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name:-0.014029979705811
name:-0.015078067779541
name:-0.010925054550171
Yanagawa; Takumi Patent Filings

Yanagawa; Takumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yanagawa; Takumi.The latest application filed is for "artificial intelligence explaining for natural language processing".

Company Profile
10.12.14
  • Yanagawa; Takumi - Tokyo JP
  • YANAGAWA; Takumi - Fremont CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Artificial Intelligence Explaining For Natural Language Processing
App 20220067558 - Yanagawa; Takumi ;   et al.
2022-03-03
Method For Etching An Etch Layer
App 20210335624 - DOLE; Nikhil ;   et al.
2021-10-28
Three or more states for achieving high aspect ratio dielectric etch
Grant 10,861,708 - Yanagawa , et al. December 8, 2
2020-12-08
Method of achieving high selectivity for high aspect ratio dielectric etch
Grant 10,847,377 - Dole , et al. November 24, 2
2020-11-24
Reduction of sidewall notching for high aspect ratio 3D NAND etch
Grant 10,741,407 - Dole , et al. A
2020-08-11
Reduction Of Sidewall Notching For High Aspect Ratio 3d Nand Etch
App 20200126804 - Dole; Nikhil ;   et al.
2020-04-23
Training data update
Grant 10,621,284 - Komine , et al.
2020-04-14
Training data update
Grant 10,614,269 - Komine , et al.
2020-04-07
Method Of Achieving High Selectivity For High Aspect Ratio Dielectric Etch
App 20200090945 - Dole; Nikhil ;   et al.
2020-03-19
Three Or More States For Achieving High Aspect Ratio Dielectric Etch
App 20200090948 - Yanagawa; Takumi ;   et al.
2020-03-19
Method Of Achieving High Selectivity For High Aspect Ratio Dielectric Etch
App 20190393047 - Dole; Nikhil ;   et al.
2019-12-26
Method of achieving high selectivity for high aspect ratio dielectric etch
Grant 10,515,821 - Dole , et al. Dec
2019-12-24
Three or more states for achieving high aspect ratio dielectric etch
Grant 10,504,744 - Yanagawa , et al. Dec
2019-12-10
Training Data Update
App 20190317998 - Komine; Hiroaki ;   et al.
2019-10-17
Training Data Update
App 20190317997 - Komine; Hiroaki ;   et al.
2019-10-17
Training data update
Grant 10,387,572 - Komine , et al. A
2019-08-20
Training data update
Grant 10,372,826 - Komine , et al.
2019-08-06
Training Data Update
App 20190087408 - Komine; Hiroaki ;   et al.
2019-03-21
Training Data Update
App 20190087411 - Komine; Hiroaki ;   et al.
2019-03-21
Plasma Module With Slotted Ground Plate
App 20170076917 - Yudovsky; Joseph ;   et al.
2017-03-16
Reducing twisting in ultra-high aspect ratio dielectric etch
Grant 8,741,165 - Ji , et al. June 3, 2
2014-06-03
Method for plasma etching performance enhancement
Grant 7,977,390 - Ji , et al. July 12, 2
2011-07-12
Reducing Twisting In Ultra-high Aspect Ratio Dielectric Etch
App 20110021030 - Ji; Bing ;   et al.
2011-01-27
Reducing Twisting In Ultra-high Aspect Ratio Dielectric Etch
App 20080119055 - Ji; Bing ;   et al.
2008-05-22
Method for plasma etching performance enhancement
App 20070026677 - Ji; Bing ;   et al.
2007-02-01

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