Yang; Jun-Young

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; Jun-Young.The latest application filed is for "semiconductor package and method of fabricating the same".

Company Profile

0.20.24

Yang; Jun-Young - Kaohsiung TW
Yang; Jun-Young - Gyeongbuk N/A KR
Yang; Jun Young - Suwon-si N/A KR
Yang; Jun Young - Seoul KR
YANG; Jun-Young - Chilgok-gun KR
Yang; Jun Young - Kaohsing TW
Yang; Jun-Young - Paju-Si KR
Yang; Jun-Young - Kyunggi-Do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package with grounding and shielding layers Grant 9,236,356 - Yang , et al. January 12, 2	2016-01-12
Semiconductor Package And Method Of Fabricating The Same App 20150035127 - YANG; Jun-Young ; et al.	2015-02-05
Method for fabricating cliche, and method for forming thin film pattern by using the same Grant 8,882,953 - Kook , et al. November 11, 2	2014-11-11
Earphone antenna of a portable terminal Grant 8,625,814 - Yang , et al. January 7, 2	2014-01-07
Near chip size semiconductor package Grant 8,154,111 - Crowley , et al. April 10, 2	2012-04-10
Earphone Antenna Of A Portable Terminal App 20110274285 - YANG; Jun Young ; et al.	2011-11-10
Method For Fabricating Cliche And Method For Forming Thin Film Pattern By Using The Same App 20110132527 - KOOK; Yun-Ho ; et al.	2011-06-09
Chip scale package and method for manufacturing the same Grant 7,833,837 - Yang , et al. November 16, 2	2010-11-16
Semiconductor device package and manufacturing method Grant 7,700,411 - Yang , et al. April 20, 2	2010-04-20
Semiconductor device package and manufacturing method Grant 7,656,047 - Yang , et al. February 2, 2	2010-02-02
Semiconductor device package and manufacturing method thereof Grant 7,633,170 - Yang , et al. December 15, 2	2009-12-15
Semiconductor package for encapsulating multiple dies and method of manufacturing the same Grant 7,439,098 - Yang , et al. October 21, 2	2008-10-21
Semiconductor Device Package And Manufacturing Method Thereof App 20080174013 - YANG; Jun Young ; et al.	2008-07-24
Semiconductor Device Package And Manufacturing Method App 20080061407 - Yang; Jun Young ; et al.	2008-03-13
Semiconductor device package and manufacturing method App 20080042301 - Yang; Jun Young ; et al.	2008-02-21
Chip Scale Package And Method For Manufacturing The Same App 20080032452 - YANG; Jun Young ; et al.	2008-02-07
Die pick and place tool App 20070272727 - Yang; Jun-Young	2007-11-29
Multiple chip package module and method of fabricating the same App 20070257348 - Yang; Jun-Young	2007-11-08
Semiconductor package and method of manufacturing the same App 20070087471 - Yang; Jun-Young ; et al.	2007-04-19
Semiconductor package having passive component disposed between semiconductor device and substrate Grant 7,166,917 - Yang , et al. January 23, 2	2007-01-23
Semiconductor package having pre-plated leads and method of manufacturing the same App 20070013038 - Yang; Jun-Young	2007-01-18
Optic semiconductor module and manufacturing method Grant 7,146,106 - Yang , et al. December 5, 2	2006-12-05
Package structure and fabrication thereof App 20060216868 - Yang; Jun-Young ; et al.	2006-09-28
Chip scale package and method for manufacturing the same App 20060170096 - Yang; Jun Young ; et al.	2006-08-03
Semiconductor package App 20060145339 - Yang; Jun Young ; et al.	2006-07-06
Semiconductor device package and manufacturing method thereof App 20060145361 - Yang; Jun Young ; et al.	2006-07-06
Stackable semiconductor package and method for manufacturing same Grant 7,045,396 - Crowley , et al. May 16, 2	2006-05-16
Singulation method used in image sensor packaging process and support for use therein App 20060063357 - Yang; Jun Young ; et al.	2006-03-23
Process and lead frame for making leadless semiconductor packages App 20060033184 - Park; Hyung Jun ; et al.	2006-02-16
Semiconductor package including passive elements and method of manufacture Grant 6,995,448 - Lee , et al. February 7, 2	2006-02-07
Multi-chip image sensor package module App 20060016973 - Yang; Jun-Young ; et al.	2006-01-26
Image sensor package module with a leadless leadframe between chips App 20050258518 - Yang, Jun-Young ; et al.	2005-11-24
Semiconductor package including low temperature co-fired ceramic substrate Grant 6,879,034 - Yang , et al. April 12, 2	2005-04-12
Stackable semiconductor package and method for manufacturing same Grant 6,730,544 - Yang May 4, 2	2004-05-04
Near chip size semiconductor package App 20040056338 - Crowley, Sean Timothy ; et al.	2004-03-25
Optic semiconductor module and manufacturing method App 20040036135 - Yang, Jun Young ; et al.	2004-02-26
Optical structure having an optical diode and a sensor in separate apertures inside double insulating layers Grant 6,646,290 - Lee , et al. November 11, 2	2003-11-11
Near chip size semiconductor package Grant 6,639,308 - Crowley , et al. October 28, 2	2003-10-28
Stackable semiconductor package and method for manufacturing same App 20030197290 - Crowley, Sean Timothy ; et al.	2003-10-23
Stackable semiconductor package and method for manufacturing same Grant 6,605,866 - Crowley , et al. August 12, 2	2003-08-12
Thin profile stackable semiconductor package and method for manufacturing App 20030006494 - Lee, Sang Ho ; et al.	2003-01-09
Semiconductor package including passive elements and method of manufacture App 20020140085 - Lee, Sang Ho ; et al.	2002-10-03

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