Willeke; Reiner
Patent Applications and Registrations
Patent applications and USPTO patent grants for Willeke; Reiner.The latest application filed is for "etching of under bump metallization layer and resulting device".
- Willeke; Reiner - Dresden N/A DE
| Patent | Date |
|---|---|
| Solder bump cleaning before reflow Grant 9,773,744 - Willeke , et al. September 26, 2 | 2017-09-26 |
| Etching Of Under Bump Metallization Layer And Resulting Device App 20160043046 - ATANASOVA; Tanya Andreeva ; et al. | 2016-02-11 |
| Etching of under bump mettallization layer and resulting device Grant 9,214,436 - Atanasova , et al. December 15, 2 | 2015-12-15 |
| Methods for etching copper during the fabrication of integrated circuits Grant 9,159,683 - Willeke , et al. October 13, 2 | 2015-10-13 |
| Methods For Etching Copper During The Fabrication Of Integrated Circuits App 20150228595 - Willeke; Reiner ; et al. | 2015-08-13 |
| Etching Of Under Bump Mettallization Layer And Resulting Device App 20150221605 - ATANASOVA; Tanya Andreeva ; et al. | 2015-08-06 |
| Solder Bump Cleaning Before Reflow App 20130017681 - Willeke; Reiner ; et al. | 2013-01-17 |
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