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Hybrid Metal Line Structure
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Method For Manufacturing Interconnection Structure
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Deep Lines And Shallow Lines In Signal Conducting Paths
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Method of fabricating semiconductor device with reduced trench distortions
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Semiconductor Device With Spacers For Self Aligned Vias
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Method Of Manufacturing A Semiconductor Device
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Integrated Circuit
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Semiconductor device with spacers for self aligned vias
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Method of manufacturing a semiconductor device, and associated semiconductor device and system
Grant 11,257,670 - Peng , et al. February 22, 2 | 2022-02-22 |
Dual spacer metal patterning
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Semiconductor Devices With Backside Power Distribution Network And Frontside Through Silicon Via
App 20220045011 - Sio; Kam-Tou ; et al. | 2022-02-10 |
Interconnect Structure And Manufacturing Method For The Same
App 20210391211 - LIU; HSIANG-WEI ; et al. | 2021-12-16 |
Semiconductor devices with backside power distribution network and frontside through silicon via
Grant 11,158,580 - Sio , et al. October 26, 2 | 2021-10-26 |
Local Interconnect Structure
App 20210280607 - CHEN; Chih-Liang ; et al. | 2021-09-09 |
Interconnect structure and manufacturing method for the same
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Structure and Method for Interconnection with Self-Alignment
App 20210265208 - Yang; Tai-I ; et al. | 2021-08-26 |
Method Of Manufacturing A Semiconductor Device, And Associated Semiconductor Device And System
App 20210249262 - PENG; SHIH-WEI ; et al. | 2021-08-12 |
Semiconductor Device And Method Of Manufacture
App 20210242076 - YANG; Tai-I ; et al. | 2021-08-05 |
Low-Resistance Interconnect
App 20210175119 - Huang; Hsin-Yen ; et al. | 2021-06-10 |
Local interconnect structure
Grant 11,018,157 - Chen , et al. May 25, 2 | 2021-05-25 |
Structure and method for interconnection with self-alignment
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Semiconductor Device With Spacers For Self Aligned Vias
App 20210134672 - Ho; Pokuan ; et al. | 2021-05-06 |
Semiconductor device and method of manufacture
Grant 10,991,618 - Yang , et al. April 27, 2 | 2021-04-27 |
Semiconductor Devices With Backside Power Distribution Network And Frontside Through Silicon Via
App 20210118805 - SIO; Kam-Tou ; et al. | 2021-04-22 |
Semiconductor Device, And Associated Method And System
App 20210098339 - PENG; SHIH-WEI ; et al. | 2021-04-01 |
Metal routing with flexible space formed using self-aligned spacer patterning
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Semiconductor Device And Method Of Manufacture
App 20210066120 - Yang; Tai-I ; et al. | 2021-03-04 |
Advanced Metal Connection With Metal Cut
App 20210066182 - Chen; Chih-Liang ; et al. | 2021-03-04 |
Barrier-Less Structures
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Method Of Fabricating Semiconductor Device With Reduced Trench Distortions
App 20210057231 - Yen; Yung-Sung ; et al. | 2021-02-25 |
Methods for fabricating a low-resistance interconnect
Grant 10,930,551 - Huang , et al. February 23, 2 | 2021-02-23 |
Method For Manufacturing Interconnection Structure
App 20210013096 - HO; Po-Kuan ; et al. | 2021-01-14 |
Interconnect Structure And Manufacturing Method For The Same
App 20210005510 - LIU; HSIANG-WEI ; et al. | 2021-01-07 |
Methods for Fabricating a Low-Resistance Interconnect
App 20200411374 - Huang; Hsin-Yen ; et al. | 2020-12-31 |
Self aligned via and method for fabricating the same
Grant 10,879,120 - Chen , et al. December 29, 2 | 2020-12-29 |
Zero Mask High Density Capacitor
App 20200373290 - Chen; Chung-Hui ; et al. | 2020-11-26 |
Formation method of damascene structure
Grant 10,847,418 - Peng , et al. November 24, 2 | 2020-11-24 |
Advanced metal connection with metal cut
Grant 10,847,460 - Chen , et al. November 24, 2 | 2020-11-24 |
Metal Routing with Flexible Space Formed Using Self-Aligned Spacer Patterning
App 20200365449 - Liu; Hsiang-Wei ; et al. | 2020-11-19 |
Method of fabricating semiconductor device with reduced trench distortions
Grant 10,818,509 - Yen , et al. October 27, 2 | 2020-10-27 |
Multi-metal fill with self-align patterning
Grant 10,784,155 - Chu , et al. Sept | 2020-09-22 |
Interconnect structure and manufacturing method for the same
Grant 10,784,151 - Liu , et al. Sept | 2020-09-22 |
Interconnection structure having top and bottom vias with a barrier layer therebetween and a dielectric spacer at the bottom via
Grant 10,777,452 - Ho , et al. Sept | 2020-09-15 |
Metal routing with flexible space formed using self-aligned spacer patterning
Grant 10,734,275 - Liu , et al. | 2020-08-04 |
Dual Spacer Metal Patterning
App 20200168458 - Liao; Yu-Chieh ; et al. | 2020-05-28 |
Metal Routing with Flexible Space Formed Using Self-Aligned Spacer Patterning
App 20200144104 - Liu; Hsiang-Wei ; et al. | 2020-05-07 |
Structure and Method for Interconnection with Self-Alignment
App 20200105598 - Yang; Tai-I ; et al. | 2020-04-02 |
Interconnect Structure And Manufacturing Method For The Same
App 20200083093 - LIU; HSIANG-WEI ; et al. | 2020-03-12 |
Multi-Metal Fill with Self-Align Patterning
App 20200051853 - Chu; Wei-Chen ; et al. | 2020-02-13 |
Semiconductor Structure And Manufacturing Method Thereof
App 20200035612 - HO; POKUAN ; et al. | 2020-01-30 |
Formation Method Of Damascene Structure
App 20200027788 - PENG; Tai-Yen ; et al. | 2020-01-23 |
Advanced Metal Connection With Metal Cut
App 20200020625 - Chen; Chih-Liang ; et al. | 2020-01-16 |
Interconnection structure of semiconductor device
Grant 10,535,560 - Chu , et al. Ja | 2020-01-14 |
Metal routing with flexible space formed using self-aligned spacer patterning
Grant 10,529,617 - Liu , et al. J | 2020-01-07 |
Split rail structures located in adjacent metal layers
Grant 10,522,469 - Wu , et al. Dec | 2019-12-31 |
Multi-metal fill with self-align patterning
Grant 10,483,159 - Chu , et al. Nov | 2019-11-19 |
Structure and formation method of damascene structure
Grant 10,475,703 - Peng , et al. Nov | 2019-11-12 |
Advanced metal connection with metal cut
Grant 10,468,349 - Chen , et al. No | 2019-11-05 |
Split Rail Structures Located In Adjacent Metal Layers
App 20190244902 - Wu; Chia-Tien ; et al. | 2019-08-08 |
Method for forming semiconductor device with damascene structure
Grant 10,276,396 - Liu , et al. | 2019-04-30 |
Method of Fabricating Semiconductor Device with Reduced Trench Distortions
App 20190122895 - Yen; Yung-Sung ; et al. | 2019-04-25 |
Split rail structures located in adjacent metal layers
Grant 10,269,715 - Wu , et al. | 2019-04-23 |
Metal Routing with Flexible Space Formed Using Self-Aligned Spacer Patterning
App 20190103305 - Liu; Hsiang-Wei ; et al. | 2019-04-04 |
Local Interconnect Structure
App 20190096909 - Chen; Chih-Liang ; et al. | 2019-03-28 |
Interconnection Structure and Manufacturing Method Thereof
App 20190080960 - HO; Po-Kuan ; et al. | 2019-03-14 |
Advanced Metal Connection With Metal Cut
App 20190051595 - Chen; Chih-Liang ; et al. | 2019-02-14 |
Method For Forming Semiconductor Device With Damascene Structure
App 20190043730 - LIU; Hsiang-Wei ; et al. | 2019-02-07 |
Structure And Formation Method Of Interconnection Structure Of Semiconductor Device
App 20190027406 - CHU; Wei-Chen ; et al. | 2019-01-24 |
Method of fabricating semiconductor device with reduced trench distortions
Grant 10,163,654 - Yen , et al. Dec | 2018-12-25 |
Method of adjusting metal line pitch
Grant 10,162,930 - Lin , et al. Dec | 2018-12-25 |
2-D interconnections for integrated circuits
Grant 10,163,690 - Wu , et al. Dec | 2018-12-25 |
Split Rail Structures Located In Adjacent Metal Layers
App 20180308798 - Wu; Chia-Tien ; et al. | 2018-10-25 |
Multi-metal Fill With Self-align Patterning
App 20180308749 - YANG; Tai-I ; et al. | 2018-10-25 |
Advanced metal connection with metal cut
Grant 10,109,582 - Chen , et al. October 23, 2 | 2018-10-23 |
Structure and formation method of semiconductor device structure
Grant 10,103,102 - Chen , et al. October 16, 2 | 2018-10-16 |
Multi-metal fill with self-align patterning
Grant 10,026,647 - Chu , et al. July 17, 2 | 2018-07-17 |
Split rail structures located in adjacent metal layers
Grant 10,020,261 - Wu , et al. July 10, 2 | 2018-07-10 |
Multi-metal Fill With Self-align Patterning
App 20180166330 - CHU; Wei-Chen ; et al. | 2018-06-14 |
Method of forming an interconnect structure for a semiconductor device
Grant 9,997,404 - Wu , et al. June 12, 2 | 2018-06-12 |
Self Aligned Via and Method for Fabricating the Same
App 20180151432 - Chen; Chih-Liang ; et al. | 2018-05-31 |
2-d Interconnections For Integrated Circuits
App 20180151416 - WU; Chia-Tien ; et al. | 2018-05-31 |
Structure And Formation Method Of Semiconductor Device Structure
App 20180122739 - CHEN; Jian-Hua ; et al. | 2018-05-03 |
Split Rail Structures Located In Adjacent Metal Layers
App 20180108611 - Wu; Chia-Tien ; et al. | 2018-04-19 |
Method Of Adjusting Metal Line Pitch
App 20180039723 - LIN; WEI-CHENG ; et al. | 2018-02-08 |
Structure and formation method of semiconductor device structure
Grant 9,865,539 - Chen , et al. January 9, 2 | 2018-01-09 |
Structure And Formation Method Of Damascene Structure
App 20170316975 - PENG; Tai-Yen ; et al. | 2017-11-02 |
Advanced Metal Connection With Metal Cut
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Structure And Formation Method Of Semiconductor Device Structure
App 20170263548 - CHEN; Jian-Hua ; et al. | 2017-09-14 |
Structure and formation method of damascene structure
Grant 9,721,836 - Peng , et al. August 1, 2 | 2017-08-01 |
Combination interconnect structure and methods of forming same
Grant 9,716,035 - Yang , et al. July 25, 2 | 2017-07-25 |
Conductive element structure and method
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Battery
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Air gap forming techniques based on anodic alumina for interconnect structures
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Method Of Forming An Interconnect Structure For A Semiconductor Device
App 20160365276 - WU; Yung-Hsu ; et al. | 2016-12-15 |
Method Of Fabricating Semiconductor Device With Reduced Trench Distortions
App 20160358788 - Yen; Yung-Sung ; et al. | 2016-12-08 |
Conductive Element Structure and Method
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Air Gap Forming Techniques Based On Anodic Alumina For Interconnect Structures
App 20160343606 - Wu; Chia-Tien ; et al. | 2016-11-24 |
Method of forming trench cut
Grant 9,490,136 - Chang , et al. November 8, 2 | 2016-11-08 |
Structure And Formation Method Of Damascene Structure
App 20160276221 - PENG; Tai-Yen ; et al. | 2016-09-22 |
Method of forming an interconnect structure for a semiconductor device
Grant 9,431,297 - Wu , et al. August 30, 2 | 2016-08-30 |
Conductive element structure and method
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Method Of Fabricating Semiconductor Device
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Method of fabricating semiconductor device with reduced trench distortions
Grant 9,418,868 - Yen , et al. August 16, 2 | 2016-08-16 |
Method of fabricating semiconductor device
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Structure and formation method of damascene structure
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Structure And Formation Method Of Damascene Structure
App 20160111371 - PENG; Tai-Yen ; et al. | 2016-04-21 |
Method Of Forming An Interconnect Structure For A Semiconductor Device
App 20160099174 - Wu; Yung-Hsu ; et al. | 2016-04-07 |
Semiconductor arrangement and formation thereof
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Conductive Element Structure And Method
App 20150380303 - Yang; Tai-I ; et al. | 2015-12-31 |
Combination Interconnect Structure and Methods of Forming Same
App 20150371939 - Yang; Tai-I ; et al. | 2015-12-24 |
Semiconductor Arrangement And Formation Thereof
App 20150294905 - Wu; Chia-Tien ; et al. | 2015-10-15 |
Air Gap Forming Techniques Based On Anodic Alumina For Interconnect Structures
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Air Gap Forming Techniques Based On Anodic Alumina For Interconnect Structures
App 20150194383 - Wu; Chia-Tien ; et al. | 2015-07-09 |
Air gap forming techniques based on anodic alumina for interconnect structures
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Exchangeable work assembly of a screwdriver and the method of using the assembly
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Manufacturing method of a muffler assembly
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Manufacturing method of a muffler assembly
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Force reducing device and method for adjusting shutter ropes
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