| Patent | Date |
|---|
Semiconductor Structure
App 20220302068 - Yu; Chen-Hua ; et al. | 2022-09-22 |
3d Semiconductor Packages
App 20220302100 - Yu; Chen-Hua ; et al. | 2022-09-22 |
Package Having Redistribution Layer Structure With Protective Layer
App 20220302038 - Yu; Chen-Hua ; et al. | 2022-09-22 |
Semiconductor Packages and Methods of Forming Same
App 20220285323 - Yu; Chen-Hua ; et al. | 2022-09-08 |
Package Structure And Manufacturing Method Thereof
App 20220262703 - Yu; Chen-Hua ; et al. | 2022-08-18 |
Semiconductor Device
App 20220238408 - Yu; Chen-Hua ; et al. | 2022-07-28 |
3D semiconductor packages
Grant 11,393,805 - Yu , et al. July 19, 2 | 2022-07-19 |
Integrated Circuit Structure
App 20220217847 - Yu; Chen-Hua ; et al. | 2022-07-07 |
Package And Method Of Manufacturing The Same
App 20220216152 - Wu; Chih-Wei ; et al. | 2022-07-07 |
Semiconductor structure comprising at least one system-on-integrated-circuit component
Grant 11,380,645 - Yu , et al. July 5, 2 | 2022-07-05 |
Package structure and manufacturing method thereof
Grant 11,355,418 - Yu , et al. June 7, 2 | 2022-06-07 |
Semiconductor Device Structure, Stacked Semiconductor Device Structure And Method Of Manufacturing Semiconductor Device Structure
App 20220165669 - Yu; Chen-Hua ; et al. | 2022-05-26 |
Semiconductor packages and methods of forming same
Grant 11,342,309 - Yu , et al. May 24, 2 | 2022-05-24 |
Semiconductor device
Grant 11,328,975 - Yu , et al. May 10, 2 | 2022-05-10 |
Temporary bonding scheme
Grant 11,328,972 - Lee , et al. May 10, 2 | 2022-05-10 |
Package and method of manufacturing the same
Grant 11,289,424 - Wu , et al. March 29, 2 | 2022-03-29 |
Integrated circuit structure
Grant 11,291,116 - Yu , et al. March 29, 2 | 2022-03-29 |
Integrated Circuit Packages And Methods Of Forming The Same
App 20220093560 - Yu; Chen-Hua ; et al. | 2022-03-24 |
Semiconductor Device Including Heat Dissipation Structure And Fabricating Method Of The Same
App 20220077024 - Teng; Po-Yuan ; et al. | 2022-03-10 |
Semiconductor Device
App 20210407887 - Yu; Chen-Hua ; et al. | 2021-12-30 |
Packaged Semiconductor Device and Method of Forming Thereof
App 20210407942 - Yu; Chen-Hua ; et al. | 2021-12-30 |
Integrated fan-out package and method for fabricating the same
Grant 11,211,336 - Yu , et al. December 28, 2 | 2021-12-28 |
Integrated circuit packages comprising a plurality of redistribution structures and methods of forming the same
Grant 11,195,816 - Yu , et al. December 7, 2 | 2021-12-07 |
Chiplets 3D SoIC System Integration and Fabrication Methods
App 20210366854 - Yu; Chen-Hua ; et al. | 2021-11-25 |
Semiconductor device including heat dissipation structure and fabricating method of the same
Grant 11,177,192 - Teng , et al. November 16, 2 | 2021-11-16 |
Chip package
Grant 11,177,434 - Yu , et al. November 16, 2 | 2021-11-16 |
Wafer Level Package Structure and Method of Forming Same
App 20210351076 - Yu; Chen-Hua ; et al. | 2021-11-11 |
Semiconductor Device And Manufacturing Method Thereof
App 20210351111 - Yu; Chen-Hua ; et al. | 2021-11-11 |
Compute-in-memory packages and methods forming the same
Grant 11,171,076 - Yu , et al. November 9, 2 | 2021-11-09 |
Package Structure And Method Of Forming The Same
App 20210343666 - Yu; Chen-Hua ; et al. | 2021-11-04 |
Package Structures And Methods Of Manufacturing The Same
App 20210343622 - Lai; Yu-Chia ; et al. | 2021-11-04 |
MEMS Packages and Methods of Manufacture Thereof
App 20210340008 - Yu; Chen-Hua ; et al. | 2021-11-04 |
Integrated circuit package and methods of forming same
Grant 11,152,344 - Yu , et al. October 19, 2 | 2021-10-19 |
Semiconductor device and manufacturing method thereof
Grant 11,139,223 - Yu , et al. October 5, 2 | 2021-10-05 |
Package Having Redistribution Layer Structure With Protective Layer And Method Of Fabricating The Same
App 20210296252 - Yu; Chen-Hua ; et al. | 2021-09-23 |
Semiconductor Structure
App 20210280528 - YU; CHEN-HUA ; et al. | 2021-09-09 |
Package Structure And Manufacturing Method Thereof
App 20210265276 - Wu; Kai-Chiang ; et al. | 2021-08-26 |
Method for forming semiconductor package using carbon nano material in molding compound
Grant 11,088,058 - Tseng , et al. August 10, 2 | 2021-08-10 |
Semiconductor device including through die via and manufacturing method thereof
Grant 11,075,145 - Yu , et al. July 27, 2 | 2021-07-27 |
Semiconductor package and method of fabricating semiconductor package
Grant 11,075,184 - Yu , et al. July 27, 2 | 2021-07-27 |
Package structure and method of forming the same
Grant 11,069,636 - Yu , et al. July 20, 2 | 2021-07-20 |
MEMS packages and methods of manufacture thereof
Grant 11,066,297 - Yu , et al. July 20, 2 | 2021-07-20 |
Wafer level package structure and method of forming same
Grant 11,069,573 - Yu , et al. July 20, 2 | 2021-07-20 |
Semiconductor Package Structure
App 20210217728 - HUNG; JENG-NAN ; et al. | 2021-07-15 |
Package Structure And Manufacturing Method Thereof
App 20210217715 - Yu; Chen-Hua ; et al. | 2021-07-15 |
Chip on Package Structure and Method
App 20210217726 - Yu; Chen-Hua ; et al. | 2021-07-15 |
Package structures
Grant 11,062,975 - Lai , et al. July 13, 2 | 2021-07-13 |
Thermally Conductive Structure For Heat Dissipation In Semiconductor Packages
App 20210202270 - Tseng; Chun-Hao ; et al. | 2021-07-01 |
Package having redistribution layer structure with protective layer and method of fabricating the same
Grant 11,031,344 - Yu , et al. June 8, 2 | 2021-06-08 |
Semiconductor Structure
App 20210159201 - Yu; Chen-Hua ; et al. | 2021-05-27 |
Semiconductor Device
App 20210159139 - Yu; Chen-Hua ; et al. | 2021-05-27 |
Semiconductor structure
Grant 11,018,095 - Yu , et al. May 25, 2 | 2021-05-25 |
Package structure and manufacturing method thereof
Grant 11,004,799 - Wu , et al. May 11, 2 | 2021-05-11 |
Semiconductor package and manufacturing method thereof
Grant 10,985,101 - Lai , et al. April 20, 2 | 2021-04-20 |
Thermally Conductive Molding Compound Structure For Heat Dissipation In Semiconductor Packages
App 20210104485 - Tseng; Chun-Hao ; et al. | 2021-04-08 |
Package structure and manufacturing method thereof
Grant 10,971,462 - Yu , et al. April 6, 2 | 2021-04-06 |
Semiconductor package structure
Grant 10,971,475 - Hung , et al. April 6, 2 | 2021-04-06 |
Package Structure And Manufacturing Method Thereof
App 20210098335 - Yu; Chen-Hua ; et al. | 2021-04-01 |
Semiconductor Structure And Method Manufacturing The Same
App 20210098381 - Yu; Chen-Hua ; et al. | 2021-04-01 |
Chip on package structure and method
Grant 10,964,666 - Yu , et al. March 30, 2 | 2021-03-30 |
Thermally conductive structure for heat dissipation in semiconductor packages
Grant 10,957,559 - Tseng , et al. March 23, 2 | 2021-03-23 |
Semiconductor packages with electromagnetic interference shielding layer and methods of forming the same
Grant 10,950,554 - Yu , et al. March 16, 2 | 2021-03-16 |
Semicondcutor Packages
App 20210066279 - Yu; Chen-Hua ; et al. | 2021-03-04 |
Semiconductor Package And Manufacturing Method Thereof
App 20210035890 - Yu; Chen-Hua ; et al. | 2021-02-04 |
Integrated Circuit Packages And Methods Of Forming The Same
App 20210028145 - Yu; Chen-Hua ; et al. | 2021-01-28 |
Multi-Die Package Structures Including Redistribution Layers
App 20210028147 - Yu; Chen-Hua ; et al. | 2021-01-28 |
Semiconductor Device and Method
App 20200411469 - Yu; Chen-Hua ; et al. | 2020-12-31 |
Antenna Device And Method For Manufacturing Antenna Device
App 20200411996 - WANG; Chuei-Tang ; et al. | 2020-12-31 |
Package-on-package structure and manufacturing method thereof
Grant 10,879,220 - Yu , et al. December 29, 2 | 2020-12-29 |
Chip package structure
Grant 10,879,153 - Yu , et al. December 29, 2 | 2020-12-29 |
Semiconductor package and manufacturing method thereof
Grant 10,861,773 - Yu , et al. December 8, 2 | 2020-12-08 |
Thermally conductive molding compound structure for heat dissipation in semiconductor packages
Grant 10,861,817 - Tseng , et al. December 8, 2 | 2020-12-08 |
Chip Package
App 20200373485 - Yu; Chen-Hua ; et al. | 2020-11-26 |
Semiconductor Device And Manufacturing Method Thereof
App 20200365488 - Yu; Chen-Hua ; et al. | 2020-11-19 |
Semiconductor device and method of manufacturing
Grant 10,840,231 - Lai , et al. November 17, 2 | 2020-11-17 |
Semiconductor Packages and Methods of Forming Same
App 20200343224 - Yu; Chen-Hua ; et al. | 2020-10-29 |
Methods of forming multi-die package structures including redistribution layers
Grant 10,804,242 - Yu , et al. October 13, 2 | 2020-10-13 |
Thermally conductive molding compound structure for heat dissipation in semiconductor packages
Grant 10,784,227 - Tseng , et al. Sept | 2020-09-22 |
Semiconductor Package And Manufacturing Method Thereof
App 20200294916 - Lai; Yu-Chia ; et al. | 2020-09-17 |
Package Structure And Manufacturing Method Thereof
App 20200294926 - Wu; Kai-Chiang ; et al. | 2020-09-17 |
Semiconductor device and method
Grant 10,770,428 - Yu , et al. Sep | 2020-09-08 |
CHIP package
Grant 10,770,655 - Yu , et al. Sep | 2020-09-08 |
Antenna device and method for manufacturing antenna device
Grant 10,770,795 - Wang , et al. Sep | 2020-09-08 |
Package Structure And Manufacturing Method Thereof
App 20200266160 - Yu; Chen-Hua ; et al. | 2020-08-20 |
Package and method for integration of heterogeneous integrated circuits
Grant 10,748,825 - Lee , et al. A | 2020-08-18 |
Semiconductor Structure
App 20200243460 - YU; CHEN-HUA ; et al. | 2020-07-30 |
Methods and apparatus for sensor module
Grant 10,714,525 - Yee , et al. | 2020-07-14 |
Semiconductor packages and methods of forming same
Grant 10,714,457 - Yu , et al. | 2020-07-14 |
Package structure and manufacturing method thereof
Grant 10,707,173 - Wu , et al. | 2020-07-07 |
Semiconductor Device And Manufacturing Method Thereof
App 20200176357 - Yu; Chen-Hua ; et al. | 2020-06-04 |
Package And Method Of Manufacturing The Same
App 20200176384 - Wu; Chih-Wei ; et al. | 2020-06-04 |
Manufacturing method of a package structure
Grant 10,651,137 - Yu , et al. | 2020-05-12 |
Semiconductor Package And Method Of Fabricating Semiconductor Package
App 20200126940 - Yu; Chen-Hua ; et al. | 2020-04-23 |
Semiconductor structure and manufacturing method thereof
Grant 10,629,541 - Yu , et al. | 2020-04-21 |
Package Structure And Method Of Forming The Same
App 20200118953 - Yu; Chen-Hua ; et al. | 2020-04-16 |
Compute-In-Memory Packages and Methods Forming The Same
App 20200118908 - Yu; Chen-Hua ; et al. | 2020-04-16 |
Package Structures And Methods Of Manufacturing The Same
App 20200105641 - Lai; Yu-Chia ; et al. | 2020-04-02 |
Semiconductor Device And Fabricating Method Of The Same
App 20200105644 - Teng; Po-Yuan ; et al. | 2020-04-02 |
Semiconductor Device and Method of Manufacturing
App 20200083208 - Lai; Jui Hsieh ; et al. | 2020-03-12 |
Package And Method Of Fabricating The Same
App 20200075496 - Yu; Chen-Hua ; et al. | 2020-03-05 |
Thermally Conductive Molding Compound Structure For Heat Dissipation In Semiconductor Packages
App 20200066671 - Tseng; Chun-Hao ; et al. | 2020-02-27 |
Integrated Fan-out Package And Method For Fabricating The Same
App 20200066642 - Yu; Chen-Hua ; et al. | 2020-02-27 |
Method For Forming Semiconductor Package Using Carbon Nano Material In Molding Compound
App 20200043838 - Tseng; Chun-Hao ; et al. | 2020-02-06 |
Thermally conductive structure for heat dissipation in semiconductor packages
Grant 10,541,154 - Tseng , et al. Ja | 2020-01-21 |
Semicondcutor Packages With Electromagnetic Interference Shielding Layer And Methods Of Forming The Same
App 20200020643 - Yu; Chen-Hua ; et al. | 2020-01-16 |
Package Structure And Manufacturing Method Thereof
App 20200020640 - Wu; Kai-Chiang ; et al. | 2020-01-16 |
Thermally Conductive Molding Compound Structure For Heat Dissipation In Semiconductor Packages
App 20200020658 - Tseng; Chun-Hao ; et al. | 2020-01-16 |
Thermally Conductive Structure For Heat Dissipation In Semiconductor Packages
App 20200013636 - Tseng; Chun-Hao ; et al. | 2020-01-09 |
Semiconductor Device and Method
App 20190393189 - Yu; Chen-Hua ; et al. | 2019-12-26 |
Semiconductor package and method of fabricating semiconductor package
Grant 10,515,921 - Yu , et al. Dec | 2019-12-24 |
Semiconductor device and method of manufacturing
Grant 10,515,942 - Lai , et al. Dec | 2019-12-24 |
Package-on-package Structure And Manufacturing Method Thereof
App 20190385989 - Yu; Chen-Hua ; et al. | 2019-12-19 |
Thermally conductive molding compound structure for heat dissipation in semiconductor packages
Grant 10,510,707 - Tseng , et al. Dec | 2019-12-17 |
Chip on package structure and method
Grant 10,510,717 - Yu , et al. Dec | 2019-12-17 |
Package structure and method of forming the same
Grant 10,510,695 - Yu , et al. Dec | 2019-12-17 |
CHIP package
App 20190372000 - Yu; Chen-Hua ; et al. | 2019-12-05 |
Semiconductor Package Structure
App 20190363066 - HUNG; JENG-NAN ; et al. | 2019-11-28 |
Method for forming semiconductor package using carbon nano material in molding compound
Grant 10,490,492 - Tseng , et al. Nov | 2019-11-26 |
Integrated Circuit Structure and Method of Forming
App 20190350082 - Yu; Chen-Hua ; et al. | 2019-11-14 |
Integrated fan-out package and method for fabricating the same
Grant 10,475,747 - Yu , et al. Nov | 2019-11-12 |
Integrated Circuit Package and Methods of Forming Same
App 20190341376 - Yu; Chen-Hua ; et al. | 2019-11-07 |
Fan-Out Stacked System in Package (SIP) and the Methods of Making the Same
App 20190333893 - Yu; Chen-Hua ; et al. | 2019-10-31 |
Package structure and manufacturing method thereof
Grant 10,461,034 - Wu , et al. Oc | 2019-10-29 |
Integrated fan-out package and method for fabricating the same
Grant 10,431,738 - Yu , et al. O | 2019-10-01 |
Integrated Fan-Out Package and the Methods of Manufacturing
App 20190273064 - Yu; Chen-Hua ; et al. | 2019-09-05 |
Semiconductor Packages and Methods of Forming Same
App 20190267354 - Yu; Chen-Hua ; et al. | 2019-08-29 |
Method of Manufacturing an Integrated Fan-out Package having Fan-Out Redistribution Layer (RDL) to Accommodate Electrical Connec
App 20190244871 - Yu; Chen-Hua ; et al. | 2019-08-08 |
Methods and Apparatus for Sensor Module
App 20190244997 - Yee; Kuo-Chung ; et al. | 2019-08-08 |
Semiconductor package structure and method of manufacturing the same
Grant 10,373,931 - Hung , et al. | 2019-08-06 |
Package And Method For Integration Of Heterogeneous Integrated Circuits
App 20190237379 - Lee; Wan-Yu ; et al. | 2019-08-01 |
Integrated circuit structure and method of forming
Grant 10,368,442 - Yu , et al. July 30, 2 | 2019-07-30 |
Integrated circuit package and methods of forming same
Grant 10,354,983 - Yu , et al. July 16, 2 | 2019-07-16 |
Semiconductor device and method
Grant 10,340,249 - Yu , et al. | 2019-07-02 |
Fan-out stacked system in package (SIP) and the methods of making the same
Grant 10,325,879 - Yu , et al. | 2019-06-18 |
Semiconductor packages and methods of forming same
Grant 10,290,611 - Yu , et al. | 2019-05-14 |
Temporary Bonding Scheme
App 20190139850 - Lee; Wan-Yu ; et al. | 2019-05-09 |
Package Structure And Manufacturing Method Thereof
App 20190139925 - Yu; Chen-Hua ; et al. | 2019-05-09 |
Chip Package Structure
App 20190139865 - YU; Chen-Hua ; et al. | 2019-05-09 |
Package structure and manufacturing method thereof
Grant 10,283,473 - Yu , et al. | 2019-05-07 |
Method For Forming Semiconductor Package Using Carbon Nano Material In Molding Compound
App 20190131222 - Tseng; Chun-Hao ; et al. | 2019-05-02 |
Package and method for integration of heterogeneous integrated circuits
Grant 10,276,471 - Lee , et al. | 2019-04-30 |
Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors
Grant 10,269,674 - Yu , et al. | 2019-04-23 |
Methods and apparatus for sensor module
Grant 10,269,851 - Yee , et al. | 2019-04-23 |
Apparatus and method for chip placement and molding
Grant 10,269,694 - Lai , et al. | 2019-04-23 |
Package Structure And Method Of Forming The Same
App 20190115311 - Yu; Chen-Hua ; et al. | 2019-04-18 |
Semiconductor Device and Method of Manufacturing
App 20190103391 - Lai; Jui Hsieh ; et al. | 2019-04-04 |
Integrated Fan-Out Package and the Methods of Manufacturing
App 20190074261 - Yu; Chen-Hua ; et al. | 2019-03-07 |
Semicondcutor Package And Manufacturing Method Thereof
App 20190067169 - Yu; Chen-Hua ; et al. | 2019-02-28 |
Integrated Fan-out Package And Method For Fabricating The Same
App 20190051604 - Yu; Chen-Hua ; et al. | 2019-02-14 |
Package Structure And Manufacturing Method Thereof
App 20190035737 - Wu; Kai-Chiang ; et al. | 2019-01-31 |
Semiconductor Package And Method Of Fabricating Semiconductor Package
App 20190035757 - Yu; Chen-Hua ; et al. | 2019-01-31 |
Semiconductor Packages And Methods Of Forming Same
App 20190035767 - Yu; Chen-Hua ; et al. | 2019-01-31 |
Method for forming semiconductor package using carbon nano material in molding compound
Grant 10,177,082 - Tseng , et al. J | 2019-01-08 |
Method for forming chip package structure
Grant 10,177,078 - Yu , et al. J | 2019-01-08 |
Fan-Out Stacked System in Package (SIP) and the Methods of Making the Same
App 20190006316 - Yu; Chen-Hua ; et al. | 2019-01-03 |
Temporary bonding scheme
Grant 10,170,387 - Lee , et al. J | 2019-01-01 |
Chip on Package Structure and Method
App 20180374822 - Yu; Chen-Hua ; et al. | 2018-12-27 |
Package structure and method of forming the same
Grant 10,157,864 - Yu , et al. Dec | 2018-12-18 |
Semiconductor device and method of manufacturing
Grant 10,157,901 - Lai , et al. Dec | 2018-12-18 |
Manufacturing Method Of A Package Structure
App 20180358312 - Yu; Chen-Hua ; et al. | 2018-12-13 |
Method of Manufacturing an Integrated Fan-out Package having Fan-Out Redistribution Layer (RDL) to Accommodate Electrical Connectors
App 20180342435 - Yu; Chen-Hua ; et al. | 2018-11-29 |
Vacuum carrier module, method of using and process of making the same
Grant 10,137,603 - Huang , et al. November 27, 2 | 2018-11-27 |
Apparatus and method of forming chip package with waveguide for light coupling having a molding layer for a laser die
Grant 10,135,224 - Tseng , et al. November 20, 2 | 2018-11-20 |
Semiconductor Structure And Manufacturing Method Thereof
App 20180331048 - YU; CHEN-HUA ; et al. | 2018-11-15 |
Integrated fan-out stacked package with fan-out redistribution layer (RDL)
Grant 10,128,213 - Yu , et al. November 13, 2 | 2018-11-13 |
MEMS Packages and Methods of Manufacture Thereof
App 20180257928 - Yu; Chen-Hua ; et al. | 2018-09-13 |
Package structure and method of fabricating the same
Grant 10,074,615 - Tseng , et al. September 11, 2 | 2018-09-11 |
Thermally Conductive Molding Compound Structure For Heat Dissipation In Semiconductor Packages
App 20180247912 - Tseng; Chun-Hao ; et al. | 2018-08-30 |
Fan-out stacked system in package (SIP) and the methods of making the same
Grant 10,056,351 - Yu , et al. August 21, 2 | 2018-08-21 |
Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors
Grant 10,049,953 - Yu , et al. August 14, 2 | 2018-08-14 |
Semiconductor package structure having am antenna pattern and manufacturing method thereof
Grant 10,032,722 - Yu , et al. July 24, 2 | 2018-07-24 |
Semiconductor structure and manufacturing method thereof
Grant 10,032,725 - Yu , et al. July 24, 2 | 2018-07-24 |
Integrated Fan-out Package and the Methods of Manufacturing
App 20180197837 - Yu; Chen-Hua ; et al. | 2018-07-12 |
Semiconductor Package Structure And Method Of Manufacturing The Same
App 20180151538 - HUNG; JENG-NAN ; et al. | 2018-05-31 |
Chip Package Structure And Method For Forming The Same
App 20180151477 - YU; Chen-Hua ; et al. | 2018-05-31 |
Wafer Level Package Structure and Method of Forming Same
App 20180138089 - Yu; Chen-Hua ; et al. | 2018-05-17 |
Package and Method for Integration of Heterogeneous Integrated Circuits
App 20180138056 - Lee; Wan-Yu ; et al. | 2018-05-17 |
MEMS packages and methods of manufacture thereof
Grant 9,969,614 - Yu , et al. May 15, 2 | 2018-05-15 |
Semiconductor package and manufacturing method thereof
Grant 9,966,360 - Yu , et al. May 8, 2 | 2018-05-08 |
Thermally conductive molding compound structure for heat dissipation in semiconductor packages
Grant 9,960,099 - Tseng , et al. May 1, 2 | 2018-05-01 |
Method For Forming Semiconductor Package Using Carbon Nano Material In Molding Compound
App 20180090425 - Tseng; Chun-Hao ; et al. | 2018-03-29 |
Apparatus and Method of Forming Chip Package with Waveguide for Light Coupling
App 20180083416 - Tseng; Chun-Hao ; et al. | 2018-03-22 |
Method of manufacturing an integrated stacked package with a fan-out redistribution layer (RDL) and a same encapsulating process
Grant 9,917,072 - Yu , et al. March 13, 2 | 2018-03-13 |
Semiconductor Device and Method of Manufacturing
App 20180061818 - Lai; Jui Hsieh ; et al. | 2018-03-01 |
Vacuum Carrier Module, Method of Using and Process of Making the Same
App 20180056548 - Huang; Tien-Yu ; et al. | 2018-03-01 |
Vacuum carrier module, method of using and process of making the same
Grant 9,902,092 - Huang , et al. February 27, 2 | 2018-02-27 |
Complementary metal-oxide-semiconductor (CMOS) image sensor (CIS) package with an image buffer
Grant 9,899,443 - Lee , et al. February 20, 2 | 2018-02-20 |
Complementary Metal-oxide-semiconductor (cmos) Image Sensor (cis) Package With An Image Buffer
App 20180026067 - Lee; Hsiao-Wen ; et al. | 2018-01-25 |
Wafer level package structure and method of forming same
Grant 9,870,946 - Yu , et al. January 16, 2 | 2018-01-16 |
Semicondcutor Package And Manufacturing Method Thereof
App 20180012863 - Yu; Chen-Hua ; et al. | 2018-01-11 |
Package and method for integration of heterogeneous integrated circuits
Grant 9,865,481 - Lee , et al. January 9, 2 | 2018-01-09 |
Methods of Forming Multi-Die Package Structures Including Redistribution Layers
App 20180005984 - Yu; Chen-Hua ; et al. | 2018-01-04 |
Method for forming semiconductor package using carbon nano material in molding compound
Grant 9,859,199 - Tseng , et al. January 2, 2 | 2018-01-02 |
Integrated Fan-out Package And Method For Fabricating The Same
App 20170373037 - Yu; Chen-Hua ; et al. | 2017-12-28 |
Package Structure And Manufacturing Method Thereof
App 20170345761 - Yu; Chen-Hua ; et al. | 2017-11-30 |
Antenna Device And Method For Manufacturing Antenna Device
App 20170346185 - WANG; Chuei-Tang ; et al. | 2017-11-30 |
Apparatus and method of forming chip package with waveguide for light coupling
Grant 9,831,634 - Tseng , et al. November 28, 2 | 2017-11-28 |
Semiconductor device and method of manufacturing
Grant 9,806,069 - Lai , et al. October 31, 2 | 2017-10-31 |
Chip on Package Structure and Method
App 20170309596 - Yu; Chen-Hua ; et al. | 2017-10-26 |
Apparatus and package structure of optical chip
Grant 9,799,528 - Lee , et al. October 24, 2 | 2017-10-24 |
Devices, packaged semiconductor devices, and semiconductor device packaging methods
Grant 9,773,757 - Yu , et al. September 26, 2 | 2017-09-26 |
Methods of forming multi-die package structures including redistribution layers
Grant 9,768,145 - Yu , et al. September 19, 2 | 2017-09-19 |
Method of fabricating three dimensional integrated circuit
Grant 9,761,513 - Yee , et al. September 12, 2 | 2017-09-12 |
Integrated Circuit Package And Methods Of Forming Same
App 20170250170 - Yu; Chen-Hua ; et al. | 2017-08-31 |
Devices, Packaged Semiconductor Devices, And Semiconductor Device Packaging Methods
App 20170207197 - Yu; Chen-Hua ; et al. | 2017-07-20 |
Chip on package structure and method
Grant 9,704,826 - Yu , et al. July 11, 2 | 2017-07-11 |
Fan-out Stacked System In Package (sip) And The Methods Of Making The Same
App 20170194290 - Yu; Chen-Hua ; et al. | 2017-07-06 |
Thermally Conductive Structure For Heat Dissipation In Semiconductor Packages
App 20170140945 - Tseng; Chun-Hao ; et al. | 2017-05-18 |
Integrated circuit package and methods of forming same
Grant 9,653,442 - Yu , et al. May 16, 2 | 2017-05-16 |
Integrated Fan-out Stacked SiP and the Methods of Manufacturing
App 20170084576 - Yu; Chen-Hua ; et al. | 2017-03-23 |
Integrated Fan-Out Package and the Methods of Manufacturing
App 20170084555 - Yu; Chen-Hua ; et al. | 2017-03-23 |
Fan-out stacked system in package (SIP) and the methods of making the same
Grant 9,601,463 - Yu , et al. March 21, 2 | 2017-03-21 |
Apparatus And Method Of Forming Chip Package With Waveguide For Light Coupling
App 20170077673 - Tseng; Chun-Hao ; et al. | 2017-03-16 |
Package Structures and Methods of Making the Same
App 20170062383 - Yee; Kuo-Chung ; et al. | 2017-03-02 |
Method of forming interconnects for three dimensional integrated circuit
Grant 9,583,365 - Yu , et al. February 28, 2 | 2017-02-28 |
Thermally conductive structure for heat dissipation in semiconductor packages
Grant 9,576,930 - Tseng , et al. February 21, 2 | 2017-02-21 |
Functional block stacked 3DIC and method of making same
Grant 9,564,420 - Yu , et al. February 7, 2 | 2017-02-07 |
Apparatus and Package Structure of Optical Chip
App 20170033094 - Lee; Wan-Yu ; et al. | 2017-02-02 |
Apparatus and method for self-aligning chip placement and leveling
Grant 9,530,673 - Lai , et al. December 27, 2 | 2016-12-27 |
Semiconductor Device and Method of Manufacturing
App 20160358900 - Lai; Jui Hsieh ; et al. | 2016-12-08 |
MEMS Packages and Methods of Manufacture Thereof
App 20160347609 - Yu; Chen-Hua ; et al. | 2016-12-01 |
Package And Method For Integration Of Heterogeneous Integrated Circuits
App 20160343697 - Lee; Wan-Yu ; et al. | 2016-11-24 |
Packages and methods of manufacture thereof
Grant 9,496,196 - Yu , et al. November 15, 2 | 2016-11-15 |
Apparatus and method of forming laser chip package with waveguide for light coupling
Grant 9,488,779 - Tseng , et al. November 8, 2 | 2016-11-08 |
Apparatus and package structure of optical chip
Grant 9,478,475 - Lee , et al. October 25, 2 | 2016-10-25 |
Integrated Circuit Structure and Method of Forming
App 20160295700 - Yu; Chen-Hua ; et al. | 2016-10-06 |
Chip on Package Structure and Method
App 20160293577 - Yu; Chen-Hua ; et al. | 2016-10-06 |
Apparatus and Method for Self-Aligning Chip Placement and Leveling
App 20160284569 - Lai; Jui Hsieh ; et al. | 2016-09-29 |
Semiconductor Structure And Manufacturing Method Thereof
App 20160254229 - YU; CHEN-HUA ; et al. | 2016-09-01 |
Semiconductor device and method of manufacturing
Grant 9,423,578 - Lai , et al. August 23, 2 | 2016-08-23 |
Package and method for integration of heterogeneous integrated circuits
Grant 9,419,156 - Lee , et al. August 16, 2 | 2016-08-16 |
Functional Block Stacked 3dic And Method Of Making Same
App 20160190101 - Yu; Chen-Hua ; et al. | 2016-06-30 |
Chip on package structure and method
Grant 9,373,527 - Yu , et al. June 21, 2 | 2016-06-21 |
Apparatus and method for self-aligning chip placement and leveling
Grant 9,368,375 - Lai , et al. June 14, 2 | 2016-06-14 |
Functional block stacked 3DIC and method of making same
Grant 9,293,437 - Yu , et al. March 22, 2 | 2016-03-22 |
Temporary Bonding Scheme
App 20160056086 - Lee; Wan-Yu ; et al. | 2016-02-25 |
Packages And Methods Of Manufacture Thereof
App 20160049385 - Yu; Chen-Hua ; et al. | 2016-02-18 |
Optical scanner integrated with substrate method of making and method of using the same
Grant 9,264,569 - Huang , et al. February 16, 2 | 2016-02-16 |
Light coupling formation in a waveguide layer
Grant 9,244,223 - Tseng , et al. January 26, 2 | 2016-01-26 |
Methods and Apparatus for Sensor Module
App 20160013235 - Yee; Kuo-Chung ; et al. | 2016-01-14 |
Temporary bonding scheme
Grant 9,202,799 - Lee , et al. December 1, 2 | 2015-12-01 |
Apparatus And Method For Chip Placement And Molding
App 20150318239 - LAI; Jui Hsieh ; et al. | 2015-11-05 |
Fan-Out Stacked System in Package (SIP) and the Methods of Making the Same
App 20150303174 - Yu; Chen-Hua ; et al. | 2015-10-22 |
Apparatus And Package Structure Of Optical Chip
App 20150287705 - LEE; Wan-Yu ; et al. | 2015-10-08 |
Methods and apparatus for sensor module
Grant 9,136,293 - Yee , et al. September 15, 2 | 2015-09-15 |
Functional Block Stacked 3DIC and Method of Making Same
App 20150235949 - Yu; Chen-Hua ; et al. | 2015-08-20 |
Manufacture including substrate and package structure of optical chip
Grant 9,099,623 - Lee , et al. August 4, 2 | 2015-08-04 |
Apparatus and method for chip placement and molding
Grant 9,093,449 - Lai , et al. July 28, 2 | 2015-07-28 |
Semiconductor Package and Methods of Forming Same
App 20150206866 - Yu; Chen-Hua ; et al. | 2015-07-23 |
Integrated Circuit Package and Methods of Forming Same
App 20150206865 - Yu; Chen-Hua ; et al. | 2015-07-23 |
Wafer Level Package Structure And Method Of Forming Same
App 20150187743 - Yu; Chen-Hua ; et al. | 2015-07-02 |
Method For Forming Semiconductor Package Using Carbon Nano Material In Molding Compound
App 20150170990 - TSENG; Chun-Hao ; et al. | 2015-06-18 |
Temporary Bonding Scheme
App 20150155260 - Lee; Wan-Yu ; et al. | 2015-06-04 |
Vacuum Carrier Module, Method Of Using And Process Of Making The Same
App 20150147852 - HUANG; Tien-Yu ; et al. | 2015-05-28 |
Optical Scanner Integrated With Substrate Method Of Making And Method Of Using The Same
App 20150146268 - HUANG; Tien-Yu ; et al. | 2015-05-28 |
Via-less Multi-layer Integrated Circuit With Inter-layer Interconnection
App 20150132008 - KUO; Ying-Hao ; et al. | 2015-05-14 |
Light Coupling Formation In A Waveguide Layer
App 20150131938 - TSENG; Chun-Hao ; et al. | 2015-05-14 |
Thermally Conductive Molding Compound Structure For Heat Dissipation In Semiconductor Packages
App 20150130047 - TSENG; Chun-Hao ; et al. | 2015-05-14 |
Thermally Conductive Structure For Heat Dissipation In Semiconductor Packages
App 20150130045 - TSENG; Chun-Hao ; et al. | 2015-05-14 |
Apparatus And Method Of Forming Chip Package With Waveguide For Light Coupling
App 20150131939 - TSENG; Chun-Hao ; et al. | 2015-05-14 |
Chip on Package Structure and Method
App 20150115464 - Yu; Chen-Hua ; et al. | 2015-04-30 |
Apparatus And Method For Chip Placement And Molding
App 20150108667 - LAI; Jui Hsieh ; et al. | 2015-04-23 |
Apparatus And Method For Self-aligning Chip Placement And Leveling
App 20150104909 - LAI; Jui Hsieh ; et al. | 2015-04-16 |
Manufacture Including Substrate And Package Structure Of Optical Chip
App 20150061126 - LEE; Wan-Yu ; et al. | 2015-03-05 |
Package And Method For Integration Of Heterogeneous Integrated Circuits
App 20150061137 - LEE; Wan-Yu ; et al. | 2015-03-05 |
Semiconductor Device And Method Of Manufacturing
App 20150036970 - LAI; Jui Hsieh ; et al. | 2015-02-05 |
Method of Fabricating Three Dimensional Integrated Circuit
App 20140231991 - Yee; Kuo-Chung ; et al. | 2014-08-21 |
Method of fabricating three dimensional integrated circuit
Grant 8,741,691 - Yee , et al. June 3, 2 | 2014-06-03 |
Methods and Apparatus for Sensor Module
App 20140070348 - Yee; Kuo-Chung ; et al. | 2014-03-13 |
Method of Forming Interconnects for Three Dimensional Integrated Circuit
App 20130313121 - Yu; Chun Hui ; et al. | 2013-11-28 |
Method of Fabricating Three Dimensional Integrated Circuit
App 20130277829 - Yee; Kuo-Chung ; et al. | 2013-10-24 |
Method for Making a Stackable Package
App 20130020703 - Yee; Kuo-Chung ; et al. | 2013-01-24 |
Three-dimensional package and method of making the same
Grant 8,288,853 - Huang , et al. October 16, 2 | 2012-10-16 |
Method for making a stackable package
Grant 8,252,629 - Yee , et al. August 28, 2 | 2012-08-28 |
Method for manufacturing package structure of optical device
Grant 8,003,426 - Yee August 23, 2 | 2011-08-23 |
Method for Making a Stackable Package
App 20110159639 - Yee; Kuo-Chung ; et al. | 2011-06-30 |
Three-dimensional package and method of making the same
Grant 7,741,152 - Huang , et al. June 22, 2 | 2010-06-22 |
Three-Dimensional Package and Method of Making the Same
App 20100052136 - Huang; Min-Lung ; et al. | 2010-03-04 |
Three-dimensional package and method of making the same
Grant 7,642,132 - Huang , et al. January 5, 2 | 2010-01-05 |
Method For Manufacturing Package Structure Of Optical Device
App 20090239329 - Yee; Kuo-Chung | 2009-09-24 |
Three-dimensional package and method of making the same
Grant 7,528,053 - Huang , et al. May 5, 2 | 2009-05-05 |
Photoelectric device grinding process and device grinding process
Grant 7,456,051 - Yee , et al. November 25, 2 | 2008-11-25 |
Three-dimensional package and method of making the same
Grant 7,446,404 - Huang , et al. November 4, 2 | 2008-11-04 |
Semiconductor Package Structure And Method For Manufacturing The Same
App 20080185707 - YEE; Kuo Chung | 2008-08-07 |
Semiconductor package structure and method for manufacturing the same
Grant 7,371,602 - Yee May 13, 2 | 2008-05-13 |
Method of fabricating anti-warp package
Grant 7,352,071 - Yee April 1, 2 | 2008-04-01 |
Semiconductor package and method for manufacturing the same
App 20080048312 - Yee; Kuo Chung ; et al. | 2008-02-28 |
Semiconductor package and method for manufacturing the same
Grant 7,285,434 - Yee , et al. October 23, 2 | 2007-10-23 |
Three-dimensional package and method of making the same
App 20070172985 - Huang; Min-Lung ; et al. | 2007-07-26 |
Three-dimensional package and method of making the same
App 20070172984 - Huang; Min-Lung ; et al. | 2007-07-26 |
Three-dimensional package and method of making the same
App 20070172983 - Huang; Min-Lung ; et al. | 2007-07-26 |
Three-dimensional package and method of making the same
App 20070172986 - Huang; Min-Lung ; et al. | 2007-07-26 |
Three-dimensional package and method of making the same
App 20070172982 - Huang; Min-Lung ; et al. | 2007-07-26 |
Mold and method of molding semiconductor devices
Grant 7,247,267 - Kao , et al. July 24, 2 | 2007-07-24 |
Chip Packaging Process
App 20070004087 - Kao; Jen-Chieh ; et al. | 2007-01-04 |
Semiconductor package and method for manufacturing the same
App 20060202314 - Yee; Kuo Chung ; et al. | 2006-09-14 |
Semiconductor package structure and method for manufacturing the same
App 20060197217 - Yee; Kuo Chung | 2006-09-07 |
Semiconductor package structure and method for manufacturing the same
App 20060197216 - Yee; Kuo Chung | 2006-09-07 |
Micro-mirror package
Grant 7,053,488 - Yee May 30, 2 | 2006-05-30 |
Method of making a package structure by dicing a wafer from the backside surface thereof
Grant 7,033,914 - Yee April 25, 2 | 2006-04-25 |
Optical component package and packaging including an optical component horizontally attached to a substrate
Grant 7,002,257 - Tao , et al. February 21, 2 | 2006-02-21 |
[photoelectric Device Grinding Process And Device Grinding Process]
App 20050266601 - Yee, Kuo-Chung ; et al. | 2005-12-01 |
Package Structure Of Optical Device And Method For Manufacturing The Same
App 20050176168 - Yee, Kuo-Chung | 2005-08-11 |
Micro-mirror Package
App 20050164426 - Yee, Kuo-Chung | 2005-07-28 |
Image sensor package and method for manufacturing the same
App 20050139848 - Yee, Kuo-Chung | 2005-06-30 |
Anti-warp Package And Method Of Fabricating The Same
App 20050116359 - Yee, Kuo-Chung | 2005-06-02 |
Method of making a package structure by dicing a wafer from the backside surface thereof
App 20050042844 - Yee, Kuo-Chung | 2005-02-24 |
[mold And Method Of Molding Semiconductor Devices]
App 20050037104 - Kao, Jen-Chieh ; et al. | 2005-02-17 |
Water-level package with bump ring
Grant 6,838,762 - Tao , et al. January 4, 2 | 2005-01-04 |
Wafer-level package with a cavity and fabricating method thereof
Grant 6,822,324 - Tao , et al. November 23, 2 | 2004-11-23 |
Microsystem package structure
Grant 6,809,852 - Tao , et al. October 26, 2 | 2004-10-26 |
Microsystem Package Structure
App 20040184133 - Su, Tao ; et al. | 2004-09-23 |
Multichip wafer-level package and method for manufacturing the same
Grant 6,768,207 - Tao , et al. July 27, 2 | 2004-07-27 |
Optical component package and packaging method thereof
App 20040104488 - Tao, Su ; et al. | 2004-06-03 |
Optical integrated circuit element package and process for making the same
Grant 6,693,364 - Tao , et al. February 17, 2 | 2004-02-17 |
Optical Integrated Circuit Element Package And Process For Making The Same
App 20030234452 - Tao, Su ; et al. | 2003-12-25 |
Multichip wafer-level package and method for manufacturing the same
App 20030214029 - Tao, Su ; et al. | 2003-11-20 |
Wafer-level package with bump and method for manufacturing the same
App 20030214007 - Tao, Su ; et al. | 2003-11-20 |
Liquid crystal display device with bump and method for manufacturing the same
App 20030214618 - Tao, Su ; et al. | 2003-11-20 |
Optical integrated circuit element package and method for making the same
App 20030193018 - Tao, Su ; et al. | 2003-10-16 |
Wafer-level package with a cavity and fabricating method thereof
App 20030193096 - Tao, Su ; et al. | 2003-10-16 |
| 