loadpatents
name:-0.03937292098999
name:-0.033710956573486
name:-0.0043971538543701
Yang; Ta-Hung Patent Filings

Yang; Ta-Hung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; Ta-Hung.The latest application filed is for "word line structure and method of manufacturing the same".

Company Profile
4.30.35
  • Yang; Ta-Hung - Miaoli County TW
  • Yang; Ta-Hung - Hsinchu TW
  • Yang; Ta-Hung - MIAOLI TW
  • Yang; Ta-Hung - Toufen Township Miaoli County TW
  • Yang; Ta-Hung - Hsin-Chu TW
  • Yang; Ta Hung - Tai Chung TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Word line structure and method of manufacturing the same
Grant 10,892,265 - Chen , et al. January 12, 2
2021-01-12
Word Line Structure And Method Of Manufacturing The Same
App 20200273868 - Chen; Chi-Min ;   et al.
2020-08-27
Semiconductor substrate and semiconductor device
Grant 10,497,652 - Luoh , et al. De
2019-12-03
Integrated circuit device with layered trench conductors
Grant 10,388,664 - Huang , et al. A
2019-08-20
3d Integrated Circuit Device Having A Buttress Structure For Resisting Deformation
App 20180337140 - Luoh; Tuung ;   et al.
2018-11-22
3d Memory Device With Layered Conductors
App 20180269222 - Huang; Yukai ;   et al.
2018-09-20
Integrated Circuit Device With Layered Trench Conductors
App 20180269225 - HUANG; Yukai ;   et al.
2018-09-20
Inverted-T shaped via for reducing adverse stress-migration effects
Grant 9,905,509 - Chen , et al. February 27, 2
2018-02-27
Isolation Structure And Method For Fabricating The Same
App 20170076976 - Yeh; Chin-Tsan ;   et al.
2017-03-16
Method of word-line formation by semi-damascene process with thin protective conductor layer
Grant 9,252,153 - Lung , et al. February 2, 2
2016-02-02
Inverted-t Shaped Via For Reducing Adverse Stress-migration Effects
App 20160027729 - Chen; Yen-Lu ;   et al.
2016-01-28
Measurement of line-edge-roughness and line-width-roughness on pre-layered structures
Grant 9,236,219 - Chen , et al. January 12, 2
2016-01-12
Measurement Of Line-edge-roughness And Line-width-roughness On Pre-layered Structures
App 20140264016 - CHEN; YU-CHUNG ;   et al.
2014-09-18
Isolation structure, non-volatile memory having the same, and method of fabricating the same
Grant 8,653,592 - Cheng , et al. February 18, 2
2014-02-18
Semiconductor device having plural conductive layers disposed within dielectric layer
Grant 8,519,541 - Luoh , et al. August 27, 2
2013-08-27
Method of forming a deposited material by utilizing a multi-step deposition/etch/deposition (D/E/D) process
Grant 8,520,194 - Luoh , et al. August 27, 2
2013-08-27
Method of depositing a silicon-containing material by utilizing a multi-step fill-in process in a deposition machine
Grant 8,184,288 - Luoh , et al. May 22, 2
2012-05-22
Isolation Structure, Non-volatile Memory Having The Same, And Method Of Fabricating The Same
App 20120049269 - Cheng; Ming-Da ;   et al.
2012-03-01
Hdp-cvd System
App 20120000423 - Luoh; Tuung ;   et al.
2012-01-05
Multivariate monitoring method for plasma process machine
Grant 8,085,390 - Luoh , et al. December 27, 2
2011-12-27
Lithography systems and processes
Grant 8,072,577 - Wu , et al. December 6, 2
2011-12-06
Isolation structure, non-volatile memory having the same, and method of fabricating the same
Grant 8,067,292 - Cheng , et al. November 29, 2
2011-11-29
Two Step Chemical-mechanical Polishing Process
App 20110275216 - Chen; Chun Fu ;   et al.
2011-11-10
HDP-CVD process, filling-in process utilizing HDP-CVD, and HDP-CVD system
Grant 8,034,691 - Luoh , et al. October 11, 2
2011-10-11
Fabrication of metal film stacks having improved bottom critical dimension
Grant 7,960,835 - Hsu , et al. June 14, 2
2011-06-14
Method for fabricating a pattern
Grant 7,939,451 - Tsai , et al. May 10, 2
2011-05-10
Contact Barrier Layer Deposition Process
App 20110056432 - Luoh; Tuung ;   et al.
2011-03-10
Contact barrier layer deposition process
Grant 7,846,835 - Luoh , et al. December 7, 2
2010-12-07
Fabrication Of Metal Film Stacks Having Improved Bottom Critical Dimension
App 20100276807 - Hsu; Han-Hui ;   et al.
2010-11-04
Method For Fabricating Device Isolation Structure
App 20100244180 - Hung; Yung-Tai ;   et al.
2010-09-30
Metal pad formation method and metal pad structure using the same
Grant 7,786,023 - Hung , et al. August 31, 2
2010-08-31
Hdp-cvd Process, Filling-in Process Utilizing Hdp-cvd, And Hdp-cvd System
App 20100041245 - Luoh; Tuung ;   et al.
2010-02-18
Method for manufacturing a semiconductor device
App 20100038786 - Luoh; Tuung ;   et al.
2010-02-18
Method of forming dielectric layer
Grant 7,648,921 - Yu , et al. January 19, 2
2010-01-19
Controlling system and method for operating the same
Grant 7,632,616 - Lo , et al. December 15, 2
2009-12-15
Apc System And Multivariate Monitoring Method For Plasma Process Machine
App 20090299668 - Luoh; Tuung ;   et al.
2009-12-03
Interconnection process
Grant 7,625,819 - Luoh , et al. December 1, 2
2009-12-01
Isolation Structure, Non-volatile Memory Having The Same, And Method Of Fabricating The Same
App 20090184343 - Cheng; Ming-Da ;   et al.
2009-07-23
Metallization process
App 20090081859 - Luoh; Tuung ;   et al.
2009-03-26
Apc System And Multivariate Monitoring Method For Plasma Process Machine
App 20090033915 - Luoh; Tuung ;   et al.
2009-02-05
Metal pad formation method and metal pad structure using the same
App 20080315420 - Hung; Yung-Tai ;   et al.
2008-12-25
Method For Fabricating A Pattern
App 20080305635 - Tsai; Shih-Chang ;   et al.
2008-12-11
Interconnection process
App 20080299761 - Luoh; Tuung ;   et al.
2008-12-04
Contact Barrier Layer Deposition Process
App 20080132060 - Luoh; Tuung ;   et al.
2008-06-05
Contact Barrier Layer Deposition Process
App 20080132061 - Luoh; Tuung ;   et al.
2008-06-05
Apc System And Multivariate Monitoring Method For Plasma Process Machine
App 20080123082 - LUOH; Tuung ;   et al.
2008-05-29
Method Of Forming Dielectric Layer
App 20080124940 - Yu; Hsu-Sheng ;   et al.
2008-05-29
Lithography systems and processes
App 20070279604 - Wu; Tzong Hsien ;   et al.
2007-12-06
Controlling System And Method For Operating The Same
App 20070145005 - Lo; Chao-Lung ;   et al.
2007-06-28
Method For Forming Opening
App 20070054486 - Yang; Ta-Hung
2007-03-08
Method for forming conductive wiring and interconnects
App 20070032060 - Yang; Ta-Hung
2007-02-08
Method of controlling implantation dosages during coding of read-only memory devices
Grant 6,969,642 - Yang , et al. November 29, 2
2005-11-29
Methods of code programming a mask ROM
Grant 6,875,659 - Yang , et al. April 5, 2
2005-04-05
Fine line printing by trimming the sidewalls of pre-developed resist image
Grant 6,864,185 - Yang , et al. March 8, 2
2005-03-08
Method of controlling implantation dosages during coding of read-only memory devices
App 20050020016 - Yang, Ta Hung ;   et al.
2005-01-27
Method for fabricating mask ROM with self-aligned coding
Grant 6,821,684 - Yang , et al. November 23, 2
2004-11-23
[microlithographic Process]
App 20040209196 - CHEN, MENG-WEI ;   et al.
2004-10-21
Critical dimension statistical process control in semiconductor fabrication
Grant 6,799,152 - Chen , et al. September 28, 2
2004-09-28
Fine line printing by trimming the sidewalls of pre-developed resist image
App 20040170929 - Yang, Ta-Hung ;   et al.
2004-09-02
Methods of code programming a mask ROM
App 20040033670 - Yang, Ta-Hung ;   et al.
2004-02-19
Method for fabricating mask ROM with self-aligned coding
App 20040029049 - Yang, Chun-Yi ;   et al.
2004-02-12
Integrated circuit passivation process and structure
Grant 5,883,001 - Jin , et al. March 16, 1
1999-03-16

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