Yeh; Der-Chyang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yeh; Der-Chyang.The latest application filed is for "structure and method of forming a joint assembly".

Company Profile

141.200.200

Yeh; Der-Chyang - Hsinchu TW
Yeh; Der-Chyang - Hsin-Chu TW
YEH; DER-CHYANG - HSINCHU CITY TW
- Hsin-Chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Structure and Method of Forming a Joint Assembly App 20220302069 - Chen; Ying-Ju ; et al.	2022-09-22
Semiconductor devices and methods of manufacturing the same Grant 11,450,612 - Lin , et al. September 20, 2	2022-09-20
Package structures and methods of forming Grant 11,444,057 - Yu , et al. September 13, 2	2022-09-13
Via for semiconductor device connection and methods of forming the same Grant 11,444,020 - Yu , et al. September 13, 2	2022-09-13
Redistribution structure for integrated circuit package and method of forming same Grant 11,444,034 - Yu , et al. September 13, 2	2022-09-13
Integrated Circuit Package Pad and Methods of Forming App 20220285171 - Yu; Chen-Hua ; et al.	2022-09-08
Stacked semiconductor devices and methods of forming same Grant 11,430,670 - Chen , et al. August 30, 2	2022-08-30
Pad structure design in fan-out package Grant 11,424,189 - Yu , et al. August 23, 2	2022-08-23
Package Structure Including A First Die And A Second Die And A Bridge Die And Method Of Forming The Package Structure App 20220223534 - Lin; Yu-Hung ; et al.	2022-07-14
Package Structure App 20220216123 - Wang; Shih-Hui ; et al.	2022-07-07
Semiconductor package and method of forming the same Grant 11,373,969 - Wu , et al. June 28, 2	2022-06-28
Structure and method of forming a joint assembly Grant 11,355,468 - Chen , et al. June 7, 2	2022-06-07
Raised Via for Terminal Connections on Different Planes App 20220165611 - Yu; Chen-Hua ; et al.	2022-05-26
Integrated circuit package pad and methods of forming Grant 11,342,196 - Chen , et al. May 24, 2	2022-05-24
Multi-chip package and method of formation Grant 11,335,658 - Lin , et al. May 17, 2	2022-05-17
Package Structure And Manufacturing Method Thereof App 20220122952 - Chen; Wei-Yu ; et al.	2022-04-21
Package structure and manufacturing method thereof Grant 11,289,398 - Wang , et al. March 29, 2	2022-03-29
Semiconductor Structure App 20220068880 - YU; CHEN-HUA ; et al.	2022-03-03
Raised via for terminal connections on different planes Grant 11,251,071 - Yu , et al. February 15, 2	2022-02-15
Semiconductor Devices And Methods Of Manufacturing The Same App 20220013461 - Lin; Yu-Hung ; et al.	2022-01-13
Package structure and manufacturing method thereof Grant 11,217,570 - Chen , et al. January 4, 2	2022-01-04
Semiconductor package, package on package structure and method of froming package on package structure Grant 11,201,142 - Huang , et al. December 14, 2	2021-12-14
Packages and Methods of Forming Packages App 20210375842 - Yu; Chen-Hua ; et al.	2021-12-02
Semiconductor packages and methods of forming same Grant 11,189,603 - Yu , et al. November 30, 2	2021-11-30
Redistribution Structure For Integrated Circuit Package And Method Of Forming Same App 20210358854 - Yu; Chen-Hua ; et al.	2021-11-18
Semiconductor structure Grant 11,177,238 - Yu , et al. November 16, 2	2021-11-16
Method for dicing integrated fan-out packages without seal rings Grant 11,177,142 - Huang , et al. November 16, 2	2021-11-16
Redistribution Layer Structures For Integrated Circuit Package App 20210351130 - CHEN; Jie ; et al.	2021-11-11
Semiconductor Package And Method Of Manufacturing The Same App 20210351117 - Huang; Li-Hsien ; et al.	2021-11-11
Semiconductor Package and Method App 20210343626 - Chen; Wei-Yu ; et al.	2021-11-04
Redistribution layers in semiconductor packages and methods of forming same Grant 11,158,619 - Huang , et al. October 26, 2	2021-10-26
Package with UBM and methods of forming Grant 11,152,323 - Yu , et al. October 19, 2	2021-10-19
Wafer Level Chip Scale Packaging Intermediate Structure Apparatus and Method App 20210305086 - Yu; Chen-Hua ; et al.	2021-09-30
Semiconductor Package And Manufacturing Method Thereof App 20210305122 - Lai; Wei-Chih ; et al.	2021-09-30
Package with bridge die for interconnection and method forming same Grant 11,133,258 - Yu , et al. September 28, 2	2021-09-28
Semiconductor Device and Method App 20210281037 - Yu; Chen-Hua ; et al.	2021-09-09
Packages and methods of forming packages Grant 11,094,680 - Yu , et al. August 17, 2	2021-08-17
Semiconductor package and method of manufacturing the same Grant 11,075,150 - Huang , et al. July 27, 2	2021-07-27
Method for forming package structure Grant 11,069,625 - Hsieh , et al. July 20, 2	2021-07-20
Chip on Package Structure and Method App 20210217726 - Yu; Chen-Hua ; et al.	2021-07-15
Package With Metal-insulator-metal Capacitor And Method Of Manufacturing The Same App 20210217691 - Chen; Shuo-Mao ; et al.	2021-07-15
Semiconductor package and method Grant 11,062,978 - Chen , et al. July 13, 2	2021-07-13
Packages with metal line crack prevention design Grant 11,056,464 - Yu , et al. July 6, 2	2021-07-06
Redistribution layer structures for integrated circuit package Grant 11,056,433 - Chen , et al. July 6, 2	2021-07-06
Redistribution Layers in Semiconductor Packages and Methods of Forming Same App 20210193618 - Hsieh; Cheng-Hsien ; et al.	2021-06-24
Fan-Out Structure and Method of Fabricating the Same App 20210193485 - Yu; Chen-Hua ; et al.	2021-06-24
Semiconductor Structure And Method Manufacturing The Same App 20210183813 - Yeh; Der-Chyang ; et al.	2021-06-17
Opening in the Pad for Bonding Integrated Passive Device in InFO Package App 20210185810 - Hsieh; Cheng-Hsien ; et al.	2021-06-17
Wafer level chip scale packaging intermediate structure apparatus and method Grant 11,037,819 - Yu , et al. June 15, 2	2021-06-15
Interconnect structure for package-on-package devices Grant 11,037,861 - Hung , et al. June 15, 2	2021-06-15
Dummy features in redistribution layers (RDLS) and methods of forming same Grant 11,018,088 - Hsieh , et al. May 25, 2	2021-05-25
Underfill control structures and method Grant 11,018,069 - Chen , et al. May 25, 2	2021-05-25
Package with passive devices and method of forming the same Grant 11,004,818 - Chen , et al. May 11, 2	2021-05-11
Semiconductor device and method Grant 10,992,100 - Yu , et al. April 27, 2	2021-04-27
Chip Package And Method Of Fabricating The Same App 20210111120 - Chen; Guan-Yu ; et al.	2021-04-15
Stacked Semiconductor Devices And Methods Of Forming Same App 20210104416 - Chen; Hsien-Wei ; et al.	2021-04-08
Multi-chip structure and method of forming same Grant 10,971,371 - Yu , et al. April 6, 2	2021-04-06
Package with metal-insulator-metal capacitor and method of manufacturing the same Grant 10,971,441 - Chen , et al. April 6, 2	2021-04-06
Package Structure And Manufacturing Method Thereof App 20210098330 - Wang; Shih-Hui ; et al.	2021-04-01
Chip on package structure and method Grant 10,964,666 - Yu , et al. March 30, 2	2021-03-30
Package structure and method of forming the same Grant 10,950,575 - Yu , et al. March 16, 2	2021-03-16
Redistribution layers in semiconductor packages and methods of forming same Grant 10,950,577 - Hsieh , et al. March 16, 2	2021-03-16
Fan-out structure and method of fabricating the same Grant 10,943,798 - Yu , et al. March 9, 2	2021-03-09
Opening in the pad for bonding integrated passive device in InFO package Grant 10,939,551 - Hsieh , et al. March 2, 2	2021-03-02
Semiconductor Package for Thermal Dissipation App 20210057387 - Yu; Chen-Hua ; et al.	2021-02-25
Integrated Circuit Package Pad and Methods of Forming App 20210035819 - Chen; Hsien-Wei ; et al.	2021-02-04
Devices Employing Thermal And Mechanical Enhanced Layers And Methods Of Forming Same App 20210035953 - Yu; Chen-Hua ; et al.	2021-02-04
Package with Bridge Die For Interconnection and Method Forming Same App 20210020574 - Yu; Chen-Hua ; et al.	2021-01-21
Multi-Stacked Package-on-Package Structures App 20210005556 - Yu; Chen-Hua ; et al.	2021-01-07
Package structure, die and method of manufacturing the same Grant 10,879,224 - Chen , et al. December 29, 2	2020-12-29
Electric magnetic shielding structure in packages Grant 10,872,865 - Yu , et al. December 22, 2	2020-12-22
Chip package and method of fabricating the same Grant 10,872,855 - Chen , et al. December 22, 2	2020-12-22
Dummy metal with zigzagged edges Grant 10,867,900 - Hsieh , et al. December 15, 2	2020-12-15
Semiconductor device and manufacturing method thereof Grant 10,867,928 - Lu , et al. December 15, 2	2020-12-15
Semiconductor Package and Method of Forming the Same App 20200373266 - Wu; Chi-Hsi ; et al.	2020-11-26
Stacked semiconductor devices and methods of forming same Grant 10,847,383 - Chen , et al. November 24, 2	2020-11-24
Semiconductor Package and Method of Forming the Same App 20200343193 - Hsieh; Cheng-Hsien ; et al.	2020-10-29
Devices employing thermal and mechanical enhanced layers and methods of forming same Grant 10,811,394 - Yu , et al. October 20, 2	2020-10-20
Semiconductor package for thermal dissipation Grant 10,811,389 - Yu , et al. October 20, 2	2020-10-20
Package with Passive Devices and Method of Forming the Same App 20200328174 - Chen; Shuo-Mao ; et al.	2020-10-15
Integrated circuit package pad and methods of forming Grant 10,796,927 - Chen , et al. October 6, 2	2020-10-06
Semiconductor package and rework process for the same Grant 10,797,038 - Yu , et al. October 6, 2	2020-10-06
Multi-stacked package-on-package structures Grant 10,784,207 - Yu , et al. Sept	2020-09-22
Package Structures and Methods of Forming App 20200294967 - Yu; Chen-Hua ; et al.	2020-09-17
Wafer Level Chip Scale Packaging Intermediate Structure Apparatus and Method App 20200294845 - Yu; Chen-Hua ; et al.	2020-09-17
Redistribution Layer Structures For Integrated Circuit Package App 20200286830 - CHEN; Jie ; et al.	2020-09-10
Multi-Chip Structure and Method of Forming Same App 20200286741 - Yu; Chen-Hua ; et al.	2020-09-10
Package structure and fabricating method thereof Grant 10,756,037 - Huang , et al. A	2020-08-25
Fan-Out Structure and Method of Fabricating the Same App 20200258760 - A1	2020-08-13
Semiconductor package and method of forming the same Grant 10,741,512 - Wu , et al. A	2020-08-11
Raised Via for Terminal Connections on Different Planes App 20200251380 - Kind Code	2020-08-06
Package Structure And Manufacturing Method Thereof App 20200251456 - Kind Code	2020-08-06
Via for Semiconductor Device Connection and Methods of Forming the Same App 20200243442 - Yu; Chen-Hua ; et al.	2020-07-30
Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same Grant 10,720,409 - Yu , et al.	2020-07-21
Semiconductor package and method of forming the same Grant 10,714,426 - Hsieh , et al.	2020-07-14
Package with passive devices and method of forming the same Grant 10,700,032 - Chen , et al.	2020-06-30
Surface mount device/integrated passive device on package or device structure and methods of forming Grant 10,700,045 - Hsieh , et al.	2020-06-30
Redistribution Layers in Semiconductor Packages and Methods of Forming Same App 20200176432 - Huang; Li-Hsien ; et al.	2020-06-04
Package structures and methods of forming Grant 10,672,738 - Yu , et al.	2020-06-02
Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same Grant 10,672,741 - Yu , et al.	2020-06-02
Wafer level chip scale packaging intermediate structure apparatus and method Grant 10,672,647 - Yu , et al.	2020-06-02
Multi-chip structure and method of forming same Grant 10,665,468 - Yu , et al.	2020-05-26
Redistribution layer structures for integrated circuit package Grant 10,665,540 - Chen , et al.	2020-05-26
Packages and packaging methods for semiconductor devices, and packaged semiconductor devices Grant 10,658,337 - Yu , et al.	2020-05-19
Fan-out structure and method of fabricating the same Grant 10,643,864 - Yu , et al.	2020-05-05
Structure and method of forming a joint assembly Grant 10,643,965 - Chen , et al.	2020-05-05
Package Structure, Die And Method Of Manufacturing The Same App 20200135708 - Chen; Wei-Yu ; et al.	2020-04-30
Package structure and manufacturing method thereof Grant 10,636,775 - Chen , et al.	2020-04-28
Conductive vias in semiconductor packages and methods of forming same Grant 10,629,537 - Hsieh , et al.	2020-04-21
Raised via for terminal connections on different planes Grant 10,629,477 - Yu , et al.	2020-04-21
Packages and Methods of Forming Packages App 20200118987 - Yu; Chen-Hua ; et al.	2020-04-16
Semiconductor Structure App 20200118974 - YU; CHEN-HUA ; et al.	2020-04-16
Via for semiconductor device connection and methods of forming the same Grant 10,622,302 - Yu , et al.	2020-04-14
Pad Structure Design in Fan-Out Package App 20200091075 - Yu; Chen-Hua ; et al.	2020-03-19
Alignment Mark Design for Packages App 20200091086 - Huang; Li-Hsien ; et al.	2020-03-19
Semiconductor Package and Method of Forming the Same App 20200083187 - Wu; Chi-Hsi ; et al.	2020-03-12
Dummy Metal with Zigzagged Edges App 20200083156 - Hsieh; Cheng-Hsien ; et al.	2020-03-12
Interconnect Structure for Package-on-Package Devices App 20200083145 - Hung; Jui-Pin ; et al.	2020-03-12
Integrated Circuit Package Pad and Methods of Forming App 20200083061 - Chen; Hsien-Wei ; et al.	2020-03-12
Surface Mount Device/Integrated Passive Device on Package or Device Structure and Methods of Forming App 20200075563 - Hsieh; Cheng-Hsien ; et al.	2020-03-05
Multi-Stacked Package-on-Package Structures App 20200066643 - Yu; Chen-Hua ; et al.	2020-02-27
Stacked Semiconductor Devices and Methods of Forming Same App 20200066548 - Chen; Hsien-Wei ; et al.	2020-02-27
Redistribution Layers in Semiconductor Packages and Methods of Forming Same App 20200058616 - Hsieh; Cheng-Hsien ; et al.	2020-02-20
Semiconductor Device And Manufacturing Method Thereof App 20200043855 - Lu; Kuan-Chung ; et al.	2020-02-06
Semiconductor Package and Method App 20200035584 - Chen; Wei-Yu ; et al.	2020-01-30
Package structure and method of forming the same Grant 10,541,226 - Yu , et al. Ja	2020-01-21
Package With Metal-insulator-metal Capacitor And Method Of Manufacturing The Same App 20200020623 - Chen; Shuo-Mao ; et al.	2020-01-16
Semiconductor Device and Method App 20200014169 - Yu; Chen-Hua ; et al.	2020-01-09
Semiconductor packages and methods of forming same Grant 10,529,698 - Yu , et al. J	2020-01-07
Semiconductor package and method Grant 10,529,650 - Chen , et al. J	2020-01-07
Chip Package And Method Of Fabricating The Same App 20200006219 - Chen; Guan-Yu ; et al.	2020-01-02
Electric Magnetic Shielding Structure in Packages App 20200006248 - Yu; Chen-Hua ; et al.	2020-01-02
Structure and Method of Forming a Joint Assembly App 20200006276 - Chen; Ying-Ju ; et al.	2020-01-02
Underfill Control Structures and Method App 20200006179 - Chen; Ying-Ju ; et al.	2020-01-02
Alignment mark design for packages Grant 10,522,473 - Huang , et al. Dec	2019-12-31
Semiconductor package and method of forming the same Grant 10,522,490 - Wu , et al. Dec	2019-12-31
Interconnect structure for package-on-package devices Grant 10,515,875 - Hung , et al. Dec	2019-12-24
Underfill control structures and method Grant 10,515,865 - Chen , et al. Dec	2019-12-24
Stacked semiconductor devices and methods of forming same Grant 10,510,562 - Chen , et al. Dec	2019-12-17
Integrated circuit package pad and methods of forming Grant 10,510,556 - Chen , et al. Dec	2019-12-17
Pad structure design in fan-out package Grant 10,510,670 - Yu , et al. Dec	2019-12-17
Dummy metal with zigzagged edges Grant 10,510,654 - Hsieh , et al. Dec	2019-12-17
Chip on package structure and method Grant 10,510,717 - Yu , et al. Dec	2019-12-17
Semiconductor structure and manufacturing method thereof Grant 10,510,715 - Yu , et al. Dec	2019-12-17
Packages and methods of forming packages Grant 10,510,735 - Yu , et al. Dec	2019-12-17
Surface mount device/integrated passive device on package or device structure and methods of forming Grant 10,504,877 - Hsieh , et al. Dec	2019-12-10
Package with Passive Devices and Method of Forming the Same App 20190363062 - Chen; Shuo-Mao ; et al.	2019-11-28
Package Structure And Fabricating Method Thereof App 20190355687 - Huang; Li-Hsien ; et al.	2019-11-21
Semicondcutor Package And Method Of Manufacturing The Same App 20190348353 - Huang; Li-Hsien ; et al.	2019-11-14
Redistribution Layer Structures For Integrated Circuit Package App 20190348366 - CHEN; Jie ; et al.	2019-11-14
Redistribution layers in semiconductor packages and methods of forming same Grant 10,475,768 - Hsieh , et al. Nov	2019-11-12
Package with metal-insulator-metal capacitor and method of manufacturing the same Grant 10,475,731 - Chen , et al. Nov	2019-11-12
Via For Component Electrode Connection App 20190341306 - Yu; Chen-Hua ; et al.	2019-11-07
Multi-stacked package-on-package structures Grant 10,461,036 - Yu , et al. Oc	2019-10-29
Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same App 20190326259 - Yu; Chen-Hua ; et al.	2019-10-24
Dummy Features in Redistribution Layers (RDLS) and Methods of Forming Same App 20190295955 - Hsieh; Cheng-Hsien ; et al.	2019-09-26
Fan-Out Structure and Method of Fabricating the Same App 20190273001 - Yu; Chen-Hua ; et al.	2019-09-05
Raised Via for Terminal Connections on Different Planes App 20190273018 - Yu; Chen-Hua ; et al.	2019-09-05
Integrated Circuit Package Pad and Methods of Forming App 20190259630 - Chen; Hsien-Wei ; et al.	2019-08-22
Interconnect Structure for Package-on-Package Devices and a Method of Fabricating App 20190252296 - Hung; Jui-Pin ; et al.	2019-08-15
Via for Semiconductor Device Connection and Methods of Forming the Same App 20190252312 - Yu; Chen-Hua ; et al.	2019-08-15
Package with UBM and Methods of Forming App 20190252341 - Yu; Chen-Hua ; et al.	2019-08-15
Package with passive devices and method of forming the same Grant 10,373,923 - Chen , et al.	2019-08-06
Redistribution layer structures for integrated circuit package Grant 10,366,953 - Chen , et al. July 30, 2	2019-07-30
Package With Metal-insulator-metal Capacitor And Method Of Manufacturing The Same App 20190229048 - Chen; Shuo-Mao ; et al.	2019-07-25
Devices employing thermal and mechanical enhanced layers and methods of forming same Grant 10,347,606 - Yu , et al. July 9, 2	2019-07-09
Dummy features in redistribution layers (RDLS) and methods of forming same Grant 10,319,681 - Hsieh , et al.	2019-06-11
Multi-stacked package-on-package structures Grant 10,319,683 - Yu , et al.	2019-06-11
Integrated Fan-out Packages And Methods Of Forming The Same App 20190164783 - Huang; Li-Hsien ; et al.	2019-05-30
Redistribution layers in semiconductor packages and methods of forming same Grant 10,304,801 - Huang , et al.	2019-05-28
Fan-out structure and method of fabricating the same Grant 10,297,471 - Yu , et al.	2019-05-21
Raised via for terminal connections on different planes Grant 10,297,494 - Yu , et al.	2019-05-21
Stacked Semiconductor Devices and Methods of Forming Same App 20190148171 - Chen; Hsien-Wei ; et al.	2019-05-16
Semiconductor Package and Method App 20190148267 - Chen; Wei-Yu ; et al.	2019-05-16
Conductive vias in semiconductor packages and methods of forming same Grant 10,290,584 - Hsieh , et al.	2019-05-14
PoP device and method of forming the same Grant 10,290,610 - Huang , et al.	2019-05-14
Multi-Chip Package and Method of Formation App 20190139922 - Lin; Jing-Cheng ; et al.	2019-05-09
Integrated circuit package pad and methods of forming Grant 10,283,375 - Chen , et al.	2019-05-07
Semiconductor Package for Thermal Dissipation App 20190131280 - Yu; Chen-Hua ; et al.	2019-05-02
Method For Forming Package Structure App 20190131249 - HSIEH; Cheng-Hsien ; et al.	2019-05-02
Package Structure And Manufacturing Method Thereof App 20190131283 - Chen; Wei-Yu ; et al.	2019-05-02
Package with metal-insulator-metal capacitor and method of manufacturing the same Grant 10,276,484 - Chen , et al.	2019-04-30
Dummy Metal with Zigzagged Edges App 20190122975 - Hsieh; Cheng-Hsien ; et al.	2019-04-25
Interconnect structure for package-on-package devices Grant 10,269,685 - Hung , et al.	2019-04-23
Alignment mark design for packages Grant 10,269,723 - Huang , et al.	2019-04-23
Wafer level chip scale packaging intermediate structure apparatus and method Grant 10,269,619 - Yu , et al.	2019-04-23
Package with UBM and methods of forming Grant 10,269,752 - Yu , et al.	2019-04-23
Conductive Vias in Semiconductor Packages and Methods of Forming Same App 20190115299 - Hsieh; Cheng-Hsien ; et al.	2019-04-18
Multi-Stacked Package-on-Package Structures App 20190115300 - Yu; Chen-Hua ; et al.	2019-04-18
Packages and Methods of Forming Packages App 20190115332 - Yu; Chen-Hua ; et al.	2019-04-18
Surface Mount Device/integrated Passive Device On Package Or Device Structure And Methods Of Forming App 20190096860 - Hsieh; Cheng-Hsien ; et al.	2019-03-28
Semiconductor Packages and Methods of Forming Same App 20190096862 - Yu; Chen-Hua ; et al.	2019-03-28
Opening in the Pad for Bonding Integrated Passive Device in InFO Package App 20190098756 - Hsieh; Cheng-Hsien ; et al.	2019-03-28
Pop Device And Method Of Forming The Same App 20190067249 - Huang; Li-Hsien ; et al.	2019-02-28
Semicondcutor Package, Package On Package Structure And Method Of Froming Package On Package Structure App 20190035772 - Huang; Li-Hsien ; et al.	2019-01-31
Package structures and methods of forming Grant 10,177,115 - Yu , et al. J	2019-01-08
Package Structures and Methods of Forming App 20190006317 - Yu; Chen-Hua ; et al.	2019-01-03
Multi-Chip Structure and Method of Forming Same App 20190006187 - Yu; Chen-Hua ; et al.	2019-01-03
Chip on Package Structure and Method App 20180374822 - Yu; Chen-Hua ; et al.	2018-12-27
Semiconductor Packages with Thermal-Electrical-Mechanical Chips and Methods of Forming the Same App 20180374824 - Yu; Chen-Hua ; et al.	2018-12-27
Stacked semiconductor devices and methods of forming same Grant 10,163,661 - Chen , et al. Dec	2018-12-25
Alignment pattern for package singulation Grant 10,163,807 - Chen , et al. Dec	2018-12-25
Integrated fan-out packages and methods of forming the same Grant 10,163,803 - Chen , et al. Dec	2018-12-25
Opening in the pad for bonding integrated passive device in InFO package Grant 10,165,682 - Hsieh , et al. Dec	2018-12-25
Multi-chip package and method of formation Grant 10,163,841 - Lin , et al. Dec	2018-12-25
Package structure and method for forming the same Grant 10,163,805 - Hsieh , et al. Dec	2018-12-25
Semiconductor package for thermal dissipation Grant 10,163,861 - Yu , et al. Dec	2018-12-25
Semiconductor Package and Method of Forming the Same App 20180366412 - Hsieh; Cheng-Hsien ; et al.	2018-12-20
Integrated Fan-out Packages And Methods Of Forming The Same App 20180366410 - Chen; Wei-Yu ; et al.	2018-12-20
Packages and methods of forming packages Grant 10,157,899 - Yu , et al. Dec	2018-12-18
Multi-stacked package-on-package structures Grant 10,157,852 - Yu , et al. Dec	2018-12-18
Dummy metal with zigzagged edges Grant 10,157,825 - Hsieh , et al. Dec	2018-12-18
Package with metal-insulator-metal capacitor and method of manufacturing the same Grant 10,153,205 - Yu , et al. Dec	2018-12-11
Method of manufacturing a capacitor Grant 10,153,338 - Chang , et al. Dec	2018-12-11
Conductive Vias In Semiconductor Packages And Methods Of Forming Same App 20180350745 - Hsieh; Cheng-Hsien ; et al.	2018-12-06
Semiconductor Package and Method of Forming the Same App 20180342474 - Wu; Chi-Hsi ; et al.	2018-11-29
Wafer Level Chip Scale Packaging Intermediate Structure Apparatus and Method App 20180342414 - Yu; Chen-Hua ; et al.	2018-11-29
Surface mount device/integrated passive device on package or device structure and methods of forming Grant 10,141,288 - Hsieh , et al. Nov	2018-11-27
Packages and Packaging Methods for Semiconductor Devices, and Packaged Semiconductor Devices App 20180337163 - Yu; Chen-Hua ; et al.	2018-11-22
Package Structure and Method of Forming the Same App 20180331069 - Yu; Chen-Hua ; et al.	2018-11-15
Multi-Stacked Package-on-Package Structures App 20180323150 - Yu; Chen-Hua ; et al.	2018-11-08
Dummy Features in Redistribution Layers (RDLS) and Methods of Forming Same App 20180294228 - Hsieh; Cheng-Hsien ; et al.	2018-10-11
Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same App 20180277520 - Yu; Chen-Hua ; et al.	2018-09-27
Package-on-package semiconductor device Grant 10,083,940 - Yu , et al. September 25, 2	2018-09-25
Semiconductor Packages And Methods Of Forming Same App 20180269188 - Yu; Chen-Hua ; et al.	2018-09-20
Packages and packaging methods for semiconductor devices, and packaged semiconductor devices Grant 10,074,631 - Yu , et al. September 11, 2	2018-09-11
Semiconductor package and method of forming the same Grant 10,062,648 - Hsieh , et al. August 28, 2	2018-08-28
Semiconductor device packages, packaging methods, and packaged semiconductor devices Grant 10,049,898 - Chen , et al. August 14, 2	2018-08-14
Multi-Stacked Package-on-Package Structures App 20180226349 - Yu; Chen-Hua ; et al.	2018-08-09
Multi-chip structure and method of forming same Grant 10,037,892 - Yu , et al. July 31, 2	2018-07-31
Package structure and method of forming the same Grant 10,037,963 - Chen , et al. July 31, 2	2018-07-31
Raised Via for Terminal Connections on Different Planes App 20180211912 - Yu; Chen-Hua ; et al.	2018-07-26
Interconnect Structure for Package-on-Package Devices and a Method of Fabricating App 20180211901 - Hung; Jui-Pin ; et al.	2018-07-26
Package With Metal-insulator-metal Capacitor And Method Of Manufacturing The Same App 20180211908 - Chen; Shuo-Mao ; et al.	2018-07-26
Semiconductor package and method of forming the same Grant 10,026,704 - Wu , et al. July 17, 2	2018-07-17
Packages with Metal Line Crack Prevention Design App 20180197839 - Yu; Chen-Hua ; et al.	2018-07-12
Fan-out Structure And Method Of Fabricating The Same App 20180174865 - Yu; Chen-Hua ; et al.	2018-06-21
Dummy features in redistribution layers (RDLS) and methods of forming same Grant 9,997,464 - Hsieh , et al. June 12, 2	2018-06-12
Redistribution Layer Structures For Integrated Circuit Package App 20180158777 - CHEN; Jie ; et al.	2018-06-07
Package Structure And Method Of Forming The Same App 20180151530 - Chen; Jie ; et al.	2018-05-31
Alignment Pattern for Package Singulation App 20180151507 - Chen; Ying-Ju ; et al.	2018-05-31
Devices employing thermal and mechanical enhanced layers and methods of forming same Grant 9,984,998 - Yu , et al. May 29, 2	2018-05-29
Semiconductor devices, multi-die packages, and methods of manufacure thereof Grant 9,984,969 - Yu , et al. May 29, 2	2018-05-29
Redistribution Layers in Semiconductor Packages and Methods of Forming Same App 20180122774 - Huang; Li-Hsien ; et al.	2018-05-03
Package with metal-insulator-metal capacitor and method of manufacturing the same Grant 9,960,106 - Chen , et al. May 1, 2	2018-05-01
Underfill Control Structures and Method App 20180102299 - Chen; Ying-Ju ; et al.	2018-04-12
Packages with metal line crack prevention design Grant 9,929,126 - Yu , et al. March 27, 2	2018-03-27
Semiconductor Package and Method of Forming the Same App 20180082964 - Wu; Chi-Hsi ; et al.	2018-03-22
Package with Passive Devices and Method of Forming the Same App 20180082966 - Chen; Shuo-Mao ; et al.	2018-03-22
Interconnect structure for package-on-package devices and a method of fabricating Grant 9,922,903 - Hung , et al. March 20, 2	2018-03-20
Redistribution Layers in Semiconductor Packages and Methods of Forming Same App 20180076175 - Hsieh; Cheng-Hsien ; et al.	2018-03-15
Semiconductor devices, method for fabricating integrated fan-out packages, and method for fabricating semiconductor devices Grant 9,911,672 - Wu , et al. March 6, 2	2018-03-06
Integrated Circuit Package Pad and Methods of Forming App 20180061668 - Chen; Hsien-Wei ; et al.	2018-03-01
Semiconductor Packages With Thermal-electrical-mechanical Chips And Methods Of Forming The Same App 20180053746 - Yu; Chen-Hua ; et al.	2018-02-22
Package Structure And Method Of Forming The Same App 20180033771 - Yu; Chen-Hua ; et al.	2018-02-01
Package Structure And Method For Forming The Same App 20180005955 - HSIEH; Cheng-Hsien ; et al.	2018-01-04
Testing, manufacturing, and packaging methods for semiconductor devices Grant 9,852,957 - Huang , et al. December 26, 2	2017-12-26
Underfill control structures and method Grant 9,842,788 - Chen , et al. December 12, 2	2017-12-12
Testing, Manufacturing, and Packaging Methods for Semiconductor Devices App 20170345726 - Huang; Li-Hsien ; et al.	2017-11-30
Integrated Fan-out Package And Method Of Fabricating The Same App 20170345741 - Wu; Chi-Hsi ; et al.	2017-11-30
Structure and Method of Forming a Joint Assembly App 20170345786 - Chen; Ying-Ju ; et al.	2017-11-30
Package with passive devices and method of forming the same Grant 9,831,200 - Chen , et al. November 28, 2	2017-11-28
EMI package and method for making same Grant 9,818,698 - Wang , et al. November 14, 2	2017-11-14
Integrated circuit package pad and methods of forming Grant 9,812,337 - Chen , et al. November 7, 2	2017-11-07
Integrated fan-out package and method of fabricating the same Grant 9,812,381 - Wu , et al. November 7, 2	2017-11-07
Dummy Features In Redistribution Layers (rdls) And Methods Of Forming Same App 20170317029 - Hsieh; Cheng-Hsien ; et al.	2017-11-02
Chip on Package Structure and Method App 20170309596 - Yu; Chen-Hua ; et al.	2017-10-26
Alignment Mark Design for Packages App 20170287845 - Huang; Li-Hsien ; et al.	2017-10-05
Package-on-package Semiconductor Device App 20170278827 - Yu; Chen-Hua ; et al.	2017-09-28
Semiconductor package and method of forming the same Grant 9,768,133 - Wu , et al. September 19, 2	2017-09-19
Semiconductor Devices, Multi-Die Packages, and Methods of Manufacture Thereof App 20170256487 - Yu; Chen-Hua ; et al.	2017-09-07
Alignment Mark Design for Packages App 20170250139 - Huang; Li-Hsien ; et al.	2017-08-31
Multi-Chip Structure and Method of Forming Same App 20170250090 - Yu; Chen-Hua ; et al.	2017-08-31
Semiconductor Package And Rework Process For The Same App 20170250171 - Yu; Chen-Hua ; et al.	2017-08-31
Semiconductor Package And Method Of Forming The Same App 20170250138 - Hsieh; Cheng-Hsien ; et al.	2017-08-31
Multi-chip package structure and method of forming same Grant 9,748,189 - Hung , et al. August 29, 2	2017-08-29
Redistribution layers in semiconductor packages and methods of forming same Grant 9,741,690 - Hsieh , et al. August 22, 2	2017-08-22
Semiconductor packages and methods of forming the same Grant 9,735,129 - Chen , et al. August 15, 2	2017-08-15
Method Of Manufacturing A Capacitor App 20170229534 - CHANG; Chun Hua ; et al.	2017-08-10
Packages And Methods Of Forming Packages App 20170229436 - Yu; Chen-Hua ; et al.	2017-08-10
Chip on package structure and method Grant 9,704,826 - Yu , et al. July 11, 2	2017-07-11
Underfill Control Structures and Method App 20170194226 - Chen; Ying-Ju ; et al.	2017-07-06
Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same App 20170194292 - Yu; Chen-Hua ; et al.	2017-07-06
Opening in the Pad for Bonding Integrated Passive Device in InFO Package App 20170188458 - Hsieh; Cheng-Hsien ; et al.	2017-06-29
Package-on-package semiconductor device Grant 9,685,426 - Yu , et al. June 20, 2	2017-06-20
Semiconductor Structure And Manufacturing Method Thereof App 20170170145 - YU; CHEN-HUA ; et al.	2017-06-15
Chip on package structure and method Grant 9,679,839 - Su , et al. June 13, 2	2017-06-13
Semiconductor Device Packages, Packaging Methods, and Packaged Semiconductor Devices App 20170154794 - Chen; Hsien-Wei ; et al.	2017-06-01
Alignment mark design for packages Grant 9,666,522 - Huang , et al. May 30, 2	2017-05-30
Semiconductor devices, multi-die packages, and methods of manufacture thereof Grant 9,659,863 - Yu , et al. May 23, 2	2017-05-23
Method of manufacturing a capacitor Grant 9,660,016 - Chang , et al. May 23, 2	2017-05-23
Multi-chip structure and method of forming same Grant 9,653,433 - Yu , et al. May 16, 2	2017-05-16
Pad Structure Design in Fan-Out Package App 20170133322 - Yu; Chen-Hua ; et al.	2017-05-11
Packages and methods of forming packages Grant 9,646,955 - Yu , et al. May 9, 2	2017-05-09
Semiconductor Device And Manufacturing Method Thereof App 20170110438 - CHEN; YU-JEN ; et al.	2017-04-20
Semiconductor device and manufacturing method thereof Grant 9,620,482 - Chen , et al. April 11, 2	2017-04-11
Dummy Metal with Zigzagged Edges App 20170084529 - Hsieh; Cheng-Hsien ; et al.	2017-03-23
Pad structure design in fan-out package Grant 9,576,926 - Yu , et al. February 21, 2	2017-02-21
Smd/ipd On Package Or Device Structure And Methods Of Forming App 20170033090 - Hsieh; Cheng-Hsien ; et al.	2017-02-02
Semiconductor device packages, packaging methods, and packaged semiconductor devices Grant 9,558,966 - Chen , et al. January 31, 2	2017-01-31
Interconnect Structure for Package-on-Package Devices and a Method of Fabricating App 20170025397 - Hung; Jui-Pin ; et al.	2017-01-26
Electric Magnetic Shielding Structure in Packages App 20170025364 - Yu; Chen-Hua ; et al.	2017-01-26
3D packages and methods for forming the same Grant 9,553,070 - Yu , et al. January 24, 2	2017-01-24
Stacked Semiconductor Devices and Methods of Forming Same App 20170005035 - Chen; Hsien-Wei ; et al.	2017-01-05
Semiconductor Package for Thermal Dissipation App 20160358894 - Yu; Chen-Hua ; et al.	2016-12-08
Fan-out package structure and methods for forming the same Grant 9,502,386 - Yu , et al. November 22, 2	2016-11-22
Dummy metal with zigzagged edges Grant 9,502,343 - Hsieh , et al. November 22, 2	2016-11-22
Chip on Package Structure and Method App 20160293577 - Yu; Chen-Hua ; et al.	2016-10-06
Interconnect structure for package-on-package devices and a method of fabricating Grant 9,460,987 - Hung , et al. October 4, 2	2016-10-04
Electric magnetic shielding structure in packages Grant 9,461,025 - Yu , et al. October 4, 2	2016-10-04
Semiconductor package including an embedded surface mount device and method of forming the same Grant 9,461,020 - Yeh , et al. October 4, 2	2016-10-04
Package-on-package Semiconductor Device App 20160284669 - Yu; Chen-Hua ; et al.	2016-09-29
Semiconductor package for thermal dissipation Grant 9,449,947 - Yu , et al. September 20, 2	2016-09-20
Package-on-package semiconductor device Grant 9,418,977 - Yu , et al. August 16, 2	2016-08-16
Structure and method for 3D IC package Grant 9,412,678 - Hou , et al. August 9, 2	2016-08-09
Multi-Chip Structure and Method of Forming Same App 20160211244 - Yu; Chen-Hua ; et al.	2016-07-21
Multiple silicide integration structure and method Grant 9,391,067 - Yeh , et al. July 12, 2	2016-07-12
Chip on package structure and method Grant 9,373,527 - Yu , et al. June 21, 2	2016-06-21
Integrated Circuit Package Pad And Methods Of Forming App 20160163566 - Chen; Hsien-Wei ; et al.	2016-06-09
Semiconductor Devices, Multi-Die Packages, and Methods of Manufacture Thereof App 20160155730 - Yu; Chen-Hua ; et al.	2016-06-02
Package With Metal-insulator-metal Capacitor And Method Of Manufacturing The Same App 20160118301 - Yu; Chen-Hua ; et al.	2016-04-28
Multi-chip structure and method of forming same Grant 9,324,698 - Yu , et al. April 26, 2	2016-04-26
Through silicon via (TSV) isolation structures for noise reduction in 3D integrated circuit Grant 9,305,864 - Horng , et al. April 5, 2	2016-04-05
Package with UBM and Methods of Forming App 20160079190 - Yu; Chen-Hua ; et al.	2016-03-17
Semiconductor Package Including An Embedded Surface Mount Device And Method Of Forming The Same App 20160079171 - Yeh; Der-Chyang ; et al.	2016-03-17
Packages and Methods of Forming Packages App 20160071829 - Yu; Chen-Hua ; et al.	2016-03-10
Package Structures And Methods Of Forming App 20160071820 - Yu; Chen-Hua ; et al.	2016-03-10
Bead for 2.5D/3D chip packaging application Grant 9,275,950 - Kuo , et al. March 1, 2	2016-03-01
Band pass filter for 2.5D/3D integrated circuit applications Grant 9,275,923 - Kuo , et al. March 1, 2	2016-03-01
Package with metal-insulator-metal capacitor and method of manufacturing the same Grant 9,263,511 - Yu , et al. February 16, 2	2016-02-16
Semiconductor Device Packages, Packaging Methods, and Packaged Semiconductor Devices App 20160013138 - Chen; Hsien-Wei ; et al.	2016-01-14
Semiconductor Package and Method App 20160005716 - Yu; Chen-Hua ; et al.	2016-01-07
Fan-Out Package Structure and Methods for Forming the Same App 20150380388 - Yu; Chen-Hua ; et al.	2015-12-31
Package-on-package Semiconductor Device App 20150357319 - YU; Chen-Hua ; et al.	2015-12-10
Alignment Mark Design For Packages App 20150348904 - Huang; Li-Hsien ; et al.	2015-12-03
Semiconductor package including an embedded surface mount device and method of forming the same Grant 9,196,586 - Chen , et al. November 24, 2	2015-11-24
Packages and Packaging Methods for Semiconductor Devices, and Packaged Semiconductor Devices App 20150294939 - Yu; Chen-Hua ; et al.	2015-10-15
Packages With Metal Line Crack Prevention Design App 20150287700 - Yu; Chen-Hua ; et al.	2015-10-08
Semiconductor Packages and Methods of Forming the Same App 20150270247 - Chen; Hsien-Wei ; et al.	2015-09-24
Interconnect Structure for Package-on-Package Devices App 20150255447 - Hung; Jui-Pin ; et al.	2015-09-10
Fan-out package structure and methods for forming the same Grant 9,129,944 - Yu , et al. September 8, 2	2015-09-08
Methods and apparatus of wafer level package for heterogeneous integration technology Grant 9,111,949 - Yu , et al. August 18, 2	2015-08-18
Package-on-package semiconductor device Grant 9,111,896 - Yu , et al. August 18, 2	2015-08-18
Semiconductor Package Including An Embedded Surface Mount Device And Method Of Forming The Same App 20150228580 - Chen; Hsien-Wei ; et al.	2015-08-13
Multiple Silicide Integration Structure and Method App 20150206871 - Yeh; Der-Chyang ; et al.	2015-07-23
Pad Structure Design In Fan-out Package App 20150200185 - Yu; Chen-Hua ; et al.	2015-07-16
Structure and Method for 3D IC Package App 20150194361 - Hou; Shang-Yun ; et al.	2015-07-09
Method of fabricating interconnect structure for package-on-package devices Grant 9,048,222 - Hung , et al. June 2, 2	2015-06-02
Packages with passive devices and methods of forming the same Grant 9,040,381 - Yu , et al. May 26, 2	2015-05-26
Chip on Package Structure and Method App 20150115470 - Su; An-Jhih ; et al.	2015-04-30
Chip on Package Structure and Method App 20150115464 - Yu; Chen-Hua ; et al.	2015-04-30
Conductive vias in a substrate Grant 8,999,179 - Yu , et al. April 7, 2	2015-04-07
Structure and method for 3D IC package Grant 8,993,380 - Hou , et al. March 31, 2	2015-03-31
Multiple silicide integration structure and method Grant 8,993,393 - Yeh , et al. March 31, 2	2015-03-31
Multi-Chip Package and Method of Formation App 20150084191 - Lin; Jing-Cheng ; et al.	2015-03-26
Multi-Chip Package Structure and Method of Forming Same App 20150084190 - Hung; Jui-Pin ; et al.	2015-03-26
Multi-Chip Structure and Method of Forming Same App 20150048500 - Yu; Chen-Hua ; et al.	2015-02-19
Method Of Manufacturing A Capacitor App 20150037960 - CHANG; Chun Hua ; et al.	2015-02-05
EMI Package and Method for Making Same App 20150024547 - Wang; Chuei-Tang ; et al.	2015-01-22
Semiconductor devices comprising GSG interconnect structures Grant 8,937,389 - Liu , et al. January 20, 2	2015-01-20
Multi-chip package structure and method of forming same Grant 8,928,117 - Hung , et al. January 6, 2	2015-01-06
Multi-chip package and method of formation Grant 8,927,412 - Lin , et al. January 6, 2	2015-01-06
Electric Magnetic Shielding Structure In Packages App 20140367160 - Yu; Chen-Hua ; et al.	2014-12-18
Fan-Out Package Structure and Methods for Forming the Same App 20140346671 - Yu; Chen-Hua ; et al.	2014-11-27
Methods of forming semiconductor structures Grant 8,895,385 - Chang , et al. November 25, 2	2014-11-25
Semiconductor structures having a metal-insulator-metal capacitor structure Grant 8,890,224 - Chang , et al. November 18, 2	2014-11-18
Capacitor for interposers and methods of manufacture thereof Grant 8,878,338 - Chang , et al. November 4, 2	2014-11-04
Low power/high speed TSV interface design Grant 8,878,369 - Chen , et al. November 4, 2	2014-11-04
3D Packages and Methods for Forming the Same App 20140319696 - Yu; Chen-Hua ; et al.	2014-10-30
EMI package and method for making same Grant 8,872,312 - Wang , et al. October 28, 2	2014-10-28
Package with Passive Devices and Method of Forming the Same App 20140295624 - Chen; Shuo-Mao ; et al.	2014-10-02
Wafer Level Chip Scale Packaging Intermediate Structure Apparatus and Method App 20140264933 - Yu; Chen-Hua ; et al.	2014-09-18
Structure and Method for 3D IC Package App 20140252572 - Hou; Shang-Yun ; et al.	2014-09-11
Interconnect Structure for Package-on-Package Devices App 20140252646 - Hung; Jui-Pin ; et al.	2014-09-11
Interposer system and method Grant 8,810,006 - Yu , et al. August 19, 2	2014-08-19
Package with passive devices and method of forming the same Grant 8,809,996 - Chen , et al. August 19, 2	2014-08-19
Package With Metal-insulator-metal Capacitor And Method Of Manufacturing The Same App 20140225222 - YU; Chen-Hua ; et al.	2014-08-14
Fan-out package structure and methods for forming the same Grant 8,803,306 - Yu , et al. August 12, 2	2014-08-12
Fan-out Package Structure And Methods For Forming The Same App 20140203429 - Yu; Chen-Hua ; et al.	2014-07-24
Packages with Passive Devices and Methods of Forming the Same App 20140073091 - Yu; Chen-Hua ; et al.	2014-03-13
Package-on-package Semiconductor Device App 20140054760 - YU; Chen-Hua ; et al.	2014-02-27
Semiconductor Devices and Methods of Manufacture Thereof App 20140042612 - Liu; Christianto Chih-Ching ; et al.	2014-02-13
Interposer System and Method App 20140042643 - Yu; Chen-Hua ; et al.	2014-02-13
Band Pass Filter for 2.5D/3D Integrated Circuit Applications App 20140029205 - Kuo; Feng Wei ; et al.	2014-01-30
Hard Mask For Thin Film Resistor Manufacture App 20110318898A1 -	2011-12-29

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