Weng; Cheng-Yi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Weng; Cheng-Yi.The latest application filed is for "semiconductor package".

Company Profile

0.9.11

Weng; Cheng-Yi - Hsinchu TW
Weng; Cheng-Yi - Kaohsiung N/A TW
Weng; Cheng-Yi - Kaohsiung City TW
WENG; CHENG-YI - Kaohsiung City R.O.C. TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package Grant 9,735,132 - Yang , et al. August 15, 2	2017-08-15
Stacked semiconductor packages and related methods Grant 8,569,885 - Weng October 29, 2	2013-10-29
Semiconductor Package App 20130161816 - Chu; Chi-Chih ; et al.	2013-06-27
Semiconductor package Grant 8,405,212 - Chu , et al. March 26, 2	2013-03-26
Stackable semiconductor device packages Grant 8,198,131 - Weng , et al. June 12, 2	2012-06-12
Stacked Semiconductor Packages And Related Methods App 20120104607 - Weng; Cheng-Yi	2012-05-03
Stackable Semiconductor Device Packages App 20120049338 - Chen; Kuang-Hsiung ; et al.	2012-03-01
Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors Grant 8,076,765 - Chen , et al. December 13, 2	2011-12-13
Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries Grant 8,012,797 - Shen , et al. September 6, 2	2011-09-06
Semiconductor Package App 20110156251 - Chu; Chi-Chih ; et al.	2011-06-30
Stackable Semiconductor Device Packages App 20110117700 - WENG; CHENG-YI ; et al.	2011-05-19
Package-on-package device, semiconductor package and method for manufacturing the same Grant 7,838,334 - Yu , et al. November 23, 2	2010-11-23
Stackable Semiconductor Device Packages App 20100171207 - Shen; Chi-Chih ; et al.	2010-07-08
Stackable Semiconductor Device Packages App 20100171205 - CHEN; Kuang-Hsiung ; et al.	2010-07-08
Package-on-Package Device, Semiconductor Package, and Method for Manufacturing The Same App 20100171206 - Chu; Chi-Chih ; et al.	2010-07-08
Package-on-package Device, Semiconductor Package And Method For Manufacturing The Same App 20100133675 - Yu; Lin Wang ; et al.	2010-06-03
Chip Package Structure App 20100032822 - LIAO; CHEN-KAI ; et al.	2010-02-11

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