| Patent | Date |
|---|
Method Of Forming Semiconductor Packages Having Thermal Through Vias (ttv)
App 20220285241 - Hsu; Sen-Kuei ; et al. | 2022-09-08 |
Package Structure With Antenna Pattern
App 20220270944 - Lin; Sheng-Ta ; et al. | 2022-08-25 |
Package, package structure with redistributing circuits and antenna elements and method of manufacturing the same
Grant 11,424,197 - Wang , et al. August 23, 2 | 2022-08-23 |
Semiconductor Packages And Forming Methods Thereof
App 20220262734 - Wu; Kai-Chiang ; et al. | 2022-08-18 |
Package structure and manufacturing method thereof
Grant 11,417,616 - Wu , et al. August 16, 2 | 2022-08-16 |
Package Structure And Manufacturing Method Thereof
App 20220254722 - Yu; Chen-Hua ; et al. | 2022-08-11 |
Methods of Forming Semiconductor Packages Having a Die with an Encapsulant
App 20220246559 - Tsai; Chung-Hao ; et al. | 2022-08-04 |
Package Component, Semiconductor Package And Manufacturing Method Thereof
App 20220246521 - Liang; Fang-Yu ; et al. | 2022-08-04 |
Polymer layers embedded with metal pads for heat dissipation
Grant 11,398,440 - Chuang , et al. July 26, 2 | 2022-07-26 |
Package structure and fabricating method thereof
Grant 11,398,422 - Lu , et al. July 26, 2 | 2022-07-26 |
Barrier Structures Between External Electrical Connectors
App 20220230940 - Miao; Chia-Chun ; et al. | 2022-07-21 |
Semiconductor packages having thermal through vias (TTV)
Grant 11,373,922 - Hsu , et al. June 28, 2 | 2022-06-28 |
Package structure and method of fabricating the same
Grant 11,362,009 - Lin , et al. June 14, 2 | 2022-06-14 |
Package Structure And Method Of Manufacturing The Same
App 20220181248 - Wang; Chuei-Tang ; et al. | 2022-06-09 |
Semiconductor packages and forming methods thereof
Grant 11,348,874 - Wu , et al. May 31, 2 | 2022-05-31 |
Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof
Grant 11,342,269 - Yu , et al. May 24, 2 | 2022-05-24 |
Package Structure And Method Of Fabricating The Same
App 20220157677 - Lin; Sheng-Ta ; et al. | 2022-05-19 |
Integrated Fan-out Package And Manufacturing Method Thereof
App 20220157625 - Wu; Kai-Chiang ; et al. | 2022-05-19 |
Data Processing Circuit And Fault-mitigating Method
App 20220138064 - Liu; Shu-Ming ; et al. | 2022-05-05 |
Methods of forming semiconductor packages having a die with an encapsulant
Grant 11,315,891 - Tsai , et al. April 26, 2 | 2022-04-26 |
Methods and apparatus for package on package devices
Grant RE49,046 - Liu , et al. April 19, 2 | 2022-04-19 |
Package component, semiconductor package and manufacturing method thereof
Grant 11,309,242 - Liang , et al. April 19, 2 | 2022-04-19 |
Barrier structures between external electrical connectors
Grant 11,296,012 - Miao , et al. April 5, 2 | 2022-04-05 |
Package structure and manufacturing method thereof
Grant 11,289,418 - Hwang , et al. March 29, 2 | 2022-03-29 |
Semiconductor device package including embedded conductive elements
Grant 11,282,817 - Chen , et al. March 22, 2 | 2022-03-22 |
Package structure and fabricating method thereof
Grant 11,282,779 - Wu , et al. March 22, 2 | 2022-03-22 |
Semiconductor Structure And Manufacturing Method Thereof
App 20220077072 - YU; CHEN-HUA ; et al. | 2022-03-10 |
Package structure and method of manufacturing the same
Grant 11,264,316 - Wang , et al. March 1, 2 | 2022-03-01 |
Integrated fan-out package and manufacturing method thereof
Grant 11,239,096 - Wu , et al. February 1, 2 | 2022-02-01 |
Package Structure And Fabricating Method Thereof
App 20220028773 - Lu; Chun-Lin ; et al. | 2022-01-27 |
Manufacturing method of semicondcutor package
Grant 11,233,019 - Liang , et al. January 25, 2 | 2022-01-25 |
Semiconductor Packages And Forming Methods Thereof
App 20220013463 - Wu; Kai-Chiang ; et al. | 2022-01-13 |
Package Component, Semiconductor Package And Manufacturing Method Thereof
App 20210407904 - Liang; Fang-Yu ; et al. | 2021-12-30 |
Packaged semiconductor devices and packaging methods
Grant 11,211,358 - Tang , et al. December 28, 2 | 2021-12-28 |
Semiconductor device
Grant 11,211,339 - Wang , et al. December 28, 2 | 2021-12-28 |
Methods and Apparatus for Package with Interposers
App 20210391230 - Lu; Chun-Lin ; et al. | 2021-12-16 |
Semiconductor Package And Manufacturing Method Thereof
App 20210375809 - Liang; Fang-Yu ; et al. | 2021-12-02 |
Package Structure
App 20210375774 - Liang; Fang-Yu ; et al. | 2021-12-02 |
Semiconductor structure and manufacturing method thereof
Grant 11,183,461 - Yu , et al. November 23, 2 | 2021-11-23 |
Integrated fan-out package with antenna components and manufacturing method thereof
Grant 11,145,595 - Lu , et al. October 12, 2 | 2021-10-12 |
Semiconductor Package And Manufacturing Method Thereof
App 20210305140 - Hung; Tuan-Yu ; et al. | 2021-09-30 |
Semiconductor Package And Manufacturing Method Thereof
App 20210296221 - Yang; Ching-Feng ; et al. | 2021-09-23 |
Methods and apparatus for package with interposers
Grant 11,114,357 - Lu , et al. September 7, 2 | 2021-09-07 |
Package Structure And Manufacturing Method Thereof
App 20210265276 - Wu; Kai-Chiang ; et al. | 2021-08-26 |
Surface mounting semiconductor components
Grant 11,101,238 - Liu , et al. August 24, 2 | 2021-08-24 |
Package structure
Grant 11,094,642 - Liang , et al. August 17, 2 | 2021-08-17 |
Integrated Devices in Semiconductor Packages and Methods of Forming Same
App 20210225786 - Yu; Chen-Hua ; et al. | 2021-07-22 |
Semiconductor Device And Manufacturing Method Thereof
App 20210210450 - LU; CHUN-LIN ; et al. | 2021-07-08 |
Semiconductor Devices And Methods Of Manufacturing
App 20210202266 - Chen; Chien-Hsun ; et al. | 2021-07-01 |
Semiconductor Package And Manufacturing Method Thereof
App 20210184335 - Wang; Yen-Ping ; et al. | 2021-06-17 |
Semiconductor package and manufacturing method thereof
Grant 11,018,083 - Hung , et al. May 25, 2 | 2021-05-25 |
Package structure and manufacturing method thereof
Grant 11,004,799 - Wu , et al. May 11, 2 | 2021-05-11 |
Semiconductor package structure
Grant 11,004,810 - Wu , et al. May 11, 2 | 2021-05-11 |
Solder ball protection in packages
Grant 10,985,117 - Miao , et al. April 20, 2 | 2021-04-20 |
Integrated devices in semiconductor packages and methods of forming same
Grant 10,971,460 - Yu , et al. April 6, 2 | 2021-04-06 |
Interconnection structure including a metal post encapsulated by a joint material having concave outer surface
Grant 10,971,463 - Lu , et al. April 6, 2 | 2021-04-06 |
Package Structure And Fabricating Method Thereof
App 20210098354 - Wu; Kai-Chiang ; et al. | 2021-04-01 |
Method for singulating packaged integrated circuits and resulting structures
Grant 10,964,595 - Wang , et al. March 30, 2 | 2021-03-30 |
Semiconductor Structure And Manufacturing Method Thereof
App 20210091031 - LU; CHUN-LIN ; et al. | 2021-03-25 |
EMI shielding structure in InFO package
Grant 10,950,556 - Wu , et al. March 16, 2 | 2021-03-16 |
Semiconductor Package And Manufacturing Method Thereof
App 20210020559 - Hung; Tuan-Yu ; et al. | 2021-01-21 |
Package Structure And Method Of Manufacturing The Same
App 20210020560 - Wang; Chuei-Tang ; et al. | 2021-01-21 |
Package Structure And Manufacturing Method Thereof
App 20210013151 - Yu; Chen-Hua ; et al. | 2021-01-14 |
Mechanisms for forming hybrid bonding structures with elongated bumps
Grant 10,867,957 - Lu , et al. December 15, 2 | 2020-12-15 |
Electronic device and manufacturing method thereof
Grant 10,868,353 - Lu , et al. December 15, 2 | 2020-12-15 |
Semiconductor structure and manufacturing method thereof
Grant 10,867,952 - Lu , et al. December 15, 2 | 2020-12-15 |
Integrated Fan-out Package And Manufacturing Method Thereof
App 20200373173 - Wu; Kai-Chiang ; et al. | 2020-11-26 |
Semiconductor Packages Having Thermal Through Vias (ttv)
App 20200373219 - Hsu; Sen-Kuei ; et al. | 2020-11-26 |
Manufacturing Method Of A Semiconductor Device
App 20200357659 - CHANG; SHOU ZEN ; et al. | 2020-11-12 |
Package structure with reinforcement structures in a redistribution circuit structure and method of manufacturing the same
Grant 10,825,773 - Yu , et al. November 3, 2 | 2020-11-03 |
Package Structure And Manufacturing Method Thereof
App 20200343203 - Wu; Kai-Chiang ; et al. | 2020-10-29 |
Manufacturing Method Of Semicondcutor Package
App 20200303331 - Liang; Fang-Yu ; et al. | 2020-09-24 |
Package Structure And Manufacturing Method Thereof
App 20200294926 - Wu; Kai-Chiang ; et al. | 2020-09-17 |
Semiconductor Structure And Manufacturing Method Thereof
App 20200286846 - LU; CHUN-LIN ; et al. | 2020-09-10 |
Package Structure And Manufacturing Method Thereof
App 20200286825 - Hwang; Chien-Ling ; et al. | 2020-09-10 |
Integrated fan-out package and manufacturing method thereof
Grant 10,770,313 - Wu , et al. Sep | 2020-09-08 |
Package structure and manufacturing method thereof
Grant 10,748,861 - Wu , et al. A | 2020-08-18 |
Semiconductor packages having thermal through vias (TTV)
Grant 10,748,831 - Hsu , et al. A | 2020-08-18 |
Package Structure
App 20200243454 - Liang; Fang-Yu ; et al. | 2020-07-30 |
Semiconductor device and manufacturing method thereof
Grant 10,727,082 - Chang , et al. | 2020-07-28 |
Semicondcutor package and manufacturing method of semicondcutor package
Grant 10,720,399 - Liang , et al. | 2020-07-21 |
Package structure and manufacturing method thereof
Grant 10,707,173 - Wu , et al. | 2020-07-07 |
Manufacturing method of semiconductor structure
Grant 10,692,832 - Lu , et al. | 2020-06-23 |
Semiconductor Device Package Including Embedded Conductive Elements
App 20200168583 - CHEN; Yu-Feng ; et al. | 2020-05-28 |
Package structure and manufacturing method thereof
Grant 10,665,537 - Hwang , et al. | 2020-05-26 |
Integrated Fan-out Package And Manufacturing Method Thereof
App 20200152570 - Lu; Chun-Lin ; et al. | 2020-05-14 |
Semiconductor Structure And Manufacturing Method Thereof
App 20200144193 - YU; CHEN-HUA ; et al. | 2020-05-07 |
Semicondcutor Package And Manufacturing Method Of Semicondcutor Package
App 20200135669 - Liang; Fang-Yu ; et al. | 2020-04-30 |
Package structure and method of fabricating the same
Grant 10,629,539 - Liang , et al. | 2020-04-21 |
Packaged Semiconductor Devices and Packaging Methods
App 20200118971 - Tang; Tzu-Chun ; et al. | 2020-04-16 |
Solder Ball Protection in Packages
App 20200118947 - Miao; Chia-Chun ; et al. | 2020-04-16 |
Semiconductor Package Structure
App 20200118952 - Wu; Kai-Chiang ; et al. | 2020-04-16 |
Integrated fan-out package having multi-band antenna and method of forming the same
Grant 10,622,222 - Chuang , et al. | 2020-04-14 |
Semiconductor Device
App 20200111753 - WANG; CHUEI-TANG ; et al. | 2020-04-09 |
Package Structure And Manufacturing Method Thereof
App 20200105675 - Yu; Chen-Hua ; et al. | 2020-04-02 |
Electronic Device And Manufacturing Method Thereof
App 20200106156 - Lu; Chun-Lin ; et al. | 2020-04-02 |
Mechanisms of forming connectors for package on package
Grant 10,553,561 - Chen , et al. Fe | 2020-02-04 |
Integrated fan-out package and manufacturing method thereof
Grant 10,553,533 - Lu , et al. Fe | 2020-02-04 |
Package, Package Structure And Method Of Manufacturing The Same
App 20200035625 - Wang; Chuei-Tang ; et al. | 2020-01-30 |
Methods and Apparatus for Package with Interposers
App 20200027803 - Lu; Chun-Lin ; et al. | 2020-01-23 |
Package Structure And Manufacturing Method Thereof
App 20200020640 - Wu; Kai-Chiang ; et al. | 2020-01-16 |
Semiconductor structure and manufacturing method thereof
Grant 10,529,666 - Yu , et al. J | 2020-01-07 |
EMI Shielding Structure in InFO Package
App 20200006249 - Wu; Kai-Chiang ; et al. | 2020-01-02 |
Methods and apparatus for package with interposers
Grant 10,522,437 - Lu , et al. Dec | 2019-12-31 |
Semiconductor device
Grant 10,510,681 - Wang , et al. Dec | 2019-12-17 |
Semiconductor package structure
Grant 10,510,693 - Wu , et al. Dec | 2019-12-17 |
Packaged semiconductor devices and packaging methods
Grant 10,510,714 - Tang , et al. Dec | 2019-12-17 |
Solder ball protection in packages
Grant 10,510,689 - Miao , et al. Dec | 2019-12-17 |
Semiconductor Packages And Methods Of Forming The Same
App 20190371694 - Hsu; Sen-Kuei ; et al. | 2019-12-05 |
Package Structure And Manufacturing Method Thereof
App 20190355679 - Wu; Kai-Chiang ; et al. | 2019-11-21 |
Integrated Devices in Semiconductor Packages and Methods of Forming Same
App 20190341363 - Yu; Chen-Hua ; et al. | 2019-11-07 |
EMI Shielding structure in InFO package
Grant 10,468,355 - Wu , et al. No | 2019-11-05 |
Barrier Structures Between External Electrical Connectors
App 20190333841 - Miao; Chia-Chun ; et al. | 2019-10-31 |
Package structure and manufacturing method thereof
Grant 10,461,034 - Wu , et al. Oc | 2019-10-29 |
Package Structure And Manufacturing Method Thereof
App 20190304901 - Hwang; Chien-Ling ; et al. | 2019-10-03 |
Semiconductor Packages And Methods Of Forming Same
App 20190295972 - Tsai; Chung-Hao ; et al. | 2019-09-26 |
Integrated Fan-out Package Having Multi-band Antenna And Method Of Forming The Same
App 20190287819 - Chuang; Nan-Chin ; et al. | 2019-09-19 |
Package structure having connecting module
Grant 10,381,309 - Wang , et al. A | 2019-08-13 |
Integrated Fan-out Package And Manufacturing Method Thereof
App 20190244834 - Wu; Kai-Chiang ; et al. | 2019-08-08 |
Method for Singulating Packaged Integrated Circuits and Resulting Structures
App 20190244861 - Wang; Yen-Ping ; et al. | 2019-08-08 |
Integrated devices in semiconductor packages and methods of forming same
Grant 10,354,964 - Yu , et al. July 16, 2 | 2019-07-16 |
Barrier structures between external electrical connectors
Grant 10,347,563 - Miao , et al. July 9, 2 | 2019-07-09 |
EMI Shielding Structure in InFO Package
App 20190181096 - Wu; Kai-Chiang ; et al. | 2019-06-13 |
Integrated fan-out package having multi-band antenna and method of forming the same
Grant 10,312,112 - Chuang , et al. | 2019-06-04 |
Manufacturing method of semiconductor package
Grant 10,312,209 - Shih , et al. | 2019-06-04 |
Method of fabricating an integrated fan-out package
Grant 10,304,790 - Chang , et al. | 2019-05-28 |
Package Structures
App 20190157206 - Wang; Chuei-Tang ; et al. | 2019-05-23 |
Integrated Fan-out Package And Manufacturing Method Thereof
App 20190139890 - Lu; Chun-Lin ; et al. | 2019-05-09 |
Package Structure And Method Of Fabricating The Same
App 20190139897 - Liang; Fang-Yu ; et al. | 2019-05-09 |
Integrated fan-out package
Grant 10,276,404 - Wu , et al. | 2019-04-30 |
Method Of Fabricating An Integrated Fan-out Package
App 20190123004 - Chang; Shou-Zen ; et al. | 2019-04-25 |
Mechanisms for Forming Hybrid Bonding Structures with Elongated Bumps
App 20190123017 - Lu; Chun-Lin ; et al. | 2019-04-25 |
Method for singulating packaged integrated circuits and resulting structures
Grant 10,269,640 - Wang , et al. | 2019-04-23 |
Integrated circuit underfill scheme
Grant 10,269,588 - Liang , et al. | 2019-04-23 |
Semiconductor Package Structure
App 20190096828 - Wu; Kai-Chiang ; et al. | 2019-03-28 |
Integrated Fan-out Package
App 20190067039 - Wu; Kai-Chiang ; et al. | 2019-02-28 |
Polymer Layers Embedded with Metal Pads for Heat Dissipation
App 20190057946 - Chuang; Hao-Hsiang ; et al. | 2019-02-21 |
Package Structure And Manufacturing Method Thereof
App 20190035737 - Wu; Kai-Chiang ; et al. | 2019-01-31 |
Package structure and method for manufacturing thereof
Grant 10,163,854 - Wang , et al. Dec | 2018-12-25 |
Mechanisms for forming hybrid bonding structures with elongated bumps
Grant 10,163,846 - Lu , et al. Dec | 2018-12-25 |
Integrated fan-out package and method of fabricating the same
Grant 10,163,824 - Chang , et al. Dec | 2018-12-25 |
Integrated Fan-out Package Having Multi-band Antenna And Method Of Forming The Same
App 20180366347 - Chuang; Nan-Chin ; et al. | 2018-12-20 |
Semiconductor device structure
Grant 10,157,859 - Chang , et al. Dec | 2018-12-18 |
Semiconductor structure and manufacturing method thereof
Grant 10,157,900 - Liang , et al. Dec | 2018-12-18 |
Method of packaging semiconductor devices
Grant 10,153,240 - Lu , et al. Dec | 2018-12-11 |
Packaged Semiconductor Devices and Packaging Methods
App 20180350771 - Tang; Tzu-Chun ; et al. | 2018-12-06 |
Semiconductor Device
App 20180350752 - WANG; CHUEI-TANG ; et al. | 2018-12-06 |
Solder Ball Protection in Packages
App 20180337144 - Miao; Chia-Chun ; et al. | 2018-11-22 |
Manufacturing Method Of Semiconductor Structure
App 20180308817 - LU; CHUN-LIN ; et al. | 2018-10-25 |
Polymer layers embedded with metal pads for heat dissipation
Grant 10,109,605 - Chuang , et al. October 23, 2 | 2018-10-23 |
Packaging devices and methods
Grant 10,079,200 - Liang , et al. September 18, 2 | 2018-09-18 |
Integrated Devices in Semiconductor Packages and Methods of Forming Same
App 20180247905 - Yu; Chen-Hua ; et al. | 2018-08-30 |
Methods and Apparatus for Package with Interposers
App 20180240723 - Lu; Chun-Lin ; et al. | 2018-08-23 |
Manufacturing Method Of Semiconductor Package
App 20180233472 - SHIH; CHAO-WEN ; et al. | 2018-08-16 |
Solder ball protection in packages
Grant 10,049,990 - Miao , et al. August 14, 2 | 2018-08-14 |
Packaged semiconductor devices and packaging methods
Grant 10,050,013 - Tang , et al. August 14, 2 | 2018-08-14 |
Semiconductor device and manufacturing method thereof
Grant 10,043,761 - Wang , et al. August 7, 2 | 2018-08-07 |
Semiconductor structure and manufacturing method thereof
Grant 10,037,959 - Miao , et al. July 31, 2 | 2018-07-31 |
Surface Mounting Semiconductor Components
App 20180211935 - LIU; MING-KAI ; et al. | 2018-07-26 |
Semiconductor structure and manufacturing method thereof
Grant 10,008,467 - Lu , et al. June 26, 2 | 2018-06-26 |
Integrated Fan-out Package And Method Of Fabricating The Same
App 20180158787 - Chang; Shou-Zen ; et al. | 2018-06-07 |
Semiconductor Structure And Manufacturing Method Thereof
App 20180151501 - YU; CHEN-HUA ; et al. | 2018-05-31 |
Semiconductor Device Structure
App 20180130756 - CHANG; Shou-Zen ; et al. | 2018-05-10 |
Methods and apparatus for package with interposers
Grant 9,966,321 - Lu , et al. May 8, 2 | 2018-05-08 |
Semiconductor packaging and manufacturing method thereof
Grant 9,953,942 - Shih , et al. April 24, 2 | 2018-04-24 |
Semiconductor device and method of forming the same
Grant 9,953,966 - Miao , et al. April 24, 2 | 2018-04-24 |
Semiconductor devices and methods of manufacture thereof
Grant 9,941,140 - Chen , et al. April 10, 2 | 2018-04-10 |
Semiconductor chip scale package and manufacturing method thereof
Grant 9,941,240 - Liu , et al. April 10, 2 | 2018-04-10 |
Semiconductor Device And Manufacturing Method Thereof
App 20180061798 - LU; CHUN-LIN ; et al. | 2018-03-01 |
Package Structure And Method For Manufacturing Thereof
App 20180061808 - WANG; Chuei-Tang ; et al. | 2018-03-01 |
Method for singulating packaged integrated circuits and resulting structures
Grant 9,875,913 - Liu , et al. January 23, 2 | 2018-01-23 |
Semiconductor device structure and method for forming the same
Grant 9,875,972 - Chang , et al. January 23, 2 | 2018-01-23 |
Semiconductor Device Structure And Method For Forming The Same
App 20180019209 - CHANG; Shou-Zen ; et al. | 2018-01-18 |
Package structure and method for manufacturing thereof
Grant 9,818,722 - Wang , et al. November 14, 2 | 2017-11-14 |
Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface
Grant 9,806,045 - Lu , et al. October 31, 2 | 2017-10-31 |
Barrier Structures Between External Electrical Connectors
App 20170256477 - Miao; Chia-Chun ; et al. | 2017-09-07 |
Method for Singulating Packaged Integrated Circuits and Resulting Structures
App 20170250114 - Wang; Yen-Ping ; et al. | 2017-08-31 |
Packaging Devices and Methods
App 20170250129 - Liang; Shih-Wei ; et al. | 2017-08-31 |
Barrier structures between external electrical connectors
Grant 9,698,079 - Miao , et al. July 4, 2 | 2017-07-04 |
Packaged Semiconductor Devices and Packaging Methods
App 20170186726 - Tang; Tzu-Chun ; et al. | 2017-06-29 |
Semiconductor Devices and Methods of Manufacture Thereof
App 20170162541 - Chen; Yu-Feng ; et al. | 2017-06-08 |
Method of manufacturing package structure
Grant 9,661,794 - Chang , et al. May 23, 2 | 2017-05-23 |
Semiconductor device having a guard ring
Grant 9,659,879 - Yang , et al. May 23, 2 | 2017-05-23 |
Mechanisms for Forming Hybrid Bonding Structures with Elongated Bumps
App 20170141073 - Lu; Chun-Lin ; et al. | 2017-05-18 |
Packaging devices and methods
Grant 9,653,418 - Liang , et al. May 16, 2 | 2017-05-16 |
Method for singulating packaged integrated circuits and resulting structures
Grant 9,653,417 - Wang , et al. May 16, 2 | 2017-05-16 |
Semiconductor Device Having A Guard Ring
App 20170125356 - YANG; CHING-FENG ; et al. | 2017-05-04 |
Semiconductor Device And Manufacturing Method Thereof
App 20170110412 - WANG; CHUEI-TANG ; et al. | 2017-04-20 |
Package alignment structure and method of forming same
Grant 9,627,325 - Liu , et al. April 18, 2 | 2017-04-18 |
Semiconductor Structure and Manufacturing Method Thereof
App 20170098640 - Liang; Shih-Wei ; et al. | 2017-04-06 |
Semiconductor structure and manufacturing method thereof
Grant 9,601,439 - Tang , et al. March 21, 2 | 2017-03-21 |
Semiconductor Structure And Manufacturing Method Thereof
App 20170062353 - TANG; TZU-CHUN ; et al. | 2017-03-02 |
Semiconductor Device And Manufacturing Method Thereof
App 20170062360 - CHANG; SHOU ZEN ; et al. | 2017-03-02 |
Semiconductor Packaging And Manufacturing Method Thereof
App 20170062369 - SHIH; CHAO-WEN ; et al. | 2017-03-02 |
Semiconductor devices and methods of manufacture thereof
Grant 9,576,874 - Chen , et al. February 21, 2 | 2017-02-21 |
Methods and Apparatus for Package with Interposers
App 20170047261 - Lu; Chun-Lin ; et al. | 2017-02-16 |
Methods and Apparatus of Packaging Semiconductor Devices
App 20170040269 - Lu; Chun-Lin ; et al. | 2017-02-09 |
Mechanisms for forming hybrid bonding structures with elongated bumps
Grant 9,559,071 - Lu , et al. January 31, 2 | 2017-01-31 |
Semiconductor Structure And Manufacturing Method Thereof
App 20170018519 - MIAO; CHIA-CHUN ; et al. | 2017-01-19 |
Semiconductor structure and manufacturing method thereof
Grant 9,543,373 - Liang , et al. January 10, 2 | 2017-01-10 |
Semiconductor packaging and manufacturing method thereof
Grant 9,543,263 - Shih , et al. January 10, 2 | 2017-01-10 |
Mechanisms Of Forming Connectors For Package On Package
App 20160343691 - CHEN; Yu-Feng ; et al. | 2016-11-24 |
Methods and apparatus for package with interposers
Grant 9,497,861 - Lu , et al. November 15, 2 | 2016-11-15 |
Methods and apparatus of packaging semiconductor devices
Grant 9,478,511 - Lu , et al. October 25, 2 | 2016-10-25 |
Copper-containing layer on under-bump metallization layer
Grant 9,472,524 - Chen , et al. October 18, 2 | 2016-10-18 |
Semiconductor structure and manufacturing method thereof
Grant 9,472,523 - Miao , et al. October 18, 2 | 2016-10-18 |
Interposer having a defined through via pattern
Grant 9,460,989 - Liang , et al. October 4, 2 | 2016-10-04 |
Integrated Circuit Underfill Scheme
App 20160254169 - Liang; Shih-Wei ; et al. | 2016-09-01 |
Semiconductor Structure And Manufacturing Method Thereof
App 20160254242 - LU; CHUN-LIN ; et al. | 2016-09-01 |
Mechanisms for forming connectors with a molding compound for package on package
Grant 9,418,947 - Chen , et al. August 16, 2 | 2016-08-16 |
Method for forming package-on-package structure
Grant 9,412,661 - Lu , et al. August 9, 2 | 2016-08-09 |
Package on package structure
Grant 9,397,060 - Yu , et al. July 19, 2 | 2016-07-19 |
Methods and apparatus for package with interposers
Grant 9,391,012 - Wu , et al. July 12, 2 | 2016-07-12 |
Methods and apparatus for package on package devices
Grant 9,373,599 - Liu , et al. June 21, 2 | 2016-06-21 |
Semiconductor structure and manufacturing method thereof
Grant 9,355,982 - Lu , et al. May 31, 2 | 2016-05-31 |
Package-on-package structure
Grant 9,355,928 - Chen , et al. May 31, 2 | 2016-05-31 |
Integrated circuit underfill scheme
Grant 9,355,924 - Liang , et al. May 31, 2 | 2016-05-31 |
Semiconductor Device And Method Of Forming The Same
App 20160133618 - MIAO; CHIA-CHUN ; et al. | 2016-05-12 |
Device packaging
Grant 9,331,023 - Liu , et al. May 3, 2 | 2016-05-03 |
Semiconductor Devices and Methods of Manufacture Thereof
App 20160086900 - Chen; Yu-Feng ; et al. | 2016-03-24 |
Semiconductor device
Grant 9,263,405 - Miao , et al. February 16, 2 | 2016-02-16 |
Copper-containing Layer On Under-bump Metallization Layer
App 20160020186 - CHEN; Yu-Feng ; et al. | 2016-01-21 |
Methods and apparatus for heat spreader on silicon
Grant 9,236,322 - Chen , et al. January 12, 2 | 2016-01-12 |
Semiconductor devices and methods of manufacture thereof
Grant 9,209,140 - Chen , et al. December 8, 2 | 2015-12-08 |
Package on Package Structure
App 20150340349 - Yu; Chen-Hua ; et al. | 2015-11-26 |
Semiconductor device with bump adjustment and manufacturing method thereof
Grant 9,184,143 - Miao , et al. November 10, 2 | 2015-11-10 |
Polymer Layers Embedded With Metal Pads for Heat Dissipation
App 20150311169 - Chuang; Hao-Hsiang ; et al. | 2015-10-29 |
Low profile interposer with stud structure
Grant 9,165,875 - Yu , et al. October 20, 2 | 2015-10-20 |
Crack stopper on under-bump metallization layer
Grant 9,159,686 - Chen , et al. October 13, 2 | 2015-10-13 |
Methods and Apparatus of Packaging Semiconductor Devices
App 20150262948 - Lu; Chun-Lin ; et al. | 2015-09-17 |
Solder Ball Protection In Packages
App 20150255406 - Miao; Chia-Chun ; et al. | 2015-09-10 |
Packaging Devices and Methods
App 20150243615 - Liang; Shih-Wei ; et al. | 2015-08-27 |
Semiconductor Structure And Manufacturing Method Thereof
App 20150200173 - MIAO; CHIA-CHUN ; et al. | 2015-07-16 |
Methods and apparatus of packaging semiconductor devices
Grant 9,082,870 - Lu , et al. July 14, 2 | 2015-07-14 |
Polymer layers embedded with metal pads for heat dissipation
Grant 9,082,761 - Chuang , et al. July 14, 2 | 2015-07-14 |
Barrier Structures Between External Electrical Connectors
App 20150194400 - Miao; Chia-Chun ; et al. | 2015-07-09 |
Methods and Apparatus for Package with Interposers
App 20150179561 - Wu; Kai-Chiang ; et al. | 2015-06-25 |
Singulated semiconductor structure
Grant 9,064,873 - Miao , et al. June 23, 2 | 2015-06-23 |
Semiconductor Device And Method Of Forming The Same
App 20150162291 - MIAO; CHIA-CHUN ; et al. | 2015-06-11 |
Semiconductor Device And Method Of Forming The Same
App 20150162288 - MIAO; CHIA-CHUN ; et al. | 2015-06-11 |
Semiconductor Packaging And Manufacturing Method Thereof
App 20150130020 - SHIH; CHAO-WEN ; et al. | 2015-05-14 |
Packaging devices and methods
Grant 9,030,010 - Liang , et al. May 12, 2 | 2015-05-12 |
Method for Singulating Packaged Integrated Circuits and Resulting Structures
App 20150125997 - Wang; Yen-Ping ; et al. | 2015-05-07 |
Method for Singulating Packaged Integrated Circuits and Resulting Structures
App 20150118797 - Liu; Ming-Kai ; et al. | 2015-04-30 |
Semiconductor Structure And Manufacturing Method Thereof
App 20150115441 - LU; CHUN-LIN ; et al. | 2015-04-30 |
Semiconductor Structure And Manufacturing Method Thereof
App 20150108635 - LIANG; SHIH-WEI ; et al. | 2015-04-23 |
Methods and apparatus for package with interposers
Grant 8,994,176 - Wu , et al. March 31, 2 | 2015-03-31 |
Methods and Apparatus for Package on Package Devices
App 20150069606 - Liu; Ming-Kai ; et al. | 2015-03-12 |
Semiconductor Device And Manufacturing Method Thereof
App 20150061116 - LU; CHUN-LIN ; et al. | 2015-03-05 |
Semiconductor Devices and Methods of Manufacture Thereof
App 20150061127 - Chen; Yu-Feng ; et al. | 2015-03-05 |
Semiconductor Device And Manufacturing Method Thereof
App 20150035161 - MIAO; CHIA-CHUN ; et al. | 2015-02-05 |
Semiconductor Device And Manufacturing Method Thereof
App 20150008575 - LIU; MING-KAI ; et al. | 2015-01-08 |
Mechanisms For Forming Hybrid Bonding Structures With Elongated Bumps
App 20150001704 - LU; Chun-Lin ; et al. | 2015-01-01 |
Multiple die packaging interposer structure and method
Grant 8,916,956 - Yu , et al. December 23, 2 | 2014-12-23 |
Polymer Layers Embedded with Metal Pads for Heat Dissipation
App 20140353819 - Chuang; Hao-Hsiang ; et al. | 2014-12-04 |
Methods and apparatus for package on package devices
Grant 8,901,730 - Liu , et al. December 2, 2 | 2014-12-02 |
Package-on-Package Structure
App 20140264849 - Chen; Yu-Feng ; et al. | 2014-09-18 |
Methods and Apparatus of Packaging Semiconductor Devices
App 20140264824 - Lu; Chun-Lin ; et al. | 2014-09-18 |
Package Alignment Structure and Method of Forming Same
App 20140252657 - Liu; Ming-Kai ; et al. | 2014-09-11 |
Package on Package Structure
App 20140246785 - Yu; Chen-Hua ; et al. | 2014-09-04 |
Methods and Apparatus for Package with Interposers
App 20140167263 - Wu; Kai-Chiang ; et al. | 2014-06-19 |
Methods and Apparatus for Package with Interposers
App 20140160688 - Lu; Chun-Lin ; et al. | 2014-06-12 |
Interposer Having a Defined Through Via Pattern
App 20140162405 - Liang; Shih-Wei ; et al. | 2014-06-12 |
Package on package structure
Grant 8,749,043 - Yu , et al. June 10, 2 | 2014-06-10 |
Method for Forming Package-on-Package Structure
App 20140138816 - Lu; Chun-Lin ; et al. | 2014-05-22 |
Integrated Circuit Underfill Scheme
App 20140117555 - Liang; Shih-Wei ; et al. | 2014-05-01 |
Multiple die packaging interposer structure and method
Grant 8,703,539 - Yu , et al. April 22, 2 | 2014-04-22 |
Multiple Die Packaging Interposer Structure and Method
App 20140084459 - Yu; Chen-Hua ; et al. | 2014-03-27 |
Packaging Devices and Methods
App 20140077369 - Liang; Shih-Wei ; et al. | 2014-03-20 |
Interposer having a defined through via pattern
Grant 8,664,768 - Liang , et al. March 4, 2 | 2014-03-04 |
Multiple Die Packaging Interposer Structure and Method
App 20140001612 - Yu; Chen-Hua ; et al. | 2014-01-02 |
Interposer Having a Defined Through Via Pattern
App 20130292830 - Liang; Shih-Wei ; et al. | 2013-11-07 |
Methods and Apparatus for Package on Package Devices
App 20130292831 - Liu; Ming-Kai ; et al. | 2013-11-07 |
Low Profile Interposer with Stud Structure
App 20130285237 - Yu; Chen-Hua ; et al. | 2013-10-31 |
Methods And Apparatus For Heat Spreader On Silicon
App 20130270686 - Chen; Hsien-Wei ; et al. | 2013-10-17 |
Package on Package Structure
App 20130228932 - Yu; Chen-Hua ; et al. | 2013-09-05 |
Mechanisms Of Forming Connectors For Package On Package
App 20130221522 - CHEN; Yu-Feng ; et al. | 2013-08-29 |
Crack Stopper On Under-bump Metallization Layer
App 20130187277 - Chen; Yu-Feng ; et al. | 2013-07-25 |
Electroplated wire layout for package sawing
Grant 7,098,524 - Wu , et al. August 29, 2 | 2006-08-29 |
Packaging stacked chips with finger structure
Grant 7,095,091 - Wu , et al. August 22, 2 | 2006-08-22 |
Multiple stacked-chip packaging structure
Grant 7,091,590 - Wu , et al. August 15, 2 | 2006-08-15 |
Electroplated wire layout for package sawing
App 20060027918 - Wu; Kai-Chiang ; et al. | 2006-02-09 |
Finger structure
App 20060001148 - Wu; Kai-Chiang ; et al. | 2006-01-05 |
Structure of gold fingers
Grant 6,937,477 - Wu August 30, 2 | 2005-08-30 |
Structure Of Gold Fingers
App 20050156303 - Wu, Kai-Chiang | 2005-07-21 |
Chip adhesive
App 20050110126 - Wu, Kai-Chiang | 2005-05-26 |
Multiple stacked-chip packaging structure
App 20050035461 - Wu, Wan Hua ; et al. | 2005-02-17 |
Stacked chip scale package structure
Grant 6,633,086 - Peng , et al. October 14, 2 | 2003-10-14 |
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