Yang; Hongchao
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yang; Hongchao.The latest application filed is for "plating apparatus and plating method".
- Yang; Hongchao - Shanghai CN
Trademarks
| Patent | Date |
|---|---|
| Plating Apparatus And Plating Method App 20220081796 - Jin; Yinuo ; et al. | 2022-03-17 |
| Electroplating Apparatus And Electroplating Method App 20210301416 - JIA; Zhaowei ; et al. | 2021-09-30 |
| Apparatus for holding a substrate Grant 11,008,669 - Wang , et al. May 18, 2 | 2021-05-18 |
| Coater With Automatic Cleaning Function And Coater Automatic Cleaning Method App 20210072645 - Wang; Hui ; et al. | 2021-03-11 |
| Plating Chuck App 20210066106 - Wang; Hui ; et al. | 2021-03-04 |
| Plating Apparatus App 20200354851 - Jia; Zhaowei ; et al. | 2020-11-12 |
| Coater with automatic cleaning function and coater automatic cleaning method Grant 10,816,901 - Wang , et al. October 27, 2 | 2020-10-27 |
| Substrate Heat Treatment Apparatus App 20200294825 - Wang; Hui ; et al. | 2020-09-17 |
| Data mining method Grant 10,482,093 - Wang , et al. Nov | 2019-11-19 |
| Apparatus and method for plating and/or polishing wafer Grant 10,227,705 - Wang , et al. | 2019-03-12 |
| Apparatus For Holding A Substrate App 20180320285 - Wang; Hui ; et al. | 2018-11-08 |
| Marking Of Business District Information Of A Merchant App 20170372331 - Yang; Hongchao ; et al. | 2017-12-28 |
| Coater With Automatic Cleaning Function And Coater Automatic Cleaning Method App 20170248848 - Wang; Hui ; et al. | 2017-08-31 |
| Data Mining Method App 20160314174 - Wang; Jun ; et al. | 2016-10-27 |
| Apparatus And Method For Plating And/or Polishing Wafer App 20160115613 - Wang; Jian ; et al. | 2016-04-28 |
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