Yang; Seung Taek

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; Seung Taek.The latest application filed is for "package-on-package type semiconductor device including fan-out memory package".

Company Profile

1.36.38

Yang; Seung Taek - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package-on-package type semiconductor device including fan-out memory package Grant 10,090,252 - Lee , et al. October 2, 2	2018-10-02
Package-on-package Type Semiconductor Device Including Fan-out Memory Package App 20170373010 - LEE; Sang Eun ; et al.	2017-12-28
Package-on-package type semiconductor device which is realized through applying not a TSV technology but a fan-out wafer level package technology Grant 9,793,217 - Lee , et al. October 17, 2	2017-10-17
Semiconductor Packages Including Interposer And Methods Of Manufacturing The Same App 20170287734 - OH; Tac Keun ; et al.	2017-10-05
Semiconductor packages including interposer and methods of manufacturing the same Grant 9,716,017 - Oh , et al. July 25, 2	2017-07-25
Semiconductor Packages Including Interposer And Methods Of Manufacturing The Same App 20160379845 - OH; Tac Keun ; et al.	2016-12-29
Package-on-package Type Semiconductor Device Including Fan-out Memory Package App 20160329298 - LEE; Sang Eun ; et al.	2016-11-10
Substrate including a dam for semiconductor package, semiconductor package using the same, and manufacturing method thereof Grant 9,418,875 - Yang August 16, 2	2016-08-16
Stack packages including diffusion barriers over sidewalls of through via electrodes and methods of manufacturing the same Grant 9,257,413 - Yang , et al. February 9, 2	2016-02-09
Substrate Including A Dam For Semiconductor Package, Semiconductor Package Using The Same, And Manufacturing Method Thereof App 20160013077 - YANG; Seung Taek	2016-01-14
Substrate including a dam for semiconductor package, semiconductor package using the same, and manufacturing method thereof Grant 9,171,813 - Yang October 27, 2	2015-10-27
Image sensor module and method of manufacturing the same Grant 9,166,095 - Yang , et al. October 20, 2	2015-10-20
Stack Packages And Methods Of Manufacturing The Same App 20150061120 - YANG; Seung Taek ; et al.	2015-03-05
Stacked wafer level package having a reduced size Grant 8,847,377 - Kim , et al. September 30, 2	2014-09-30
Substrate For Semiconductor Package, Semiconductor Package Using The Same, And Manufacturing Method Thereof App 20140183724 - YANG; Seung Taek	2014-07-03
Method For Manufacturing Image Sensor Module App 20130309786 - YANG; Seung Taek	2013-11-21
Semiconductor package Grant 8,502,366 - Yang August 6, 2	2013-08-06
Image Sensor Module And Method Of Manufacturing The Same App 20130102106 - YANG; Seung Taek ; et al.	2013-04-25
Semiconductor package module Grant 8,395,245 - Kim , et al. March 12, 2	2013-03-12
Reverse image sensor module and method for manufacturing the same Grant 8,383,447 - Yang February 26, 2	2013-02-26
Semiconductor package and method for manufacturing the same via holes in semiconductor chip for plurality stack chips Grant 8,361,838 - Yang , et al. January 29, 2	2013-01-29
Image sensor module and method of manufacturing the same Grant 8,357,959 - Yang , et al. January 22, 2	2013-01-22
Stacked Wafer Level Package Having A Reduced Size App 20120299199 - KIM; Jong Hoon ; et al.	2012-11-29
Stacked Wafer Level Package Having A Reduced Size App 20120299169 - KIM; Jong Hoon ; et al.	2012-11-29
Semiconductor Package App 20120205815 - YANG; Seung Taek	2012-08-16
Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same Grant 8,222,083 - Lee , et al. July 17, 2	2012-07-17
Semiconductor package having through-electrodes which are electrically connected with internal circuit patterns formed in a semiconductor chip and method for manufacturing the same Grant 8,217,434 - Son , et al. July 10, 2	2012-07-10
Reverse Image Sensor Module And Method For Manufacturing The Same App 20120171803 - YANG; Seung Taek	2012-07-05
Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layers Grant 8,178,975 - Yang , et al. May 15, 2	2012-05-15
Semiconductor package having a heat dissipation member Grant 8,159,066 - Yang April 17, 2	2012-04-17
Reverse image sensor module and method for manufacturing the same Grant 8,154,098 - Yang April 10, 2	2012-04-10
Semiconductor Package And Method For Manufacturing The Same App 20120009736 - YANG; Seung Taek ; et al.	2012-01-12
Semiconductor Chip With Fine Pitch Leads For Normal Testing Of Same App 20110309358 - KIM; Jong Hoon ; et al.	2011-12-22
Semiconductor Package Having Side Walls And Method For Manufacturing The Same App 20110287584 - SUH; Min Suk ; et al.	2011-11-24
Semiconductor package and method for manufacturing the same Grant 8,049,341 - Yang , et al. November 1, 2	2011-11-01
Stacked Wafer Level Package Having A Reduced Size App 20110233795 - KIM; Jong Hoon ; et al.	2011-09-29
Semiconductor package having side walls and method for manufacturing the same Grant 8,018,043 - Suh , et al. September 13, 2	2011-09-13
Reverse Image Sensor Module And Method For Manufacturing The Same App 20110121420 - YANG; Seung Taek	2011-05-26
Semiconductor Package With Pad Parts Electrically Connected To Bonding Pads Through Re-distribution Layers App 20110042809 - YANG; Seung Taek ; et al.	2011-02-24
Semiconductor Package Having A Heat Dissipation Member App 20110031613 - YANG; Seung Taek	2011-02-10
Image Sensor Module And Method For Manufacturing The Same App 20110032400 - YANG; Seung Taek	2011-02-10
Semiconductor package with passive elements embedded within a semiconductor chip Grant 7,884,465 - Yang February 8, 2	2011-02-08
Semiconductor package for improving characteristics for transmitting signals and power Grant 7,859,115 - Kim , et al. December 28, 2	2010-12-28
Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layers Grant 7,847,419 - Yang , et al. December 7, 2	2010-12-07
Semiconductor package with passive elements Grant 7,834,437 - Yang November 16, 2	2010-11-16
Semiconductor Package And Method For Manufacturing The Same App 20100276795 - SON; Ho Young ; et al.	2010-11-04
Method for manufacturing semiconductor package Grant 7,795,139 - Han , et al. September 14, 2	2010-09-14
Semiconductor Package Adapted For High-speed Data Processing And Damage Prevention Of Chips Packaged Therein And Method For Fabricating The Same App 20100197077 - LEE; Seung Hyun ; et al.	2010-08-05
Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same Grant 7,728,419 - Lee , et al. June 1, 2	2010-06-01
Semiconductor Package For Improving Characteristics For Transmitting Signals And Power App 20100117208 - KIM; Jong Hoon ; et al.	2010-05-13
Image Sensor Module And Method Of Manufacturing The Same App 20100059838 - YANG; Seung Taek ; et al.	2010-03-11
Semiconductor package having embedded passive elements and method for manufacturing the same Grant 7,652,347 - Yang January 26, 2	2010-01-26
Wafer level package configured to compensate size difference in different types of packages Grant 7,629,682 - Yang , et al. December 8, 2	2009-12-08
Semiconductor Package And Method For Manufacturing The Same App 20090230565 - YANG; Seung Taek ; et al.	2009-09-17
Semiconductor Package Having Side Walls And Method For Manufacturing The Same App 20090224392 - SUH; Min Suk ; et al.	2009-09-10
Stacked Wafer Level Package Having A Reduced Size App 20090166836 - KIM; Jong Hoon ; et al.	2009-07-02
Semiconductor Package Module App 20090121326 - KIM; Jong Hoon ; et al.	2009-05-14
Method for fabricating semiconductor package Grant 7,498,199 - Yang March 3, 2	2009-03-03
Semiconductor Package With Pad Parts Electrically Connected To Bonding Pads Through Re-distribution Layers App 20090051030 - YANG; Seung Taek ; et al.	2009-02-26
Semiconductor Package Adapted For High-speed Data Processing And Damage Prevention Of Chips Packaged Therein And Method For Fabricating The Same App 20090026591 - LEE; Seung Hyun ; et al.	2009-01-29
A Semiconductor Package With Passive Elements Embedded Within A Semiconductor Chip App 20080315416 - YANG; Seung Taek	2008-12-25
Method For Manufacturing Semiconductor Package App 20080318361 - HAN; Kwon Whan ; et al.	2008-12-25
Method For Fabricating Semiconductor Package App 20080311701 - YANG; Seung Taek	2008-12-18
Semiconductor Package With Passive Elements App 20080308918 - YANG; Seung Taek	2008-12-18
Stack package with vertically formed heat sink Grant 7,429,792 - Lee , et al. September 30, 2	2008-09-30
Wafer level package configured to compensate size difference in different types of packages App 20080122062 - Yang; Seung Taek ; et al.	2008-05-29
Semiconductor package having embedded passive elements and method for manufacturing the same App 20080001285 - Yang; Seung Taek	2008-01-03
Stack Package With Vertically Formed Heat Sink App 20080001283 - LEE; Ha Na ; et al.	2008-01-03

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