Winniczek; Jaroslaw W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Winniczek; Jaroslaw W..The latest application filed is for "fabrication of a silicon structure and deep silicon etch with profile control".

Company Profile

0.25.21

Winniczek; Jaroslaw W. - Daly City CA
Winniczek; Jaroslaw W - Daly City CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fabrication of a silicon structure and deep silicon etch with profile control Grant 9,865,472 - Chebi , et al. January 9, 2	2018-01-09
Fabrication Of A Silicon Structure And Deep Silicon Etch With Profile Control App 20160233102 - CHEBI; Robert ; et al.	2016-08-11
Fabrication of a silicon structure and deep silicon etch with profile control Grant 9,330,926 - Chebi , et al. May 3, 2	2016-05-03
Silicon etch with passivation using chemical vapor deposition Grant 9,018,098 - Winniczek , et al. April 28, 2	2015-04-28
Method for achieving smooth side walls after Bosch etch process Grant 8,871,105 - Winniczek , et al. October 28, 2	2014-10-28
High Strip Rate Downstream Chamber App 20140261803 - Wang; Ing-Yann ; et al.	2014-09-18
Method and apparatus for removing photoresist Grant 8,757,178 - Chebi , et al. June 24, 2	2014-06-24
Method for providing high etch rate Grant 8,609,548 - Xu , et al. December 17, 2	2013-12-17
Silicon etch with passivation using plasma enhanced oxidation Grant 8,598,037 - Winniczek , et al. December 3, 2	2013-12-03
Method For Achieving Smooth Side Walls After Bosch Etch Process App 20130237062 - Winniczek; Jaroslaw W. ; et al.	2013-09-12
Pressure Control Valve Assembly Of Plasma Processing Chamber And Rapid Alternating Process App 20130203259 - Winniczek; Jaroslaw W	2013-08-08
High strip rate downstream chamber Grant 8,425,682 - Wang , et al. April 23, 2	2013-04-23
High Strip Rate Downstream Chamber App 20130025693 - Wang; Ing-Yann ; et al.	2013-01-31
Method For Providing High Etch Rate App 20120309194 - Xu; Qing ; et al.	2012-12-06
High strip rate downstream chamber Grant 8,298,336 - Wang , et al. October 30, 2	2012-10-30
Silicon etch with passivation using plasma enhanced oxidation Grant 8,173,547 - Winniczek , et al. May 8, 2	2012-05-08
Silicon Etch With Passivation Using Plasma Enhanced Oxidation App 20120100720 - WINNICZEK; Jaroslaw W. ; et al.	2012-04-26
Method And Apparatus For Removing Photoresist App 20120006486 - CHEBI; Robert P. ; et al.	2012-01-12
Method and apparatus for removing photoresist Grant 8,043,434 - Chebi , et al. October 25, 2	2011-10-25
Silicon Etch With Passivation Using Plasma Enhanced Oxidation App 20100105209 - Winniczek; Jaroslaw W. ; et al.	2010-04-29
Method And Apparatus For Removing Photoresist App 20100101603 - Chebi; Robert P. ; et al.	2010-04-29
Silicon Etch With Passivation Using Chemical Vapor Deposition App 20100105208 - Winniczek; Jaroslaw W. ; et al.	2010-04-29
Photoresist stripping chamber and methods of etching photoresist on substrates Grant 7,605,063 - Chebi , et al. October 20, 2	2009-10-20
Fabrication Of A Silicon Structure And Deep Silicon Etch With Profile Control App 20090184089 - CHEBI; Robert ; et al.	2009-07-23
System, method and apparatus for in-situ substrate inspection Grant 7,542,134 - Owczarz , et al. June 2, 2	2009-06-02
System, Method And Apparatus For In-situ Substrate Inspection App 20080273195 - Owczarz; Aleksander ; et al.	2008-11-06
System, method and apparatus for in-situ substrate inspection Grant 7,397,555 - Owczarz , et al. July 8, 2	2008-07-08
Photoresist stripping chamber and methods of etching photoresist on substrates App 20070264841 - Chebi; Robert P. ; et al.	2007-11-15
High strip rate downstream chamber App 20060219361 - Wang; Ing-Yann ; et al.	2006-10-05
System, method and apparatus for in-situ substrate inspection App 20060139450 - Owczarz; Aleksander ; et al.	2006-06-29
Full spectrum endpoint detection Grant 6,969,619 - Winniczek November 29, 2	2005-11-29
Methods and apparatus for determining an etch endpoint in a plasma processing system App 20030183335 - Winniczek, Jaroslaw W. ; et al.	2003-10-02
Methods and apparatus for determining an etch endpoint in a plasma processing system Grant 6,562,187 - Winniczek , et al. May 13, 2	2003-05-13
Methods for running a high density plasma etcher to achieve reduced transistor device damage App 20020029853 - Hudson, Eric A. ; et al.	2002-03-14
Methods for running a high density plasma etcher to achieve reduced transistor device damage Grant 6,255,221 - Hudson , et al. July 3, 2	2001-07-03
Methods and apparatus for determining an etch endpoint in a plasma processing system App 20010004921 - Winniczek, Jaroslaw W. ; et al.	2001-06-28
Methods and apparatus for determining an etch endpoint in a plasma processing system Grant 6,228,278 - Winniczek , et al. May 8, 2	2001-05-08
Methods for reducing mask erosion during plasma etching Grant 6,093,332 - Winniczek , et al. July 25, 2	2000-07-25

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