| Patent | Date |
|---|
Semiconductor Packages And Methods For Forming The Same
App 20220310489 - YANG; Shin-Yi ; et al. | 2022-09-29 |
Integrated Circuit Interconnect Structure Having Discontinuous Barrier Layer And Air Gap
App 20220310446 - Chung; Chin-Lung ; et al. | 2022-09-29 |
Graded Metallic Liner For Metal Interconnect Structures And Methods For Forming The Same
App 20220302039 - LI; Shu-Wei ; et al. | 2022-09-22 |
Semiconductor Packages And Methods For Forming The Same
App 20220293527 - LEE; Ming-Han ; et al. | 2022-09-15 |
Semiconductor Packages And Methods For Forming The Same
App 20220293546 - YANG; Shin-Yi ; et al. | 2022-09-15 |
Semiconductor Packages And Methods For Forming The Same
App 20220285292 - SHUE; Shau-Lin ; et al. | 2022-09-08 |
Semiconductor Packages And Methods For Forming The Same
App 20220285318 - YANG; Shin-Yi ; et al. | 2022-09-08 |
Semiconductor Device Structure And Methods Of Forming The Same
App 20220270970 - CHAN; Yu-Chen ; et al. | 2022-08-25 |
Hybrid interconnect structure for self aligned via
Grant 11,404,366 - Yang , et al. August 2, 2 | 2022-08-02 |
Protection Liner On Interconnect Wire To Enlarge Processing Window For Overlying Interconnect Via
App 20220238434 - Yang; Shin-Yi ; et al. | 2022-07-28 |
Interconnect Structures
App 20220165617 - LUO; Guanyu ; et al. | 2022-05-26 |
Two 2d Capping Layers On Interconnect Conductive Structure To Increase Interconnect Structure Reliability
App 20220157710 - Li; Shu-Wei ; et al. | 2022-05-19 |
Protection liner on interconnect wire to enlarge processing window for overlying interconnect via
Grant 11,309,241 - Yang , et al. April 19, 2 | 2022-04-19 |
Graphene Barrier Layer
App 20220115327 - Yang; Shin-Yi ; et al. | 2022-04-14 |
Semiconductor Structure And Method For Forming The Same
App 20220068799 - LU; MENG-PEI ; et al. | 2022-03-03 |
Graphene-Assisted Low-Resistance Interconnect Structures and Methods of Formation Thereof
App 20220020694 - Yang; Shin-Yi ; et al. | 2022-01-20 |
Semiconductor Device Including Liner Structure
App 20210407852 - Yeh; Ching-Fu ; et al. | 2021-12-30 |
Protection Liner On Interconnect Wire To Enlarge Processing Window For Overlying Interconnect Via
App 20210398898 - Yang; Shin-Yi ; et al. | 2021-12-23 |
Graphene barrier layer
Grant 11,205,618 - Yang , et al. December 21, 2 | 2021-12-21 |
Hybrid Interconnect Structure For Self Aligned Via
App 20210375749 - Yang; Shin-Yi ; et al. | 2021-12-02 |
Graphene Layer for Reduced Contact Resistance
App 20210375777 - Yang; Shin-Yi ; et al. | 2021-12-02 |
Via Structure And Methods For Forming The Same
App 20210366765 - Lu; Meng-Pei ; et al. | 2021-11-25 |
Hybrid Via Interconnect Structure
App 20210366822 - Chung; Chin-Lung ; et al. | 2021-11-25 |
Graphene enabled selective barrier layer formation
Grant 11,114,374 - Yang , et al. September 7, 2 | 2021-09-07 |
Graphene layer for reduced contact resistance
Grant 11,094,631 - Yang , et al. August 17, 2 | 2021-08-17 |
Structure and formation method of interconnection structure of semiconductor device
Grant 11,088,020 - Yang , et al. August 10, 2 | 2021-08-10 |
Graphene-assisted low-resistance interconnect structures and methods of formation thereof
Grant 11,081,447 - Yang , et al. August 3, 2 | 2021-08-03 |
Method of forming interconnection structure
Grant 11,011,467 - Chan , et al. May 18, 2 | 2021-05-18 |
Interconnect structure with low resistivity and method for forming the same
Grant 10,964,636 - Yang , et al. March 30, 2 | 2021-03-30 |
Graphene Barrier Layer
App 20210082829 - Yang; Shin-Yi ; et al. | 2021-03-18 |
Graphene-Assisted Low-Resistance Interconnect Structures and Methods of Formation Thereof
App 20210082832 - Yang; Shin-Yi ; et al. | 2021-03-18 |
Barrier-Less Structures
App 20210057273 - Chen; Hsin-Ping ; et al. | 2021-02-25 |
Graphene Enabled Selective Barrier Layer Formation
App 20210057335 - Yang; Shin-Yi ; et al. | 2021-02-25 |
Method Of Forming Interconnection Structure
App 20200373239 - CHAN; Yu-Chen ; et al. | 2020-11-26 |
Method of Forming Metal Interconnection
App 20200343177 - Yang; Shin-Yi ; et al. | 2020-10-29 |
Interconnection structure and method for forming the same
Grant 10,741,493 - Chan , et al. A | 2020-08-11 |
Method of forming metal interconnection
Grant 10,714,424 - Yang , et al. | 2020-07-14 |
Semiconductor interconnect structure having graphene-capped metal interconnects
Grant 10,651,279 - Yang , et al. | 2020-05-12 |
Graphene Layer for Reduced Contact Resistance
App 20200135655 - Yang; Shin-Yi ; et al. | 2020-04-30 |
Semiconductor Structure
App 20200118925 - YANG; Shin-Yi ; et al. | 2020-04-16 |
Semiconductor Structure And Manufacturing Method Thereof
App 20200118924 - YANG; Shin-Yi ; et al. | 2020-04-16 |
Vertical MOS transistor
Grant 10,622,453 - Yang , et al. | 2020-04-14 |
Interconnect Structure With Low Resistivity And Method For Forming The Same
App 20200091055 - YANG; Shin-Yi ; et al. | 2020-03-19 |
Semiconductor interconnect structure having a graphene barrier layer
Grant 10,535,559 - Yang , et al. Ja | 2020-01-14 |
Semiconductor device with interconnecting structure and method for manufacturing the same
Grant 10,510,657 - Yang , et al. Dec | 2019-12-17 |
Semiconductor Interconnect Structure Having a Graphene Barrier Layer
App 20190259658 - YANG; Shin-Yi ; et al. | 2019-08-22 |
Vertical Mos Transistor
App 20190245054 - YANG; Tai-I ; et al. | 2019-08-08 |
Semiconductor interconnect structure having a graphene barrier layer
Grant 10,319,632 - Yang , et al. | 2019-06-11 |
Semiconductor Interconnect Structure Having Graphene-Capped Metal Interconnects
App 20190131408 - YANG; Shin-Yi ; et al. | 2019-05-02 |
Vertical MOS transistor and fabricating method thereof
Grant 10,269,915 - Yang , et al. | 2019-04-23 |
Method of Forming Metal Interconnection
App 20190115297 - Yang; Shin-Yi ; et al. | 2019-04-18 |
Interconnection Structure And Method For Forming The Same
App 20190096806 - CHAN; Yu-Chen ; et al. | 2019-03-28 |
Semiconductor Device With Interconnecting Structure And Method For Manufacturing The Same
App 20190096801 - YANG; Shin-Yi ; et al. | 2019-03-28 |
Structure And Formation Method Of Interconnection Structure Of Semiconductor Device
App 20190067089 - YANG; Tai-I ; et al. | 2019-02-28 |
Semiconductor interconnect structure having graphene-capped metal interconnects
Grant 10,164,018 - Yang , et al. Dec | 2018-12-25 |
Method of forming metal interconnection
Grant 10,163,786 - Yang , et al. Dec | 2018-12-25 |
Semiconductor Interconnect Structure Having Graphene-capped Metal Interconnects
App 20180350913 - YANG; Shin-Yi ; et al. | 2018-12-06 |
Interconnection Structure And Method For Forming The Same
App 20180342459 - CHAN; Yu-Chen ; et al. | 2018-11-29 |
Interconnection structure and method for forming the same
Grant 10,141,260 - Chan , et al. Nov | 2018-11-27 |
Vertical Mos Transistor And Fabricating Method Thereof
App 20180308947 - YANG; Tai-I ; et al. | 2018-10-25 |
Semiconductor Interconnect Structure Having A Graphene Barrier Layer
App 20180166333 - YANG; Shin-Yi ; et al. | 2018-06-14 |
Method of forming metal interconnection
Grant 9,972,529 - Yang , et al. May 15, 2 | 2018-05-15 |
Interconnect structure and manufacturing method thereof
Grant 9,818,644 - Yang , et al. November 14, 2 | 2017-11-14 |
Method for Via Plating with Seed Layer
App 20170236750 - Yang; Shin-Yi ; et al. | 2017-08-17 |
Method of Forming Metal Interconnection
App 20170186685 - Yang; Shin-Yi ; et al. | 2017-06-29 |
Method for via plating with seed layer
Grant 9,640,431 - Yang , et al. May 2, 2 | 2017-05-02 |
Method and apparatus for back end of line semiconductor device processing
Grant 9,613,854 - Yang , et al. April 4, 2 | 2017-04-04 |
Method of forming metal interconnection
Grant 9,613,856 - Yang , et al. April 4, 2 | 2017-04-04 |
Method of Forming Metal Interconnection
App 20170092536 - Yang; Shin-Yi ; et al. | 2017-03-30 |
Method of Forming Metal Interconnection
App 20170084483 - Yang; Shin-Yi ; et al. | 2017-03-23 |
Interconnect having air gaps and polymer wrapped conductive lines
Grant 9,496,170 - Yang , et al. November 15, 2 | 2016-11-15 |
Semiconductor devices and methods of manufacture thereof
Grant 9,484,302 - Yang , et al. November 1, 2 | 2016-11-01 |
Method for Via Plating with Seed Layer
App 20160240434 - Yang; Shin-Yi ; et al. | 2016-08-18 |
Interconnect Structure And Manufacturing Method Thereof
App 20160218035 - YANG; SHIN-YI ; et al. | 2016-07-28 |
Interconnect Having Air Gaps and Polymer Wrapped Conductive Lines
App 20160172232 - Yang; Shin-Yi ; et al. | 2016-06-16 |
Method for via plating with seed layer
Grant 9,324,608 - Yang , et al. April 26, 2 | 2016-04-26 |
Interconnect structure and manufacturing method thereof
Grant 9,318,439 - Yang , et al. April 19, 2 | 2016-04-19 |
Interconnect having air gaps and polymer wrapped conductive lines
Grant 9,269,668 - Yang , et al. February 23, 2 | 2016-02-23 |
Interconnect Having Air Gaps And Polymer Wrapped Conductive Lines
App 20160020176 - Yang; Shin-Yi ; et al. | 2016-01-21 |
Method and Apparatus for Back End of Line Semiconductor Device Processing
App 20160005648 - Yang; Shin-Yi ; et al. | 2016-01-07 |
Interconnect Structure And Manufacturing Method Thereof
App 20150270225 - YANG; SHIN-YI ; et al. | 2015-09-24 |
Method and apparatus for back end of line semiconductor device processing
Grant 9,142,505 - Yang , et al. September 22, 2 | 2015-09-22 |
Method for Via Plating with Seed Layer
App 20150255334 - Yang; Shin-Yi ; et al. | 2015-09-10 |
Semiconductor Devices and Methods of Manufacture Thereof
App 20150200164 - Yang; Shin-Yi ; et al. | 2015-07-16 |
Method for via plating with seed layer
Grant 9,054,163 - Yang , et al. June 9, 2 | 2015-06-09 |
Method for Via Plating with Seed Layer
App 20150126030 - Yang; Shin-Yi ; et al. | 2015-05-07 |
Semiconductor devices and methods of manufacture thereof
Grant 9,006,095 - Yang , et al. April 14, 2 | 2015-04-14 |
Method and Apparatus for Back End of Line Semiconductor Device Processing
App 20140367857 - Yang; Shin-Yi ; et al. | 2014-12-18 |
Semiconductor Devices and Methods of Manufacture Thereof
App 20140235049 - Yang; Shin-Yi ; et al. | 2014-08-21 |
Transparent Electrode with Flexibility and Method for Manufacturing the Same
App 20130295384 - Ma; Chen-Chi M. ; et al. | 2013-11-07 |
| 