Wu; Shi-Min
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wu; Shi-Min.The latest application filed is for "trench capacitor profile to decrease substrate warpage".
- Wu; Shi-Min - Changhua County TW
- Wu; Shi-Min - Hsinchu TW
- Wu; Shi-Min - Shihu Jen TW
| Patent | Date |
|---|---|
| Trench Capacitor Profile To Decrease Substrate Warpage App 20210343881 - Cheng; Hsin-Li ; et al. | 2021-11-04 |
| Semiconductor device having fins Grant 11,152,462 - Fang , et al. October 19, 2 | 2021-10-19 |
| Trench capacitor profile to decrease substrate warpage Grant 11,063,157 - Cheng , et al. July 13, 2 | 2021-07-13 |
| Trench Capacitor Profile To Decrease Substrate Warpage App 20210202761 - Cheng; Hsin-Li ; et al. | 2021-07-01 |
| Semiconductor Device Having Fins App 20190355814 - FANG; Cong-Min ; et al. | 2019-11-21 |
| Method of manufacturing a semiconductor structure having a buried raised portion Grant 10,367,059 - Fang , et al. July 30, 2 | 2019-07-30 |
| Method Of Manufacturing Semiconductor Structure App 20170373143 - FANG; Cong-Min ; et al. | 2017-12-28 |
| Shallow trench isolation structure with raised portion between active areas and manufacturing method thereof Grant 9,761,658 - Fang , et al. September 12, 2 | 2017-09-12 |
| Semiconductor Structure And Manufacturing Method Thereof App 20160190240 - FANG; Cong-Min ; et al. | 2016-06-30 |
| Hollow bra cup App 20080139085 - Wu; Shi-Min | 2008-06-12 |
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