The Same
App 20210134704 - Chen; Hsien-Wei ; et al. | 2021-05-06 |
3DIC Formation with Dies Bonded to Formed RDLs
App 20210125968 - Yu; Chen-Hua ; et al. | 2021-04-29 |
Packages with Si-substrate-free interposer and method forming same
Grant 10,971,443 - Yu , et al. April 6, 2 | 2021-04-06 |
Semiconductor Die Package And Method Of Manufacture
App 20210098380 - Chen; Ming-Fa ; et al. | 2021-04-01 |
Package Structure And Method Of Manufacturing The Same
App 20210098423 - Chen; Hsien-Wei ; et al. | 2021-04-01 |
Package Structure And Method Of Fabricating The Same
App 20210098420 - Chen; Ming-Fa ; et al. | 2021-04-01 |
Package Structure And Manufacturing Method Thereof
App 20210098409 - Chen; Ming-Fa ; et al. | 2021-04-01 |
Integrated Circuit Package and Method
App 20210098323 - Yu; Chen-Hua ; et al. | 2021-04-01 |
Semiconductor Devices and Methods of Manufacture
App 20210091084 - Yu; Chen-Hua ; et al. | 2021-03-25 |
Package And Manufacturing Method Of Reconstructed Wafer
App 20210082874 - Chen; Ming-Fa ; et al. | 2021-03-18 |
Structure And Formation Method For Chip Package
App 20210074684 - Yu; Chen-Hua ; et al. | 2021-03-11 |
Die Stack Structure And Manufacturing Method Thereof
App 20210066254 - Yu; Chen-Hua ; et al. | 2021-03-04 |
Package And Manufacturing Method Thereof
App 20210066248A1 - | 2021-03-04 |
Bonding Structure And Method Of Forming Same
App 20210066222 - Chen; Ming-Fa ; et al. | 2021-03-04 |
Package And Manufacturing Method Thereof
App 20210066168 - Chen; Ming-Fa ; et al. | 2021-03-04 |
Package And Manufacturing Method Thereof
App 20210057362 - Chen; Ming-Fa ; et al. | 2021-02-25 |
Semiconductor Structure And Manufacturing Method Thereof
App 20210057332 - Chen; Ming-Fa ; et al. | 2021-02-25 |
Three-dimensional Integrated Circuit Structures And Methods Of Manufacturing The Same
App 20210020601 - Chen; Hsien-Wei ; et al. | 2021-01-21 |
Package Structure, Chip Structure And Method Of Fabricating The Same
App 20210020602 - Chen; Ming-Fa ; et al. | 2021-01-21 |
Semiconductor Device and Method of Manufacturing
App 20210005561 - Hu; Chih-Chia ; et al. | 2021-01-07 |
Semiconductor structure, 3DIC structure and method of fabricating the same
Grant 10,886,245 - Chen , et al. January 5, 2 | 2021-01-05 |
Stacking Structure, Package Structure And Method Of Fabricating The Same
App 20200411476 - Chen; Ming-Fa ; et al. | 2020-12-31 |
Semiconductor Packages And Method Of Forming The Same
App 20200411445 - Chen; Ming-Fa ; et al. | 2020-12-31 |
Package And Manufacturing Method Thereof
App 20200411473 - Chen; Ming-Fa ; et al. | 2020-12-31 |
Package Structure
App 20200402947 - Yeh; Sung-Feng ; et al. | 2020-12-24 |
Semiconductor Structure And Method Manufacturing The Same
App 20200402942 - Chen; Ming-Fa ; et al. | 2020-12-24 |
Semiconductor Structure And Method Manufacturing The Same
App 20200402960 - Chen; Ming-Fa ; et al. | 2020-12-24 |
Package structure for heat dissipation
Grant 10,872,836 - Yu , et al. December 22, 2 | 2020-12-22 |
Semiconductor structures and methods of forming the same
Grant 10,867,929 - Yu , et al. December 15, 2 | 2020-12-15 |
Package structure, package-on-package structure and method of fabricating the same
Grant 10,867,966 - Chen , et al. December 15, 2 | 2020-12-15 |
Integrated circuit package and method
Grant 10,867,879 - Yu , et al. December 15, 2 | 2020-12-15 |
Semiconductor Device and Method of Manufacture
App 20200388563 - Yu; Chen-Hua ; et al. | 2020-12-10 |
Integrated Circuit Package and Method
App 20200381396 - Chen; Ming-Fa ; et al. | 2020-12-03 |
Semiconductor Structure, 3dic Structure And Method Of Fabricating The Same
App 20200381379 - Chen; Hsien-Wei ; et al. | 2020-12-03 |
System Formed Through Package-In-Package Formation
App 20200381397 - Yu; Chen-Hua ; et al. | 2020-12-03 |
Forming metal bonds with recesses
Grant 10,854,574 - Chen , et al. December 1, 2 | 2020-12-01 |
Stacked chip package and methods of manufacture thereof
Grant 10,840,217 - Yu , et al. November 17, 2 | 2020-11-17 |
Package Structure, Package-on-package Structure And Method Of Fabricating The Same
App 20200343223 - Chen; Hsien-Wei ; et al. | 2020-10-29 |
Integrated Circuit Packages And Methods Of Forming The Same
App 20200343218 - Hu; Chih-Chia ; et al. | 2020-10-29 |
Method of manufacturing 3DIC structure
Grant 10,797,015 - Yeh , et al. October 6, 2 | 2020-10-06 |
Packages with Si-Substrate-Free Interposer and Method Forming Same
App 20200312758 - Yu; Chen-Hua ; et al. | 2020-10-01 |
Semiconductor Package And Manufacturing Method Of The Same
App 20200303301 - CHEN; MING-FA ; et al. | 2020-09-24 |
Semiconductor device and method of manufacturing
Grant 10,784,219 - Hu , et al. Sept | 2020-09-22 |
Semiconductor Device Package and Method
App 20200294870 - Yu; Chen-Hua ; et al. | 2020-09-17 |
Semiconductor Component, Package Structure And Manufacturing Method Thereof
App 20200294984 - Chen; Ming-Fa ; et al. | 2020-09-17 |
Package Structure And Method Of Fabricating The Same
App 20200279831 - Chen; Hsien-Wei ; et al. | 2020-09-03 |
Semiconductor device packaging structure having through interposer vias and through substrate vias
Grant 10,756,010 - Yu , et al. A | 2020-08-25 |
Forming metal bonds with recesses
Grant 10,685,935 - Chen , et al. | 2020-06-16 |
Semiconductor package and manufacturing method of the same
Grant 10,685,911 - Chen , et al. | 2020-06-16 |
Packages with Si-substrate-free interposer and method forming same
Grant 10,685,910 - Yu , et al. | 2020-06-16 |
Semiconductor Structures And Methods Of Forming The Same
App 20200185330 - Yu; Chen-Hua ; et al. | 2020-06-11 |
Semiconductor component, package structure and manufacturing method thereof
Grant 10,672,754 - Chen , et al. | 2020-06-02 |
Method of forming semiconductor device package having testing pads on a topmost die
Grant 10,672,674 - Yu , et al. | 2020-06-02 |
Package structure and method of fabricating the same
Grant 10,658,333 - Chen , et al. | 2020-05-19 |
System on Integrated Chips and Methods of Forming Same
App 20200152604 - Yeh; Sung-Feng ; et al. | 2020-05-14 |
Semiconductor Structure And Manufacturing Method Thereof
App 20200118975 - CHEN; MING-FA ; et al. | 2020-04-16 |
Semiconductor Device and Method of Manufacture
App 20200118915 - Yu; Chen-Hua ; et al. | 2020-04-16 |
Method for manufacturing semiconductor structure
Grant 10,622,327 - Yu , et al. | 2020-04-14 |
Integrated Circuit Package and Method
App 20200105635 - Yu; Chen-Hua ; et al. | 2020-04-02 |
Package Structure And Method Of Fabricating The Same
App 20200043893 - Chen; Hsien-Wei ; et al. | 2020-02-06 |
System on integrated chips and methods of forming same
Grant 10,541,227 - Yeh , et al. Ja | 2020-01-21 |
3D Chip-on-wager-on-substrate structure with via last process
Grant 10,535,631 - Yu , et al. Ja | 2020-01-14 |
Method Of Manufacturing 3dic Structure
App 20200013746 - Yeh; Sung-Feng ; et al. | 2020-01-09 |
Forming Metal Bonds with Recesses
App 20200006288 - Chen; Ming-Fa ; et al. | 2020-01-02 |
Semiconductor Device Package and Method
App 20200006164 - Yu; Chen-Hua ; et al. | 2020-01-02 |
Semiconductor structure and manufacturing method thereof
Grant 10,510,718 - Chen , et al. Dec | 2019-12-17 |
Method of manufacturing semiconductor device packaging structure having through interposer vias and through substrate vias
Grant 10,510,650 - Yu , et al. Dec | 2019-12-17 |
Packages with Si-Substrate-Free Interposer and Method Forming Same
App 20190363045 - Yu; Chen-Hua ; et al. | 2019-11-28 |
3dic Structure And Method Of Manufacturing The Same
App 20190355692 - Yeh; Sung-Feng ; et al. | 2019-11-21 |
3DIC structure and method of manufacturing the same
Grant 10,475,762 - Yeh , et al. Nov | 2019-11-12 |
Semiconductor Component, Package Structure And Manufacturing Method Thereof
App 20190312022 - Chen; Ming-Fa ; et al. | 2019-10-10 |
Packages with Si-substrate-free interposer and method forming same
Grant 10,381,298 - Yu , et al. A | 2019-08-13 |
Semiconductor Device and Method of Manufacture
App 20190244947 - Yu; Chen-Hua ; et al. | 2019-08-08 |
Semiconductor component, package structure and manufacturing method thereof
Grant 10,319,707 - Chen , et al. | 2019-06-11 |
Semiconductor Device and Method of Manufacturing
App 20190164919 - Hu; Chih-Chia ; et al. | 2019-05-30 |
Forming Metal Bonds with Recesses
App 20190148336 - Chen; Ming-Fa ; et al. | 2019-05-16 |
Structure and Formation Method for Chip Package
App 20190148343 - Yu; Chen-Hua ; et al. | 2019-05-16 |
Packages with si-substrate-free interposer and method forming same
Grant 10,290,571 - Yu , et al. | 2019-05-14 |
3D Chip-on-Wafer-on-Substrate Structure with Via Last Process
App 20190139933 - Yu; Chen-Hua ; et al. | 2019-05-09 |
Package Structure for Heat Dissipation
App 20190115277 - Yu; Chen-Hua ; et al. | 2019-04-18 |
Packages with Si-Substrate-Free Interposer and Method Forming Same
App 20190109083 - Yu; Chen-Hua ; et al. | 2019-04-11 |
Semiconductor Component, Package Structure And Manufacturing Method Thereof
App 20190096867 - Chen; Ming-Fa ; et al. | 2019-03-28 |
Packages with Si-Substrate-Free Interposer and Method Forming Same
App 20190088581 - Yu; Chen-Hua ; et al. | 2019-03-21 |
Semiconductor Structure And Manufacturing Method Thereof
App 20190067244 - CHEN; MING-FA ; et al. | 2019-02-28 |
System on Integrated Chips and Methods of Forming Same
App 20190027465 - Yeh; Sung-Feng ; et al. | 2019-01-24 |
Semiconductor structure and method of manufacturing the same
Grant 10,163,799 - Chen , et al. Dec | 2018-12-25 |
Package structure for heat dissipation
Grant 10,163,750 - Yu , et al. Dec | 2018-12-25 |
Structure and formation method for chip package
Grant 10,163,859 - Yu , et al. Dec | 2018-12-25 |
Semiconductor structure and method of manufacturing the same
Grant 10,157,890 - Yu , et al. Dec | 2018-12-18 |
3D chip-on-wafer-on-substrate structure with via last process
Grant 10,157,882 - Yu , et al. Dec | 2018-12-18 |
3DIC Formation with Dies Bonded to Formed RDLs
App 20180323177 - Yu; Chen-Hua ; et al. | 2018-11-08 |
Method For Manufacturing Semiconductor Structure
App 20180308818 - YU; CHEN-HUA ; et al. | 2018-10-25 |
Chip-on-wafer package and method of forming same
Grant 10,096,571 - Yu , et al. October 9, 2 | 2018-10-09 |
System on integrated chips and methods of forming same
Grant 10,074,629 - Yeh , et al. September 11, 2 | 2018-09-11 |
3DIC formation with dies bonded to formed RDLs
Grant 10,026,716 - Yu , et al. July 17, 2 | 2018-07-17 |
Semiconductor structure and method of manufacturing the same
Grant 10,014,271 - Yu , et al. July 3, 2 | 2018-07-03 |
Package Structure for Heat Dissipation
App 20180158749 - Yu; Chen-Hua ; et al. | 2018-06-07 |
Semiconductor Structure And Method Of Manufacturing The Same
App 20180130744 - CHEN; MING-FA ; et al. | 2018-05-10 |
Three-dimensional integrated circuit structure
Grant 9,899,355 - Yuan , et al. February 20, 2 | 2018-02-20 |
Semiconductor device and manufacturing method thereof
Grant 9,875,982 - Chen , et al. January 23, 2 | 2018-01-23 |
Chip-On-Wafer Package and Method of Forming Same
App 20180012862 - Yu; Chen-Hua ; et al. | 2018-01-11 |
Semiconductor Structure And A Manufacturing Method Thereof
App 20180005992 - YU; CHEN-HUA ; et al. | 2018-01-04 |
Semiconductor Package And Manufacturing Method Of The Same
App 20180005940 - CHEN; MING-FA ; et al. | 2018-01-04 |
Semiconductor structure and a manufacturing method thereof
Grant 9,859,254 - Yu , et al. January 2, 2 | 2018-01-02 |
3d Chip-on-wafer-on-substrate Structure With Via Last Process
App 20170365579 - Yu; Chen-Hua ; et al. | 2017-12-21 |
Semiconductor Device And Manufacturing Method Thereof
App 20170352634 - CHEN; MING-FA ; et al. | 2017-12-07 |
Semiconductor Structure And Method Of Manufacturing The Same
App 20170345798 - YU; CHEN-HUA ; et al. | 2017-11-30 |
Chip-on-wafer package and method of forming same
Grant 9,806,055 - Yu , et al. October 31, 2 | 2017-10-31 |
3DIC Formation with Dies Bonded to Formed RDLs
App 20170301650 - Yu; Chen-Hua ; et al. | 2017-10-19 |
3D chip-on-wafer-on-substrate structure with via last process
Grant 9,754,918 - Yu , et al. September 5, 2 | 2017-09-05 |
Semiconductor structure and method of manufacturing the same
Grant 9,741,694 - Yu , et al. August 22, 2 | 2017-08-22 |
Semiconductor Structure And Method Of Manufacturing The Same
App 20170194291 - YU; CHEN-HUA ; et al. | 2017-07-06 |
Semiconductor Structure And Method Of Manufacturing The Same
App 20170148756 - YU; CHEN-HUA ; et al. | 2017-05-25 |
System On Integrated Chips And Methods Of Forming Same
App 20170125376 - Yeh; Sung-Feng ; et al. | 2017-05-04 |
Structure And Formation Method For Chip Package
App 20170117253 - YU; Chen-Hua ; et al. | 2017-04-27 |
Three-dimensional integrated circuit structure and bonded structure
Grant 9,620,488 - Yu , et al. April 11, 2 | 2017-04-11 |
Three-dimensional Integrated Circuit Structure
App 20170092626 - Yuan; Ching-Pin ; et al. | 2017-03-30 |
Three-dimensional Integrated Circuit Structure And Bonded Structure
App 20170053902 - Yu; Chen-Hua ; et al. | 2017-02-23 |
Reticle for non-rectangular die
Grant 9,548,274 - Yu , et al. January 17, 2 | 2017-01-17 |
System on integrated chips and methods of forming same
Grant 9,524,959 - Yeh , et al. December 20, 2 | 2016-12-20 |
Stacked dies with wire bonds and method
Grant 9,508,703 - Yu , et al. November 29, 2 | 2016-11-29 |
Chip-on-wafer Package And Method Of Forming Same
App 20160247779 - Yu; Chen-Hua ; et al. | 2016-08-25 |
Chip-on-wafer package and method of forming same
Grant 9,331,021 - Yu , et al. May 3, 2 | 2016-05-03 |
3d Chip-on-wafer-on-substrate Structure With Via Last Process
App 20150325520 - Yu; Chen-Hua ; et al. | 2015-11-12 |
Stacked Dies With Wire Bonds and Method
App 20150318264 - Yu; Chen-Hua ; et al. | 2015-11-05 |
Chip-on-wafer Package And Method Of Forming Same
App 20150318246 - Yu; Chen-Hua ; et al. | 2015-11-05 |
Cutting mold for rigid-flexible circuit board and method for forming the same
Grant 8,042,445 - Lin , et al. October 25, 2 | 2011-10-25 |
Cutting Mold For Rigid-flexible Circuit Board And Method For Forming The Same
App 20090232925 - Lin; Yu-Lun ; et al. | 2009-09-17 |
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