Woychik; Charles G.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Woychik; Charles G..The latest application filed is for "integrated circuits protected by substrates with cavities, and methods of manufacture".

Company Profile

19.103.94

Woychik; Charles G. - San Jose CA
Woychik; Charles G. - Niskayuna NY
Woychik; Charles G. - US
Woychik; Charles G. - Vestal NY
WOYCHIK, CHARLES G. - BROOME NY
Woychik; Charles G. - Endicott NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated interposer solutions for 2D and 3D IC packaging Grant 11,302,616 - Shen , et al. April 12, 2	2022-04-12
Integrated circuits protected by substrates with cavities, and methods of manufacture Grant 11,205,600 - Shen , et al. December 21, 2	2021-12-21
Embedded graphite heat spreader for 3DIC Grant 10,586,785 - Gao , et al.	2020-03-10
Integrated Circuits Protected By Substrates With Cavities, And Methods Of Manufacture App 20200043817 - Shen; Hong ; et al.	2020-02-06
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates Grant 10,522,457 - Uzoh , et al. Dec	2019-12-31
Method and structures for heat dissipating interposers Grant 10,475,733 - Uzoh , et al. Nov	2019-11-12
Integrated circuits protected by substrates with cavities, and methods of manufacture Grant 10,446,456 - Shen , et al. Oc	2019-10-15
Interposers with electrically conductive features having different porosities Grant 10,440,822 - Lee , et al. O	2019-10-08
Method of fabricating low CTE interposer without TSV structure Grant 10,396,114 - Woychik , et al. A	2019-08-27
Structure and method for integrated circuits packaging with increased density Grant 10,381,326 - Woychik , et al. A	2019-08-13
Integrated Interposer Solutions For 2d And 3d Ic Packaging App 20190198435 - Shen; Hong ; et al.	2019-06-27
Hybrid 3D/2.5D interposer Grant 10,325,880 - Woychik , et al.	2019-06-18
Microelectronic Components With Features Wrapping Around Protrusions Of Conductive Vias Protruding From Through-holes Passing Th App 20190157199 - UZOH; Cyprian Emeka ; et al.	2019-05-23
BVA interposer Grant 10,297,582 - Caskey , et al.	2019-05-21
Method And Structures For Heat Dissipating Interposers App 20190139878 - Uzoh; Cyprian Emeka ; et al.	2019-05-09
Integrated interposer solutions for 2D and 3D IC packaging Grant 10,256,177 - Shen , et al.	2019-04-09
Hybrid 3d/2.5d Interposer App 20190096849 - Woychik; Charles G. ; et al.	2019-03-28
Method for fabricating a carrier-less silicon interposer Grant 10,181,411 - Newman , et al. Ja	2019-01-15
Hybrid 3D/2.5D interposer Grant 10,177,114 - Woychik , et al. J	2019-01-08
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates Grant 10,177,086 - Uzoh , et al. J	2019-01-08
Method and structures for heat dissipating interposers Grant 10,103,094 - Uzoh , et al. October 16, 2	2018-10-16
Microelectronic Components With Features Wrapping Around Protrusions Of Conductive Vias Protruding From Through-holes Passing Through Substrates App 20180233447 - UZOH; Cyprian Emeka ; et al.	2018-08-16
Embedded Graphite Heat Spreader For 3dic App 20180219001 - Gao; Guilian ; et al.	2018-08-02
Stacked die integrated circuit Grant 9,991,231 - Woychik , et al. June 5, 2	2018-06-05
Integrated Circuits Protected By Substrates With Cavities, And Methods Of Manufacture App 20180130717 - SHEN; Hong ; et al.	2018-05-10
Embedded graphite heat spreader for 3DIC Grant 9,953,957 - Gao , et al. April 24, 2	2018-04-24
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates Grant 9,947,618 - Uzoh , et al. April 17, 2	2018-04-17
Circuit assemblies with multiple interposer substrates, and methods of fabrication Grant 9,905,507 - Shen , et al. February 27, 2	2018-02-27
Integrated circuits protected by substrates with cavities, and methods of manufacture Grant 9,899,281 - Shen , et al. February 20, 2	2018-02-20
Reliable device assembly Grant 9,893,030 - Uzoh , et al. February 13, 2	2018-02-13
Integrated circuit assemblies with reinforcement frames, and methods of manufacture Grant 9,887,166 - Katkar , et al. February 6, 2	2018-02-06
Low cost hybrid high density package Grant 9,875,955 - Desai , et al. January 23, 2	2018-01-23
Polymer member based interconnect Grant 9,865,548 - Uzoh , et al. January 9, 2	2018-01-09
Methods and structures to repair device warpage Grant 9,859,234 - Uzoh , et al. January 2, 2	2018-01-02
Interposers And Fabrication Methods That Use Nanoparticle Inks And Magnetic Fields App 20170374738 - Lee; Bong-Sub ; et al.	2017-12-28
Method And Structures For Heat Dissipating Interposers App 20170365546 - Uzoh; Cyprian Emeka ; et al.	2017-12-21
Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies Grant 9,824,974 - Gao , et al. November 21, 2	2017-11-21
Microelectronic assemblies with cavities, and methods of fabrication Grant 9,812,406 - Shen , et al. November 7, 2	2017-11-07
Integrated Interposer Solutions For 2d And 3d Ic Packaging App 20170317019 - Shen; Hong ; et al.	2017-11-02
Tunable composite interposer Grant 9,780,042 - Woychik , et al. October 3, 2	2017-10-03
Microelectronic Components With Features Wrapping Around Protrusions Of Conductive Vias Protruding From Through-holes Passing Through Substrates App 20170278787 - UZOH; Cyprian Emeka ; et al.	2017-09-28
Interposers Grant 9,769,923 - Lee , et al. September 19, 2	2017-09-19
Integrated interposer solutions for 2D and 3D IC packaging Grant 9,741,649 - Shen , et al. August 22, 2	2017-08-22
Bond via array for thermal conductivity Grant 9,735,084 - Katkar , et al. August 15, 2	2017-08-15
Method Of Fabricating Low Cte Interposer Without Tsv Structure App 20170194373 - Woychik; Charles G. ; et al.	2017-07-06
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates Grant 9,691,702 - Uzoh , et al. June 27, 2	2017-06-27
Structures for heat dissipating interposers Grant 9,685,401 - Uzoh , et al. June 20, 2	2017-06-20
Device and method for localized underfill Grant 9,673,124 - Wang , et al. June 6, 2	2017-06-06
Hybrid 3d/2.5d Interposer App 20170148763 - Woychik; Charles G. ; et al.	2017-05-25
Interposers And Fabrication Methods That Use Nanoparticle Inks And Magnetic Fields App 20170099733 - Lee; Bong-Sub ; et al.	2017-04-06
Integrated Circuit Assemblies With Rigid Layers Used For Protection Against Mechanical Thinning And For Other Purposes, And Methods Of Fabricating Such Assemblies App 20170084539 - GAO; Guilian ; et al.	2017-03-23
Thin wafer handling and known good die test method Grant 9,601,398 - Woychik , et al. March 21, 2	2017-03-21
Low cost hybrid high density package App 20170077018 - DESAI; Kishor ; et al.	2017-03-16
Method for fabrication of interconnection circuitry with electrically conductive features passing through a support and comprising core portions formed using nanoparticle-containing inks Grant 9,570,385 - Lee , et al. February 14, 2	2017-02-14
Methods And Structures To Repair Device Warpage App 20170040270 - Uzoh; Cyprian Emeka ; et al.	2017-02-09
Integrated Circuits Protected By Substrates With Cavities, And Methods Of Manufacture App 20170040237 - SHEN; Hong ; et al.	2017-02-09
Stacked Die Integrated Circuit App 20170033088 - Woychik; Charles G. ; et al.	2017-02-02
Method of fabricating low CTE interposer without TSV structure Grant 9,558,964 - Woychik , et al. January 31, 2	2017-01-31
Microelectronic Assemblies With Cavities, And Methods Of Fabrication App 20170018510 - SHEN; Hong ; et al.	2017-01-19
Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies Grant 9,548,273 - Gao , et al. January 17, 2	2017-01-17
Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture Grant 9,536,862 - Shen , et al. January 3, 2	2017-01-03
Low cost hybrid high density package Grant 9,508,687 - Desai , et al. November 29, 2	2016-11-29
BVA interposer Grant 9,502,390 - Caskey , et al. November 22, 2	2016-11-22
Reliable Device Assembly App 20160329290 - Haba; Belgacem ; et al.	2016-11-10
Microelectronic Components With Features Wrapping Around Protrusions Of Conductive Vias Protruding From Through-holes Passing Through Substrates App 20160315047 - Uzoh; Cyprian Emeka ; et al.	2016-10-27
Microelectronic assemblies with cavities, and methods of fabrication Grant 9,478,504 - Shen , et al. October 25, 2	2016-10-25
Circuit Assemblies With Multiple Interposer Substrates, And Methods Of Fabrication App 20160293534 - SHEN; Hong ; et al.	2016-10-06
Integrated Circuit Assemblies With Reinforcement Frames, And Methods Of Manufacture App 20160276294 - KATKAR; Rajesh ; et al.	2016-09-22
Tunable Composite Interposer App 20160276296 - Woychik; Charles G. ; et al.	2016-09-22
Polymer Member Based Interconnect App 20160268205 - Uzoh; Cyprian Emeka ; et al.	2016-09-15
Embedded Graphite Heat Spreader For 3dic App 20160260687 - Gao; Guilian ; et al.	2016-09-08
Device And Method For Localized Underfill App 20160254205 - WANG; Liang ; et al.	2016-09-01
Low-stress TSV design using conductive particles Grant 9,433,100 - Woychik , et al. August 30, 2	2016-08-30
Stacked die integrated circuit Grant 9,418,924 - Woychik , et al. August 16, 2	2016-08-16
Interposers And Fabrication Methods That Use Nanoparticle Inks And Magnetic Fields App 20160218057 - Lee; Bong-Sub ; et al.	2016-07-28
Circuit assemblies with multiple interposer substrates, and methods of fabrication Grant 9,402,312 - Shen , et al. July 26, 2	2016-07-26
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates Grant 9,397,038 - Uzoh , et al. July 19, 2	2016-07-19
Method of forming a reliable microelectronic assembly Grant 9,398,700 - Uzoh , et al. July 19, 2	2016-07-19
Metal PVD-free conducting structures Grant 9,379,008 - Uzoh , et al. June 28, 2	2016-06-28
Polymer member based interconnect Grant 9,373,585 - Uzoh , et al. June 21, 2	2016-06-21
Bond Via Array for Thermal Conductivity App 20160172268 - KATKAR; Rajesh ; et al.	2016-06-16
Integrated Circuit Assemblies With Rigid Layers Used For Protection Against Mechanical Thinning And For Other Purposes, And Methods Of Fabricating Such Assemblies App 20160163650 - GAO; Guilian ; et al.	2016-06-09
Tunable composite interposer Grant 9,362,204 - Woychik , et al. June 7, 2	2016-06-07
Integrated circuit assemblies with reinforcement frames, and methods of manufacture Grant 9,355,997 - Katkar , et al. May 31, 2	2016-05-31
Methods and structure for carrier-less thin wafer handling Grant 9,355,905 - Uzoh , et al. May 31, 2	2016-05-31
Device and method for localized underfill Grant 9,349,614 - Wang , et al. May 24, 2	2016-05-24
Reduced stress TSV and interposer structures Grant 9,349,669 - Uzoh , et al. May 24, 2	2016-05-24
Microelectronic Assemblies With Integrated Circuits And Interposers With Cavities, And Methods Of Manufacture App 20160133600 - Shen; Hong ; et al.	2016-05-12
Bva Interposer App 20160079214 - Caskey; Terrence ; et al.	2016-03-17
Polymer Member Based Interconnect App 20160079169 - Uzoh; Cyprian Emeka ; et al.	2016-03-17
Carrier-less Silicon Interposer App 20160079090 - Newman; Michael ; et al.	2016-03-17
Device And Method For An Integrated Ultra-high-density Device App 20160049383 - Woychik; Charles G. ; et al.	2016-02-18
Device And Method For Localized Underfill App 20160042978 - WANG; Liang ; et al.	2016-02-11
Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture Grant 9,252,127 - Shen , et al. February 2, 2	2016-02-02
Microelectronic Assemblies With Integrated Circuits And Interposers With Cavities, And Methods Of Manufacture App 20160013151 - SHEN; Hong ; et al.	2016-01-14
Carrier-less silicon interposer Grant 9,237,648 - Newman , et al. January 12, 2	2016-01-12
Back-end-of-line Stack For A Stacked Device App 20150371938 - Katkar; Rajesh ; et al.	2015-12-24
Integrated Interposer Solutions For 2d And 3d Ic Packaging App 20150357272 - Shen; Hong ; et al.	2015-12-10
Structure And Method For Integrated Circuits Packaging With Increased Density App 20150348940 - WOYCHIK; Charles G. ; et al.	2015-12-03
Method And Structures For Heat Dissipating Interposers App 20150340310 - Uzoh; Cyprian Emeka ; et al.	2015-11-26
Holding Of Interposers And Other Microelectronic Workpieces In Position During Assembly And Other Processing App 20150333049 - Woychik; Charles G. ; et al.	2015-11-19
Circuit Assemblies With Multiple Interposer Substrates, And Methods Of Fabrication App 20150327367 - SHEN; Hong ; et al.	2015-11-12
Stacked Die Integrated Circuit App 20150270209 - WOYCHIK; Charles G. ; et al.	2015-09-24
Integrated Circuits Protected By Substrates With Cavities, And Methods Of Manufacture App 20150262902 - SHEN; Hong ; et al.	2015-09-17
Integrated Circuit Assemblies With Reinforcement Frames, And Methods Of Manufacture App 20150262972 - KATKAR; Rajesh ; et al.	2015-09-17
Methods And Structure For Carrier-less Thin Wafer Handling App 20150255345 - Uzoh; Cyprian Emeka ; et al.	2015-09-10
Method and structures for heat dissipating interposers Grant 9,123,780 - Uzoh , et al. September 1, 2	2015-09-01
Reduced Stress Tsv And Interposer Structures App 20150187673 - Uzoh; Cyprian Emeka ; et al.	2015-07-02
Methods and structure for carrier-less thin wafer handling Grant 9,064,933 - Uzoh , et al. June 23, 2	2015-06-23
Low Cost Hybrid High Density Package App 20150171058 - Desai; Kishor ; et al.	2015-06-18
Tunable Composite Interposer App 20150162216 - Woychik; Charles G. ; et al.	2015-06-11
Metal Pvd-free Conducting Structures App 20150162241 - Uzoh; Cyprian Emeka ; et al.	2015-06-11
High Strength Through-substrate Vias App 20150146393 - UZOH; CYPRIAN EMEKA ; et al.	2015-05-28
Reduced stress TSV and interposer structures Grant 9,000,600 - Uzoh , et al. April 7, 2	2015-04-07
Metal PVD-free conducting structures Grant 8,981,564 - Woychik , et al. March 17, 2	2015-03-17
Tunable composite interposer Grant 8,963,335 - Woychik , et al. February 24, 2	2015-02-24
Low cost hybrid high density package Grant 8,963,310 - Desai , et al. February 24, 2	2015-02-24
Method Of Fabricating Low Cte Interposer Without Tsv Structure App 20150044820 - Woychik; Charles G. ; et al.	2015-02-12
Thin Wafer Handling and Known Good Die Test Method App 20150014688 - Woychik; Charles G. ; et al.	2015-01-15
Reliable Device Assembly App 20140376200 - Uzoh; Cyprian Emeka ; et al.	2014-12-25
Metal Pvd-free Conducting Structures App 20140339702 - Woychik; Charles G. ; et al.	2014-11-20
Low CTE interposer without TSV structure Grant 8,884,427 - Woychik , et al. November 11, 2	2014-11-11
Thin wafer handling and known good die test method Grant 8,846,447 - Woychik , et al. September 30, 2	2014-09-30
Low Cte Interposer Without Tsv Structure App 20140264794 - Woychik; Charles G. ; et al.	2014-09-18
Carrier-less Silicon Interposer App 20140240938 - Newman; Michael ; et al.	2014-08-28
Reduced Stress Tsv And Interposer Structures App 20140217607 - Uzoh; Cyprian Emeka ; et al.	2014-08-07
Low-stress Tsv Design Using Conductive Particles App 20140201994 - Woychik; Charles G. ; et al.	2014-07-24
High strength through-substrate vias Grant 8,785,790 - Uzoh , et al. July 22, 2	2014-07-22
Reduced stress TSV and interposer structures Grant 8,772,946 - Uzoh , et al. July 8, 2	2014-07-08
Methods And Structure For Carrier-less Thin Wafer Handling App 20140179099 - Uzoh; Cyprian Emeka ; et al.	2014-06-26
Method And Structures For Heat Dissipating Interposers App 20140167267 - Uzoh; Cyprian Emeka ; et al.	2014-06-19
Low-stress TSV design using conductive particles Grant 8,723,049 - Woychik , et al. May 13, 2	2014-05-13
Tunable Composite Interposer App 20140070423 - Woychik; Charles G. ; et al.	2014-03-13
Thin Wafer Handling And Known Good Die Test Method App 20140054763 - Woychik; Charles G. ; et al.	2014-02-27
Bva Interposer App 20140036454 - Caskey; Terrence ; et al.	2014-02-06
Reduced Stress Tsv And Interposer Structures App 20130328186 - Uzoh; Cyprian Emeka ; et al.	2013-12-12
Area array quad flat no-lead (QFN) package Grant 8,525,312 - Low , et al. September 3, 2	2013-09-03
Flip-chip QFN structure using etched lead frame Grant 8,525,309 - Chia , et al. September 3, 2	2013-09-03
High Strength Through-substrate Vias App 20130118784 - Uzoh; Cyprian ; et al.	2013-05-16
Low Cost Hybrid High Density Package App 20130049179 - Desai; Kishor ; et al.	2013-02-28
Area Array Qfn App 20130037925 - Low; Qwai H. ; et al.	2013-02-14
Flip-chip Qfn Structure Using Etched Lead Frame App 20130001757 - Chia; Chok ; et al.	2013-01-03
Low-stress Tsv Design Using Conductive Particles App 20120314384 - Woychik; Charles G. ; et al.	2012-12-13
Ultrasound transducer with improved acoustic performance Grant 8,207,652 - Baumgartner , et al. June 26, 2	2012-06-26
System and apparatus for venting electronic packages and method of making same Grant 7,956,457 - Fillion , et al. June 7, 2	2011-06-07
Ultrasound Transducer With Improved Acoustic Performance App 20100317972 - Baumgartner; Charles Edward ; et al.	2010-12-16
System And Apparatus For Venting Electronic Packages And Method Of Making Same App 20100133683 - Fillion; Raymond Albert ; et al.	2010-06-03
CT detector module construction Grant 7,606,346 - Tkaczyk , et al. October 20, 2	2009-10-20
Ct Detector Module Construction App 20080165921 - Tkaczyk; John Eric ; et al.	2008-07-10
Method of making an electronic package Grant 7,250,330 - Thomas , et al. July 31, 2	2007-07-31
Low temperature solder chip attach structure and process to produce a high temperature interconnection Grant 6,994,243 - Milewski , et al. February 7, 2	2006-02-07
Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriers Grant 6,989,607 - Darbha , et al. January 24, 2	2006-01-24
Low temperature solder chip attach structure and process to produce a high temperature interconnection App 20050109820 - Milewski, Joseph M. ; et al.	2005-05-26
Low temperature solder chip attach structure Grant 6,847,118 - Milewski , et al. January 25, 2	2005-01-25
Method of making an electronic package App 20040082108 - Thomas, David L. ; et al.	2004-04-29
Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriers App 20040021205 - Darbha, Krishna ; et al.	2004-02-05
Method for producing a reliable solder joint interconnection Grant 6,672,500 - Caletka , et al. January 6, 2	2004-01-06
Method of forming an apparatus to reduce thermal fatigue stress on flip chip solder connections Grant 6,667,557 - Alcoe , et al. December 23, 2	2003-12-23
Method Of Forming An Apparatus To Reduce Thermal Fatigue Stress On Flip Chip Solder Connections App 20030210531 - Alcoe, David J. ; et al.	2003-11-13
Stress reduction in flip-chip PBGA packaging by utilizing segmented chip carries Grant 6,639,302 - Darbha , et al. October 28, 2	2003-10-28
Stress Reduction In Flip-chip Pbga Packaging By Utilizing Segmented Chip Carriers App 20030178649 - Darbha, Krishna ; et al.	2003-09-25
Apparatus to reduce thermal fatigue stress on flip chip solder connections Grant 6,570,259 - Alcoe , et al. May 27, 2	2003-05-27
Method and device for semiconductor testing using electrically conductive adhesives Grant 6,559,666 - Bernier , et al. May 6, 2	2003-05-06
Apparatus to reduce thermal fatigue stress on flip chip solder connections App 20020135063 - Alcoe, David J. ; et al.	2002-09-26
Process For Making Semiconductor Chip Assembly App 20020046804 - CULNANE, THOMAS M. ; et al.	2002-04-25
Low temperature solder chip attach structure App 20020036227 - Milewski, Joseph M. ; et al.	2002-03-28
Process to produce a high temperature interconnection Grant 6,330,967 - Milewski , et al. December 18, 2	2001-12-18
Method for producing a reliable solder joint interconnection App 20010045445 - Caletka, David V. ; et al.	2001-11-29
Method and device for semiconductor testing using electrically conductive adhesives App 20010035759 - Bernier, William E. ; et al.	2001-11-01
Semiconductor Testing Using Electrically Conductive Adhesives App 20010024127 - BERNIER, WILLIAM E. ; et al.	2001-09-27
Lead-free, high tin ternary solder alloy of tin, silver, and bismuth App 20010002982 - Sarkhel, Amit Kumar ; et al.	2001-06-07
Polymer with transient liquid phase bondable particles Grant 6,199,751 - Gaynes , et al. March 13, 2	2001-03-13
Polymer with transient liquid phase bondable particles Grant 6,087,021 - Gaynes , et al. July 11, 2	2000-07-11
Lead-free solder process Grant 6,010,060 - Sarkhel , et al. January 4, 2	2000-01-04
Semiconductor chip carrier assembly Grant 5,973,389 - Culnane , et al. October 26, 1	1999-10-26
Lead-free, high tin ternary solder alloy of tin, silver, and indium Grant 5,874,043 - Sarkhel , et al. February 23, 1	1999-02-23
Stabilization of conductive adhesive by metallurgical bonding Grant 5,542,602 - Gaynes , et al. August 6, 1	1996-08-06
Pressure contact open-circuit detector Grant 5,493,775 - Darekar , et al. February 27, 1	1996-02-27
Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate Grant 5,201,451 - Desai , et al. April 13, 1	1993-04-13
Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate Grant 5,170,931 - Desai , et al. December 15, 1	1992-12-15
Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate Grant 5,159,535 - Desai , et al. October 27, 1	1992-10-27
Low temperature controlled collapse chip attach process Grant 5,075,965 - Carey , et al. December 31, 1	1991-12-31
Bonding of metallic surfaces Grant 5,038,996 - Wilcox , et al. August 13, 1	1991-08-13

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