Wijekoon; Kapila

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wijekoon; Kapila.The latest application filed is for "process for electroless copper deposition on a ruthenium seed".

Company Profile

0.13.13

Wijekoon; Kapila - Palo Alto CA
Wijekoon; Kapila - Palto Alto CA
Wijekoon; Kapila - Santa Clara CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Process For Electroless Copper Deposition On A Ruthenium Seed App 20120315756 - Weidman; Timothy W. ; et al.	2012-12-13
Surface cleaning and texturing process for crystalline solar cells Grant 8,129,212 - Wijekoon , et al. March 6, 2	2012-03-06
Surface cleaning and texturing process for crystalline solar cells App 20110272625 - Wijekoon; Kapila ; et al.	2011-11-10
Process for electroless copper deposition Grant 7,651,934 - Lubomirsky , et al. January 26, 2	2010-01-26
Surface cleaning and texturing process for crystalline solar cells App 20090280597 - Wijekoon; Kapila ; et al.	2009-11-12
Process for electroless copper deposition App 20070099422 - Wijekoon; Kapila ; et al.	2007-05-03
Process for electroless copper deposition App 20070004201 - Lubomirsky; Dmitry ; et al.	2007-01-04
Temperature control in a chemical mechanical polishing system Grant 7,153,188 - Zuniga , et al. December 26, 2	2006-12-26
Process for electroless copper deposition on a ruthenium seed App 20060246699 - Weidman; Timothy W. ; et al.	2006-11-02
Method and apparatus for polishing substrates Grant 7,070,480 - Moon , et al. July 4, 2	2006-07-04
Method and apparatus for polishing metal and dielectric substrates Grant 6,960,521 - Moon , et al. November 1, 2	2005-11-01
Method and apparatus for polishing metal and dielectric substrates App 20050032381 - Moon, Yongsik ; et al.	2005-02-10
Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects Grant 6,790,768 - Moon , et al. September 14, 2	2004-09-14
Ion exchange materials for chemical mechanical polishing Grant 6,638,143 - Wang , et al. October 28, 2	2003-10-28
Method and apparatus for hard pad polishing Grant 6,620,027 - Zutshi , et al. September 16, 2	2003-09-16
Method and apparatus for polishing substrates App 20030114084 - Moon, Yongsik ; et al.	2003-06-19
Multi-fluid polishing process Grant 6,572,453 - Wijekoon , et al. June 3, 2	2003-06-03
Method and apparatus for enhanced CMP using metals having reductive properties Grant 6,561,873 - Tsai , et al. May 13, 2	2003-05-13
Method and apparatus for enhanced CMP using metals having reductive properties Grant 6,537,144 - Tsai , et al. March 25, 2	2003-03-25
Method and apparatus for polishing metal and dielectric substrates App 20030029841 - Moon, Yongsik ; et al.	2003-02-13
Method and apparatus for enhanced CMP using metals having reductive properties App 20020098779 - Tsai, Stan D. ; et al.	2002-07-25
Method and apparatus for hard pad polishing App 20020090886 - Zutshi, Ajoy ; et al.	2002-07-11
Ion exchange materials for chemical mechanical polishing App 20020077035 - Wang, Yuchun ; et al.	2002-06-20
Carrier head with local pressure control for a chemical mechanical polishing apparatus App 20020072313 - Zuniga, Steven M. ; et al.	2002-06-13
Endpoint monitoring with polishing rate change Grant 6,309,276 - Tsai , et al. October 30, 2	2001-10-30
Carrier head with local pressure control for a chemical mechanical polishing apparatus Grant 6,146,259 - Zuniga , et al. November 14, 2	2000-11-14

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