loadpatents
name:-0.011960983276367
name:-0.012485027313232
name:-0.0048208236694336
Weng; Chun-Jen Patent Filings

Weng; Chun-Jen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Weng; Chun-Jen.The latest application filed is for "reflective condensing interferometer".

Company Profile
4.8.10
  • Weng; Chun-Jen - Tainan TW
  • WENG; CHUN-JEN - Taipei City TW
  • WENG; CHUN-JEN - Hsinchu TW
  • Weng; Chun-Jen - Tainan City TW
  • Weng; Chun-Jen - Chiayi County N/A TW
  • Weng; Chun-Jen - Tai-Nan TW
  • Weng; Chun-Jen - Tai-Nan City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Support structure with sacrifice structure for light-emitting diode and manufacturing method thereof
Grant 11,063,180 - Wu , et al. July 13, 2
2021-07-13
Reflective Condensing Interferometer
App 20210172722 - LIU; YI-CHENG ;   et al.
2021-06-10
Integrated Device For Laser Ranging And Imaging
App 20210096256 - LIAO; TAI-SHAN ;   et al.
2021-04-01
Vacuum transfer device and a method of forming the same
Grant 10,804,134 - Wu , et al. October 13, 2
2020-10-13
Vacuum Transfer Device And A Method Of Forming The Same
App 20200258767 - A1
2020-08-13
Support Structure For Light-emitting Diode And Manufacturing Method Thereof
App 20190386176 - WU; BIING-SENG ;   et al.
2019-12-19
Mechanism with component position adjusting function
Grant 8,574,117 - Chang , et al. November 5, 2
2013-11-05
Mechanism With Component Position Adjusting Function
App 20130045830 - CHANG; Shian-Wen ;   et al.
2013-02-21
Method of manufacturing spacer
Grant 7,235,491 - Weng , et al. June 26, 2
2007-06-26
Method of forming damascene structures
Grant 7,189,640 - Weng , et al. March 13, 2
2007-03-13
Method Of Manufacturing Spacer
App 20060252190 - Weng; Chun-Jen ;   et al.
2006-11-09
Method Of Forming Damascene Structures
App 20060121730 - Weng; Chun-Jen ;   et al.
2006-06-08
Gap-filling process
Grant 6,833,318 - Weng , et al. December 21, 2
2004-12-21
Gap-filling process
App 20040097069 - Weng, Chun-Jen ;   et al.
2004-05-20
Package With High Heat Dissipation
App 20030147215 - Weng, Chun-Jen
2003-08-07
Package with high heat dissipation
Grant 6,600,651 - Weng July 29, 2
2003-07-29

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed