loadpatents
name:-0.0094051361083984
name:-0.0048129558563232
name:-0.0034999847412109
Wu; Yen-Yi Patent Filings

Wu; Yen-Yi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu; Yen-Yi.The latest application filed is for "method for legalizing mixed-cell height standard cells of ic".

Company Profile
3.4.7
  • Wu; Yen-Yi - Taipei TW
  • WU; Yen-Yi - Taipei City TW
  • WU; Yen-Yi - Kao-Hsiung City TW
  • Wu; Yen-Yi - Kao-Hsiung TW
  • Wu; Yen-Yi - Kaohsiung TW
  • Wu; Yen-Yi - Kaoshiung TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for legalizing mixed-cell height standard cells of IC
Grant 10,713,410 - Wang , et al.
2020-07-14
Method For Legalizing Mixed-cell Height Standard Cells Of Ic
App 20190251224 - WANG; Chao-Hung ;   et al.
2019-08-15
Method for legalizing mixed-cell height standard cells of IC
Grant 10,275,559 - Wang , et al.
2019-04-30
Method For Legalizing Mixed-cell Height Standard Cells Of Ic
App 20180144083 - WANG; Chao-Hung ;   et al.
2018-05-24
Semiconductor Package And Semiconductor Device
App 20140312496 - WU; Yen-Yi ;   et al.
2014-10-23
Method of making a semiconductor package and method of making a semiconductor device
Grant 7,642,133 - Wu , et al. January 5, 2
2010-01-05
Three-dimensional package and method of making the same
Grant 7,635,917 - Wang , et al. December 22, 2
2009-12-22
Stackable Semiconductor Package And The Method For Making The Same
App 20080164595 - Wu; Yen-Yi ;   et al.
2008-07-10
Three-dimensional Package And Method Of Making The Same
App 20080142957 - Wang; Ching-Chun ;   et al.
2008-06-19
Semiconductor package and semiconductor device
App 20080073769 - Wu; Yen-Yi ;   et al.
2008-03-27
Method of making a semiconductor package and method of making a semiconductor device
App 20080076208 - Wu; Yen-Yi ;   et al.
2008-03-27

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