| Patent | Date |
|---|
Method Of Forming Semiconductor Packages Having Thermal Through Vias (ttv)
App 20220285241 - Hsu; Sen-Kuei ; et al. | 2022-09-08 |
Polymer layers embedded with metal pads for heat dissipation
Grant 11,398,440 - Chuang , et al. July 26, 2 | 2022-07-26 |
Semiconductor packages having thermal through vias (TTV)
Grant 11,373,922 - Hsu , et al. June 28, 2 | 2022-06-28 |
Manufacturing method of semicondcutor package
Grant 11,233,019 - Liang , et al. January 25, 2 | 2022-01-25 |
Semiconductor device
Grant 11,211,339 - Wang , et al. December 28, 2 | 2021-12-28 |
Methods and Apparatus for Package with Interposers
App 20210391230 - Lu; Chun-Lin ; et al. | 2021-12-16 |
Semiconductor Package And Manufacturing Method Thereof
App 20210305140 - Hung; Tuan-Yu ; et al. | 2021-09-30 |
Semiconductor Package And Manufacturing Method Thereof
App 20210296221 - Yang; Ching-Feng ; et al. | 2021-09-23 |
Methods and apparatus for package with interposers
Grant 11,114,357 - Lu , et al. September 7, 2 | 2021-09-07 |
Surface mounting semiconductor components
Grant 11,101,238 - Liu , et al. August 24, 2 | 2021-08-24 |
Semiconductor Device And Manufacturing Method Thereof
App 20210210450 - LU; CHUN-LIN ; et al. | 2021-07-08 |
Semiconductor package and manufacturing method thereof
Grant 11,018,083 - Hung , et al. May 25, 2 | 2021-05-25 |
Interconnection structure including a metal post encapsulated by a joint material having concave outer surface
Grant 10,971,463 - Lu , et al. April 6, 2 | 2021-04-06 |
EMI shielding structure in InFO package
Grant 10,950,556 - Wu , et al. March 16, 2 | 2021-03-16 |
Semiconductor Package And Manufacturing Method Thereof
App 20210020559 - Hung; Tuan-Yu ; et al. | 2021-01-21 |
Mechanisms for forming hybrid bonding structures with elongated bumps
Grant 10,867,957 - Lu , et al. December 15, 2 | 2020-12-15 |
Semiconductor Packages Having Thermal Through Vias (ttv)
App 20200373219 - Hsu; Sen-Kuei ; et al. | 2020-11-26 |
Manufacturing Method Of A Semiconductor Device
App 20200357659 - CHANG; SHOU ZEN ; et al. | 2020-11-12 |
Manufacturing Method Of Semicondcutor Package
App 20200303331 - Liang; Fang-Yu ; et al. | 2020-09-24 |
Semiconductor packages having thermal through vias (TTV)
Grant 10,748,831 - Hsu , et al. A | 2020-08-18 |
Semiconductor device and manufacturing method thereof
Grant 10,727,082 - Chang , et al. | 2020-07-28 |
Semicondcutor package and manufacturing method of semicondcutor package
Grant 10,720,399 - Liang , et al. | 2020-07-21 |
Semicondcutor Package And Manufacturing Method Of Semicondcutor Package
App 20200135669 - Liang; Fang-Yu ; et al. | 2020-04-30 |
Integrated fan-out package having multi-band antenna and method of forming the same
Grant 10,622,222 - Chuang , et al. | 2020-04-14 |
Semiconductor Device
App 20200111753 - WANG; CHUEI-TANG ; et al. | 2020-04-09 |
Methods and Apparatus for Package with Interposers
App 20200027803 - Lu; Chun-Lin ; et al. | 2020-01-23 |
EMI Shielding Structure in InFO Package
App 20200006249 - Wu; Kai-Chiang ; et al. | 2020-01-02 |
Methods and apparatus for package with interposers
Grant 10,522,437 - Lu , et al. Dec | 2019-12-31 |
Semiconductor device
Grant 10,510,681 - Wang , et al. Dec | 2019-12-17 |
Semiconductor Packages And Methods Of Forming The Same
App 20190371694 - Hsu; Sen-Kuei ; et al. | 2019-12-05 |
EMI Shielding structure in InFO package
Grant 10,468,355 - Wu , et al. No | 2019-11-05 |
Integrated Fan-out Package Having Multi-band Antenna And Method Of Forming The Same
App 20190287819 - Chuang; Nan-Chin ; et al. | 2019-09-19 |
EMI Shielding Structure in InFO Package
App 20190181096 - Wu; Kai-Chiang ; et al. | 2019-06-13 |
Integrated fan-out package having multi-band antenna and method of forming the same
Grant 10,312,112 - Chuang , et al. | 2019-06-04 |
Manufacturing method of semiconductor package
Grant 10,312,209 - Shih , et al. | 2019-06-04 |
Mechanisms for Forming Hybrid Bonding Structures with Elongated Bumps
App 20190123017 - Lu; Chun-Lin ; et al. | 2019-04-25 |
Integrated circuit underfill scheme
Grant 10,269,588 - Liang , et al. | 2019-04-23 |
Polymer Layers Embedded with Metal Pads for Heat Dissipation
App 20190057946 - Chuang; Hao-Hsiang ; et al. | 2019-02-21 |
Mechanisms for forming hybrid bonding structures with elongated bumps
Grant 10,163,846 - Lu , et al. Dec | 2018-12-25 |
Integrated Fan-out Package Having Multi-band Antenna And Method Of Forming The Same
App 20180366347 - Chuang; Nan-Chin ; et al. | 2018-12-20 |
Semiconductor structure and manufacturing method thereof
Grant 10,157,900 - Liang , et al. Dec | 2018-12-18 |
Semiconductor Device
App 20180350752 - WANG; CHUEI-TANG ; et al. | 2018-12-06 |
Polymer layers embedded with metal pads for heat dissipation
Grant 10,109,605 - Chuang , et al. October 23, 2 | 2018-10-23 |
Methods and Apparatus for Package with Interposers
App 20180240723 - Lu; Chun-Lin ; et al. | 2018-08-23 |
Manufacturing Method Of Semiconductor Package
App 20180233472 - SHIH; CHAO-WEN ; et al. | 2018-08-16 |
Semiconductor device and manufacturing method thereof
Grant 10,043,761 - Wang , et al. August 7, 2 | 2018-08-07 |
Surface Mounting Semiconductor Components
App 20180211935 - LIU; MING-KAI ; et al. | 2018-07-26 |
Methods and apparatus for package with interposers
Grant 9,966,321 - Lu , et al. May 8, 2 | 2018-05-08 |
Semiconductor packaging and manufacturing method thereof
Grant 9,953,942 - Shih , et al. April 24, 2 | 2018-04-24 |
Semiconductor chip scale package and manufacturing method thereof
Grant 9,941,240 - Liu , et al. April 10, 2 | 2018-04-10 |
Semiconductor Device And Manufacturing Method Thereof
App 20180061798 - LU; CHUN-LIN ; et al. | 2018-03-01 |
Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface
Grant 9,806,045 - Lu , et al. October 31, 2 | 2017-10-31 |
Semiconductor device having a guard ring
Grant 9,659,879 - Yang , et al. May 23, 2 | 2017-05-23 |
Mechanisms for Forming Hybrid Bonding Structures with Elongated Bumps
App 20170141073 - Lu; Chun-Lin ; et al. | 2017-05-18 |
Semiconductor structure and manufacturing method thereof
Grant 9,653,341 - Miao , et al. May 16, 2 | 2017-05-16 |
Semiconductor Device Having A Guard Ring
App 20170125356 - YANG; CHING-FENG ; et al. | 2017-05-04 |
Semiconductor Device And Manufacturing Method Thereof
App 20170110412 - WANG; CHUEI-TANG ; et al. | 2017-04-20 |
Package alignment structure and method of forming same
Grant 9,627,325 - Liu , et al. April 18, 2 | 2017-04-18 |
Semiconductor Structure and Manufacturing Method Thereof
App 20170098640 - Liang; Shih-Wei ; et al. | 2017-04-06 |
Semiconductor Packaging And Manufacturing Method Thereof
App 20170062369 - SHIH; CHAO-WEN ; et al. | 2017-03-02 |
Semiconductor Device And Manufacturing Method Thereof
App 20170062360 - CHANG; SHOU ZEN ; et al. | 2017-03-02 |
Methods and Apparatus for Package with Interposers
App 20170047261 - Lu; Chun-Lin ; et al. | 2017-02-16 |
Mechanisms for forming hybrid bonding structures with elongated bumps
Grant 9,559,071 - Lu , et al. January 31, 2 | 2017-01-31 |
Semiconductor packaging and manufacturing method thereof
Grant 9,543,263 - Shih , et al. January 10, 2 | 2017-01-10 |
Semiconductor structure and manufacturing method thereof
Grant 9,543,373 - Liang , et al. January 10, 2 | 2017-01-10 |
Methods and apparatus for package with interposers
Grant 9,497,861 - Lu , et al. November 15, 2 | 2016-11-15 |
Integrated Circuit Underfill Scheme
App 20160254169 - Liang; Shih-Wei ; et al. | 2016-09-01 |
Method for forming package-on-package structure
Grant 9,412,661 - Lu , et al. August 9, 2 | 2016-08-09 |
Integrated circuit underfill scheme
Grant 9,355,924 - Liang , et al. May 31, 2 | 2016-05-31 |
Polymer Layers Embedded With Metal Pads for Heat Dissipation
App 20150311169 - Chuang; Hao-Hsiang ; et al. | 2015-10-29 |
Semiconductor Structure And Manufacturing Method Thereof
App 20150255273 - MIAO; CHIA-CHUN ; et al. | 2015-09-10 |
Polymer layers embedded with metal pads for heat dissipation
Grant 9,082,761 - Chuang , et al. July 14, 2 | 2015-07-14 |
Semiconductor Packaging And Manufacturing Method Thereof
App 20150130020 - SHIH; CHAO-WEN ; et al. | 2015-05-14 |
Semiconductor Structure And Manufacturing Method Thereof
App 20150108635 - LIANG; SHIH-WEI ; et al. | 2015-04-23 |
Semiconductor Device And Manufacturing Method Thereof
App 20150061116 - LU; CHUN-LIN ; et al. | 2015-03-05 |
Semiconductor Device And Manufacturing Method Thereof
App 20150008575 - LIU; MING-KAI ; et al. | 2015-01-08 |
Mechanisms For Forming Hybrid Bonding Structures With Elongated Bumps
App 20150001704 - LU; Chun-Lin ; et al. | 2015-01-01 |
Polymer Layers Embedded with Metal Pads for Heat Dissipation
App 20140353819 - Chuang; Hao-Hsiang ; et al. | 2014-12-04 |
Package Alignment Structure and Method of Forming Same
App 20140252657 - Liu; Ming-Kai ; et al. | 2014-09-11 |
Methods and Apparatus for Package with Interposers
App 20140160688 - Lu; Chun-Lin ; et al. | 2014-06-12 |
Method for Forming Package-on-Package Structure
App 20140138816 - Lu; Chun-Lin ; et al. | 2014-05-22 |
Integrated Circuit Underfill Scheme
App 20140117555 - Liang; Shih-Wei ; et al. | 2014-05-01 |
Tin-indium based lead-free solders with zinc addition
App 20110110813 - Chen; Sinn-Wen ; et al. | 2011-05-12 |
Soldering method and solder joints formed therein
App 20050269385 - Chen, Sinn-Wen ; et al. | 2005-12-08 |
Synchronous rectifyier controlled by a current transformer
Grant 6,813,166 - Chang , et al. November 2, 2 | 2004-11-02 |
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