Yang; Wen Kun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; Wen Kun.The latest application filed is for "semiconductor device package and method of the same".

Company Profile

0.55.130

Yang; Wen Kun - Hsin-Chu TW
Yang; Wen Kun - Hsinchu TW
YANG; Wen Kun - Hsin-Chu City TW
YANG; WEN KUN - Hsinchu City TW
Yang; Wen Kun - Hsinchuy City TW
Yang; Wen-Kun -
Yang, Wen-Kun - Hsinchui TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for forming semiconductor device package with slanting structures Grant 9,634,180 - Yang April 25, 2	2017-04-25
Semiconductor device package and method of the same Grant 9,379,081 - Yang , et al. June 28, 2	2016-06-28
Semiconductor Device Package and Method of the Same App 20150270243 - Yang; Wen Kun ; et al.	2015-09-24
Semiconductor Device Package and Method of the Same App 20150270239 - Yang; Wen Kun ; et al.	2015-09-24
LED package and method of the same Grant 9,117,941 - Yang , et al. August 25, 2	2015-08-25
Method for Forming Semiconductor Device Package with Slanting Structures App 20150111327 - YANG; Wen Kun	2015-04-23
LED Package with Slanting Structure and Method of the Same App 20150099319 - YANG; Wen Kun	2015-04-09
LED Package and Method of the Same App 20150001570 - YANG; Wen Kun ; et al.	2015-01-01
LED Package and Method of the Same App 20150004727 - YANG; Wen Kun ; et al.	2015-01-01
Semiconductor Device Package with Slanting Structures App 20130214418 - YANG; Wen Kun	2013-08-22
Semiconductor Device Package with Slanting Structures App 20130181351 - YANG; Wen Kun	2013-07-18
LED Package with Slanting Structure and Method of the Same App 20130181227 - YANG; Wen Kun	2013-07-18
Led Package And Method Of The Same App 20130056773 - YANG; Wen Kun	2013-03-07
Semiconductor device package structure and method for the same Grant 8,350,377 - Yang January 8, 2	2013-01-08
Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same Grant 8,304,287 - Yang November 6, 2	2012-11-06
LED chip Grant 8,299,488 - Yang October 30, 2	2012-10-30
Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same Grant 8,237,257 - Yang August 7, 2	2012-08-07
Stacking package structure with chip embedded inside and die having through silicon via and method of the same Grant 8,236,608 - Yang August 7, 2	2012-08-07
Image sensor package with dual substrates and the method of the same Grant 8,232,633 - Yang July 31, 2	2012-07-31
Led Chip App 20120153299 - YANG; WEN KUN	2012-06-21
Wafer level package with die receiving through-hole and method of the same Grant 8,178,963 - Yang May 15, 2	2012-05-15
Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for WLP and method of the same Grant 8,178,964 - Yang May 15, 2	2012-05-15
Image Sensor Package with Dual Substrates and the Method of the Same App 20120043635 - YANG; Wen-Kun	2012-02-23
Substrate Structure of LED (light emitting diode) Packaging and Method of the same App 20120037935 - Yang; Wen-Kun	2012-02-16
Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same Grant 8,115,297 - Yang February 14, 2	2012-02-14
Stacking package structure with chip embedded inside and die having through silicon via and method of the same Grant 8,106,504 - Yang January 31, 2	2012-01-31
Substrate Structure With Die Embedded Inside And Dual Build-up Layers Over Both Side Surfaces And Method Of The Same App 20110256714 - YANG; Wen-Kun	2011-10-20
Stacking Package Structure With Chip Embedded Inside And Die Having Through Silicon Via And Method Of The Same App 20110195546 - Yang; Wen-Kun	2011-08-11
Manufacturing tool for wafer level package and method of placing dies Grant 7,985,626 - Yang , et al. July 26, 2	2011-07-26
RF module package for releasing stress Grant 7,911,044 - Yang , et al. March 22, 2	2011-03-22
Image sensor package and forming method of the same Grant 7,863,105 - Yang , et al. January 4, 2	2011-01-04
Semiconductor Device Package Structure and Method for the Same App 20100301474 - Yang; Wen-Kun	2010-12-02
Wafer level package with die receiving through-hole and method of the same Grant 7,812,434 - Yang October 12, 2	2010-10-12
Semiconductor device package with multi-chips and method of the same Grant 7,763,494 - Yang , et al. July 27, 2	2010-07-27
Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same App 20100078655 - Yang; Wen-Kun	2010-04-01
Semiconductor device package having a back side protective scheme Grant 7,687,923 - Yang , et al. March 30, 2	2010-03-30
Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same App 20100072588 - Yang; Wen-Kun	2010-03-25
Stacking Package Structure with Chip Embedded Inside and Die Having Through Silicon Via and Method of the same App 20100072606 - YANG; Wen-Kun	2010-03-25
Fan out type wafer level package structure and method of the same Grant 7,667,318 - Yang , et al. February 23, 2	2010-02-23
Wafer level package with good CTE performance Grant 7,655,501 - Yang , et al. February 2, 2	2010-02-02
Re-distribution Conductive Line Structure And The Method Of Forming The Same App 20090212428 - Yang; Wen-Kun ; et al.	2009-08-27
Image sensor module Grant 7,566,854 - Yang , et al. July 28, 2	2009-07-28
Fan out type wafer level package structure and method of the same Grant 7,557,437 - Yang , et al. July 7, 2	2009-07-07
Inter-connecting Structure For Semiconductor Device Package And Method Of The Same App 20090166873 - Yang; Wen-Kun ; et al.	2009-07-02
Under Bump Metallurgy Structure Of Semiconductor Device Package App 20090160052 - Yang; Wen-Kun ; et al.	2009-06-25
Stacking die package structure for semiconductor devices and method of the same App 20090127686 - Yang; Wen-Kun ; et al.	2009-05-21
Image sensor with a protection layer Grant 7,525,139 - Yang , et al. April 28, 2	2009-04-28
Semiconductor device package having multi-chips with side-by-side configuration and method of the same Grant 7,525,185 - Yang , et al. April 28, 2	2009-04-28
Inter-connecting Structure For Semiconductor Package And Method Of The Same App 20090096093 - Yang; Wen-Kun ; et al.	2009-04-16
Inter-connecting Structure For Semiconductor Package And Method Of The Same App 20090096098 - Yang; Wen-Kun ; et al.	2009-04-16
Fan out type wafer level package structure and method of the same Grant 7,514,767 - Yang April 7, 2	2009-04-07
Structure of image sensor module and method for manufacturing of wafer level package Grant 7,501,310 - Yang , et al. March 10, 2	2009-03-10
Structure of image sensor module and a method for manufacturing of wafer level package Grant 7,498,646 - Yang , et al. March 3, 2	2009-03-03
Image sensor module having build-in package cavity and the method of the same Grant 7,498,556 - Yang , et al. March 3, 2	2009-03-03
Fan Out Type Wafer Level Package Structure And Method Of The Same App 20090051025 - Yang; Wen-Kun ; et al.	2009-02-26
Semiconductor Device Package Having A Back Side Protective Scheme App 20090039497 - Yang; Wen-Kun ; et al.	2009-02-12
Semiconductor Device Package Having A Back Side Protective Scheme App 20090039532 - Yang; Wen-Kun ; et al.	2009-02-12
Method for forming filling paste structure of WL package Grant 7,476,565 - Yang , et al. January 13, 2	2009-01-13
Inter-connecting Structure For Semiconductor Device Package And Method Of The Same App 20090008777 - Lin; Diann-Fang ; et al.	2009-01-08
Image Sensor Package Utilizing A Removable Protection Film And Method Of Making The Same App 20090008729 - Yang; Wen-Kun ; et al.	2009-01-08
Structure and process for WL-CSP with metal cover Grant 7,468,544 - Yang December 23, 2	2008-12-23
Semiconductor image device package with die receiving through-hole and method of the same Grant 7,459,729 - Yang , et al. December 2, 2	2008-12-02
Fan out type wafer level package structure and method of the same Grant 7,459,781 - Yang , et al. December 2, 2	2008-12-02
Structure of dielectric layers in built-up layers of wafer level package Grant 7,453,148 - Yang , et al. November 18, 2	2008-11-18
Wafer level image sensor package with die receiving cavity and method of making the same App 20080274579 - Yang; Wen-Kun ; et al.	2008-11-06
Semiconductor device package with multi-chips and method of the same App 20080274593 - Yang; Wen-Kun ; et al.	2008-11-06
Method and system of trace pull test Grant 7,446,546 - Yang , et al. November 4, 2	2008-11-04
Panel/wafer Molding Apparatus And Method Of The Same App 20080265462 - Yang; Wen-Kun ; et al.	2008-10-30
Stack Package With Releasing Layer And Method For Forming The Same App 20080265393 - Lin; Diann-Fang ; et al.	2008-10-30
Method Of Plasma Etching With Pattern Mask App 20080268647 - Yang; Wen-Kun ; et al.	2008-10-30
Semiconductor Device Package To Improve Functions Of Heat Sink And Ground Shield App 20080258293 - YANG; Wen-Kun ; et al.	2008-10-23
Semiconductor Image Device Package With Die Receiving Through-hole And Method Of The Same App 20080261346 - Yang; Wen-Kun ; et al.	2008-10-23
Semiconductor device package having multi-chips with side-by-side configuration and method of the same App 20080251908 - Yang; Wen-Kun ; et al.	2008-10-16
Wafer Level Package With Good Cte Performance App 20080248614 - Yang; Wen-Kun ; et al.	2008-10-09
Semiconductor Device Package With Die Receiving Through-hole And Dual Build-up Layers Over Both Side-surfaces For Wlp And Method Of The Same App 20080237828 - YANG; Wen-Kun	2008-10-02
Semiconductor Device Package With Die Receiving Through-hole And Dual Build-up Layers Over Both Side-surfaces For Wlp And Method Of The Same App 20080237879 - Yang; Wen-Kun	2008-10-02
Self chip redistribution apparatus and method for the same App 20080229574 - Yang; Wen-Kun ; et al.	2008-09-25
Semiconductor device package having multi-chips with side-by-side configuration and method of the same App 20080230884 - Yang; Wen-Kun ; et al.	2008-09-25
Image sensor module having build-in package cavity and the method of the same App 20080224248 - Yang; Wen-Kun ; et al.	2008-09-18
Multi-chips Package And Method Of Forming The Same App 20080224306 - YANG; Wen-Kun	2008-09-18
Semiconductor device package App 20080224276 - Yang; Wen-Kun ; et al.	2008-09-18
Structure of semiconductor device package and method of the same App 20080217761 - Yang; Wen-Kun ; et al.	2008-09-11
Sensor module package structure and method of the same Grant 7,423,335 - Yang , et al. September 9, 2	2008-09-09
Package structure to improve the reliability for WLP App 20080211080 - Yang; Wen-Kun ; et al.	2008-09-04
Image Sensor Chip Scale Package Having Inter-adhesion With Gap And Method Of The Same App 20080211075 - Yang; Wen-Kun ; et al.	2008-09-04
Image Sensor Package And Forming Method Of The Same App 20080206918 - Yang; Wen-Kun ; et al.	2008-08-28
Semiconductor device protective structure and method for fabricating the same Grant 7,416,920 - Yang , et al. August 26, 2	2008-08-26
Semiconductor device package with multi-chips and method of the same App 20080197474 - Yang; Wen-Kun ; et al.	2008-08-21
Wafer level image sensor package with die receiving cavity and method of making the same App 20080197435 - Yang; Wen-Kun ; et al.	2008-08-21
Multi-chips package with reduced structure and method for forming the same App 20080197469 - Yang; Wen-Kun ; et al.	2008-08-21
Semiconductor device package with multi-chips and method of the same App 20080197480 - Yang; Wen-Kun ; et al.	2008-08-21
Semiconductor Device Package With Die Receiving Through-hole And Connecting Through-hole And Method Of The Same App 20080197478 - Yang; Wen-Kun ; et al.	2008-08-21
Cmos Image Sensor Chip Scale Package With Die Receiving Opening And Method Of The Same App 20080191335 - Yang; Wen-Kun ; et al.	2008-08-14
Wafer Level Image Sensor Package With Die Receiving Cavity And Method Of The Same App 20080191297 - Yang; Wen-Kun ; et al.	2008-08-14
Image sensor package with die receiving opening and method of the same App 20080191333 - Yang; Wen-Kun ; et al.	2008-08-14
Structure of Memory Card and the Method of the Same App 20080174008 - Yang; Wen-Kun ; et al.	2008-07-24
Image sensor module and the method of the same App 20080173792 - Yang; Wen-Kun ; et al.	2008-07-24
Under bump metallurgy structure of a package and method of making same App 20080169539 - Fang; Sychyi ; et al.	2008-07-17
Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP Grant 7,400,037 - Yang , et al. July 15, 2	2008-07-15
Wafer level package with die receiving through-hole and method of the same App 20080157336 - Yang; Wen-Kun	2008-07-03
RF module package App 20080157340 - Yang; Wen-Kun ; et al.	2008-07-03
Structure of super thin chip scale package and method of the same App 20080157303 - Yang; Wen-Kun	2008-07-03
Package with a marking structure and method of the same App 20080157342 - Yang; Wen-Kun	2008-07-03
Multi-chips package and method of forming the same App 20080157316 - Yang; Wen-Kun	2008-07-03
Semiconductor device package having pseudo chips App 20080157398 - Yang; Wen-Kun ; et al.	2008-07-03
RF module package App 20080157341 - Yang; Wen-Kun ; et al.	2008-07-03
Sensor Module Package Structure And Method Of The Same App 20080157250 - Yang; Wen-Kun ; et al.	2008-07-03
Package On Package Structure For Semiconductor Devices And Method Of The Same App 20080157327 - Yang; Wen-Kun	2008-07-03
Semiconductor image device package with die receiving through-hole and method of the same App 20080157312 - Yang; Wen-Kun ; et al.	2008-07-03
Wafer level package with die receiving through-hole and method of the same App 20080157396 - Yang; Wen-Kun	2008-07-03
Wafer level package with die receiving through-hole and method of the same App 20080157358 - Yang; Wen-Kun	2008-07-03
Structure Of Dielectric Layers In Built-up Layers Of Wafer Level Package App 20080150130 - Yang; Wen-Kun ; et al.	2008-06-26
Tools Structure For Chip Redistribution And Method Of The Same App 20080142939 - Yang; Wen-Kun ; et al.	2008-06-19
Wafer Level Package With Good Cte Performance App 20080142946 - Yang; Wen-Kun ; et al.	2008-06-19
3d Electronic Packaging Structure With Enhanced Grounding Performance And Embedded Antenna App 20080142941 - Yew; Ming-Chih ; et al.	2008-06-19
Imagine Sensor Package And Forming Method Of The Same App 20080136012 - Yang; Wen-Kun ; et al.	2008-06-12
Image Sensor Module App 20080135728 - Yang; Wen-Kun ; et al.	2008-06-12
Multi-chip Package Structure And Method Of Forming The Same App 20080136004 - Yang; Wen-Kun ; et al.	2008-06-12
Multi-chips Package And Method Of Forming The Same App 20080136002 - Yang; Wen-Kun	2008-06-12
Structure And Process For Wl-csp With Metal Cover App 20080136026 - Yang; Wen-Kun	2008-06-12
Method And Structure Of Pattern Mask For Dry Etching App 20080116169 - Yang; Wen-Kun ; et al.	2008-05-22
Method And Structure Of Pattern Mask For Dry Etching App 20080118707 - Yang; Wen-Kun ; et al.	2008-05-22
Wafer level package with die receiving cavity and method of the same App 20080116564 - Yang; Wen-Kun ; et al.	2008-05-22
Structure Of Image Sensor Module And Method For Manufacturing Of Wafer Level Package App 20080108168 - Yang; Wen-Kun ; et al.	2008-05-08
Fan Out Type Wafer Level Package Structure And Method Of The Same App 20080105967 - Yang; Wen-Kun ; et al.	2008-05-08
Wafer Level Package Structure With Build Up Layers App 20080088004 - Yang; Wen-Kun ; et al.	2008-04-17
Cmos Image Sensor Chip Scale Package With Die Receiving Through-hole And Method Of The Same App 20080083980 - Yang; Wen-Kun ; et al.	2008-04-10
Semiconductor Packaging Method By Using Large Panel Size App 20080085572 - Yang; Wen-Kun ; et al.	2008-04-10
Chip Package And Chip Package Array App 20080073774 - Yang; Wen-Kun ; et al.	2008-03-27
Wafer street buffer layer Grant 7,342,296 - Yang , et al. March 11, 2	2008-03-11
Chip-size package structure and method of the same Grant 7,339,279 - Yang March 4, 2	2008-03-04
Method for image sensor protection Grant 7,335,870 - Yang , et al. February 26, 2	2008-02-26
Filling paste structure and process for WL-CSP App 20080044945 - Yang; Wen-Kun ; et al.	2008-02-21
Method For Separating Package Of Wlp App 20080029877 - Yang; Wen-Kun ; et al.	2008-02-07
Structure of image sensor module and a method for manufacturing of wafer level package App 20080020511 - Yang; Wen-Kun ; et al.	2008-01-24
Structure of image sensor module and a method for manufacturing of wafer level package App 20080017941 - Yang; Wen Kun ; et al.	2008-01-24
Method and system of trace pull test Grant 7,319,043 - Yang , et al. January 15, 2	2008-01-15
Method Of Plasma Etching With Pattern Mask App 20070262051 - Yang; Wen-Kun ; et al.	2007-11-15
FBGA and COB package structure for image sensor Grant 7,279,782 - Yang , et al. October 9, 2	2007-10-09
Chip-size Package Structure And Method Of The Same App 20070205494 - Yang; Wen Kun	2007-09-06
Fan out type wafer level package structure and method of the same Grant 7,262,081 - Yang , et al. August 28, 2	2007-08-28
Structure of package Grant 7,259,468 - Yang August 21, 2	2007-08-21
Method And System Of Trace Pull Test App 20070152693 - Yang; Wen-Kun ; et al.	2007-07-05
Chip-size package structure and method of the same Grant 7,238,602 - Yang July 3, 2	2007-07-03
Semiconductor package structure and method for separating package of wafer level package App 20070128835 - Yang; Wen-Kun ; et al.	2007-06-07
Package structure Grant 7,224,061 - Yang , et al. May 29, 2	2007-05-29
Semiconductor Device Protective Structure And Method For Fabricating The Same App 20070082428 - Yang; Wen-Kun ; et al.	2007-04-12
Method for separating package of WLP App 20070072338 - Yang; Wen-Kun ; et al.	2007-03-29
Method and system of trace pull test App 20070069207 - Yang; Wen-Kun ; et al.	2007-03-29
Fan out type wafer level package structure and method of the same Grant 7,196,408 - Yang , et al. March 27, 2	2007-03-27
Fan out type wafer level package structure and method of the same App 20070059866 - Yang; Wen-Kun ; et al.	2007-03-15
Semiconductor device protective structure and method for fabricating the same Grant 7,176,567 - Yang , et al. February 13, 2	2007-02-13
Semiconductor Device Protective Structure And Method For Fabricating The Same App 20070007648 - Yang; Wen-Kun ; et al.	2007-01-11
Fan Out Type Wafer Level Package Structure And Method Of The Same App 20060231958 - Yang; Wen-Kun	2006-10-19
Filling paste structure and process for WL-CSP App 20060145364 - Yang; Wen-Kun ; et al.	2006-07-06
FBGA and COB package structure for image sensor App 20060145325 - Yang; Wen-Kun ; et al.	2006-07-06
Structure of image sensor module and a method for manufacturing of wafer level package Grant 7,061,106 - Yang , et al. June 13, 2	2006-06-13
Method for package burn-in testing App 20060105594 - Yang; Wen-Kun	2006-05-18
Fan out type wafer level package structure and method of the same App 20060091514 - Yang; Wen-Kun ; et al.	2006-05-04
Chip-size package structure and method of the same App 20060087036 - Yang; Wen-Kun	2006-04-27
Package structure App 20060033196 - Yang; Wen-Kun ; et al.	2006-02-16
Manufacturing tool for wafer level package and method of placing dies App 20050247398 - Yang, Wen Kun ; et al.	2005-11-10
Manufacturing tool for wafer level package and method of placing dies App 20050249945 - Yang, Wen Kun ; et al.	2005-11-10
Structure of image sensor module and a method for manufacturing of wafer level package App 20050242408 - Yang, Wen-Kun ; et al.	2005-11-03
FCBGA package structure App 20050242427 - Yang, Wen Kun	2005-11-03
Imagine sensor with a protection layer App 20050242409 - Yang, Wen-Kun ; et al.	2005-11-03
Structure of package App 20050242418 - Yang, Wen-Kun	2005-11-03
Fan out type wafer level package structure and method of the same App 20050236696 - Yang, Wen-Kun ; et al.	2005-10-27
Structure and method for package burn-in testing App 20050182585 - Yang, Wen-Kun	2005-08-18
Fan out type wafer level package structure and method of the same App 20050124093 - Yang, Wen-Kun ; et al.	2005-06-09
Wafer level package and the process of the same Grant 6,818,475 - Yang , et al. November 16, 2	2004-11-16
Wafer level package and the process of the same App 20040032026 - Yang, Wen-Kun ; et al.	2004-02-19
Wafer level package and the process of the same App 20020160597 - Yang, Wen-Kun ; et al.	2002-10-31
Wafer level probe card App 20020121911 - Yang, Wen-Kun ; et al.	2002-09-05