Yang; Kuo-Pin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; Kuo-Pin.The latest application filed is for "semiconductor package with through silicon vias and method for making the same".

Company Profile

0.19.24

Yang; Kuo-Pin - Kaohsiung TW
Yang; Kuo-Pin - Kaohsiung City TW
Yang; Kuo Pin - Meinong Township TW
Yang; Kuo-Pin - Kao-Hsiung Hsien TW
Yang; Kuo-Pin - Kaohsiung County TW
Yang; Kuo-Pin - Meinong Town TW
Yang; Kuo Pin - Meining Township TW
Yang; Kuo-Pin - Kaoshiung TW
Yang; Kuo-Pin - Kaohsiung Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Carrier bonding and detaching processes for a semiconductor wafer Grant 8,865,520 - Yang , et al. October 21, 2	2014-10-21
Semiconductor package with through silicon vias and method for making the same Grant 8,643,167 - Hung , et al. February 4, 2	2014-02-04
Method for forming a via in a substrate and substrate with a via Grant 8,471,156 - Wang , et al. June 25, 2	2013-06-25
Chip having a bump and package having the same Grant 8,314,490 - Yang November 20, 2	2012-11-20
Semiconductor Package With Through Silicon Vias And Method For Making The Same App 20120175767 - Hung; Chia-Lin ; et al.	2012-07-12
Silicon substrate having through vias and package having the same Grant 8,188,593 - Chen , et al. May 29, 2	2012-05-29
Carrier Bonding And Detaching Processes For A Semiconductor Wafer App 20120052654 - Yang; Kuo-Pin ; et al.	2012-03-01
Microelectromechanical microphone packaging system Grant 7,945,062 - Wang , et al. May 17, 2	2011-05-17
Method for forming a via in a substrate and substrate with a via App 20110048788 - Wang; Meng-Jen ; et al.	2011-03-03
Microelectromechanical system package and the method for manufacturing the same Grant 7,833,815 - Wang , et al. November 16, 2	2010-11-16
Chip Having a Bump and Package Having the Same App 20100244244 - Yang; Kuo-Pin	2010-09-30
Silicon Substrate Having Through Vias and Package Having the Same App 20100187681 - Chen; Kuo-Hua ; et al.	2010-07-29
Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same Grant 7,573,124 - Wang , et al. August 11, 2	2009-08-11
Method for encapsulating sensor chips Grant 7,563,652 - Yang , et al. July 21, 2	2009-07-21
Package optical chip with conductive pillars Grant 7,560,744 - Hsiao , et al. July 14, 2	2009-07-14
Semiconductor Package Structure, Applications Thereof And Manufacturing Method Of The Same App 20090140413 - WANG; Meng-Jen ; et al.	2009-06-04
Microelectromechanical System Package And The Method For Manufacturing The Same App 20080303126 - WANG; Meng Jen ; et al.	2008-12-11
Method of fabricating wafer level package Grant 7,435,621 - Yang October 14, 2	2008-10-14
Method of fabricating wafer level package Grant 7,429,499 - Yang September 30, 2	2008-09-30
Chip Hermetic Package Device And Method For Producing The Same App 20080230885 - Wang; Meng-jen ; et al.	2008-09-25
Chip Scale Package And Method For Marking Chip Scale Packages App 20080132000 - TSAI; Yu Pin ; et al.	2008-06-05
Semiconductor Packaging Structure Having Electromagnetic Shielding Function And Method For Manufacturing The Same App 20080087987 - Wang; Meng-Jen ; et al.	2008-04-17
Method for Encasulating Sensor Chips App 20080009102 - Yang; Kuo-Pin ; et al.	2008-01-10
Semiconductor Device Package App 20070252261 - Wang; Meng-Jen ; et al.	2007-11-01
Microelectromechanical microphone packaging system App 20070205499 - Wang; Wei-Chung ; et al.	2007-09-06
Wafer level package for image sensor components and fabricating method thereof App 20070187711 - Hsiao; Wei-Min ; et al.	2007-08-16
Package structure and fabricating method thereof App 20070158828 - Hsiao; Wei-Min ; et al.	2007-07-12
Package structure of semiconductor and wafer-level formation thereof Grant 7,238,590 - Yang , et al. July 3, 2	2007-07-03
Method for forming wafer-level heat spreader structure and package structure thereof App 20060278974 - Hsiao; Wei-Min ; et al.	2006-12-14
Method for packaging an image sensor die and a package thereof App 20060255253 - Hsiao; Wei-Min ; et al.	2006-11-16
Method of fabricating wafer level package App 20060252230 - Yang; Kuo-Pin	2006-11-09
Package Structure of Semiconductor and Wafer-level Formation Thereof App 20060216859 - Yang; Kuo-Pin ; et al.	2006-09-28
Package of image sensor device and formation thereof App 20060211173 - Hsiao; Wei-Min ; et al.	2006-09-21
Method for preparing arylphosphonite antioxidant Grant 7,105,424 - Tsai , et al. September 12, 2	2006-09-12
Method for preparing arylphosphonite antioxidant App 20050142837 - Tsai, Yu-Pen ; et al.	2005-06-30
Chip scale package and method for marking the same App 20040188860 - Tsai, Yu Pen ; et al.	2004-09-30
Semiconductor wafer and testing method for the same Grant 6,768,332 - Lin , et al. July 27, 2	2004-07-27
Semicondutor wafer device App 20040032009 - Fang, Yao-Shin ; et al.	2004-02-19
Semiconductor wafer and testing method for the same App 20040021479 - Lin, Yueh Lung ; et al.	2004-02-05
Chip-scale semiconductor package Grant 6,150,730 - Chung , et al. November 21, 2	2000-11-21

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