| Patent | Date |
|---|
Semiconductor Package And Manufacturing Method Thereof
App 20220310411 - Chen; Jiun-Ting ; et al. | 2022-09-29 |
Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same
Grant 11,456,245 - Tsou , et al. September 27, 2 | 2022-09-27 |
Three dimensional integrated circuit (3DIC) with support structures
Grant 11,424,194 - Wu , et al. August 23, 2 | 2022-08-23 |
Integrated circuit package and method of forming same
Grant 11,424,173 - Yu , et al. August 23, 2 | 2022-08-23 |
Semiconductor structure having a dielectric layer edge covering circuit carrier
Grant 11,410,897 - Wu , et al. August 9, 2 | 2022-08-09 |
Package Structure Including A First Die And A Second Die And A Bridge Die And Method Of Forming The Package Structure
App 20220223534 - Lin; Yu-Hung ; et al. | 2022-07-14 |
Package And Method Of Manufacturing The Same
App 20220216152 - Wu; Chih-Wei ; et al. | 2022-07-07 |
Method of detecting jitter in clock of apparatus and apparatus utilizing same
Grant 11,381,247 - Hsu , et al. July 5, 2 | 2022-07-05 |
Integrated Fan-out Packages And Methods Of Forming The Same
App 20220199465 - Wu; Chih-Wei ; et al. | 2022-06-23 |
Package Structure
App 20220189920 - Liao; Shu-Hang ; et al. | 2022-06-16 |
Wire tension control device and braiding machine using the same
Grant 11,352,725 - Huang , et al. June 7, 2 | 2022-06-07 |
Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same
Grant 11,296,032 - Tsou , et al. April 5, 2 | 2022-04-05 |
Package and method of manufacturing the same
Grant 11,289,424 - Wu , et al. March 29, 2 | 2022-03-29 |
Shift Control Method In Manufacture Of Semiconductor Device
App 20220077108 - Wu; Chih-Wei ; et al. | 2022-03-10 |
Package structure and method of manufacturing the same
Grant 11,270,976 - Liao , et al. March 8, 2 | 2022-03-08 |
Integrated fan-out packages and methods of forming the same
Grant 11,257,715 - Wu , et al. February 22, 2 | 2022-02-22 |
Automated Workflows From Media Asset Differentials
App 20220021911 - Wang; Yadong ; et al. | 2022-01-20 |
Joint Structure In Semiconductor Package And Manufacturing Method Thereof
App 20220013492 - Huang; Kuan-Yu ; et al. | 2022-01-13 |
Semiconductor device and method of manufacture
Grant 11,205,615 - Tsou , et al. December 21, 2 | 2021-12-21 |
Method of manufacture of a semiconductor device
Grant 11,201,097 - Huang , et al. December 14, 2 | 2021-12-14 |
Silicon Interposer Including Through-silicon Via Structures With Enhanced Overlay Tolerance And Methods Of Forming The Same
App 20210375768 - TSOU; Hsien-Ju ; et al. | 2021-12-02 |
Silicon Interposer Including Through-silicon Via Structures With Enhanced Overlay Tolerance And Methods Of Forming The Same
App 20210375741 - TSOU; Hsien-Ju ; et al. | 2021-12-02 |
Chip Package Structure
App 20210366842 - CHEN; Jiun-Ting ; et al. | 2021-11-25 |
Shift control method in manufacture of semiconductor device
Grant 11,183,482 - Wu , et al. November 23, 2 | 2021-11-23 |
Techniques For Training A Multitask Learning Model To Assess Perceived Audio Quality
App 20210350819 - WU; Chih-Wei ; et al. | 2021-11-11 |
Techniques For Computing Perceived Audio Quality Based On A Trained Multitask Learning Model
App 20210350820 - WU; Chih-Wei ; et al. | 2021-11-11 |
Package structure with a heat dissipating element and method of manufacturing the same
Grant 11,164,855 - Chen , et al. November 2, 2 | 2021-11-02 |
Semiconductor package structure and method for forming the same
Grant 11,152,330 - Li , et al. October 19, 2 | 2021-10-19 |
Package structure and method of manufacturing the same
Grant 11,145,562 - Chang , et al. October 12, 2 | 2021-10-12 |
Semiconductor package
Grant 11,139,285 - Tsou , et al. October 5, 2 | 2021-10-05 |
Chip packages and methods of manufacture thereof
Grant 11,133,286 - Wu , et al. September 28, 2 | 2021-09-28 |
Method of manufacture of a semiconductor device
Grant 11,121,050 - Huang , et al. September 14, 2 | 2021-09-14 |
Package And Manufacturing Method Thereof
App 20210265306 - Wu; Chih-Wei ; et al. | 2021-08-26 |
Chip package structure and method for forming the same
Grant 11,088,086 - Chen , et al. August 10, 2 | 2021-08-10 |
Wire Tension Control Device And Braiding Machine Using The Same
App 20210189618 - HUANG; Yi-Ping ; et al. | 2021-06-24 |
Package Structure And Method Of Manufacturing The Same
App 20210193542 - Chang; Jung-Hua ; et al. | 2021-06-24 |
Semiconductor Device And Method
App 20210159325 - Hsu; Shu-Wei ; et al. | 2021-05-27 |
Dummy Die Placement Without Backside Chipping
App 20210118817 - Wu; Chih-Wei ; et al. | 2021-04-22 |
Package Component, Electronic Device And Manufacturing Method Thereof
App 20210098421 - Wu; Chih-Wei ; et al. | 2021-04-01 |
Perceptually-based Loss Functions For Audio Encoding And Decoding Based On Machine Learning
App 20210082444 - FEJGIN; Roy M. ; et al. | 2021-03-18 |
Package Structure Having Bridge Structure For Connection Between Semiconductor Dies
App 20210082819 - Wu; Chih-Wei ; et al. | 2021-03-18 |
Shift Control Method In Manufacture Of Semiconductor Device
App 20210082870 - Wu; Chih-Wei ; et al. | 2021-03-18 |
Package Structure And Method Of Manufacturing The Same
App 20210082894 - Chen; Weiming Chris ; et al. | 2021-03-18 |
Light-emitting element having a plurality of light-emitting structures
Grant 10,930,701 - Ou , et al. February 23, 2 | 2021-02-23 |
Package of integrated circuits having a light-to-heat-conversion coating material
Grant 10,916,450 - Tsou , et al. February 9, 2 | 2021-02-09 |
Integrated Circuit Package and Method of Forming Same
App 20210028081 - Yu; Chen-Hua ; et al. | 2021-01-28 |
Semiconductor Structure And Manufacturing Method Thereof
App 20200411399 - Wu; Chih-Wei ; et al. | 2020-12-31 |
Package structure having bridge structure for connection between semiconductor dies and method of fabricating the same
Grant 10,872,862 - Wu , et al. December 22, 2 | 2020-12-22 |
Package structures and methods of forming the same
Grant 10,867,965 - Shih , et al. December 15, 2 | 2020-12-15 |
Packaging process and manufacturing method
Grant 10,867,962 - Chen , et al. December 15, 2 | 2020-12-15 |
Dummy die placement without backside chipping
Grant 10,861,799 - Wu , et al. December 8, 2 | 2020-12-08 |
Die-on-Interposer Assembly with Dam Structure and Method of Manufacturing the Same
App 20200373215 - Wu; Chih-Wei ; et al. | 2020-11-26 |
Dummy Die Placement Without Backside Chipping
App 20200365525 - Wu; Chih-Wei ; et al. | 2020-11-19 |
Semiconductor Package And Manufacturing Method Thereof
App 20200357768 - Shih; Ying-Ching ; et al. | 2020-11-12 |
Semiconductor Package And Manufacturing Method Thereof
App 20200350283 - Shih; Ying-Ching ; et al. | 2020-11-05 |
Chip Package Structure And Method For Forming The Same
App 20200343197 - CHEN; Jiun-Ting ; et al. | 2020-10-29 |
Semiconductor Package Structure And Method For Forming The Same
App 20200335479 - LI; Cheng-Chieh ; et al. | 2020-10-22 |
Integrated circuit package and method of forming same
Grant 10,804,178 - Yu , et al. October 13, 2 | 2020-10-13 |
Semiconductor package and manufacturing method thereof
Grant 10,756,058 - Shih , et al. A | 2020-08-25 |
Die-on-interposer assembly with dam structure and method of manufacturing the same
Grant 10,741,467 - Wu , et al. A | 2020-08-11 |
Package And Method Of Manufacturing The Same
App 20200176384 - Wu; Chih-Wei ; et al. | 2020-06-04 |
Integrated Circuit Package and Method of Forming Same
App 20200135605 - Yu; Chen-Hua ; et al. | 2020-04-30 |
Semiconductor Package
App 20200091131 - TSOU; HSIEN-JU ; et al. | 2020-03-19 |
Semiconductor device and method of manufacture
Grant 10,586,763 - Tsou , et al. | 2020-03-10 |
Semiconductor Package And Manufacturing Method Thereof
App 20200075546 - Shih; Ying-Ching ; et al. | 2020-03-05 |
Chip Packages and Methods of Manufacture Thereof
App 20200043892 - Wu; Chih-Wei ; et al. | 2020-02-06 |
Die-on-Interposer Assembly with Dam Structure and Method of Manufacturing the Same
App 20200035578 - Wu; Chih-Wei ; et al. | 2020-01-30 |
Three Dimensional Integrated Circuit (3dic) With Support Structures
App 20200035622 - Wu; Chih-Wei ; et al. | 2020-01-30 |
Package structures and methods of forming the same
Grant 10,529,690 - Shih , et al. J | 2020-01-07 |
Integrated circuit package and method of forming same
Grant 10,529,637 - Yu , et al. J | 2020-01-07 |
Super thin two-screen display
Grant D872,040 - Wu J | 2020-01-07 |
Packaging Process And Manufacturing Method
App 20200006286 - Chen; Jiun-Ting ; et al. | 2020-01-02 |
Integrated Fan-out Packages And Methods Of Forming The Same
App 20200006136 - Wu; Chih-Wei ; et al. | 2020-01-02 |
Method of Manufacture of a Semiconductor Device
App 20200006178 - Huang; Kuan-Yu ; et al. | 2020-01-02 |
Semiconductor Device and Method of Manufacture
App 20200006225 - Tsou; Hsien-Ju ; et al. | 2020-01-02 |
Three dimensional integrated circuit (3DIC) with support structures
Grant 10,510,684 - Wu , et al. Dec | 2019-12-17 |
PoP device and method of forming the same
Grant 10,510,732 - Tsou , et al. Dec | 2019-12-17 |
Integrated fan-out packages and methods of forming the same
Grant 10,510,595 - Wu , et al. Dec | 2019-12-17 |
Semiconductor package, method for forming semiconductor package, and method for forming semiconductor assembly
Grant 10,497,690 - Tsou , et al. De | 2019-12-03 |
Die-on-interposer assembly with dam structure and method of manufacturing the same
Grant 10,490,474 - Wu , et al. Nov | 2019-11-26 |
Chip packages and methods of manufacture thereof
Grant 10,483,234 - Wu , et al. Nov | 2019-11-19 |
Integrated Fan-out Packages And Methods Of Forming The Same
App 20190333811 - Wu; Chih-Wei ; et al. | 2019-10-31 |
Package Structure And Method Of Manufacturing The Same
App 20190319008 - Liao; Shu-Hang ; et al. | 2019-10-17 |
Package Structure Having Bridge Structure For Connection Between Semiconductor Dies And Method Of Fabricating The Same
App 20190304913 - Wu; Chih-Wei ; et al. | 2019-10-03 |
Network Bridge And Network Management Method
App 20190288872 - Wu; Chih-Wei | 2019-09-19 |
Light-emitting Element Having A Pluarality Of Light-emitting Structures
App 20190252459 - OU; Chen ; et al. | 2019-08-15 |
Light-emitting Device
App 20190237628 - OU; Chen ; et al. | 2019-08-01 |
Package structure and method of manufacturing the same
Grant 10,340,253 - Liao , et al. | 2019-07-02 |
Light-emitting element having a plurality of light-emitting structures
Grant 10,319,780 - Ou , et al. | 2019-06-11 |
Semiconductor Device and Method of Manufacture
App 20190148288 - Tsou; Hsien-Ju ; et al. | 2019-05-16 |
Light-emitting device
Grant 10,290,773 - Ou , et al. | 2019-05-14 |
Method of manufacturing a release film as isolation film in package
Grant 10,269,589 - Tsou , et al. | 2019-04-23 |
Apparatus for dicing interposer assembly
Grant 10,269,731 - Wang , et al. | 2019-04-23 |
Package Structures and Methods of Forming the Same
App 20190109119 - Shih; Ying-Ching ; et al. | 2019-04-11 |
Method of lubricating a rotary screw compressor
Grant 10,253,232 - Li , et al. | 2019-04-09 |
Pop Device And Method Of Forming The Same
App 20190103387 - Tsou; Hsien-Ju ; et al. | 2019-04-04 |
Package Structure And Method Of Manufacturing The Same
App 20190096851 - Liao; Shu-Hang ; et al. | 2019-03-28 |
Semiconductor Package, Method For Forming Semiconductor Package, And Method For Forming Semiconductor Assembly
App 20190096868 - TSOU; HSIEN-JU ; et al. | 2019-03-28 |
Method of Manufacturing a Release Film as Isolation Film in Package
App 20190096700 - Tsou; Hsien-Ju ; et al. | 2019-03-28 |
Die-on-Interposer Assembly with Dam Structure and Method of Manufacturing the Same
App 20190067148 - Wu; Chih-Wei ; et al. | 2019-02-28 |
Semiconductor Device and Method of Manufacture
App 20190006256 - Huang; Kuan-Yu ; et al. | 2019-01-03 |
Release Film as Isolation Film in Package
App 20190006199 - Tsou; Hsien-Ju ; et al. | 2019-01-03 |
Semiconductor structure and manufacturing method thereof
Grant 10,170,441 - Wu , et al. J | 2019-01-01 |
Integrated fan-out package and method of fabricating the same
Grant 10,157,870 - Wu , et al. Dec | 2018-12-18 |
Semiconductor packages and manufacturing method thereof
Grant 10,157,850 - Wu , et al. Dec | 2018-12-18 |
Die-on-interposer assembly with dam structure and method of manufacturing the same
Grant 10,115,650 - Wu , et al. October 30, 2 | 2018-10-30 |
Three Dimensional Integrated Circuit (3dic) With Support Structures
App 20180197826 - Wu; Chih-Wei ; et al. | 2018-07-12 |
Blind bandwidth extension using K-means and a support vector machine
Grant 10,008,218 - Wu , et al. June 26, 2 | 2018-06-26 |
Package Structures And Methods Of Forming The Same
App 20180138151 - Shih; Ying-Ching ; et al. | 2018-05-17 |
Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure
Grant 9,929,109 - Wu , et al. March 27, 2 | 2018-03-27 |
Blind Bandwidth Extension using K-Means and a Support Vector Machine
App 20180040336 - WU; Chih-Wei ; et al. | 2018-02-08 |
Light-emitting Element Having A Plurality Of Light-emitting Structures
App 20170365637 - OU; Chen ; et al. | 2017-12-21 |
Chip Packages and Methods of Manufacture Thereof
App 20170301649 - Wu; Chih-Wei ; et al. | 2017-10-19 |
Light-emitting element having a plurality of light-emitting structures
Grant 9,768,227 - Ou , et al. September 19, 2 | 2017-09-19 |
Light-emitting Device
App 20170263818 - OU; Chen ; et al. | 2017-09-14 |
Chip packages and methods of manufacture thereof
Grant 9,704,825 - Wu , et al. July 11, 2 | 2017-07-11 |
Fluorescent Led Backlight Plate Assembly
App 20170168208 - Wu; Chih-Wei | 2017-06-15 |
Stacking Of Multiple Dies For Forming Three Dimensional Integrated Circuit (3dic) Structure
App 20170103954 - Wu; Chih-Wei ; et al. | 2017-04-13 |
Chip Packages and Methods of Manufacture Thereof
App 20170092617 - Wu; Chih-Wei ; et al. | 2017-03-30 |
Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure
Grant 9,570,421 - Wu , et al. February 14, 2 | 2017-02-14 |
Power Supply Circuit For A Computing Server
App 20160378175 - Wu; Chih-Wei ; et al. | 2016-12-29 |
Method of forming a semiconductor structure
Grant 9,530,646 - Feng , et al. December 27, 2 | 2016-12-27 |
Die-on-interposer Assembly With Dam Structure And Method Of Manufacturing The Same
App 20160293532 - Wu; Chih-Wei ; et al. | 2016-10-06 |
Common voltage compensation in display apparatus
Grant 9,449,567 - Chen , et al. September 20, 2 | 2016-09-20 |
Method Of Forming A Semiconductor Structure
App 20160247678 - Feng; Li-Wei ; et al. | 2016-08-25 |
Method of Lubricating a Rotary Screw Compressor
App 20160230111 - LI; Hsinheng ; et al. | 2016-08-11 |
Switchable Grating And Application Thereof
App 20160187679 - LIN; Tsung-Hsien ; et al. | 2016-06-30 |
Die-on-interposer assembly with dam structure and method of manufacturing the same
Grant 9,368,458 - Wu , et al. June 14, 2 | 2016-06-14 |
Apparatus and methods for molding die on wafer interposers
Grant 9,337,096 - Wang , et al. May 10, 2 | 2016-05-10 |
Led Backlight Assembly Suitable Of Middle Or Small Size Lcd Display
App 20150362661 - Wu; Chih-Wei | 2015-12-17 |
Apparatus for Dicing Interposer Assembly
App 20150145133 - Wang; Chung Yu ; et al. | 2015-05-28 |
Stacking Of Multiple Dies For Forming Three Dimensional Integrated Circuit (3dic) Structure
App 20150130072 - WU; Chih-Wei ; et al. | 2015-05-14 |
Light-emitting Element Having A Plurality Of Light-emitting Structures
App 20150076536 - OU; Chen ; et al. | 2015-03-19 |
Apparatus for dicing interposer assembly
Grant 8,946,893 - Wang , et al. February 3, 2 | 2015-02-03 |
Die-on-Interposer Assembly with Dam Structure and Method of Manufacturing the Same
App 20150014844 - Wu; Chih-Wei ; et al. | 2015-01-15 |
Three-Dimensional Integrated Circuit (3DIC)
App 20140248745 - Wu; Chih-Wei ; et al. | 2014-09-04 |
Common voltage compensation in a display apparatus
App 20140240302 - Chen; Ying-Ji ; et al. | 2014-08-28 |
Three-dimensional integrated circuit (3DIC)
Grant 8,749,077 - Wu , et al. June 10, 2 | 2014-06-10 |
Light-emitting Device
App 20140110741 - Ou; Chen ; et al. | 2014-04-24 |
Apparatus and Methods for Molding Die on Wafer Interposers
App 20140038360 - Wang; Chung Yu ; et al. | 2014-02-06 |
Three-Dimensional Integrated Circuit (3DIC)
App 20130307149 - Wu; Chih-Wei ; et al. | 2013-11-21 |
Apparatus and methods for molding die on wafer interposers
Grant 8,580,683 - Wang , et al. November 12, 2 | 2013-11-12 |
Apparatus For Dicing Interposer Assembly
App 20130285241 - Wang; Chung Yu ; et al. | 2013-10-31 |
Semiconductor device and method of dicing semiconductor devices
Grant 8,569,086 - Lin , et al. October 29, 2 | 2013-10-29 |
Three-dimensional integrated circuit (3DIC) formation process
Grant 8,557,684 - Wu , et al. October 15, 2 | 2013-10-15 |
Semiconductor device having shielded conductive vias
Grant 8,541,883 - Cheng , et al. September 24, 2 | 2013-09-24 |
Assembly method for three dimensional integrated circuit
Grant 8,518,753 - Wu , et al. August 27, 2 | 2013-08-27 |
Apparatus and methods for dicing interposer assembly
Grant 8,501,590 - Wang , et al. August 6, 2 | 2013-08-06 |
Gripping mechanism
Grant 8,460,394 - Lee , et al. June 11, 2 | 2013-06-11 |
Semiconductor Device Having Shielded Conductive Vias And Method For Manufacturing The Same
App 20130134601 - Cheng; Hung-Hsiang ; et al. | 2013-05-30 |
Assembly Method for Three Dimensional Integrated Circuit
App 20130122659 - Wu; Chih-Wei ; et al. | 2013-05-16 |
Distributed File System And Method Of Selecting Backup Location For The Same
App 20130110786 - WU; Chih-Wei | 2013-05-02 |
Apparatus and Methods for Molding Die on Wafer Interposers
App 20130075937 - Wang; Chung Yu ; et al. | 2013-03-28 |
Three-Dimensional Integrated Circuit (3DIC) Formation Process
App 20130049195 - Wu; Chih-Wei ; et al. | 2013-02-28 |
Substrate Dicing
App 20130049234 - Lin; Jing-Cheng ; et al. | 2013-02-28 |
Apparatus and Methods for Dicing Interposer Assembly
App 20130009316 - Wang; Chung Yu ; et al. | 2013-01-10 |
Method And System For Monitoring And Recording Viral Infection Process And Screening For Agents That Inhibit Virus Infection
App 20120276526 - Wu; Chih-Wei ; et al. | 2012-11-01 |
Network videoconference equipment and its method of proceeding network videoconference
Grant 8,254,532 - Wu , et al. August 28, 2 | 2012-08-28 |
Method And System For Monitoring And Recording A Viral Infection Process And That For Screening Vaccines
App 20120190007 - WU; CHIH-WEI ; et al. | 2012-07-26 |
Motherboard with selected sub-system controlling shared peripherals
Grant 8,225,025 - Chang , et al. July 17, 2 | 2012-07-17 |
Method For Providing Virtual Optical Disk Function In Portable Storage Device And Portable Storage Device With Virtual Optical Disk Function
App 20120042140 - Tsai; Pi-Hsi ; et al. | 2012-02-16 |
Network Videoconference Equipment And Its Method Of Proceeding Network Videoconference
App 20120019611 - WU; Chih-Wei ; et al. | 2012-01-26 |
Automatic Patent Transaction System
App 20110302045 - LEE; Chen-Yi ; et al. | 2011-12-08 |
Gripping Mechanism
App 20110270416 - Lee; Wei-Chen ; et al. | 2011-11-03 |
Liquid Core Waveguide Assembly And Detecting System Including The Same
App 20110149286 - Wu; Chih-Wei ; et al. | 2011-06-23 |
Motherboard For Selecting One Of Sub-systems Immediately
App 20110035520 - Chang; Chia Yi ; et al. | 2011-02-10 |
Semiconductor structure and semiconductor manufacturing method
Grant 7,851,895 - Huang , et al. December 14, 2 | 2010-12-14 |
Substrate for multi-chip stacking, multi-chip stack package utilizing the substrate and its applications
Grant 7,663,204 - Hsu , et al. February 16, 2 | 2010-02-16 |
Semiconductor structure and semiconductor manufacturing method
App 20090039521 - Huang; Chih Yi ; et al. | 2009-02-12 |
Desktop personal computer and thermal module thereof
Grant 7,474,527 - Wu January 6, 2 | 2009-01-06 |
Mother Board Module And Personal Computer Host Using The Same
App 20080301346 - Wu; Chih-Wei ; et al. | 2008-12-04 |
Substrate for multi-chip stacking, multi-chip stack package utilizing the substrate and its applications
App 20080265389 - Hsu; Hung-Hsin ; et al. | 2008-10-30 |
Sliding Open/closed Device
App 20080259535 - Wu; Chih-Wei ; et al. | 2008-10-23 |
Desktop Personal Computer And Thermal Module Thereof
App 20080218963 - Wu; Chih-Wei | 2008-09-11 |
Heat Dissipation Module And Desktop Host Using The Same
App 20080218961 - Wu; Chih-Wei ; et al. | 2008-09-11 |
Motherboard And Desktop Host Using The Same
App 20080186666 - Wu; Chih-Wei | 2008-08-07 |
Foldable computer mouse
Grant 7,379,051 - Yin , et al. May 27, 2 | 2008-05-27 |
Method and apparatus for radio frequency identification
Grant 7,376,444 - Kao , et al. May 20, 2 | 2008-05-20 |
Method for in-gas micro/nanoimprinting of bulk metallic glass
App 20080099175 - Chu; Jinn P. ; et al. | 2008-05-01 |
Cellular phone structure and portable electronic apparatus
Grant 7,054,670 - Wang , et al. May 30, 2 | 2006-05-30 |
Mouse
Grant D514,573 - Yin , et al. February 7, 2 | 2006-02-07 |
Mouse
Grant D511,518 - Wu , et al. November 15, 2 | 2005-11-15 |
Pen mouse
Grant D509,506 - Huang , et al. September 13, 2 | 2005-09-13 |
Method and apparatus for radio frequency identification
App 20050192053 - Kao, Chia-Hung ; et al. | 2005-09-01 |
Mouse device
App 20050179659 - Yin, Chun-Hsiung ; et al. | 2005-08-18 |
Method for updating BIOS setting
App 20050144432 - Wu, Chih-Wei | 2005-06-30 |
Self-inflating mouse device
App 20050122312 - Huang, Hsun-Li ; et al. | 2005-06-09 |
Foldable computer mouse
App 20050116934 - Yin, Chun-Hsiung ; et al. | 2005-06-02 |
Pen-like mouse device
App 20050110779 - Huang, Hsun-Li ; et al. | 2005-05-26 |
Cellular phone structure and portable electronic apparatus
App 20050059425 - Wang, Chien-Jui ; et al. | 2005-03-17 |
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