Yeh; Kung-Chen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yeh; Kung-Chen.The latest application filed is for "package structure and method of fabricating the same".
- Yeh; Kung-Chen - Taichung TW
- Yeh; Kung-Chen - Taichung City TW
| Patent | Date |
|---|---|
| Package structure and method of fabricating the same Grant 11,164,824 - Tsai , et al. November 2, 2 | 2021-11-02 |
| Package Structure And Method Of Fabricating The Same App 20210202436 - Yeh; Kung-Chen ; et al. | 2021-07-01 |
| Package Structure And Method For Forming The Same App 20210167024 - TSAI; Tsung-Fu ; et al. | 2021-06-03 |
| Dummy Die Placement Without Backside Chipping App 20210118817 - Wu; Chih-Wei ; et al. | 2021-04-22 |
| Package Structure And Method Of Fabricating The Same App 20210066211 - Tsai; Tsung-Fu ; et al. | 2021-03-04 |
| Package structure and method for forming the same Grant 10,923,438 - Tsai , et al. February 16, 2 | 2021-02-16 |
| Chip package structure with dummy bump and method for forming the same Grant 10,872,871 - Huang , et al. December 22, 2 | 2020-12-22 |
| Dummy die placement without backside chipping Grant 10,861,799 - Wu , et al. December 8, 2 | 2020-12-08 |
| Dummy Die Placement Without Backside Chipping App 20200365525 - Wu; Chih-Wei ; et al. | 2020-11-19 |
| Package Structure And Method For Forming The Same App 20200343198 - TSAI; Tsung-Fu ; et al. | 2020-10-29 |
| Chip Package Structure With Dummy Bump And Method For Forming The Same App 20200203299 - HUANG; Sung-Hui ; et al. | 2020-06-25 |
| Apparatus for dicing interposer assembly Grant 10,269,731 - Wang , et al. | 2019-04-23 |
| 3D packages and methods for forming the same Grant 9,793,187 - Lin , et al. October 17, 2 | 2017-10-17 |
| Package for three dimensional integrated circuit Grant 9,337,063 - Chen , et al. May 10, 2 | 2016-05-10 |
| 3D Packages and Methods for Forming the Same App 20150357255 - Lin; Shih Ting ; et al. | 2015-12-10 |
| 3D packages and methods for forming the same Grant 9,111,912 - Lin , et al. August 18, 2 | 2015-08-18 |
| Apparatus for Dicing Interposer Assembly App 20150145133 - Wang; Chung Yu ; et al. | 2015-05-28 |
| Apparatus for dicing interposer assembly Grant 8,946,893 - Wang , et al. February 3, 2 | 2015-02-03 |
| 3D Packages and Methods for Forming the Same App 20140353838 - Lin; Shih Ting ; et al. | 2014-12-04 |
| Package for Three Dimensional Integrated Circuit App 20140322866 - Chen; Chih-Hao ; et al. | 2014-10-30 |
| Package for three dimensional integrated circuit Grant 8,772,929 - Chen , et al. July 8, 2 | 2014-07-08 |
| Methods for de-bonding carriers Grant 8,629,043 - Wang , et al. January 14, 2 | 2014-01-14 |
| Apparatus For Dicing Interposer Assembly App 20130285241 - Wang; Chung Yu ; et al. | 2013-10-31 |
| Apparatus and methods for dicing interposer assembly Grant 8,501,590 - Wang , et al. August 6, 2 | 2013-08-06 |
| Package for Three Dimensional Integrated Circuit App 20130119533 - Chen; Chih-Hao ; et al. | 2013-05-16 |
| Methods for De-Bonding Carriers App 20130122689 - Wang; Chung Yu ; et al. | 2013-05-16 |
| Apparatus and Methods for Dicing Interposer Assembly App 20130009316 - Wang; Chung Yu ; et al. | 2013-01-10 |
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