Wright; Steven L.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wright; Steven L..The latest application filed is for "fluid delivery device with hydrophobic surface".

Company Profile

3.35.28

Wright; Steven L. - Cortland Manor NY
Wright; Steven L. - Cortlandt Manor NY
Wright; Steven L - Cortlandt Manor NY
Wright; Steven L. - N/A
Wright; Steven L. - US
Wright; Steven L. - Urbandale IA
Wright; Steven L. - West Des Moines IA
Wright; Steven L. - Johnston IA
Wright; Steven L. - Peekskill NY
Wright; Steven L. - Yorktown Heights NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Microchip substance delivery devices Grant 11,000,474 - Chey , et al. May 11, 2	2021-05-11
Drug delivery device having a cavity sealed by a pressurized membrane Grant 10,940,265 - Dang , et al. March 9, 2	2021-03-09
Delivery device including reactive material for programmable discrete delivery of a substance Grant 10,881,788 - Dang , et al. January 5, 2	2021-01-05
Transdermal sensing probes and smart patch systems using same Grant 10,638,945 - Dang , et al.	2020-05-05
Integrated self-coining probe Grant 10,585,119 - Liu , et al.	2020-03-10
Fluid Delivery Device With Hydrophobic Surface App 20200032925 - LIU; YANG ; et al.	2020-01-30
Fluid delivery device with hydrophobic surface Grant 10,508,755 - Liu , et al. Dec	2019-12-17
Drug Delivery Device Having A Cavity Sealed By A Pressurized Membrane App 20190290840 - DANG; BING ; et al.	2019-09-26
Test probe head for full wafer testing Grant 10,330,701 - Dang , et al.	2019-06-25
Drug delivery device having a cavity sealed by a pressurized membrane Grant 10,314,970 - Dang , et al.	2019-06-11
Fluid Delivery Device With Hydrophobic Surface App 20190024823 - LIU; YANG ; et al.	2019-01-24
Integrated Self-coining Probe App 20180252747 - Liu; Yang ; et al.	2018-09-06
Integrated self-coining probe Grant 10,001,508 - Liu , et al. June 19, 2	2018-06-19
Microchip Substance Delivery Devices Having Low-power Electromechanical Release Mechanisms App 20180133152 - Chey; S. Jay ; et al.	2018-05-17
Drug Delivery Device Having A Cavity Sealed By A Pressurized Membrane App 20180117245 - DANG; BING ; et al.	2018-05-03
Microchip substance delivery devices having low-power electromechanical release mechanisms Grant 9,937,124 - Chey , et al. April 10, 2	2018-04-10
Drug delivery device having a cavity sealed by a pressurized membrane Grant 9,867,932 - Dang , et al. January 16, 2	2018-01-16
Planarity-tolerant reworkable interconnect with integrated testing Grant 9,865,569 - Dang , et al. January 9, 2	2018-01-09
Integrated Self-coining Probe App 20170363659 - Liu; Yang ; et al.	2017-12-21
Transdermal Sensing Probes And Smart Patch Systems Using Same App 20170172445 - Dang; Bing ; et al.	2017-06-22
Transdermal Sensing Probes And Smart Patch Systems Using Same App 20170175280 - Dang; Bing ; et al.	2017-06-22
Delivery Device Including Reactive Material For Programmable Discrete Delivery Of A Substance App 20170119960 - DANG; BING ; et al.	2017-05-04
Drug Delivery Device Having A Cavity Sealed By A Pressurized Membrane App 20170119964 - DANG; BING ; et al.	2017-05-04
Planarity-tolerant Reworkable Interconnect With Integrated Testing App 20160240513 - Dang; Bing ; et al.	2016-08-18
Planarity-tolerant reworkable interconnect with integrated testing Grant 9,391,040 - Dang , et al. July 12, 2	2016-07-12
Planarity-tolerant Reworkable Interconnect With Integrated Testing App 20160111387 - Dang; Bing ; et al.	2016-04-21
Test Probe Head For Full Wafer Testing App 20160084882 - Dang; Bing ; et al.	2016-03-24
Microchip Substance Delivery Devices Having Low-power Electromechanical Release Mechanisms App 20160074323 - Chey; S. Jay ; et al.	2016-03-17
Transferable probe tips Grant 9,200,883 - Andry , et al. December 1, 2	2015-12-01
Automatic detection of object pixels for hyperspectral analysis Grant 8,965,060 - Janni , et al. February 24, 2	2015-02-24
Structures and methods to reduce maximum current density in a solder ball Grant 8,674,506 - Bezama , et al. March 18, 2	2014-03-18
Structures And Methods To Reduce Maximum Current Density In A Solder Ball App 20130234329 - BEZAMA; Raschid J. ; et al.	2013-09-12
Precision Phenotyping Using Score Space Proximity Analysis App 20130179085 - Hazebroek; Jan ; et al.	2013-07-11
Structures and methods to reduce maximum current density in a solder ball Grant 8,446,006 - Bezama , et al. May 21, 2	2013-05-21
Automatic Detection Of Object Pixels For Hyperspectral Analysis App 20130094717 - Janni; James ; et al.	2013-04-18
Transferable Probe Tips App 20120279287 - Andry; Paul S. ; et al.	2012-11-08
Offset solder vias, methods of manufacturing and design structures Grant 8,298,929 - Daubenspeck , et al. October 30, 2	2012-10-30
Metal wiring structures for uniform current density in C4 balls Grant 8,264,078 - Daubenspeck , et al. September 11, 2	2012-09-11
Offset Solder Vias, Methods Of Manufacturing And Design Structures App 20120139123 - Daubenspeck; Timothy H. ; et al.	2012-06-07
Metal Wiring Structures For Uniform Current Density In C4 Balls App 20120080797 - Daubenspeck; Timothy H. ; et al.	2012-04-05
Metal wiring structures for uniform current density in C4 balls Grant 8,084,858 - Daubenspeck , et al. December 27, 2	2011-12-27
Structures And Methods To Reduce Maximum Current Density In A Solder Ball App 20110147922 - BEZAMA; Raschid J. ; et al.	2011-06-23
Inverse Modeling for Characteristic Prediction from Multi-Spectral and Hyper-Spectral Remote Sensed Datasets App 20110125477 - Lightner; Jonathan E. ; et al.	2011-05-26
Metal Wiring Structures For Uniform Current Density In C4 Balls App 20100263913 - Daubenspeck; Timothy H. ; et al.	2010-10-21
Silicon Carrier Including An Integrated Heater For Die Rework And Wafer Probe App 20090178275 - Dang; Bing ; et al.	2009-07-16
Non-destructive single seed or several seeds NIR analyzer and method Grant 7,508,517 - Wright March 24, 2	2009-03-24
Silicon carrier including an integrated heater for die rework and wafer probe Grant 7,474,540 - Dang , et al. January 6, 2	2009-01-06
Non-destructive Single Seed Or Several Seeds Nir Analyzer And Method App 20080037002 - WRIGHT; STEVEN L.	2008-02-14
Non-destructive single seed or several seeds NIR analyzer and method Grant 7,274,456 - Wright September 25, 2	2007-09-25
Non-destructive single seed or several seeds NIR analyzer and method App 20050254053 - Wright, Steven L.	2005-11-17
Method and apparatus for adjusting subpixel intensity values based upon luminance characteristics of the subpixels for improved viewing angle characteristics of liquid crystal displays Grant 6,801,220 - Greier , et al. October 5, 2	2004-10-05
Near infrared spectrometry for real time analysis of substances Grant 6,483,583 - Wright , et al. November 19, 2	2002-11-19
Method and apparatus for adjusting subpixel intensity values based upon luminance characteristics of the subpixels for improved viewing angle characteristics of liquid crystal displays App 20020149598 - Greier, Paul F. ; et al.	2002-10-17
Near infrared spectrometer used in combination with an agricultural implement for real time grain and forage analysis Grant 5,991,025 - Wright , et al. November 23, 1	1999-11-23
Near infrared spectrometer used in combination with a combine for real time grain analysis Grant 5,751,421 - Wright , et al. May 12, 1	1998-05-12
Group III-V heterostructure devices having self-aligned graded contact diffusion regions and method for fabricating same Grant 5,162,891 - Burroughes , et al. November 10, 1	1992-11-10
Method for fabricating group III-V heterostructure devices having self-aligned graded contact diffusion regions Grant 5,158,896 - Burroughes , et al. October 27, 1	1992-10-27
Unpinned oxide-compound semiconductor structures and method of forming same Grant 5,086,321 - Batey , et al. February 4, 1	1992-02-04
Compound semiconductor interface control using cationic ingredient oxide to prevent fermi level pinning Grant 5,021,365 - Kirchner , et al. June 4, 1	1991-06-04
Germanium channel silicon MOSFET Grant 5,019,882 - Solomon , et al. May 28, 1	1991-05-28
Compound semiconductor interface control Grant 4,843,450 - Kirchner , et al. June 27, 1	1989-06-27

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