Yang; Ching-Jung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; Ching-Jung.The latest application filed is for "semiconductor structure and manufacturing method thereof".

Company Profile

35.58.65

Yang; Ching-Jung - Taoyuan City TW
Yang; Ching-Jung - Pingzhen TW
Yang; Ching-Jung - Taoyuan TW
YANG; CHING-JUNG - TAOYUAN COUNTY TW
Yang; Ching-Jung - Pingzhen City TW
- Pingzhen TW
Yang; Ching-Jung - Hsinchu N/A TW
YANG; Ching-Jung - Hsinchu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Structure And Manufacturing Method Thereof App 20220285279 - Yang; Ching-Jung ; et al.	2022-09-08
Semiconductor Package With Shared Barrier Layer In Redistribution And Via And Method Of Manufacturing The Same App 20220262772 - Chen; Hsien-Wei ; et al.	2022-08-18
Packages for Semiconductor Devices, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices App 20220262765 - Yang; Ching-Jung ; et al.	2022-08-18
Plurality of different size metal layers for a pad structure Grant 11,417,599 - Chen , et al. August 16, 2	2022-08-16
Semiconductor Structure Including Interconnection To Probe Pad With Probe Mark App 20220238397 - Chen; Hsien-Wei ; et al.	2022-07-28
Semiconductor structure and manufacturing method thereof Grant 11,373,953 - Yang , et al. June 28, 2	2022-06-28
Semiconductor package with shared barrier layer in redistribution and via Grant 11,362,064 - Chen , et al. June 14, 2	2022-06-14
Semiconductor Structure Having An Anti-arcing Pattern Disposed On A Passivation Layer And Method Of Fabricating The Semiconductor Structure App 20220165633 - Kuo; Sheng-An ; et al.	2022-05-26
Method Of Manufacturing Die Stack Structure App 20220165711 - Yang; Ching-Jung ; et al.	2022-05-26
Semiconductor structure including interconnection to probe pad with probe mark and method of manufacturing the same Grant 11,335,610 - Chen , et al. May 17, 2	2022-05-17
Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices Grant 11,329,022 - Yang , et al. May 10, 2	2022-05-10
Die stack structure with hybrid bonding structure and method of fabricating the same and package Grant 11,251,157 - Yang , et al. February 15, 2	2022-02-15
Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and method of fabricating the semiconductor structure Grant 11,251,100 - Kuo , et al. February 15, 2	2022-02-15
Integrated circuit device with through interconnect via and methods of manufacturing the same Grant 11,121,084 - Chen , et al. September 14, 2	2021-09-14
Semiconductor Structure App 20210257340 - Chen; Hsien-Wei ; et al.	2021-08-19
Semiconductor Device And Fabricating Method Thereof App 20210225788 - HUANG; CHANG-PIN ; et al.	2021-07-22
Semiconductor Structure Including Interconnection To Probe Pad With Probe Mark And Method Of Manufacturing The Same App 20210151355 - Chen; Hsien-Wei ; et al.	2021-05-20
Method of fabricating semiconductor structure Grant 10,998,293 - Chen , et al. May 4, 2	2021-05-04
Bump structure and fabricating method thereof Grant 10,985,121 - Huang , et al. April 20, 2	2021-04-20
Package Structure And Method Of Manufacturing The Same App 20210098423 - Chen; Hsien-Wei ; et al.	2021-04-01
Semiconductor Structure And Method Of Fabricating The Same App 20210090966 - Kuo; Sheng-An ; et al.	2021-03-25
Semiconductor Device And Manufacturing Method Thereof App 20210082849 - SHAO; TUNG-LIANG ; et al.	2021-03-18
Package Structure With Protective Structure And Method Of Fabricating The Same App 20210074681 - Chen; Hsien-Wei ; et al.	2021-03-11
Semiconductor Structure And Manufacturing Method Thereof App 20210043576 - Yang; Ching-Jung ; et al.	2021-02-11
Integrated Circuit Device With Through Interconnect Via And Methods Of Manufacturing The Same App 20210035907 - Chen; Hsien-Wei ; et al.	2021-02-04
Semiconductor packaging structure including interconnection to probe pad with probe mark and method of manufacturing the same Grant 10,879,138 - Chen , et al. December 29, 2	2020-12-29
Package with solder regions aligned to recesses Grant 10,879,198 - Yang , et al. December 29, 2	2020-12-29
Semiconductor Packaging Structure Including Interconnection To Probe Pad With Probe Mark And Method Of Manufacturing The Same App 20200395254 - Chen; Hsien-Wei ; et al.	2020-12-17
Method Of Fabricating Semiconductor Structure App 20200395339 - Chen; Hsien-Wei ; et al.	2020-12-17
3DIC structure with protective structure and method of fabricating the same Grant 10,867,968 - Chen , et al. December 15, 2	2020-12-15
Semiconductor device and manufacturing method thereof Grant 10,854,564 - Shao , et al. December 1, 2	2020-12-01
Semiconductor Structure And Manufacturing Method Thereof App 20200365514 - Yang; Ching-Jung ; et al.	2020-11-19
Semiconductor structure and manufacturing method thereof Grant 10,840,190 - Yang , et al. November 17, 2	2020-11-17
Hollow metal pillar packaging scheme Grant 10,825,804 - Huang , et al. November 3, 2	2020-11-03
Plurality of Different Size Metal Layers for a Pad Structure App 20200279802 - Chen; Hsien-Wei ; et al.	2020-09-03
Plurality of different size metal layers for a pad structure Grant 10,658,290 - Chen , et al.	2020-05-19
Integrated circuit component package and method of fabricating the same Grant 10,636,757 - Yang , et al.	2020-04-28
3dic Structure With Protective Structure And Method Of Fabricating The Same App 20200098731 - Chen; Hsien-Wei ; et al.	2020-03-26
3dic Structure With Protective Structure And Method Of Fabricating The Same And Package App 20190393194 - Chen; Hsien-Wei ; et al.	2019-12-26
3DIC structure with protective structure and method of fabricating the same and package Grant 10,504,873 - Chen , et al. Dec	2019-12-10
Hollow Metal Pillar Packaging Scheme App 20190341377 - Huang; Chang-Pin ; et al.	2019-11-07
Plurality of Different Size Metal Layers for a Pad Structure App 20190259700 - Chen; Hsien-Wei ; et al.	2019-08-22
Hollow metal pillar packaging scheme Grant 10,354,986 - Huang , et al. July 16, 2	2019-07-16
Package with Solder Regions Aligned to Recesses App 20190214356 - Yang; Ching-Jung ; et al.	2019-07-11
Packages for Semiconductor Devices, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices App 20190157238 - Yang; Ching-Jung ; et al.	2019-05-23
Semiconductor Structure App 20190139842 - CHEN; HSIEN-WEI ; et al.	2019-05-09
Die Stack Structure And Method Of Fabricating The Same And Package App 20190131277 - Yang; Ching-Jung ; et al.	2019-05-02
Plurality of different size metal layers for a pad structure Grant 10,276,496 - Chen , et al.	2019-04-30
Method for manufacturing semiconductor structure Grant 10,269,737 - Huang , et al.	2019-04-23
Semiconductor Device And Fabricating Method Thereof App 20190115312 - HUANG; CHANG-PIN ; et al.	2019-04-18
Package with solder regions aligned to recesses Grant 10,262,958 - Yang , et al.	2019-04-16
Integrated Circuit Component Package And Method Of Fabricating The Same App 20190067226 - Yang; Ching-Jung ; et al.	2019-02-28
Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices Grant 10,170,444 - Yang , et al. J	2019-01-01
Semiconductor device and fabricating method thereof Grant 10,163,828 - Huang , et al. Dec	2018-12-25
Semiconductor Device And Manufacturing Method Thereof App 20180331059 - SHAO; TUNG-LIANG ; et al.	2018-11-15
Package with Solder Regions Aligned to Recesses App 20180226370 - Yang; Ching-Jung ; et al.	2018-08-09
Semiconductor device and manufacturing method thereof Grant 10,032,737 - Shao , et al. July 24, 2	2018-07-24
Package with solder regions aligned to recesses Grant 9,947,630 - Yang , et al. April 17, 2	2018-04-17
Hollow Metal Pillar Packaging Scheme App 20180040599 - Huang; Chang-Pin ; et al.	2018-02-08
Method For Manufacturing Semiconductor Structure App 20180033750 - HUANG; CHANG-PIN ; et al.	2018-02-01
Method and Apparatus for Packaging Pad Structure App 20180012837 - Chen; Hsien-Wei ; et al.	2018-01-11
Hollow metal pillar packaging scheme Grant 9,812,434 - Huang , et al. November 7, 2	2017-11-07
Semiconductor structure and manufacturing method thereof Grant 9,786,618 - Huang , et al. October 10, 2	2017-10-10
Method and apparatus for packaging pad structure Grant 9,773,732 - Chen , et al. September 26, 2	2017-09-26
Hollow Metal Pillar Packaging Scheme App 20170271316 - Huang; Chang-Pin ; et al.	2017-09-21
Hollow metal pillar packaging scheme Grant 9,679,883 - Huang , et al. June 13, 2	2017-06-13
Metal insulator metal capacitor and method for making the same Grant 9,673,270 - Lai , et al. June 6, 2	2017-06-06
Semiconductor Structure And Manufacturing Method Thereof App 20170141056 - HUANG; CHANG-PIN ; et al.	2017-05-18
Package with Solder Regions Aligned to Recesses App 20170141054 - Yang; Ching-Jung ; et al.	2017-05-18
Alignment structures and methods of forming same Grant 9,646,944 - Yang , et al. May 9, 2	2017-05-09
Integrated Fan-out (info) Package Structures And Methods Of Forming Same App 20170110425 - Huang; Chang-Pin ; et al.	2017-04-20
Integrated circuit structure and seal ring structure Grant 9,627,332 - Liang , et al. April 18, 2	2017-04-18
Package with solder regions aligned to recesses Grant 9,559,044 - Yang , et al. January 31, 2	2017-01-31
Packages for Semiconductor Devices, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices App 20170005067 - Yang; Ching-Jung ; et al.	2017-01-05
Semiconductor Device And Manufacturing Method Thereof App 20160372434 - SHAO; TUNG-LIANG ; et al.	2016-12-22
Semiconductor device and manufacturing method thereof Grant 9,484,318 - Shao , et al. November 1, 2	2016-11-01
MIM capacitor and method forming the same Grant 9,461,106 - Yang , et al. October 4, 2	2016-10-04
MIM Capacitor and Method Forming the Same App 20160276426 - Yang; Ching-Jung ; et al.	2016-09-22
Seal ring structure with metal-insulator-metal capacitor Grant 9,449,927 - Chen , et al. September 20, 2	2016-09-20
Alignment Structures and Methods of Forming Same App 20160268224 - Yang; Ching-Jung ; et al.	2016-09-15
Hollow Metal Pillar Packaging Scheme App 20160225751 - Huang; Chang-Pin ; et al.	2016-08-04
Alignment structures and methods of forming same Grant 9,355,979 - Yang , et al. May 31, 2	2016-05-31
Hollow metal pillar packaging scheme Grant 9,343,417 - Huang , et al. May 17, 2	2016-05-17
Self-alignment structure for wafer level chip scale package Grant 9,318,456 - Lai , et al. April 19, 2	2016-04-19
Metal Insulator Metal Capacitor and Method for Making the Same App 20160020269 - Yang; Ching-Jung ; et al.	2016-01-21
Metal insulator metal capacitor and method for making the same Grant 9,153,504 - Lai , et al. October 6, 2	2015-10-06
Seal ring structure for integrated circuit chips Grant 9,117,831 - Yang , et al. August 25, 2	2015-08-25
Semiconductor Device And Manufacturing Method Thereof App 20150235977 - SHAO; TUNG-LIANG ; et al.	2015-08-20
Self-alignment Structure For Wafer Level Chip Scale Package App 20150228599 - LAI; Yu-Chia ; et al.	2015-08-13
Self-alignment structure for wafer level chip scale package Grant 9,048,149 - Lai , et al. June 2, 2	2015-06-02
Semiconductor Device And Fabricating Method Thereof App 20150137350 - HUANG; CHANG-PIN ; et al.	2015-05-21
Metal Insulator Metal Capacitor and Method for Making the Same App 20150102459 - Lai; Yu-Chia ; et al.	2015-04-16
Hollow Metal Pillar Packaging Scheme App 20150076689 - Huang; Chang-Pin ; et al.	2015-03-19
Reducing delamination between an underfill and a buffer layer in a bond structure Grant 8,963,328 - Yang , et al. February 24, 2	2015-02-24
Alignment Structures and Methods of Forming Same App 20150048498 - Yang; Ching-Jung ; et al.	2015-02-19
Self-alignment Structure for Wafer Level Chip Scale Package App 20150014846 - Lai; Yu-Chia ; et al.	2015-01-15
Package with Solder Regions Aligned to Recesses App 20140374899 - Yang; Ching-Jung ; et al.	2014-12-25
Method and Apparatus for Packaging Pad Structure App 20140252608 - Chen; Hsien-Wei ; et al.	2014-09-11
Reinforcement structure for flip-chip packaging Grant 8,810,025 - Liu , et al. August 19, 2	2014-08-19
Seal Ring Structure with Metal-Insulator-Metal Capacitor App 20140145307 - Chen; Hsien-Wei ; et al.	2014-05-29
Reducing Delamination Between an Underfill and a Buffer Layer in a Bond Structure App 20140087522 - Yang; Ching-Jung ; et al.	2014-03-27
Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device Grant 08618827 -	2013-12-31
Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device Grant 8,618,827 - Shao , et al. December 31, 2	2013-12-31
Reducing delamination between an underfill and a buffer layer in a bond structure Grant 8,610,267 - Yang , et al. December 17, 2	2013-12-17
Active device array substrate Grant 8,445,911 - Yang , et al. May 21, 2	2013-05-21
Digital logic circuit and manufacture method thereof Grant 8,421,496 - Yang , et al. April 16, 2	2013-04-16
Reinforcement Structure For Flip-chip Packaging App 20120235303 - Liu; Yu-Wen ; et al.	2012-09-20
Probe pad on a corner stress relief region in a semiconductor chip Grant 8,237,160 - Chen , et al. August 7, 2	2012-08-07
Seal Ring Structure For Integrated Circuit Chips App 20120175728 - YANG; Ching-Jung ; et al.	2012-07-12
Measurement Of Electrical And Mechanical Characteristics Of Low-k Dielectric In A Semiconductor Device App 20120092033 - Shao; Tung-Liang ; et al.	2012-04-19
Reducing Delamination Between an Underfill and a Buffer layer in a Bond Structure App 20120018875 - Yang; Ching-Jung ; et al.	2012-01-26
Digital Logic Circuit And Manufacture Method Thereof App 20110291697 - YANG; Ching-Jung ; et al.	2011-12-01
Probe Pad On A Corner Stress Relief Region In A Semiconductor Chip App 20110284843 - Chen; Hsien-Wei ; et al.	2011-11-24
Integrated circuit with electrostatic discharge protection circuit Grant 7,974,054 - Yang , et al. July 5, 2	2011-07-05
Active Device Array Substrate App 20110156038 - Yang; Ching-Jung ; et al.	2011-06-30
Electronic Chip And Substrate Providing Insulation Protection Between Conducting Nodes App 20110103034 - Huang; Yao-Sheng ; et al.	2011-05-05
Integrated Circuit With Electrostatic Discharge Protection Circuit App 20090195949 - Yang; Ching-Jung ; et al.	2009-08-06
Esd Protection Circuit App 20090168282 - Wu; Kun-Tai ; et al.	2009-07-02

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