Yang; Tien-Chung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; Tien-Chung.The latest application filed is for "force sensor device and method for detecting force based on temporal or spatial differential image".

Company Profile

7.19.21

Yang; Tien-Chung - Hsin-Chu City TW
YANG; TIEN-CHUNG - HSINCHU CITY TW
Yang; Tien-Chung - Hsinchu TW
Yang; Tien-Chung - Hsin-Chu TW
Yang; Tien-Chung - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Force Sensor Device And Method For Detecting Force Based On Temporal Or Spatial Differential Image App 20220137723 - Yang; Tien-Chung ; et al.	2022-05-05
Semiconductor Structure App 20220068880 - YU; CHEN-HUA ; et al.	2022-03-03
Semiconductor structure Grant 11,177,238 - Yu , et al. November 16, 2	2021-11-16
Semiconductor package and manufacturing method thereof Grant 11,145,633 - Chen , et al. October 12, 2	2021-10-12
Semiconductor structure and method of forming Grant 11,133,197 - Chen , et al. September 28, 2	2021-09-28
Semiconductor Package And Manufacturing Method Thereof App 20210066263 - Chen; Wei-Yu ; et al.	2021-03-04
Semiconductor Device And Method Of Manufacture App 20210050305 - Wu; Chi-Hsi ; et al.	2021-02-18
Semiconductor device with electromagnetic interference protection and method of manufacture Grant 10,825,780 - Wu , et al. November 3, 2	2020-11-03
Semiconductor Structure App 20200118974 - YU; CHEN-HUA ; et al.	2020-04-16
Semiconductor structure and manufacturing method thereof Grant 10,510,715 - Yu , et al. Dec	2019-12-17
Semiconductor Structure and Method of Forming App 20190326132 - Chen; Wei-Yu ; et al.	2019-10-24
Semiconductor structure and method of forming Grant 10,340,155 - Chen , et al.	2019-07-02
Package structure and manufacturing method thereof Grant 10,276,542 - Huang , et al.	2019-04-30
Semiconductor device and manufacturing method thereof Grant 10,217,687 - Yang , et al. Feb	2019-02-26
Multi-stack package-on-package structures Grant 10,163,701 - Lee , et al. Dec	2018-12-25
Semiconductor device and method of manufacture Grant 10,090,284 - Chen , et al. October 2, 2	2018-10-02
Semiconductor Device And Manufacturing Method Thereof App 20180211895 - YANG; TIEN-CHUNG ; et al.	2018-07-26
Semiconductor Device And Method Of Manufacture App 20180151510 - Wu; Chi-Hsi ; et al.	2018-05-31
Semiconductor Device and Method of Manufacture App 20180122781 - Chen; Wei-Yu ; et al.	2018-05-03
Package structures, pop devices and methods of forming the same Grant 9,941,248 - Yang , et al. April 10, 2	2018-04-10
Semiconductor device and manufacturing method thereof Grant 9,929,069 - Yang , et al. March 27, 2	2018-03-27
Wafer level shielding in multi-stacked fan out packages and methods of forming same Grant 9,922,939 - Chen , et al. March 20, 2	2018-03-20
Multi-Stack Package-on-Package Structures App 20180068979 - Lee; Chi-Jung ; et al.	2018-03-08
Package Structure And Manufacturing Method Thereof App 20180026010 - Huang; Li-Hsien ; et al.	2018-01-25
Semiconductor device and method of manufacture Grant 9,859,258 - Chen , et al. January 2, 2	2018-01-02
Package Structures, Pop Devices And Methods Of Forming The Same App 20170345795 - Yang; Tien-Chung ; et al.	2017-11-30
Semiconductor Device and Method of Manufacture App 20170338207 - Chen; Wei-Yu ; et al.	2017-11-23
Multi-Stack Package-on-Package Structures App 20170330858 - Lee; Chi-Jung ; et al.	2017-11-16
Multi-stack package-on-package structures Grant 9,806,059 - Lee , et al. October 31, 2	2017-10-31
Semiconductor Structure and Method of Forming App 20170301562 - Chen; Wei-Yu ; et al.	2017-10-19
Pop devices and methods of forming the same Grant 9,793,246 - Tseng , et al. October 17, 2	2017-10-17
Wafer Level Shielding in Multi-Stacked Fan Out Packages and Methods of Forming Same App 20170256502 - Chen; Wei-Yu ; et al.	2017-09-07
Semiconductor Structure And Manufacturing Method Thereof App 20170170145 - YU; CHEN-HUA ; et al.	2017-06-15
Wafer level shielding in multi-stacked fan out packages and methods of forming same Grant 9,659,878 - Chen , et al. May 23, 2	2017-05-23
Wafer Level Shielding In Multi-stacked Fan Out Packages And Methods Of Forming Same App 20170110413 - Chen; Wei-Yu ; et al.	2017-04-20
Semiconductor Device And Manufacturing Method Thereof App 20170098588 - YANG; TIEN-CHUNG ; et al.	2017-04-06
Semiconductor Device And Manufacturing Method Thereof App 20170053812 - YANG; TIEN-CHUNG ; et al.	2017-02-23
Semiconductor device and manufacturing method thereof Grant 9,564,345 - Yang , et al. February 7, 2	2017-02-07
Concurrent operation of plural flash memories Grant 8,325,534 - Yang , et al. December 4, 2	2012-12-04
Concurrent Operation Of Plural Flash Memories App 20120163086 - Yang; Tien-Chung ; et al.	2012-06-28

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