WU; Weng-Jin

Patent Applications and Registrations

Patent applications and USPTO patent grants for WU; Weng-Jin.The latest application filed is for "controllable gap height for an image sensor package".

Company Profile

7.107.94

WU; Weng-Jin - Hsinchu-City TW
Wu; Weng-Jin - Hsinchu TW
Wu; Weng-Jin - Hsin-Chu TW
Wu; Weng-Jin - Hsin-Chi TW
Wu; Weng-Jin - Hsin-Chu City TW
Wu; Weng-Jin - Shinjuang TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Controllable Gap Height For An Image Sensor Package App 20220216256 - WU; Weng-Jin	2022-07-07
Controllable gap height for an image sensor package Grant 11,289,522 - Wu March 29, 2	2022-03-29
Embedded image sensor semiconductor packages and related methods Grant 11,201,182 - Wu December 14, 2	2021-12-14
Molded Image Sensor Chip Scale Packages And Related Methods App 20210151488 - WU; Weng-Jin	2021-05-20
Image Sensor Flip Chip Package App 20210143199 - WU; Weng-Jin	2021-05-13
System, structure, and method of manufacturing a semiconductor substrate stack Grant 11,004,832 - Chang , et al. May 11, 2	2021-05-11
Packaging Structure For A Sensor Having A Sealing Layer App 20210098518 - Wu; Weng-Jin	2021-04-01
Molded image sensor chip scale packages and related methods Grant 10,910,421 - Wu February 2, 2	2021-02-02
Image sensor flip chip package Grant 10,903,255 - Wu January 26, 2	2021-01-26
Packaging structure for a sensor having a sealing layer Grant 10,868,061 - Wu December 15, 2	2020-12-15
Controllable Gap Height For An Image Sensor Package App 20200321375 - WU; Weng-Jin	2020-10-08
Embedded Image Sensor Semiconductor Packages And Related Methods App 20200295065 - WU; Weng-Jin	2020-09-17
Embedded image sensor semiconductor packages and related methods Grant 10,707,250 - Wu	2020-07-07
Image Sensor Flip Chip Package App 20200152681 - WU; Weng-Jin	2020-05-14
System, Structure, and Method of Manufacturing a Semiconductor Substrate Stack App 20200126953 - Chang; Hung-Pin ; et al.	2020-04-23
Embedded image sensor semiconductor packages and related methods Grant 10,615,202 - Wu	2020-04-07
Packaging Structure For A Sensor Having A Sealing Layer App 20200052020 - WU; Weng-Jin	2020-02-13
System, structure, and method of manufacturing a semiconductor substrate stack Grant 10,515,933 - Chang , et al. Dec	2019-12-24
Stacked Image Sensor Package App 20190363122 - WU; Weng-Jin	2019-11-28
Stacked Image Sensor Package App 20190305023 - WU; Weng-Jin	2019-10-03
Stacked image sensor package Grant 10,418,396 - Wu Sept	2019-09-17
Image Sensor Semiconductor Packages And Related Methods App 20190229144 - KINSMAN; Larry ; et al.	2019-07-25
Image sensor semiconductor packages and related methods Grant 10,290,672 - Kinsman , et al.	2019-05-14
Embedded Image Sensor Semiconductor Packages And Related Methods App 20190043907 - WU; Weng-Jin	2019-02-07
Embedded Image Sensor Semiconductor Packages And Related Methods App 20190043906 - WU; Weng-Jin	2019-02-07
Embedded image sensor semiconductor packages and related methods Grant 10,128,289 - Wu November 13, 2	2018-11-13
Molded Image Sensor Chip Scale Packages And Related Methods App 20180240828 - WU; Weng-Jin	2018-08-23
Protection layer for adhesive material at wafer edge Grant 9,997,440 - Chiou , et al. June 12, 2	2018-06-12
Bonding method including adjusting surface contours of a bonding system Grant 9,978,628 - Lin , et al. May 22, 2	2018-05-22
Molded image sensor chip scale packages and related methods Grant 9,960,197 - Wu May 1, 2	2018-05-01
Embedded Image Sensor Semiconductor Packages And Related Methods App 20180076244 - WU; Weng-Jin	2018-03-15
Image Sensor Semiconductor Packages And Related Methods App 20170345864 - KINSMAN; Larry ; et al.	2017-11-30
Backside through vias in a bonded structure Grant 9,799,694 - Wu , et al. October 24, 2	2017-10-24
Formation of through via before contact processing Grant 9,793,192 - Yu , et al. October 17, 2	2017-10-17
System, structure, and method of manufacturing a semiconductor substrate stack Grant 9,728,457 - Chang , et al. August 8, 2	2017-08-08
System, Structure, and Method of Manufacturing a Semiconductor Substrate Stack App 20170194295 - Chang; Hung-Pin ; et al.	2017-07-06
Image sensors with contamination barrier structures Grant 9,515,108 - Hsieh , et al. December 6, 2	2016-12-06
Alignment mark and method of formation Grant 9,478,480 - Tsai , et al. October 25, 2	2016-10-25
Image Sensors With Contamination Barrier Structures App 20160268325 - HSIEH; Yu-Te ; et al.	2016-09-15
Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnects Grant 9,418,961 - Yu , et al. August 16, 2	2016-08-16
Method of three dimensional integrated circuit assembly Grant 9,418,876 - Lin , et al. August 16, 2	2016-08-16
Bonding Method Including Adjusting Surface Contours Of A Bonding System App 20160204014 - LIN; Yu-Liang ; et al.	2016-07-14
Backside Through Vias in a Bonded Structure App 20160172403 - Wu; Weng-Jin ; et al.	2016-06-16
Formation of Through Via Before Contact Processing App 20160099196 - Yu; Chen-Hua ; et al.	2016-04-07
Substrate bonding system and method of modifying the same Grant 9,299,594 - Lin , et al. March 29, 2	2016-03-29
Stacked structures and methods of forming stacked structures Grant 9,299,612 - Wu , et al. March 29, 2	2016-03-29
Backside through vias in a bonded structure Grant 9,293,418 - Wu , et al. March 22, 2	2016-03-22
Barrier for through-silicon via Grant 9,287,166 - Yu , et al. March 15, 2	2016-03-15
Formation of through via before contact processing Grant 9,209,157 - Chiou , et al. December 8, 2	2015-12-08
Spin chuck for thin wafer cleaning Grant 9,153,462 - Lin , et al. October 6, 2	2015-10-06
Method of handling a thin wafer Grant 9,117,828 - Wu , et al. August 25, 2	2015-08-25
Chip on wafer bonder Grant 9,093,447 - Yu , et al. July 28, 2	2015-07-28
Alignment Mark and Method of Formation App 20150069580 - Tsai; Chen-Yu ; et al.	2015-03-12
System, Structure, and Method of Manufacturing a Semiconductor Substrate Stack App 20150024546 - Chang; Hung-Pin ; et al.	2015-01-22
Alignment mark and method of formation Grant 8,896,136 - Tsai , et al. November 25, 2	2014-11-25
System, structure, and method of manufacturing a semiconductor substrate stack Grant 8,853,830 - Chang , et al. October 7, 2	2014-10-07
Composite carrier structure Grant 8,846,499 - Shih , et al. September 30, 2	2014-09-30
Process of forming through-silicon via structure Grant 8,846,523 - Wu , et al. September 30, 2	2014-09-30
Backside Through Vias in a Bonded Structure App 20140232013 - Wu; Weng-Jin ; et al.	2014-08-21
Stacked Structures And Methods Of Forming Stacked Structures App 20140220741 - WU; Weng-Jin ; et al.	2014-08-07
Through-silicon via structure formation process Grant 8,791,011 - Lin , et al. July 29, 2	2014-07-29
Barrier for Through-Silicon Via App 20140175652 - Yu; Chen-Hua ; et al.	2014-06-26
Stacked structures and methods of forming stacked structures Grant 8,736,039 - Wu , et al. May 27, 2	2014-05-27
Controlling defects in thin wafer handling Grant 8,722,540 - Lin , et al. May 13, 2	2014-05-13
Barrier structures and methods for through substrate vias Grant 8,704,375 - Liu , et al. April 22, 2	2014-04-22
Backside process for a substrate Grant 8,691,664 - Yang , et al. April 8, 2	2014-04-08
Barrier for through-silicon via Grant 8,680,682 - Yu , et al. March 25, 2	2014-03-25
Multi-die stacking using bumps with different sizes Grant 8,669,174 - Wu , et al. March 11, 2	2014-03-11
Component stacking using pre-formed adhesive films Grant 8,664,749 - Wu , et al. March 4, 2	2014-03-04
Surface modification for handling wafer thinning process Grant 8,647,925 - Chiou , et al. February 11, 2	2014-02-11
Method for stacking semiconductor dies Grant 8,629,042 - Yang , et al. January 14, 2	2014-01-14
Thin wafer protection device Grant 8,629,565 - Yang , et al. January 14, 2	2014-01-14
Apparatus and Method of Substrate to Substrate Bonding for Three Dimensional (3D) IC Interconnects App 20130320071 - Yu; Chen-Hua ; et al.	2013-12-05
Multi-die stacking using bumps with different sizes Grant 8,581,418 - Wu , et al. November 12, 2	2013-11-12
Through Via Process App 20130277844 - CHIOU; Wen-Chih ; et al.	2013-10-24
Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnects Grant 8,528,802 - Yu , et al. September 10, 2	2013-09-10
Protection Layer For Adhesive Material At Wafer Edge App 20130228920 - CHIOU; Wen-Chih ; et al.	2013-09-05
Process Of Forming Through-silicon Via Structure App 20130224909 - WU; Weng-Jin ; et al.	2013-08-29
Vacuum wafer carriers for strengthening thin wafers Grant 8,500,182 - Yang , et al. August 6, 2	2013-08-06
Methods of forming through via Grant 8,486,823 - Chiou , et al. July 16, 2	2013-07-16
Through-silicon Via Structure Formation Process App 20130171772 - LIN; Yung-Chi ; et al.	2013-07-04
Chip On Wafer Bonder App 20130157412 - Yu; Chen-Hua ; et al.	2013-06-20
Method for Stacking Semiconductor Dies App 20130137222 - Yang; Ku-Feng ; et al.	2013-05-30
Multi-Die Stacking Using Bumps with Different Sizes App 20130122700 - Wu; Weng-Jin ; et al.	2013-05-16
Protection layer for adhesive material at wafer edge Grant 8,441,136 - Chiou , et al. May 14, 2	2013-05-14
Barrier For Through-Silicon Via App 20130113105 - Yu; Chen-Hua ; et al.	2013-05-09
Through-silicon via structure and a process for forming the same Grant 8,432,038 - Wu , et al. April 30, 2	2013-04-30
Method for Three Dimensional Integrated Circuit Fabrication App 20130075892 - Lin; Jing-Cheng ; et al.	2013-03-28
Through-silicon via structure Grant 8,405,201 - Lin , et al. March 26, 2	2013-03-26
Three-dimensional integrated circuits with protection layers Grant 8,405,225 - Yu , et al. March 26, 2	2013-03-26
Method of Three Dimensional Integrated Circuit Assembly App 20130056865 - Lin; Jing-Cheng ; et al.	2013-03-07
Chip on wafer bonder Grant 8,387,674 - Yu , et al. March 5, 2	2013-03-05
Method for stacking semiconductor dies Grant 8,362,593 - Yang , et al. January 29, 2	2013-01-29
Barrier for through-silicon via Grant 8,344,513 - Yu , et al. January 1, 2	2013-01-01
Protection Layer For Adhesive Material At Wafer Edge App 20120292783 - CHIOU; Wen-Chih ; et al.	2012-11-22
Backside metal of redistribution line with silicide layer on through-silicon via of semiconductor chips Grant 8,264,077 - Chiou , et al. September 11, 2	2012-09-11
Protection layer for adhesive material at wafer edge Grant 8,252,665 - Chiou , et al. August 28, 2	2012-08-28
Method for thinning a wafer Grant 8,252,682 - Yang , et al. August 28, 2	2012-08-28
Method for ultra thin wafer handling and processing Grant 8,232,140 - Yang , et al. July 31, 2	2012-07-31
Three-Dimensional Integrated Circuits with Protection Layers App 20120187576 - Yu; Chen-Hua ; et al.	2012-07-26
Thin Wafer Protection Device App 20120168962 - YANG; Ku-Feng ; et al.	2012-07-05
Spin Chuck for Thin Wafer Cleaning App 20120145204 - Lin; Yu-Liang ; et al.	2012-06-14
Three-dimensional integrated circuits with protection layers Grant 8,148,826 - Yu , et al. April 3, 2	2012-04-03
Composite Carrier Structure App 20120045611 - Shih; Ying-Ching ; et al.	2012-02-23
Wafer bonding Grant 8,119,500 - Yang , et al. February 21, 2	2012-02-21
Three-dimensional Integrated Circuits With Protection Layers App 20120032348 - Yu; Chen-Hua ; et al.	2012-02-09
Substrate Bonding System And Method Of Modifying The Same App 20120024456 - LIN; Yu-Liang ; et al.	2012-02-02
Multi-Die Stacking Using Bumps with Different Sizes App 20120018876 - Wu; Weng-Jin ; et al.	2012-01-26
Controlling Defects in Thin Wafer Handling App 20120021604 - Lin; Yu-Liang ; et al.	2012-01-26
Alignment Mark and Method of Formation App 20120001337 - Tsai; Chen-Yu ; et al.	2012-01-05
Vacuum Wafer Carriers for Strengthening Thin Wafers App 20110309647 - Yang; Ku-Feng ; et al.	2011-12-22
Particle free wafer separation Grant 8,058,150 - Wu , et al. November 15, 2	2011-11-15
Through-substrate vias (TSVs) electrically connected to a bond pad design with reduced dishing effect Grant 8,053,900 - Yu , et al. November 8, 2	2011-11-08
Three-dimensional integrated circuits with protection layers Grant 8,053,277 - Yu , et al. November 8, 2	2011-11-08
Method for Stacking Semiconductor Dies App 20110248409 - Yang; Ku-Feng ; et al.	2011-10-13
Method For Thinning A Wafer App 20110198721 - YANG; Ku-Feng ; et al.	2011-08-18
Component Stacking Using Pre-Formed Adhesive Films App 20110186967 - Wu; Weng-Jin ; et al.	2011-08-04
Method for stacking semiconductor dies Grant 7,989,318 - Yang , et al. August 2, 2	2011-08-02
Formation of Through Via before Contact Processing App 20110177655 - Chiou; Wen-Chih ; et al.	2011-07-21
Method and apparatus for thinning a substrate Grant 7,972,969 - Yang , et al. July 5, 2	2011-07-05
Method of fabricating a semiconductor device Grant 7,960,290 - Yu , et al. June 14, 2	2011-06-14
Structure and method for stacked wafer fabrication Grant 7,955,895 - Yang , et al. June 7, 2	2011-06-07
Stacked structures and methods of fabricating stacked structures Grant 7,956,448 - Yu , et al. June 7, 2	2011-06-07
Performing die-to-wafer stacking by filling gaps between dies Grant 7,951,647 - Yang , et al. May 31, 2	2011-05-31
Integrated etch and supercritical CO.sub.2 process and chamber design Grant 7,951,723 - Wang , et al. May 31, 2	2011-05-31
Component stacking using pre-formed adhesive films Grant 7,943,421 - Wu , et al. May 17, 2	2011-05-17
Through-silicon Via Structure And A Process For Forming The Same App 20110108986 - LIN; Yung-Chi ; et al.	2011-05-12
Formation of through via before contact processing Grant 7,939,941 - Chiou , et al. May 10, 2	2011-05-10
Surface Modification For Handling Wafer Thinning Process App 20110081749 - CHIOU; Wen-Chih ; et al.	2011-04-07
Protection Layer For Adhesive Material At Wafer Edge App 20110065238 - CHIOU; Wen-Chih ; et al.	2011-03-17
High throughput die-to-wafer bonding using pre-alignment Grant 7,897,481 - Chiou , et al. March 1, 2	2011-03-01
Stacked structures and methods of fabricating stacked structures Grant 7,879,711 - Yu , et al. February 1, 2	2011-02-01
Protection for bonding pads and methods of formation Grant 7,872,357 - Yu , et al. January 18, 2	2011-01-18
Stacked Structures And Methods Of Fabricating Stacked Structures App 20100327463 - YU; Chen-Hua ; et al.	2010-12-30
Three-Dimensional Integrated Circuits with Protection Layers App 20100330743 - Yu; Chen-Hua ; et al.	2010-12-30
Through-silicon Via Structure And A Process For Forming The Same App 20100314758 - WU; Weng-Jin ; et al.	2010-12-16
Backside Process for a Substrate App 20100267217 - Yang; Ku-Feng ; et al.	2010-10-21
Three-dimensional integrated circuits with protection layers Grant 7,812,459 - Yu , et al. October 12, 2	2010-10-12
Method For Ultra Thin Wafer Handling And Processing App 20100244284 - YANG; Ku-Feng ; et al.	2010-09-30
Barrier for Through-Silicon Via App 20100237502 - Yu; Chen-Hua ; et al.	2010-09-23
Barrier Structures and Methods for Through Substrate Vias App 20100193954 - Liu; Max ; et al.	2010-08-05
Through-Silicon Via Sidewall Isolation Structure App 20100187694 - Yu; Chen-Hua ; et al.	2010-07-29
Backside Metal Treatment of Semiconductor Chips App 20100164109 - Chiou; Wen-Chih ; et al.	2010-07-01
Method for Stacking Semiconductor Dies App 20100144118 - Yang; Ku-Feng ; et al.	2010-06-10
Component Stacking Using Pre-Formed Adhesive Films App 20100140767 - Wu; Weng-Jin ; et al.	2010-06-10
High Throughput Die-to-Wafer Bonding Using Pre-Alignment App 20100144068 - Chiou; Wen-Chih ; et al.	2010-06-10
Integrated Alignment and Bonding System App 20100122456 - Yu; Chen-Hua ; et al.	2010-05-20
Structure And Method For Stacked Wafer Fabrication App 20100117226 - YANG; Ku-Feng ; et al.	2010-05-13
Bond Pad Design with Reduced Dishing Effect App 20100096760 - Yu; Chen-Hua ; et al.	2010-04-22
Two Step Method And Apparatus For Polishing Metal And Other Films In Semiconductor Manufacturing App 20100062693 - Yu; Chen-Hua ; et al.	2010-03-11
Apparatus and Method of Substrate to Substrate Bonding for Three Dimensional (3D) IC Interconnects App 20100050423 - Yu; Chen-Hua ; et al.	2010-03-04
Particle Free Wafer Separation App 20100009518 - Wu; Weng-Jin ; et al.	2010-01-14
Performing Die-to-Wafer Stacking by Filling Gaps Between Dies App 20090311829 - Yang; Ku-Feng ; et al.	2009-12-17
Wafer Leveling-Bonding System Using Disposable Foils App 20090289097 - Wu; Weng-Jin ; et al.	2009-11-26
System, Structure, and Method of Manufacturing a Semiconductor Substrate Stack App 20090283871 - Chang; Hung-Pin ; et al.	2009-11-19
Through Via Process App 20090224405 - Chiou; Wen-Chih ; et al.	2009-09-10
Method And Apparatus For Thinning A Substrate App 20090227047 - Yang; Ku-Feng ; et al.	2009-09-10
Protection for Bonding Pads and Methods of Formation App 20090224371 - Yu; Chen-Hua ; et al.	2009-09-10
Chip On Wafer Bonder App 20090142903 - Yu; Chen-Hua ; et al.	2009-06-04
Thickness Indicators for Wafer Thinning App 20090008794 - Wu; Weng-Jin ; et al.	2009-01-08
Formation of Through Via before Contact Processing App 20090001598 - Chiou; Wen-Chih ; et al.	2009-01-01
Semiconductor contact structure Grant 7,466,028 - Yu , et al. December 16, 2	2008-12-16
Method of fabricating a semiconductor device App 20080272498 - Yu; Chen-Hua ; et al.	2008-11-06
Wafer Bonding App 20080268614 - Yang; Ku-Feng ; et al.	2008-10-30
By-product removal for wafer bonding process App 20080191310 - Wu; Weng-Jin ; et al.	2008-08-14
Three-dimensional integrated circuits with protection layers App 20080142990 - Yu; Chen-Hua ; et al.	2008-06-19
Three dimensional integrated circuit and method of making the same Grant 7,385,283 - Wu , et al. June 10, 2	2008-06-10
Stacked Structures And Methods Of Fabricating Stacked Structures App 20080124845 - Yu; Chen-Hua ; et al.	2008-05-29
Integrated Etch and Supercritical CO2 Process and Chamber Design App 20080108223 - Wang; Ching-Ya ; et al.	2008-05-08
Stacked Structures And Methods Of Forming Stacked Structures App 20080083959 - Wu; Weng-Jin ; et al.	2008-04-10
Three Dimensional Integrated Circuit And Method Of Making The Same App 20070296073 - Wu; Weng-Jin ; et al.	2007-12-27
Integrated surface-emitting optoelectronic module and the method for making the same Grant 6,511,235 - Wu , et al. January 28, 2	2003-01-28