Yanagisawa; Hiroharu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yanagisawa; Hiroharu.The latest application filed is for "substrate fixing device".
- Yanagisawa; Hiroharu - Nagano JP
- Yanagisawa; Hiroharu - Nagano-shi JP
| Patent | Date |
|---|---|
| Substrate fixing apparatus including a base plate, an electrostatic adsorption member, a plurality of support members on the base plate and supporting the electrostatic adsorption member, and an adhesive layer bonding the electrostatic adsorption member to the base plate Grant 11,456,200 - Iijima , et al. September 27, 2 | 2022-09-27 |
| Substrate Fixing Device App 20220223454 - Sato; Keita ; et al. | 2022-07-14 |
| Wiring board having two insulating films and hole penetrating therethrough Grant 11,152,293 - Oshima , et al. October 19, 2 | 2021-10-19 |
| Electrostatic chuck Grant 11,088,006 - Yoshikawa , et al. August 10, 2 | 2021-08-10 |
| Substrate Fixing Apparatus App 20200395236 - Iijima; Nobuyuki ; et al. | 2020-12-17 |
| Wiring Board App 20200105651 - OSHIMA; Kazuhiro ; et al. | 2020-04-02 |
| Electrostatic Chuck App 20190385883 - Yoshikawa; Takamasa ; et al. | 2019-12-19 |
| Wiring substrate and semiconductor device Grant 9,966,331 - Ota , et al. May 8, 2 | 2018-05-08 |
| Circuit board and method of manufacturing circuit board Grant 9,961,767 - Oshima , et al. May 1, 2 | 2018-05-01 |
| Wiring Board App 20180047661 - OSHIMA; Kazuhiro ; et al. | 2018-02-15 |
| Wiring board and electronic component device Grant 9,698,094 - Yanagisawa , et al. July 4, 2 | 2017-07-04 |
| Wiring Board And Electronic Component Device App 20170040249 - Yanagisawa; Hiroharu ; et al. | 2017-02-09 |
| Wiring substrate Grant 9,538,664 - Yanagisawa , et al. January 3, 2 | 2017-01-03 |
| Wiring Substrate And Semiconductor Device App 20160276255 - Ota; Takayuki ; et al. | 2016-09-22 |
| Circuit Board And Method Of Manufacturing Circuit Board App 20160234932 - OSHIMA; Kazuhiro ; et al. | 2016-08-11 |
| Wiring Substrate App 20140182920 - YANAGISAWA; Hiroharu ; et al. | 2014-07-03 |
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