Wisotzki; Elmar

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wisotzki; Elmar.The latest application filed is for "semiconductor device module and method of assembly".

Company Profile

3.12.9

Wisotzki; Elmar - Darmstadt DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device Module And Method Of Assembly App 20210265332 - Wisotzki; Elmar	2021-08-26
Semiconductor Device Module And Method Of Assembly App 20210183841 - Wisotzki; Elmar	2021-06-17
Semiconductor device module and method of assembly Grant 11,037,917 - Wisotzki June 15, 2	2021-06-15
Die stack assembly using an edge separation structure for connectivity through a die of the stack Grant 10,854,581 - Wisotzki , et al. December 1, 2	2020-12-01
Fast recovery inverse diode Grant 10,847,658 - Wisotzki November 24, 2	2020-11-24
Fast Recovery Inverse Diode App 20200287058 - Wisotzki; Elmar	2020-09-10
Die Stack Assembly Using An Edge Separation Structure For Connectivity Through A Die Of The Stack App 20200266174 - Wisotzki; Elmar ; et al.	2020-08-20
Die stack assembly using an edge separation structure for connectivity through a die of the stack Grant 10,734,362 - Wisotzki , et al.	2020-08-04
Fast recovery inverse diode Grant 10,714,635 - Wisotzki	2020-07-14
Fast Recovery Inverse Diode App 20190115480 - Wisotzki; Elmar	2019-04-18
Fast recovery inverse diode Grant 10,193,000 - Wisotzki Ja	2019-01-29
Inverse diode stack Grant 9,941,256 - Ettingshausen , et al. April 10, 2	2018-04-10
Trench separation diffusion for high voltage device Grant 9,922,864 - Wisotzki , et al. March 20, 2	2018-03-20
Die Stack Assembly Using An Edge Separation Structure For Connectivity Through A Die Of The Stack App 20170278828 - Wisotzki; Elmar ; et al.	2017-09-28
Die stack assembly using an edge separation structure for connectivity through a die of the stack Grant 9,704,832 - Wisotzki , et al. July 11, 2	2017-07-11
Trench Separation Diffusion for High Voltage Device App 20170178947 - Wisotzki; Elmar ; et al.	2017-06-22
Trench separation diffusion for high voltage device Grant 9,590,033 - Wisotzki , et al. March 7, 2	2017-03-07
Power device manufacture on the recessed side of a thinned wafer Grant 8,716,067 - Wisotzki , et al. May 6, 2	2014-05-06
Power Device Manufacture On The Recessed Side Of A Thinned Wafer App 20130217185 - Wisotzki; Elmar ; et al.	2013-08-22

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