| Patent | Date |
|---|
Substrate with routing
Grant 9,748,168 - Wenzel August 29, 2 | 2017-08-29 |
Substrate With Routing
App 20170125336 - WENZEL; Robert J. | 2017-05-04 |
Packaged integrated circuit using wire bonds
Grant 8,912,667 - Wenzel , et al. December 16, 2 | 2014-12-16 |
Packaged Integrated Circuit Using Wire Bonds
App 20130193589 - WENZEL; ROBERT J. ; et al. | 2013-08-01 |
Circuit device with at least partial packaging and method for forming
Grant 8,072,062 - Leal , et al. December 6, 2 | 2011-12-06 |
Automatic broiler for variable batch cooking
Grant 8,033,213 - Cook , et al. October 11, 2 | 2011-10-11 |
Automatic broiler for variable batch cooking
Grant 7,921,767 - Cook , et al. April 12, 2 | 2011-04-12 |
Methods and apparatus for a semiconductor device package with improved thermal performance
Grant 7,892,882 - Leal , et al. February 22, 2 | 2011-02-22 |
Semiconductor die with die pad pattern
Grant 7,834,466 - Wenzel , et al. November 16, 2 | 2010-11-16 |
Integrated circuit module with integrated passive device
Grant 7,763,976 - Tang , et al. July 27, 2 | 2010-07-27 |
Integrated Circuit Module With Integrated Passive Device
App 20100078760 - Tang; Jinbang ; et al. | 2010-04-01 |
Die positioning for packaged integrated circuits
Grant 7,674,656 - Wenzel , et al. March 9, 2 | 2010-03-09 |
Method of packaging semiconductor devices
Grant 7,632,715 - Hess , et al. December 15, 2 | 2009-12-15 |
Semiconductor device with a protected active die region and method therefor
Grant 7,579,219 - Leal , et al. August 25, 2 | 2009-08-25 |
Method of forming crack arrest features in embedded device build-up package and package thereof
Grant 7,553,753 - Zhao , et al. June 30, 2 | 2009-06-30 |
Structure With Die Pad Pattern
App 20090152718 - Wenzel; Robert J. ; et al. | 2009-06-18 |
Fine pitch interconnect and method of making
Grant 7,528,069 - Wenzel , et al. May 5, 2 | 2009-05-05 |
Methods and apparatus for thermal management in a multi-layer embedded chip structure
Grant 7,405,102 - Lee , et al. July 29, 2 | 2008-07-29 |
Method Of Packaging Semiconductor Devices
App 20080164593 - Hess; Kevin J. ; et al. | 2008-07-10 |
Circuit Device With At Least Partial Packaging And Method For Forming
App 20080142960 - Leal; George R. ; et al. | 2008-06-19 |
Automatic broiler for variable batch cooking
App 20080141868 - Cook; Jeffrey R. ; et al. | 2008-06-19 |
Die Positioning For Packaged Integrated Circuits
App 20080138938 - Wenzel; Robert J. ; et al. | 2008-06-12 |
Circuit device with at least partial packaging and method for forming
Grant 7,361,987 - Leal , et al. April 22, 2 | 2008-04-22 |
Method Of Forming Crack Arrest Features In Embedded Device Build-up Package And Package Thereof
App 20080057696 - Zhao; Jie-Hua ; et al. | 2008-03-06 |
Methods and apparatus for thermal management in a multi-layer embedded chip structure
App 20070284711 - Lee; Tien Yu T. ; et al. | 2007-12-13 |
Methods and apparatus for a semiconductor device package with improved thermal performance
App 20070284704 - Leal; George R. ; et al. | 2007-12-13 |
Perforated embedded plane package and method
App 20070212813 - Fay; Owen R. ; et al. | 2007-09-13 |
Fine pitch interconnect and method of making
App 20070102828 - Wenzel; Robert J. ; et al. | 2007-05-10 |
Automatic broiler for variable batch cooking
App 20060257542 - Cook; Jeffrey R. ; et al. | 2006-11-16 |
Semiconductor device with a protected active die region and method therefor
App 20060192301 - Leal; George R. ; et al. | 2006-08-31 |
Circuit device with at least partial packaging and method for forming
App 20060012036 - Leal; George R. ; et al. | 2006-01-19 |
Semiconductor device with a protected active die region and method therefor
App 20050242425 - Leal, George R. ; et al. | 2005-11-03 |
Circuit device with at least partial packaging, exposed active surface and a voltage reference plane
Grant 6,921,975 - Leal , et al. July 26, 2 | 2005-07-26 |
Circuit device with at least partial packaging and method for forming
Grant 6,838,776 - Leal , et al. January 4, 2 | 2005-01-04 |
Semiconductor package having optimized wire bond positioning
Grant 6,812,580 - Wenzel , et al. November 2, 2 | 2004-11-02 |
Circuit device with at least partial packaging and method for forming
App 20040207077 - Leal, George R. ; et al. | 2004-10-21 |
Circuit device with at least partial packaging and method for forming
App 20040207068 - Leal, George R. ; et al. | 2004-10-21 |
Dielectric resonator filter having reduced spurious modes
Grant 6,239,673 - Wenzel , et al. May 29, 2 | 2001-05-29 |
Method and apparatus for generating and applying steam for food cooking and finishing
Grant 6,171,630 - Stanger , et al. January 9, 2 | 2001-01-09 |
Dielectric resonator filter having cross-coupled resonators
Grant 6,094,113 - Wenzel , et al. July 25, 2 | 2000-07-25 |
Series coupled filters where the first filter is a dielectric resonator filter with cross-coupling
Grant 5,841,330 - Wenzel , et al. November 24, 1 | 1998-11-24 |
Portable filter
Grant 4,702,827 - Wenzel October 27, 1 | 1987-10-27 |
Oven for cooking and flavoring meat products
Grant 4,455,924 - Wenzel June 26, 1 | 1984-06-26 |
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