Patent | Date |
---|
Silicon mandrel etch after native oxide punch-through Grant 11,387,115 - Yan , et al. July 12, 2 | 2022-07-12 |
Spacer etching process Grant 11,276,560 - Sung , et al. March 15, 2 | 2022-03-15 |
Spacer open process by dual plasma Grant 11,195,718 - Sung , et al. December 7, 2 | 2021-12-07 |
Processing of Workpieces Using Flourocarbon Plasma App 20210305071 - Wang; Shanyu ;   et al. | 2021-09-30 |
Ozone treatment for selective silicon nitride etch over silicon Grant 11,043,393 - Wang , et al. June 22, 2 | 2021-06-22 |
Spacer Etching Process App 20210066047 - Sung; Tsai Wen ;   et al. | 2021-03-04 |
Processing Of Workpieces Using Deposition Process And Etch Process App 20210020445 - Wang; Shanyu ;   et al. | 2021-01-21 |
Spacer Open Process By Dual Plasma App 20210005456 - Sung; Tsai Wen ;   et al. | 2021-01-07 |
Post Plasma Gas Injection In A Separation Grid App 20200243305 - Zeng; Weimin ;   et al. | 2020-07-30 |
Ozone Treatment for Selective Silicon Nitride Etch Over Silicon App 20200234969 - Wang; Shanyu ;   et al. | 2020-07-23 |
Silicon Mandrel Etch After Native Oxide Punch-through App 20200203182 - Yan; Chun ;   et al. | 2020-06-25 |
Integrated system and method for source/drain engineering Grant 10,504,717 - Yan , et al. Dec | 2019-12-10 |
Method for removing native oxide and residue from a III-V group containing surface Grant 10,438,796 - Yan , et al. O | 2019-10-08 |
Method for protecting cloud storage video data and system thereof Grant 10,395,048 - Zhou , et al. A | 2019-08-27 |
UV radiation system and method for arsenic outgassing control in sub 7nm CMOS fabrication Grant 10,332,739 - Yan , et al. | 2019-06-25 |
Degassing Chamber For Arsenic Related Processes App 20190169767 - BAO; Xinyu ;   et al. | 2019-06-06 |
Method And Apparatus For Wafer Outgassing Control App 20190172728 - BAO; Xinyu ;   et al. | 2019-06-06 |
Method of uniform channel formation Grant 10,243,063 - Yan , et al. | 2019-03-26 |
Method for wafer outgassing control Grant 10,236,190 - Yan , et al. | 2019-03-19 |
Self-aligned process for sub-10nm fin formation Grant 10,224,421 - Ye , et al. | 2019-03-05 |
Method of epitaxial growth shape control for CMOS applications Grant 10,205,002 - Bao , et al. Feb | 2019-02-12 |
Integrated System And Method For Source/drain Engineering App 20190035623 - YAN; Chun ;   et al. | 2019-01-31 |
Method For Conditioning A Processing Chamber For Steady Etching Rate Control App 20190013221 - YAN; Chun | 2019-01-10 |
Method for conditioning a processing chamber for steady etching rate control Grant 10,177,017 - Yan J | 2019-01-08 |
Methods and solutions for cleaning INGAAS (or III-V) substrates Grant 10,147,596 - Yan , et al. De | 2018-12-04 |
Method and apparatus for wafer outgassing control Grant 10,115,607 - Bao , et al. October 30, 2 | 2018-10-30 |
Integrated system and method for source/drain engineering Grant 10,090,147 - Yan , et al. October 2, 2 | 2018-10-02 |
Self-aligned Process For Sub-10nm Fin Formation App 20180277649 - YE; Zhiyuan ;   et al. | 2018-09-27 |
Integrated method for wafer outgassing reduction Grant 10,043,667 - Yan , et al. August 7, 2 | 2018-08-07 |
Template Formation For Fully Relaxed Sige Growth App 20180211836 - YAN; Chun ;   et al. | 2018-07-26 |
Integrated System And Method For Source/drain Engineering App 20180174825 - YAN; Chun ;   et al. | 2018-06-21 |
Method of forming structures with V shaped bottom on silicon substrate Grant 10,002,759 - Bao , et al. June 19, 2 | 2018-06-19 |
Methods And Solutions For Cleaning Ingaas (or Iii-v) Substrates App 20180138032 - YAN; Chun ;   et al. | 2018-05-17 |
Integrated System And Method For Source/drain Engineering App 20180082836 - YAN; Chun ;   et al. | 2018-03-22 |
Method And Apparatus For Wafer Outgassing Control App 20180082874 - BAO; Xinyu ;   et al. | 2018-03-22 |
Uv Radiation System And Method For Arsenic Outgassing Control In Sub 7nm Cmos Fabrication App 20180082835 - YAN; Chun ;   et al. | 2018-03-22 |
Degassing Chamber For Arsenic Related Processes App 20180073162 - BAO; Xinyu ;   et al. | 2018-03-15 |
Integrated Method For Wafer Outgassing Reduction App 20180076031 - YAN; Chun ;   et al. | 2018-03-15 |
Method and solution for cleaning InGaAs (or III-V) substrates Grant 9,905,412 - Yan , et al. February 27, 2 | 2018-02-27 |
Method And System For Scheduling Video Analysis Tasks App 20180052711 - Zhou; Mingyao ;   et al. | 2018-02-22 |
Method Of Forming Structures With V Shaped Bottom On Silicon Substrate App 20180033621 - BAO; Xinyu ;   et al. | 2018-02-01 |
Method Of Uniform Channel Formation App 20180033873 - YAN; Chun ;   et al. | 2018-02-01 |
Method Of Epitaxial Growth Shape Control For Cmos Applications App 20180033872 - BAO; Xinyu ;   et al. | 2018-02-01 |
Gas Purge System And Method For Outgassing Control App 20180033659 - YAN; Chun ;   et al. | 2018-02-01 |
Method And Material For Cmos Contact And Barrier Layer App 20180019121 - BAO; Xinyu ;   et al. | 2018-01-18 |
Integrated process and structure to form III-V channel for sub-7nm CMOS devices Grant 9,865,706 - Bao , et al. January 9, 2 | 2018-01-09 |
System and method in indium-gallium-arsenide channel height control for sub 7nm FinFET Grant 9,852,903 - Yan , et al. December 26, 2 | 2017-12-26 |
Method For Wafer Outgassing Control App 20170352557 - YAN; Chun ;   et al. | 2017-12-07 |
Methods for removing contamination from surfaces in substrate processing systems Grant 9,805,914 - Yan , et al. October 31, 2 | 2017-10-31 |
Method For Removing Native Oxide And Residue From A Iii-v Group Containing Surface App 20170229303 - YAN; Chun ;   et al. | 2017-08-10 |
System And Method In Indium-gallium-arsenide Channel Height Control For Sub 7nm Finfet App 20170221706 - YAN; Chun ;   et al. | 2017-08-03 |
Methods And Solutions For Cleaning Ingaas (or Iii-v) Substrates App 20170162379 - YAN; Chun ;   et al. | 2017-06-08 |
Method for removing native oxide and residue from a III-V group containing surface Grant 9,653,291 - Yan , et al. May 16, 2 | 2017-05-16 |
Silicon-containing substrate cleaning procedure Grant 9,653,282 - Yan , et al. May 16, 2 | 2017-05-16 |
Integrated Process And Structure To Form Iii-v Channel For Sub-7nm Cmos Devices App 20170133224 - BAO; Xinyu ;   et al. | 2017-05-11 |
Sputter etch processing for heavy metal patterning in integrated circuits Grant 9,484,220 - Hoinkis , et al. November 1, 2 | 2016-11-01 |
Methods of surface interface engineering Grant 9,472,416 - He , et al. October 18, 2 | 2016-10-18 |
Method For Protecting Cloud Storage Video Data And System Thereof App 20160300071 - ZHOU; Bo ;   et al. | 2016-10-13 |
Methods For Removing Contamination From Surfaces In Substrate Processing Systems App 20160293384 - YAN; Chun ;   et al. | 2016-10-06 |
Method For Removing Native Oxide And Residue From A Iii-v Group Containing Surface App 20160141175 - YAN; Chun ;   et al. | 2016-05-19 |
Silicon-containing Substrate Cleaning Procedure App 20160035562 - YAN; Chun ;   et al. | 2016-02-04 |
Copper residue chamber clean Grant 9,114,438 - Hoinkis , et al. August 25, 2 | 2015-08-25 |
Methods Of Surface Interface Engineering App 20150111389 - HE; JIM ZHONGYI ;   et al. | 2015-04-23 |
Copper Residue Chamber Clean App 20140345645 - Hoinkis; Mark ;   et al. | 2014-11-27 |
Subtractive plasma etching of a blanket layer of metal or metal alloy Grant 8,871,107 - Fuller , et al. October 28, 2 | 2014-10-28 |
Sputter Etch Processing For Heavy Metal Patterning In Integrated Circuits App 20140264861 - HOINKIS; MARK D. ;   et al. | 2014-09-18 |
Subtractive Plasma Etching Of A Blanket Layer Of Metal Or Metal Alloy App 20140273437 - Fuller; Nicholas C. M. ;   et al. | 2014-09-18 |
Methods for silicon electrode assembly etch rate and etch uniformity recovery Grant 7,442,114 - Huang , et al. October 28, 2 | 2008-10-28 |
Method and apparatus for providing uniform plasma in a magnetic field enhanced plasma reactor Grant 7,374,636 - Horioka , et al. May 20, 2 | 2008-05-20 |
Method for removal of metallic residue after plasma etching of a metal layer Grant 7,320,942 - Chen , et al. January 22, 2 | 2008-01-22 |
Method and apparatus for controlling the magnetic field intensity in a plasma enhanced semiconductor wafer processing chamber Grant 7,316,199 - Horioka , et al. January 8, 2 | 2008-01-08 |
Methods for silicon electrode assembly etch rate and etch uniformity recovery App 20060138081 - Huang; Tuochuan ;   et al. | 2006-06-29 |
Method for removing conductive residue Grant 6,933,239 - Ying , et al. August 23, 2 | 2005-08-23 |
Method for planarizing an interconnect structure App 20050079703 - Chen, Hui ;   et al. | 2005-04-14 |
Method for etching an organic anti-reflective coating (OARC) App 20050009342 - Chen, Hui ;   et al. | 2005-01-13 |
Method of fabricating a magneto-resistive random access memory (MRAM) device Grant 6,841,484 - Ying , et al. January 11, 2 | 2005-01-11 |
Method for removal of residue from a substrate App 20040237997 - Rui, Ying ;   et al. | 2004-12-02 |
Method for etching an aluminum layer using an amorphous carbon mask App 20040229470 - Rui, Ying ;   et al. | 2004-11-18 |
Method of fabricating a magneto-resistive random access memory (MRAM) device App 20040209476 - Ying, Chentsau ;   et al. | 2004-10-21 |
Method of etching metallic materials to form a tapered profile App 20040171272 - Jin, Guangxiang ;   et al. | 2004-09-02 |
Method for planarizing a copper interconnect structure Grant 6,784,107 - Chen , et al. August 31, 2 | 2004-08-31 |
Method for removing conductive residue App 20040137749 - Ying, Chentsau ;   et al. | 2004-07-15 |
Method for removal of metallic residue after plasma etching of a metal layer App 20030219912 - Chen, Xiaoyi ;   et al. | 2003-11-27 |
Methods for etching an organic anti-reflective coating Grant 6,649,532 - Chen , et al. November 18, 2 | 2003-11-18 |
Methods For Etching An Organic Anti-reflective Coating App 20030209520 - Chen, Hui ;   et al. | 2003-11-13 |
Method and apparatus for asymmetric gas distribution in a semiconductor wafer processing system Grant 6,620,289 - Yan , et al. September 16, 2 | 2003-09-16 |
Method and apparatus for controlling the magnetic field intensity in a plasma enhanced semiconductor wafer processing chamber App 20030085000 - Horioka, Keiji ;   et al. | 2003-05-08 |
Method for etching low k dielectrics Grant 6,547,977 - Yan , et al. April 15, 2 | 2003-04-15 |
Method for etching silicon oxynitride and dielectric antireflection coatings Grant 6,537,918 - Ionov , et al. March 25, 2 | 2003-03-25 |
Method and apparatus for providing uniform plasma in a magnetic field enhanced plasma reactor App 20030006008 - Horioka, Keiji ;   et al. | 2003-01-09 |
Method of etching dielectric layers using a removable hardmask Grant 6,458,516 - Ye , et al. October 1, 2 | 2002-10-01 |
Plasma assisted processing chamber with separate control of species density Grant 6,352,049 - Yin , et al. March 5, 2 | 2002-03-05 |
Method for etching silicon oxynitride and dielectric antireflection coatings App 20020016078 - Ionov, Pavel ;   et al. | 2002-02-07 |
Method of pattern etching a low K dielectric layer Grant 6,331,380 - Ye , et al. December 18, 2 | 2001-12-18 |
Method for etching silicon oxynitride and dielectric antireflection coatings Grant 6,291,356 - Ionov , et al. September 18, 2 | 2001-09-18 |
Method of etching patterned layers useful as masking during subsequent etching or for damascene structures Grant 6,080,529 - Ye , et al. June 27, 2 | 2000-06-27 |