| Patent | Date |
|---|
Electrically controlled nanomagnet and spin orbit torque magnetic random access memory including the same
Grant 10,971,677 - Lin , et al. April 6, 2 | 2021-04-06 |
Electrically Controlled Nanomagnet And Spin Orbit Torque Magnetic Random Access Memory Including The Same
App 20200212294 - LIN; Hsin ; et al. | 2020-07-02 |
LED chip package structure using sedimentation and method for making the same
Grant 8,623,680 - Wang , et al. January 7, 2 | 2014-01-07 |
LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the same
Grant 8,198,800 - Wang , et al. June 12, 2 | 2012-06-12 |
LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same
Grant 8,183,065 - Wang , et al. May 22, 2 | 2012-05-22 |
LED chip package structure with multifunctional integrated chips and a method for making the same
Grant 8,162,510 - Wang , et al. April 24, 2 | 2012-04-24 |
LED chip package structure with different LED spacings and a method for making the same
Grant 8,138,508 - Wang , et al. March 20, 2 | 2012-03-20 |
Led Chip Package Structure With A High-efficiency Heat-dissipating Substrate And Method For Making The Same
App 20120049212 - WANG; BILY ; et al. | 2012-03-01 |
Led Chip Package Structure Using Sedimentation And Method For Making The Same
App 20120003765 - WANG; BILY ; et al. | 2012-01-05 |
LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same
Grant 8,017,969 - Wang , et al. September 13, 2 | 2011-09-13 |
LED chip package structure using a substrate as a lampshade and method for making the same
Grant 8,002,436 - Wang , et al. August 23, 2 | 2011-08-23 |
Led Chip Package Structure In Order To Prevent The Light-emitting Efficiency Of Fluorescent Powder From Decreasing Due To High Temperature And Method For Making The Same
App 20110189803 - WANG; BILY ; et al. | 2011-08-04 |
Led Chip Package Structure With High-efficiency Light Emission By Rough Surfaces And Method Of Making The Same
App 20110020967 - WANG; BILY ; et al. | 2011-01-27 |
LED chip package structure with high-efficiency light-emitting effect and method for making the same
Grant 7,829,901 - Wang , et al. November 9, 2 | 2010-11-09 |
LED lamp structure and system with high-efficiency heat-dissipating function
Grant 7,828,464 - Wang , et al. November 9, 2 | 2010-11-09 |
Method for calculating out an optimum arrangement pitch between each two LED chip package units
Grant 7,815,346 - Wang , et al. October 19, 2 | 2010-10-19 |
Led chip package structure using sedimentation and method for making the same
App 20100006880 - Wang; Bily ; et al. | 2010-01-14 |
Modular illumination device with adjustable lighting angles
Grant 7,614,766 - Wang , et al. November 10, 2 | 2009-11-10 |
Led Chip Package Structure Using A Substrate As A Lampshade And Method For Making The Same
App 20090261368 - WANG; BILY ; et al. | 2009-10-22 |
LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the same
App 20090224653 - Wang; Bily ; et al. | 2009-09-10 |
LED chip package structure with a high-efficiency heat-dissipating substrate and method for making the same
App 20090224265 - Wang; Bily ; et al. | 2009-09-10 |
LED chip package structure applied to a backlight module and method for making the same
App 20090224266 - Wang; Bily ; et al. | 2009-09-10 |
Led chip package structure with multifunctional integrated chips and a method for making the same
App 20090212304 - Wang; Bily ; et al. | 2009-08-27 |
Method for calculating out an optimum arrangement pitch between each two LED chip package units
App 20090213378 - Wang; Bily ; et al. | 2009-08-27 |
LED chip package structure with different LED spacings and a method for making the same
App 20090206350 - Wang; Bily ; et al. | 2009-08-20 |
LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same
App 20090152570 - Wang; Bily ; et al. | 2009-06-18 |
Led chip package structure with high-efficiency light-emitting effect and method for making the same
App 20090146156 - Wang; Bily ; et al. | 2009-06-11 |
Method of manufacturing high power light-emitting device package and structure thereof
Grant 7,485,480 - Wang , et al. February 3, 2 | 2009-02-03 |
Method of manufacturing high power light-emitting device package and structure thereof
App 20090014745 - Wang; Bily ; et al. | 2009-01-15 |
LED lamp structure and system with high-efficiency heat-dissipating function
App 20090009999 - Wang; Bily ; et al. | 2009-01-08 |
Method of manufacturing high power light-emitting device package and structure thereof
App 20080073662 - Wang; Bily ; et al. | 2008-03-27 |
Modular illumination device with adjustable lighting angles
App 20080002413 - Wang; Bily ; et al. | 2008-01-03 |
Modular lamp structure
App 20070297177 - Wang; Bily ; et al. | 2007-12-27 |
Electrical lamp apparatus
App 20070133209 - Wang; Bily ; et al. | 2007-06-14 |
Manufacturing method for photoelectric package structure having two-layered substrate and control chip
App 20060249656 - Wang; Bily ; et al. | 2006-11-09 |
Method for manufacturing photoelectric package having control chip
App 20060252173 - Wang; Bily ; et al. | 2006-11-09 |
Package structure for optical-electrical semiconductor
App 20060086945 - Wang; Bily ; et al. | 2006-04-27 |
Semiconductor substrate structure
App 20060071328 - Wang; Bily ; et al. | 2006-04-06 |
Optical projection device of a colored lighting module
App 20050135113 - Wang, Bily ; et al. | 2005-06-23 |
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