YAO; Ying

Patent Applications and Registrations

Patent applications and USPTO patent grants for YAO; Ying.The latest application filed is for "method for controlling internet of things device, and terminal device".

Company Profile

2.4.10

YAO; Ying - Beijing CN
Yao; Ying - Atlanta GA
YAO; Ying - Shanghai CN
YAO; Ying - Tokyo JP
Yao; Ying - Hangzhou CN
Yao; Ying - Ann Arbor MI
YAO; YING - Shenzhen City CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Method For Controlling Internet Of Things Device, And Terminal Device App 20220300096 - LI; Yaming ; et al.	2022-09-22
Display screen or portion thereof with graphical user interface Grant D962,963 - Breier , et al. September 6, 2	2022-09-06
Chemical Mechanical Polishing Slurry And Use Thereof App 20220056308 - ZHOU; Wenting ; et al.	2022-02-24
Chemical Mechanical Polishing Solution App 20210139740 - MA; Jian ; et al.	2021-05-13
p-BORONOPHENYLALANINE DERIVATIVE AND COMPOSITION CONTAINING SAME, AND KIT FOR PRODUCING SAID DERIVATIVE AND COMPOSITION App 20210040244 - NISHIYAMA; Nobuhiro ; et al.	2021-02-11
Chemical Mechanical Polishing Slurry And Application Thereof App 20190062594 - YAO; Ying ; et al.	2019-02-28
Tablet comprising natural allicin and method for producing the same Grant 8,216,617 - Yao July 10, 2	2012-07-10
Wafer-level, polymer-based encapsulation for microstructure devices Grant 8,193,645 - Wise , et al. June 5, 2	2012-06-05
Method For Producing Tablet Comprising Natural Allicin App 20110212082 - YAO; Ying	2011-09-01
Nfc Antenna Aided Design System And Design Method Employing The Same App 20110148720 - YAO; YING ; et al.	2011-06-23
Tablet Comprising Natural Allicin And Method For Producing The Same App 20110052568 - YAO; Ying	2011-03-03
Wafer-Level, Polymer-Based Encapsulation for Microstructure Devices App 20100308456 - Wise; Kensall D. ; et al.	2010-12-09
Wafer-level, polymer-based encapsulation for microstructure devices Grant 7,790,493 - Wise , et al. September 7, 2	2010-09-07
Wafer-level, polymer-based encapsulation for microstructure devices App 20070007240 - Wise; Kensall D. ; et al.	2007-01-11

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.