| Patent | Date |
|---|
Optical transceiver and manufacturing method thereof
Grant 11,454,773 - Yu , et al. September 27, 2 | 2022-09-27 |
Structure and Method of Forming a Joint Assembly
App 20220302069 - Chen; Ying-Ju ; et al. | 2022-09-22 |
Via for semiconductor device connection and methods of forming the same
Grant 11,444,020 - Yu , et al. September 13, 2 | 2022-09-13 |
Integrated Circuit Package Pad and Methods of Forming
App 20220285171 - Yu; Chen-Hua ; et al. | 2022-09-08 |
Package structures and methods of forming the same
Grant 11,417,580 - Yu , et al. August 16, 2 | 2022-08-16 |
Package structure and method of fabricating the same
Grant 11,417,606 - Lin , et al. August 16, 2 | 2022-08-16 |
Semiconductor package and method of forming the same
Grant 11,373,969 - Wu , et al. June 28, 2 | 2022-06-28 |
Structure and method of forming a joint assembly
Grant 11,355,468 - Chen , et al. June 7, 2 | 2022-06-07 |
Raised Via for Terminal Connections on Different Planes
App 20220165611 - Yu; Chen-Hua ; et al. | 2022-05-26 |
Integrated circuit package pad and methods of forming
Grant 11,342,196 - Chen , et al. May 24, 2 | 2022-05-24 |
Package Structure And Manufacturing Method Thereof
App 20220122952 - Chen; Wei-Yu ; et al. | 2022-04-21 |
Semiconductor Structure
App 20220068880 - YU; CHEN-HUA ; et al. | 2022-03-03 |
Raised via for terminal connections on different planes
Grant 11,251,071 - Yu , et al. February 15, 2 | 2022-02-15 |
Package structure and manufacturing method thereof
Grant 11,217,570 - Chen , et al. January 4, 2 | 2022-01-04 |
Semiconductor package, package on package structure and method of froming package on package structure
Grant 11,201,142 - Huang , et al. December 14, 2 | 2021-12-14 |
Giga Interposer Integration through Chip-On-Wafer-On-Substrate
App 20210366814 - Hou; Shang-Yun ; et al. | 2021-11-25 |
Semiconductor Structure
App 20210366805 - WU; CHI-HSI ; et al. | 2021-11-25 |
Semiconductor device and method of manufacture
Grant 11,183,399 - Wei , et al. November 23, 2 | 2021-11-23 |
Semiconductor structure
Grant 11,177,238 - Yu , et al. November 16, 2 | 2021-11-16 |
Package structure with a heat dissipating element and method of manufacturing the same
Grant 11,164,855 - Chen , et al. November 2, 2 | 2021-11-02 |
Semiconductor Device And Method
App 20210335701 - Lin; Jing-Cheng ; et al. | 2021-10-28 |
Photonic semiconductor device and method
Grant 11,156,772 - Yu , et al. October 26, 2 | 2021-10-26 |
Redistribution layers in semiconductor packages and methods of forming same
Grant 11,158,619 - Huang , et al. October 26, 2 | 2021-10-26 |
Package Structures and Methods of Forming the Same
App 20210327778 - Yu; Chen-Hua ; et al. | 2021-10-21 |
Integrated Circuit Package And Method Of Forming Same
App 20210320097 - Hou; Shang-Yun ; et al. | 2021-10-14 |
Method Of Fabricating A Finfet Device
App 20210305102 - YIN; Joanna Chaw Yane ; et al. | 2021-09-30 |
Package with bridge die for interconnection and method forming same
Grant 11,133,258 - Yu , et al. September 28, 2 | 2021-09-28 |
Package with embedded heat dissipation features
Grant 11,133,237 - Hung , et al. September 28, 2 | 2021-09-28 |
3DIC Packaging with Hot Spot Thermal Management Features
App 20210287956 - Hung; Wensen ; et al. | 2021-09-16 |
Method of forming a dummy die of an integrated circuit having an embedded annular structure
Grant 11,101,260 - Hou , et al. August 24, 2 | 2021-08-24 |
Semiconductor device and method of manufacture
Grant 11,101,140 - Wei , et al. August 24, 2 | 2021-08-24 |
Semiconductor structure
Grant 11,088,048 - Wu , et al. August 10, 2 | 2021-08-10 |
Integrated Circuit Package And Method
App 20210225666 - Lin; Shih Ting ; et al. | 2021-07-22 |
Method for forming package structure
Grant 11,069,625 - Hsieh , et al. July 20, 2 | 2021-07-20 |
Semiconductor device
Grant 11,062,987 - Lin , et al. July 13, 2 | 2021-07-13 |
Fan-Out Structure and Method of Fabricating the Same
App 20210193485 - Yu; Chen-Hua ; et al. | 2021-06-24 |
Redistribution Layers in Semiconductor Packages and Methods of Forming Same
App 20210193618 - Hsieh; Cheng-Hsien ; et al. | 2021-06-24 |
Opening in the Pad for Bonding Integrated Passive Device in InFO Package
App 20210185810 - Hsieh; Cheng-Hsien ; et al. | 2021-06-17 |
3DIC packaging with hot spot thermal management features
Grant 11,037,852 - Hung , et al. June 15, 2 | 2021-06-15 |
Underfill control structures and method
Grant 11,018,069 - Chen , et al. May 25, 2 | 2021-05-25 |
Dummy features in redistribution layers (RDLS) and methods of forming same
Grant 11,018,088 - Hsieh , et al. May 25, 2 | 2021-05-25 |
Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices
Grant 11,004,771 - Hsieh , et al. May 11, 2 | 2021-05-11 |
Optical Transceiver and Manufacturing Method Thereof
App 20210132310 - Yu; Chen-Hua ; et al. | 2021-05-06 |
FinFET device
Grant 10,978,352 - Yin , et al. April 13, 2 | 2021-04-13 |
Package Structure And Method Of Fabricating The Same
App 20210098382 - Lin; Shih-Ting ; et al. | 2021-04-01 |
Interconnect Chips
App 20210098408 - Ting; Kuo-Chiang ; et al. | 2021-04-01 |
Photonic Semiconductor Device And Method Of Manufacture
App 20210088723 - Yu; Chen-Hua ; et al. | 2021-03-25 |
Package Structure And Method Of Manufacturing The Same
App 20210082894 - Chen; Weiming Chris ; et al. | 2021-03-18 |
Redistribution layers in semiconductor packages and methods of forming same
Grant 10,950,577 - Hsieh , et al. March 16, 2 | 2021-03-16 |
Package structure and method of forming the same
Grant 10,950,575 - Yu , et al. March 16, 2 | 2021-03-16 |
Fan-out structure and method of fabricating the same
Grant 10,943,798 - Yu , et al. March 9, 2 | 2021-03-09 |
Opening in the pad for bonding integrated passive device in InFO package
Grant 10,939,551 - Hsieh , et al. March 2, 2 | 2021-03-02 |
Semiconductor Device And Method Of Manufacture
App 20210050305 - Wu; Chi-Hsi ; et al. | 2021-02-18 |
Devices Employing Thermal And Mechanical Enhanced Layers And Methods Of Forming Same
App 20210035953 - Yu; Chen-Hua ; et al. | 2021-02-04 |
Integrated Circuit Package Pad and Methods of Forming
App 20210035819 - Chen; Hsien-Wei ; et al. | 2021-02-04 |
Package with Bridge Die For Interconnection and Method Forming Same
App 20210020574 - Yu; Chen-Hua ; et al. | 2021-01-21 |
Photonic Semiconductor Device and Method
App 20210018678 - Yu; Chen-Hua ; et al. | 2021-01-21 |
Multi-Stacked Package-on-Package Structures
App 20210005556 - Yu; Chen-Hua ; et al. | 2021-01-07 |
Package Structures and Methods of Forming the Same
App 20200402877 - Yu; Chen-Hua ; et al. | 2020-12-24 |
Interconnect chips
Grant 10,867,954 - Ting , et al. December 15, 2 | 2020-12-15 |
Package structures and methods of forming the same
Grant 10,867,965 - Shih , et al. December 15, 2 | 2020-12-15 |
Optical transceiver and manufacturing method thereof
Grant 10,866,373 - Yu , et al. December 15, 2 | 2020-12-15 |
Highly strained source/drain trenches in semiconductor devices
Grant 10,868,166 - Kao , et al. December 15, 2 | 2020-12-15 |
Dummy metal with zigzagged edges
Grant 10,867,900 - Hsieh , et al. December 15, 2 | 2020-12-15 |
Semiconductor Package and Method of Forming the Same
App 20200373266 - Wu; Chi-Hsi ; et al. | 2020-11-26 |
Semiconductor device with electromagnetic interference protection and method of manufacture
Grant 10,825,780 - Wu , et al. November 3, 2 | 2020-11-03 |
Semiconductor Package and Method of Forming the Same
App 20200343193 - Hsieh; Cheng-Hsien ; et al. | 2020-10-29 |
Devices employing thermal and mechanical enhanced layers and methods of forming same
Grant 10,811,394 - Yu , et al. October 20, 2 | 2020-10-20 |
Integrated circuit package pad and methods of forming
Grant 10,796,927 - Chen , et al. October 6, 2 | 2020-10-06 |
Multi-stacked package-on-package structures
Grant 10,784,207 - Yu , et al. Sept | 2020-09-22 |
Package structures and methods of forming the same
Grant 10,770,365 - Yu , et al. Sep | 2020-09-08 |
Photonic semiconductor device and method
Grant 10,746,923 - Yu , et al. A | 2020-08-18 |
Fan-Out Structure and Method of Fabricating the Same
App 20200258760 - A1 | 2020-08-13 |
Semiconductor package and method of forming the same
Grant 10,741,512 - Wu , et al. A | 2020-08-11 |
Raised Via for Terminal Connections on Different Planes
App 20200251380 - Kind Code | 2020-08-06 |
Package With Embedded Heat Dissipation Features
App 20200251398 - Kind Code | 2020-08-06 |
Package Structure And Manufacturing Method Thereof
App 20200251456 - Kind Code | 2020-08-06 |
Via for Semiconductor Device Connection and Methods of Forming the Same
App 20200243442 - Yu; Chen-Hua ; et al. | 2020-07-30 |
Semiconductor Device and Method
App 20200243435 - Lin; Jing-Cheng ; et al. | 2020-07-30 |
Interconnect chips
Grant 10,720,401 - Ting , et al. | 2020-07-21 |
Semiconductor package and method of forming the same
Grant 10,714,426 - Hsieh , et al. | 2020-07-14 |
Surface mount device/integrated passive device on package or device structure and methods of forming
Grant 10,700,045 - Hsieh , et al. | 2020-06-30 |
Chip-on-substrate packaging on carrier
Grant 10,679,951 - Yu , et al. | 2020-06-09 |
Redistribution Layers in Semiconductor Packages and Methods of Forming Same
App 20200176432 - Huang; Li-Hsien ; et al. | 2020-06-04 |
Finfet Device
App 20200144130 - YIN; Joanna Chaw Yane ; et al. | 2020-05-07 |
Fan-out structure and method of fabricating the same
Grant 10,643,864 - Yu , et al. | 2020-05-05 |
Structure and method of forming a joint assembly
Grant 10,643,965 - Chen , et al. | 2020-05-05 |
Semiconductor Structure
App 20200135610 - WU; CHI-HSI ; et al. | 2020-04-30 |
Package structure and manufacturing method thereof
Grant 10,636,775 - Chen , et al. | 2020-04-28 |
Semiconductor Device And Method For Manufacturing The Same
App 20200126900 - TING; KUO-CHIANG ; et al. | 2020-04-23 |
Conductive vias in semiconductor packages and methods of forming same
Grant 10,629,537 - Hsieh , et al. | 2020-04-21 |
Package with embedded heat dissipation features
Grant 10,629,510 - Hung , et al. | 2020-04-21 |
Raised via for terminal connections on different planes
Grant 10,629,477 - Yu , et al. | 2020-04-21 |
Semiconductor Device
App 20200118979 - Chen; Weiming Chris ; et al. | 2020-04-16 |
Semiconductor Structure
App 20200118974 - YU; CHEN-HUA ; et al. | 2020-04-16 |
Via for semiconductor device connection and methods of forming the same
Grant 10,622,302 - Yu , et al. | 2020-04-14 |
Semiconductor device and method
Grant 10,622,297 - Lin , et al. | 2020-04-14 |
Semiconductor Package and Method of Forming the Same
App 20200083187 - Wu; Chi-Hsi ; et al. | 2020-03-12 |
Integrated Circuit Package Pad and Methods of Forming
App 20200083061 - Chen; Hsien-Wei ; et al. | 2020-03-12 |
Dummy Metal with Zigzagged Edges
App 20200083156 - Hsieh; Cheng-Hsien ; et al. | 2020-03-12 |
Surface Mount Device/Integrated Passive Device on Package or Device Structure and Methods of Forming
App 20200075563 - Hsieh; Cheng-Hsien ; et al. | 2020-03-05 |
Multi-Stacked Package-on-Package Structures
App 20200066643 - Yu; Chen-Hua ; et al. | 2020-02-27 |
Redistribution Layers in Semiconductor Packages and Methods of Forming Same
App 20200058616 - Hsieh; Cheng-Hsien ; et al. | 2020-02-20 |
Method of fabricating a FinFET device
Grant 10,546,786 - Yin , et al. Ja | 2020-01-28 |
Semiconductor Device and Method of Manufacture
App 20200027750 - Wei; Wen-Hsin ; et al. | 2020-01-23 |
3DIC Packaging with Hot Spot Thermal Management Features
App 20200027809 - Hung; Wensen ; et al. | 2020-01-23 |
Interconnect Chips
App 20200027851 - Ting; Kuo-Chiang ; et al. | 2020-01-23 |
Package structure and method of forming the same
Grant 10,541,226 - Yu , et al. Ja | 2020-01-21 |
Package structures and methods of forming the same
Grant 10,529,690 - Shih , et al. J | 2020-01-07 |
Structure and Method of Forming a Joint Assembly
App 20200006276 - Chen; Ying-Ju ; et al. | 2020-01-02 |
Optical Transceiver and Manufacturing Method Thereof
App 20200003975 - Yu; Chen-Hua ; et al. | 2020-01-02 |
Photonic Semiconductor Device And Method
App 20200003950 - Yu; Chen-Hua ; et al. | 2020-01-02 |
Underfill Control Structures and Method
App 20200006179 - Chen; Ying-Ju ; et al. | 2020-01-02 |
Semiconductor package and method of forming the same
Grant 10,522,490 - Wu , et al. Dec | 2019-12-31 |
Semiconductor structure and manufacturing method thereof
Grant 10,515,867 - Wu , et al. Dec | 2019-12-24 |
Semiconductor device and method for manufacturing the same
Grant 10,515,888 - Ting , et al. Dec | 2019-12-24 |
Underfill control structures and method
Grant 10,515,865 - Chen , et al. Dec | 2019-12-24 |
Semiconductor device and method for manufacturing the same
Grant 10,510,722 - Chen , et al. Dec | 2019-12-17 |
Integrated circuit package pad and methods of forming
Grant 10,510,556 - Chen , et al. Dec | 2019-12-17 |
Dummy metal with zigzagged edges
Grant 10,510,654 - Hsieh , et al. Dec | 2019-12-17 |
Semiconductor structure and manufacturing method thereof
Grant 10,510,715 - Yu , et al. Dec | 2019-12-17 |
Surface mount device/integrated passive device on package or device structure and methods of forming
Grant 10,504,877 - Hsieh , et al. Dec | 2019-12-10 |
Redistribution layers in semiconductor packages and methods of forming same
Grant 10,475,768 - Hsieh , et al. Nov | 2019-11-12 |
Via For Component Electrode Connection
App 20190341306 - Yu; Chen-Hua ; et al. | 2019-11-07 |
3DIC packaging with hot spot thermal management features
Grant 10,461,009 - Hung , et al. Oc | 2019-10-29 |
Multi-stacked package-on-package structures
Grant 10,461,036 - Yu , et al. Oc | 2019-10-29 |
Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same
App 20190326259 - Yu; Chen-Hua ; et al. | 2019-10-24 |
Dummy Features in Redistribution Layers (RDLS) and Methods of Forming Same
App 20190295955 - Hsieh; Cheng-Hsien ; et al. | 2019-09-26 |
Raised Via for Terminal Connections on Different Planes
App 20190273018 - Yu; Chen-Hua ; et al. | 2019-09-05 |
Fan-Out Structure and Method of Fabricating the Same
App 20190273001 - Yu; Chen-Hua ; et al. | 2019-09-05 |
Integrated Circuit Package Pad and Methods of Forming
App 20190259630 - Chen; Hsien-Wei ; et al. | 2019-08-22 |
Via for Semiconductor Device Connection and Methods of Forming the Same
App 20190252312 - Yu; Chen-Hua ; et al. | 2019-08-15 |
Cooling Devices, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices
App 20190252294 - Hsieh; Cheng-Chieh ; et al. | 2019-08-15 |
Integrated Circuit Package And Method Of Forming Same
App 20190237454 - Hou; Shang-Yun ; et al. | 2019-08-01 |
Devices employing thermal and mechanical enhanced layers and methods of forming same
Grant 10,347,606 - Yu , et al. July 9, 2 | 2019-07-09 |
Chip package having die structures of different heights
Grant 10,319,699 - Wei , et al. | 2019-06-11 |
Multi-stacked package-on-package structures
Grant 10,319,683 - Yu , et al. | 2019-06-11 |
Dummy features in redistribution layers (RDLS) and methods of forming same
Grant 10,319,681 - Hsieh , et al. | 2019-06-11 |
Packaging with substrates connected by conductive bumps
Grant 10,304,800 - Chen , et al. | 2019-05-28 |
Redistribution layers in semiconductor packages and methods of forming same
Grant 10,304,801 - Huang , et al. | 2019-05-28 |
Raised via for terminal connections on different planes
Grant 10,297,494 - Yu , et al. | 2019-05-21 |
Fan-out structure and method of fabricating the same
Grant 10,297,471 - Yu , et al. | 2019-05-21 |
Semiconductor Device and Method of Manufacture
App 20190148166 - Wei; Wen-Hsin ; et al. | 2019-05-16 |
Interconnect Chips
App 20190148329 - Ting; Kuo-Chiang ; et al. | 2019-05-16 |
Semiconductor Structure And Manufacturing Method Thereof
App 20190148261 - WU; CHI-HSI ; et al. | 2019-05-16 |
Conductive vias in semiconductor packages and methods of forming same
Grant 10,290,584 - Hsieh , et al. | 2019-05-14 |
Integrated circuit package pad and methods of forming
Grant 10,283,375 - Chen , et al. | 2019-05-07 |
Package Structure And Manufacturing Method Thereof
App 20190131283 - Chen; Wei-Yu ; et al. | 2019-05-02 |
Method For Forming Package Structure
App 20190131249 - HSIEH; Cheng-Hsien ; et al. | 2019-05-02 |
Dummy Metal with Zigzagged Edges
App 20190122975 - Hsieh; Cheng-Hsien ; et al. | 2019-04-25 |
Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices
Grant 10,269,682 - Hsieh , et al. | 2019-04-23 |
Chip-on-Substrate Packaging on Carrier
App 20190115307 - Yu; Chen-Hua ; et al. | 2019-04-18 |
Multi-Stacked Package-on-Package Structures
App 20190115300 - Yu; Chen-Hua ; et al. | 2019-04-18 |
Conductive Vias in Semiconductor Packages and Methods of Forming Same
App 20190115299 - Hsieh; Cheng-Hsien ; et al. | 2019-04-18 |
Package Structures and Methods of Forming the Same
App 20190115272 - Yu; Chen-Hua ; et al. | 2019-04-18 |
Package Structures and Methods of Forming the Same
App 20190109119 - Shih; Ying-Ching ; et al. | 2019-04-11 |
3DIC Packaging with Hot Spot Thermal Management Features
App 20190096781 - Hung; Wensen ; et al. | 2019-03-28 |
Semiconductor Device and Method
App 20190096796 - Lin; Jing-Cheng ; et al. | 2019-03-28 |
Surface Mount Device/integrated Passive Device On Package Or Device Structure And Methods Of Forming
App 20190096860 - Hsieh; Cheng-Hsien ; et al. | 2019-03-28 |
Opening in the Pad for Bonding Integrated Passive Device in InFO Package
App 20190098756 - Hsieh; Cheng-Hsien ; et al. | 2019-03-28 |
Semiconductor Device And Method For Manufacturing The Same
App 20190088582 - TING; KUO-CHIANG ; et al. | 2019-03-21 |
Method Of Fabricating A Finfet Device
App 20190057908 - YIN; Joanna Chaw Yane ; et al. | 2019-02-21 |
Semicondcutor Package, Package On Package Structure And Method Of Froming Package On Package Structure
App 20190035772 - Huang; Li-Hsien ; et al. | 2019-01-31 |
COWOS structures and method of forming the same
Grant 10,170,457 - Chen , et al. J | 2019-01-01 |
Semiconductor Structure And Manufacturing Method Thereof
App 20180374821 - CHEN; WEIMING CHRIS ; et al. | 2018-12-27 |
Chip-on-substrate packaging on carrier
Grant 10,163,822 - Yu , et al. Dec | 2018-12-25 |
Package structure and method for forming the same
Grant 10,163,805 - Hsieh , et al. Dec | 2018-12-25 |
Opening in the pad for bonding integrated passive device in InFO package
Grant 10,165,682 - Hsieh , et al. Dec | 2018-12-25 |
Formation method of chip package
Grant 10,163,853 - Wei , et al. Dec | 2018-12-25 |
Semiconductor Device And Method For Manufacturing The Same
App 20180366440 - CHEN; WEIMING CHRIS ; et al. | 2018-12-20 |
Semiconductor Package and Method of Forming the Same
App 20180366412 - Hsieh; Cheng-Hsien ; et al. | 2018-12-20 |
Dummy metal with zigzagged edges
Grant 10,157,825 - Hsieh , et al. Dec | 2018-12-18 |
Multi-stacked package-on-package structures
Grant 10,157,852 - Yu , et al. Dec | 2018-12-18 |
3DIC packaging with hot spot thermal management features
Grant 10,157,813 - Hung , et al. Dec | 2018-12-18 |
Package structures and methods of forming the same
Grant 10,153,222 - Yu , et al. Dec | 2018-12-11 |
Conductive Vias In Semiconductor Packages And Methods Of Forming Same
App 20180350745 - Hsieh; Cheng-Hsien ; et al. | 2018-12-06 |
Semiconductor Package and Method of Forming the Same
App 20180342474 - Wu; Chi-Hsi ; et al. | 2018-11-29 |
Semiconductor device and method
Grant 10,141,253 - Lin , et al. Nov | 2018-11-27 |
Surface mount device/integrated passive device on package or device structure and methods of forming
Grant 10,141,288 - Hsieh , et al. Nov | 2018-11-27 |
Package Structure and Method of Forming the Same
App 20180331069 - Yu; Chen-Hua ; et al. | 2018-11-15 |
Multi-Stacked Package-on-Package Structures
App 20180323150 - Yu; Chen-Hua ; et al. | 2018-11-08 |
Dummy Features in Redistribution Layers (RDLS) and Methods of Forming Same
App 20180294228 - Hsieh; Cheng-Hsien ; et al. | 2018-10-11 |
Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same
App 20180277520 - Yu; Chen-Hua ; et al. | 2018-09-27 |
Package with Embedded Heat Dissipation Features
App 20180269127 - Hung; Wensen ; et al. | 2018-09-20 |
FinFET device
Grant 10,062,614 - Yin , et al. August 28, 2 | 2018-08-28 |
Semiconductor package and method of forming the same
Grant 10,062,648 - Hsieh , et al. August 28, 2 | 2018-08-28 |
Semiconductor device packages, packaging methods, and packaged semiconductor devices
Grant 10,049,898 - Chen , et al. August 14, 2 | 2018-08-14 |
Multi-Stacked Package-on-Package Structures
App 20180226349 - Yu; Chen-Hua ; et al. | 2018-08-09 |
Raised Via for Terminal Connections on Different Planes
App 20180211912 - Yu; Chen-Hua ; et al. | 2018-07-26 |
Chip-on-Substrate Packaging on Carrier
App 20180204810 - Yu; Chen-Hua ; et al. | 2018-07-19 |
Semiconductor package and method of forming the same
Grant 10,026,704 - Wu , et al. July 17, 2 | 2018-07-17 |
CoWoS Structures and Method of Forming the Same
App 20180190638 - Chen; Wei-Ming ; et al. | 2018-07-05 |
Fan-out Structure And Method Of Fabricating The Same
App 20180174865 - Yu; Chen-Hua ; et al. | 2018-06-21 |
FinFET with high mobility and strain channel
Grant 9,997,629 - Li , et al. June 12, 2 | 2018-06-12 |
Dummy features in redistribution layers (RDLS) and methods of forming same
Grant 9,997,464 - Hsieh , et al. June 12, 2 | 2018-06-12 |
Semiconductor Device And Method Of Manufacture
App 20180151510 - Wu; Chi-Hsi ; et al. | 2018-05-31 |
Semiconductor devices, multi-die packages, and methods of manufacure thereof
Grant 9,984,969 - Yu , et al. May 29, 2 | 2018-05-29 |
Devices employing thermal and mechanical enhanced layers and methods of forming same
Grant 9,984,998 - Yu , et al. May 29, 2 | 2018-05-29 |
Package with embedded heat dissipation features
Grant 9,978,660 - Hung , et al. May 22, 2 | 2018-05-22 |
Package Structures And Methods Of Forming The Same
App 20180138101 - Yu; Chen-Hua ; et al. | 2018-05-17 |
Package Structures And Methods Of Forming The Same
App 20180138151 - Shih; Ying-Ching ; et al. | 2018-05-17 |
Semiconductor Device and Method
App 20180138116 - Lin; Jing-Cheng ; et al. | 2018-05-17 |
Redistribution Layers in Semiconductor Packages and Methods of Forming Same
App 20180122774 - Huang; Li-Hsien ; et al. | 2018-05-03 |
Underfill Control Structures and Method
App 20180102299 - Chen; Ying-Ju ; et al. | 2018-04-12 |
Semiconductor Package and Method of Forming the Same
App 20180082964 - Wu; Chi-Hsi ; et al. | 2018-03-22 |
Chip-on-substrate packaging on carrier
Grant 9,922,943 - Yu , et al. March 20, 2 | 2018-03-20 |
Redistribution Layers in Semiconductor Packages and Methods of Forming Same
App 20180076175 - Hsieh; Cheng-Hsien ; et al. | 2018-03-15 |
Semiconductor devices, method for fabricating integrated fan-out packages, and method for fabricating semiconductor devices
Grant 9,911,672 - Wu , et al. March 6, 2 | 2018-03-06 |
Integrated Circuit Package Pad and Methods of Forming
App 20180061668 - Chen; Hsien-Wei ; et al. | 2018-03-01 |
Formation Method Of Chip Package
App 20180047703 - WEI; Wen-Hsin ; et al. | 2018-02-15 |
Chip Package Having Die Structures of Different Heights and Method of Forming Same
App 20180040586 - Wei; Wen-Hsin ; et al. | 2018-02-08 |
Package Structure And Method Of Forming The Same
App 20180033771 - Yu; Chen-Hua ; et al. | 2018-02-01 |
Finfet Device
App 20180012809 - Yin; Joanna Chaw Yane ; et al. | 2018-01-11 |
Package Structure And Method For Forming The Same
App 20180005955 - HSIEH; Cheng-Hsien ; et al. | 2018-01-04 |
Underfill control structures and method
Grant 9,842,788 - Chen , et al. December 12, 2 | 2017-12-12 |
Integrated Fan-out Package And Method Of Fabricating The Same
App 20170345741 - Wu; Chi-Hsi ; et al. | 2017-11-30 |
Structure and Method of Forming a Joint Assembly
App 20170345786 - Chen; Ying-Ju ; et al. | 2017-11-30 |
3DIC Packaging with Hot Spot Thermal Management Features
App 20170345732 - Hung; Wensen ; et al. | 2017-11-30 |
Structure and formation method for chip package
Grant 9,818,720 - Wei , et al. November 14, 2 | 2017-11-14 |
Integrated circuit package pad and methods of forming
Grant 9,812,337 - Chen , et al. November 7, 2 | 2017-11-07 |
Integrated fan-out package and method of fabricating the same
Grant 9,812,381 - Wu , et al. November 7, 2 | 2017-11-07 |
Dummy Features In Redistribution Layers (rdls) And Methods Of Forming Same
App 20170317029 - Hsieh; Cheng-Hsien ; et al. | 2017-11-02 |
FinFET device
Grant 9,805,984 - Yin , et al. October 31, 2 | 2017-10-31 |
Chip package having die structures of different heights and method of forming same
Grant 9,806,058 - Wei , et al. October 31, 2 | 2017-10-31 |
Semiconductor package and method of forming the same
Grant 9,768,133 - Wu , et al. September 19, 2 | 2017-09-19 |
Semiconductor Devices, Multi-Die Packages, and Methods of Manufacture Thereof
App 20170256487 - Yu; Chen-Hua ; et al. | 2017-09-07 |
Semiconductor Package And Method Of Forming The Same
App 20170250138 - Hsieh; Cheng-Hsien ; et al. | 2017-08-31 |
Redistribution layers in semiconductor packages and methods of forming same
Grant 9,741,690 - Hsieh , et al. August 22, 2 | 2017-08-22 |
3DIC packaging with hot spot thermal management features
Grant 9,735,082 - Hung , et al. August 15, 2 | 2017-08-15 |
Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same
App 20170194292 - Yu; Chen-Hua ; et al. | 2017-07-06 |
Underfill Control Structures and Method
App 20170194226 - Chen; Ying-Ju ; et al. | 2017-07-06 |
Opening in the Pad for Bonding Integrated Passive Device in InFO Package
App 20170188458 - Hsieh; Cheng-Hsien ; et al. | 2017-06-29 |
Semiconductor Structure And Manufacturing Method Thereof
App 20170170145 - YU; CHEN-HUA ; et al. | 2017-06-15 |
Semiconductor Device Packages, Packaging Methods, and Packaged Semiconductor Devices
App 20170154794 - Chen; Hsien-Wei ; et al. | 2017-06-01 |
Semiconductor devices, multi-die packages, and methods of manufacture thereof
Grant 9,659,863 - Yu , et al. May 23, 2 | 2017-05-23 |
Method of making a FinFET device
Grant 9,659,810 - Yin , et al. May 23, 2 | 2017-05-23 |
Integrated circuit package with probe pad structure
Grant 9,653,427 - Wu , et al. May 16, 2 | 2017-05-16 |
Cooling Devices, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices
App 20170103937 - Hsieh; Cheng-Chieh ; et al. | 2017-04-13 |
Finfet Device
App 20170098582 - Yin; Joanna Chaw Yane ; et al. | 2017-04-06 |
Chip-on-Substrate Packaging on Carrier
App 20170098617 - Yu; Chen-Hua ; et al. | 2017-04-06 |
Dummy Metal with Zigzagged Edges
App 20170084529 - Hsieh; Cheng-Hsien ; et al. | 2017-03-23 |
Packages with thermal interface material on the sidewalls of stacked dies
Grant 9,583,415 - Yu , et al. February 28, 2 | 2017-02-28 |
Smd/ipd On Package Or Device Structure And Methods Of Forming
App 20170033090 - Hsieh; Cheng-Hsien ; et al. | 2017-02-02 |
Semiconductor device packages, packaging methods, and packaged semiconductor devices
Grant 9,558,966 - Chen , et al. January 31, 2 | 2017-01-31 |
Structure And Formation Method For Chip Package
App 20170005072 - WEI; Wen-Hsin ; et al. | 2017-01-05 |
Structure And Formation Method For Chip Package
App 20170005071 - WEI; Wen-Hsin ; et al. | 2017-01-05 |
Chip-on-substrate packaging on carrier
Grant 9,524,942 - Yu , et al. December 20, 2 | 2016-12-20 |
Dummy metal with zigzagged edges
Grant 9,502,343 - Hsieh , et al. November 22, 2 | 2016-11-22 |
FinFET with High Mobility and Strain Channel
App 20160293762 - Li; Hou-Ju ; et al. | 2016-10-06 |
Integrated Circuit Package and Methods of Forming Same
App 20160172333 - Wu; Chi-Hsi ; et al. | 2016-06-16 |
FinFET with high mobility and strain channel
Grant 9,368,628 - Li , et al. June 14, 2 | 2016-06-14 |
Integrated Circuit Package Pad And Methods Of Forming
App 20160163566 - Chen; Hsien-Wei ; et al. | 2016-06-09 |
Semiconductor Devices, Multi-Die Packages, and Methods of Manufacture Thereof
App 20160155730 - Yu; Chen-Hua ; et al. | 2016-06-02 |
Methods of forming integrated circuit package
Grant 9,281,254 - Yu , et al. March 8, 2 | 2016-03-08 |
Semiconductor Device Packages, Packaging Methods, and Packaged Semiconductor Devices
App 20160013138 - Chen; Hsien-Wei ; et al. | 2016-01-14 |
Package with Embedded Heat Dissipation Features
App 20150262904 - Hung; Wensen ; et al. | 2015-09-17 |
Integrated Circuit Package and Methods of Forming Same
App 20150228550 - Yu; Chen-Hua ; et al. | 2015-08-13 |
Chip-on-Substrate Packaging on Carrier
App 20150171034 - Yu; Chen-Hua ; et al. | 2015-06-18 |
3DIC Packaging with Hot Spot Thermal Management Features
App 20150155218 - Hung; Wensen ; et al. | 2015-06-04 |
Packages with Thermal Interface Material on the Sidewalls of Stacked Dies
App 20150108628 - Yu; Chen-Hua ; et al. | 2015-04-23 |
Method of Making a FinFET Device
App 20140291770 - Yin; Joanna Chaw Yane ; et al. | 2014-10-02 |
FinFET with high mobility and strain channel
Grant 8,729,634 - Shen , et al. May 20, 2 | 2014-05-20 |
Method of making a FinFET device
Grant 8,697,515 - Yin , et al. April 15, 2 | 2014-04-15 |
Dual damascene copper process using a selected mask
Grant 8,685,853 - Tseng , et al. April 1, 2 | 2014-04-01 |
FinFET with High Mobility and Strain Channel
App 20140008736 - Li; Hou-Ju ; et al. | 2014-01-09 |
FinFET with High Mobility and Strain Channel
App 20130334606 - Shen; Chun-Liang ; et al. | 2013-12-19 |
Method Of Making A Finfet Device
App 20130330889 - Yin; Joanna ChawYane ; et al. | 2013-12-12 |
Device With Self Aligned Stressor And Method Of Making Same
App 20130161650 - LAI; Kao-Ting ; et al. | 2013-06-27 |
Device with self aligned stressor and method of making same
Grant 8,404,538 - Lai , et al. March 26, 2 | 2013-03-26 |
Dual Damascene Copper Process Using a Selected Mask
App 20120108054 - Tseng; Fan Chung ; et al. | 2012-05-03 |
Highly Strained Source/drain Trenches In Semiconductor Devices
App 20120018786 - KAO; Ta-Wei ; et al. | 2012-01-26 |
Method for forming highly strained source/drain trenches
Grant 8,071,481 - Kao , et al. December 6, 2 | 2011-12-06 |
Dual damascence copper process using a selected mask
Grant 7,989,341 - Tseng , et al. August 2, 2 | 2011-08-02 |
Device With Self Aligned Stressor And Method Of Making Same
App 20110079820 - Lai; Kao-Ting ; et al. | 2011-04-07 |
Method For Forming Highly Strained Source/drain Trenches
App 20100270598 - KAO; Ta-Wei ; et al. | 2010-10-28 |
Metal salicide formation having nitride liner to reduce silicide stringer and encroachment
Grant 7,732,298 - Lee , et al. June 8, 2 | 2010-06-08 |
Vertical MIM capacitors and method of fabricating the same
Grant 7,416,953 - Lee , et al. August 26, 2 | 2008-08-26 |
Metal salicide formation having nitride liner to reduce silicide stringer and encroachment
App 20080179689 - Lee; Tan-Chen ; et al. | 2008-07-31 |
Dual Damascene Copper Process Using a Selected Mask
App 20080020565 - Tseng; Fan Chung ; et al. | 2008-01-24 |
Vertical MIM capacitors and method of fabricating the same
App 20070099390 - Lee; Charles ; et al. | 2007-05-03 |
Metal fuse for semiconductor devices
Grant 7,205,588 - Jeng , et al. April 17, 2 | 2007-04-17 |
Electrical fuse for silicon-on-insulator devices
App 20060208274 - Wu; Chi-Hsi | 2006-09-21 |
Method of fabricating an electrical fuse for silicon-on-insulator devices
Grant 7,067,359 - Wu June 27, 2 | 2006-06-27 |
Electrical fuse for silicon-on-insulator devices
App 20050214982 - Wu, Chi-Hsi | 2005-09-29 |
Metal fuse for semiconductor devices
App 20040219720 - Jeng, Shin-Puu ; et al. | 2004-11-04 |
Metal fuse for semiconductor devices
Grant 6,753,210 - Jeng , et al. June 22, 2 | 2004-06-22 |
Metal-insulator-metal device structure inserted into a low k material and the method for making same
Grant 6,713,840 - Lee , et al. March 30, 2 | 2004-03-30 |
Metal fuse for semiconductor devices
App 20040053487 - Jeng, Shin-Puu ; et al. | 2004-03-18 |
Method of forming T-shaped gate
Grant 6,239,007 - Wu May 29, 2 | 2001-05-29 |
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