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Optical sensor and manufacturing method thereof
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Optical Sensor And Manufacturing Method Thereof
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Optical sensor and manufacturing method thereof
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Testing assembly for testing magnetic sensor and method for testing magnetic sensor
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Optical Sensor and Manufacturing Method Thereof
App 20160049529 - YU; Teng-Chien ; et al. | 2016-02-18 |
Testing Assembly for Testing Magnetic Sensor and Method for Testing Magnetic Sensor
App 20160011277 - Chen; Kuang-Ching ; et al. | 2016-01-14 |
Integrated circuit layout
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Switchable readout device
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Semiconductor device
Grant 8,952,500 - Huang , et al. February 10, 2 | 2015-02-10 |
Switchable Readout Device
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Stacked chip system
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Switchable readout device
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Method for fabricating a through-silicon via
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Stacked Chip System
App 20140266418 - Huang; Chao-Yuan ; et al. | 2014-09-18 |
Integrated Circuit Layout
App 20140264918 - Huang; Chao-Yuan ; et al. | 2014-09-18 |
Integrated Structure
App 20140264630 - Huang; Chao-Yuan ; et al. | 2014-09-18 |
A Semiconductor Device with a Through-Silicon Via and a Method for Making the Same
App 20140264917 - Huang; Chao-Yuan ; et al. | 2014-09-18 |
Semiconductor Device
App 20140264912 - Huang; Chao-Yuan ; et al. | 2014-09-18 |
Stacked Integrated Circuit System
App 20140264915 - Huang; Chao-Yuan ; et al. | 2014-09-18 |
Semiconductor Device
App 20140264869 - Huang; Chao-Yuan ; et al. | 2014-09-18 |
Semiconductor Device
App 20140264913 - Huang; Chao-Yuan ; et al. | 2014-09-18 |
Method For Fabricating A Through-silicon Via
App 20140273435 - Huang; Chao-Yuan ; et al. | 2014-09-18 |
Switchable Readout Device
App 20140197878 - SUN; Tai-Ping ; et al. | 2014-07-17 |
Method for fabricating an image sensor device
Grant 8,283,110 - Yang , et al. October 9, 2 | 2012-10-09 |
Method For Fabricating An Image Sensor Device
App 20110311919 - YANG; Ming-Sheng ; et al. | 2011-12-22 |
Electronic Device With Fuse Structure And Method For Repairing The Same
App 20110121426 - Yang; Ming-Sheng ; et al. | 2011-05-26 |
Light sensing element having two functions
Grant 7,719,732 - Wei , et al. May 18, 2 | 2010-05-18 |
Air gap for dual damascene applications
Grant 7,449,407 - Lur , et al. November 11, 2 | 2008-11-11 |
Method For Adjusting Visibility Of A Display And System Thereof
App 20070273680 - Yang; Ming Sheng ; et al. | 2007-11-29 |
Air gap formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit device
Grant 7,253,095 - Lur , et al. August 7, 2 | 2007-08-07 |
Air Gap For Tungsten/aluminum Plug Applications
App 20070076339 - Lur; Water ; et al. | 2007-04-05 |
Air gap for tungsten/aluminum plug applications
Grant 7,138,329 - Lur , et al. November 21, 2 | 2006-11-21 |
Electro-chemical Deposition Apparatus And Method Of Preventing Cavities In An Ecd Copper Film
App 20060199381 - Chen; Hsueh-Chung ; et al. | 2006-09-07 |
Light sensing element having two functions
App 20060132861 - Wei; Chih-Hsien ; et al. | 2006-06-22 |
Chemical mechanical polishing in forming semiconductor device
Grant 7,037,802 - Yang , et al. May 2, 2 | 2006-05-02 |
Air gap formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit device
App 20050263896 - Lur, Water ; et al. | 2005-12-01 |
Air gap structure and formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit device
Grant 6,917,109 - Lur , et al. July 12, 2 | 2005-07-12 |
Method of forming interconnect structure with low dielectric constant
Grant 6,905,938 - Yang , et al. June 14, 2 | 2005-06-14 |
Method of manufacturing a semiconductor device
Grant 6,858,487 - Yang , et al. February 22, 2 | 2005-02-22 |
Chemical mechanical polishing in forming semiconductor device
App 20050032328 - Yang, Ming-Sheng ; et al. | 2005-02-10 |
Electro-chemical deposition apparatus and method of preventing cavities in an ECD copper film
App 20040178058 - Chen, Hsueh-Chung ; et al. | 2004-09-16 |
Chemical mechanical polishing in forming semiconductor device
Grant 6,790,742 - Yang , et al. September 14, 2 | 2004-09-14 |
Method Of Manufacturing A Semiconductor Device
App 20040132259 - Yang, Ming-Sheng ; et al. | 2004-07-08 |
Air gap structure and formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit device
App 20040097013 - Lur, Water ; et al. | 2004-05-20 |
Air gap for dual damascene applications
App 20040094821 - Lur, Water ; et al. | 2004-05-20 |
Air gap for tungsten/aluminum plug applications
App 20040097065 - Lur, Water ; et al. | 2004-05-20 |
Method of preventing leakage current of a metal-oxide semiconductor transistor
Grant 6,723,609 - Yang , et al. April 20, 2 | 2004-04-20 |
Thermal process for reducing copper via distortion and crack
App 20040038526 - Liu, Jeng-Mei ; et al. | 2004-02-26 |
Method for increasing adhesion ability of dielectric material in semiconductor
Grant 6,677,231 - Tsai , et al. January 13, 2 | 2004-01-13 |
Chemical mechanical polishing method for copper
Grant 6,616,510 - Hsu , et al. September 9, 2 | 2003-09-09 |
Method of planarization
Grant 6,609,954 - Yang , et al. August 26, 2 | 2003-08-26 |
Method of preventing leakage current of a metal-oxide semiconductor transistor
App 20030148585 - Yang, Ming-Sheng ; et al. | 2003-08-07 |
Method of fabricating low dielectric constant film
Grant 6,596,652 - Yang , et al. July 22, 2 | 2003-07-22 |
Chemical mechanical polishing in forming semiconductor device
App 20030129808 - Yang, Ming-Sheng ; et al. | 2003-07-10 |
Method for forming interconnect structure with low dielectric constant
App 20030119306 - Yang, Ming-Sheng ; et al. | 2003-06-26 |
Method of planarization
App 20030087590 - Yang, Ming-Sheng ; et al. | 2003-05-08 |
Method of electroplating
App 20020176996 - Chen, Hsueh-Chung ; et al. | 2002-11-28 |
Surface densification of low dielectric constant film
App 20020177329 - Yang, Neng-Hui ; et al. | 2002-11-28 |
Method for stabilizing low dielectric constant layer
App 20020137360 - Tsai, Cheng-Yuan ; et al. | 2002-09-26 |
Method of fabricating low dielectric constant film
App 20020127874 - Yang, Neng-Hui ; et al. | 2002-09-12 |
Method of forming dual damascene structure
Grant 6,440,861 - Liu , et al. August 27, 2 | 2002-08-27 |
Method For Stabilizing Low Dielectric Constant Materials
App 20020115305 - Tsai, Cheng-Yuan ; et al. | 2002-08-22 |
Method for manufacturing cooper interconnects by using a cap layer
App 20020102840 - Tsai, Teng-Chun ; et al. | 2002-08-01 |
Method for improving curvature of the polished surface by chemical mechanical polishing
App 20020090893 - Hsu, Chia-Lin ; et al. | 2002-07-11 |
Method of forming an intermetal dielectric layer
Grant 6,410,106 - Tsai , et al. June 25, 2 | 2002-06-25 |
Method for removing carbon-rich particles adhered on the exposed copper surface of a copper/low k dielectric dual damascene structure
App 20020068435 - Tsai, Teng-Chun ; et al. | 2002-06-06 |
Method for removing carbon-rich particles adhered on a copper surface
App 20020068455 - Tsai, Teng-Chun ; et al. | 2002-06-06 |
Chemical mechanical polishing method for copper
App 20020065025 - Hsu, Chia-Lin ; et al. | 2002-05-30 |
Method for depositing silicon carbide in semiconductor devices
Grant 6,365,527 - Yang , et al. April 2, 2 | 2002-04-02 |
Method of improving surface planarity of chemical-mechanical polishing operation by forming shallow dummy
App 20020025689 - Yang, Ming-Sheng ; et al. | 2002-02-28 |
Method for improving non-uniformity of chemical mechanical polishing by over coating
Grant 6,344,408 - Chen , et al. February 5, 2 | 2002-02-05 |
Low-K dual damascene integration process
Grant 6,323,123 - Liu , et al. November 27, 2 | 2001-11-27 |
Chemical Mechanical Polishing Methods Using Low Ph Slurrymixtures
App 20010002335 - YANG, MING-SHENG ; et al. | 2001-05-31 |
Method of forming an intermetal dielectric layer
App 20010001678 - Tsai, Cheng-Yuan ; et al. | 2001-05-24 |
Method of forming an intermetal dielectric layer
Grant 6,200,653 - Tsai , et al. March 13, 2 | 2001-03-13 |
Method fabricating metal interconnected structure
Grant 6,169,028 - Wang , et al. January 2, 2 | 2001-01-02 |
Chemical-mechanical polishing station with end-point monitoring device
Grant 6,077,147 - Yang , et al. June 20, 2 | 2000-06-20 |
Post-CMP wafer clean process
Grant 6,024,106 - Yang , et al. February 15, 2 | 2000-02-15 |
Method of forming a dual damascene with dummy metal lines
Grant 6,001,733 - Huang , et al. December 14, 1 | 1999-12-14 |
Liner for a cargo container
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