| Patent | Date |
|---|
Package With A Substrate Comprising Pad-on-pad Interconnects
App 20220310488 - FANG; Kun ; et al. | 2022-09-29 |
Integrated circuit (IC) packages employing split, double-sided metallization structures to facilitate a semiconductor die ("die") module employing stacked dice, and related fabrication methods
Grant 11,456,291 - We , et al. September 27, 2 | 2022-09-27 |
Package comprising a substrate with interconnect routing over solder resist layer and an integrated device coupled to the substrate and method for manufacturing the package
Grant 11,444,019 - Patil , et al. September 13, 2 | 2022-09-13 |
Thermal Structures Adapted To Electronic Device Heights In Integrated Circuit (ic) Packages
App 20220278016 - Patil; Aniket ; et al. | 2022-09-01 |
Package With A Substrate Comprising Periphery Interconnects
App 20220246531 - PATIL; Aniket ; et al. | 2022-08-04 |
Package Having A Substrate Comprising Surface Interconnects Aligned With A Surface Of The Substrate
App 20220246496 - WE; Hong Bok ; et al. | 2022-08-04 |
Circular Bond Finger Pad
App 20220238488 - BUOT; Joan Rey Villarba ; et al. | 2022-07-28 |
Ultra-low profile stacked RDL semiconductor package
Grant 11,393,808 - Patil , et al. July 19, 2 | 2022-07-19 |
Substrate Comprising Interconnects In A Core Layer Configured For Skew Matching
App 20220223499 - PATIL; Aniket ; et al. | 2022-07-14 |
Package Comprising A Substrate And Interconnect Device Configured For Diagonal Routing
App 20220223529 - BUOT; Joan Rey Villarba ; et al. | 2022-07-14 |
Antenna Module
App 20220200166 - WE; Hong Bok ; et al. | 2022-06-23 |
Multi-terminal integrated passive devices embedded on die and a method for fabricating the multi-terminal integrated passive devices
Grant 11,342,246 - Patil , et al. May 24, 2 | 2022-05-24 |
Package Comprising Inter-substrate Gradient Interconnect Structure
App 20220148952 - PATIL; Aniket ; et al. | 2022-05-12 |
Package Structure For Passive Component To Die Critical Distance Reduction
App 20220130741 - PATIL; Aniket ; et al. | 2022-04-28 |
Substrate Comprising Interconnects Embedded In A Solder Resist Layer
App 20220115312 - FANG; Kun ; et al. | 2022-04-14 |
Passive device orientation in core for improved power delivery in package
Grant 11,302,656 - We , et al. April 12, 2 | 2022-04-12 |
Nested interconnect structure in concentric arrangement for improved package architecture
Grant 11,296,024 - Patil , et al. April 5, 2 | 2022-04-05 |
Package and substrate comprising interconnects with semi-circular planar shape and/or trapezoid planar shape
Grant 11,296,022 - Patil , et al. April 5, 2 | 2022-04-05 |
Terminal Connection Routing
App 20220104359 - PATIL; Aniket ; et al. | 2022-03-31 |
Package comprising a substrate and a high-density interconnect structure coupled to the substrate
Grant 11,289,453 - Patil , et al. March 29, 2 | 2022-03-29 |
Package Comprising An Integrated Device Coupled To A Substrate Through A Cavity
App 20220077069 - PATIL; Aniket ; et al. | 2022-03-10 |
Package And Substrate Comprising Interconnects With Semi-circular Planar Shape And/or Trapezoid Planar Shape
App 20220068798 - PATIL; Aniket ; et al. | 2022-03-03 |
Substrate Comprising Interconnects Embedded In A Solder Resist Layer
App 20220068662 - FANG; Kun ; et al. | 2022-03-03 |
Asymmetric antenna structure
Grant 11,258,165 - We , et al. February 22, 2 | 2022-02-22 |
Packages With Local High-density Routing Region Embedded Within An Insulating Layer
App 20220051988 - PATIL; Aniket ; et al. | 2022-02-17 |
Redistribution Layer Connection
App 20220028816 - PATIL; Aniket ; et al. | 2022-01-27 |
Multi-terminal Integrated Passive Devices Embedded On Die And A Method For Fabricating The Multi-terminal Integrated Passive Devices
App 20220028756 - PATIL; Aniket ; et al. | 2022-01-27 |
Passive Device Orientation In Core For Improved Power Delivery In Package
App 20220028805 - WE; Hong Bok ; et al. | 2022-01-27 |
Integrated Circuit (ic) Packages Employing Split, Double-sided Metallization Structures To Facilitate A Semiconductor Die ("die") Module Employing Stacked Dice, And Related Fabrication Methods
App 20210407979 - We; Hong Bok ; et al. | 2021-12-30 |
Hybrid Metallization And Laminate Structure
App 20210407919 - PATIL; Aniket ; et al. | 2021-12-30 |
Substrate Comprising A High-density Interconnect Portion Embedded In A Core Layer
App 20210391247 - PATIL; Aniket ; et al. | 2021-12-16 |
Thermal Mitigation Die Using Back Side Etch
App 20210375712 - PATIL; Aniket ; et al. | 2021-12-02 |
Variable Dielectric Constant Materials In Same Layer Of A Package
App 20210375743 - PATIL; Aniket ; et al. | 2021-12-02 |
Multicore Substrate
App 20210375736 - BUOT; Joan Rey Villarba ; et al. | 2021-12-02 |
X.5 layer substrate
Grant 11,183,446 - Yeon , et al. November 23, 2 | 2021-11-23 |
Nested Interconnect Structure In Concentric Arrangement For Improved Package Architecture
App 20210358839 - PATIL; Aniket ; et al. | 2021-11-18 |
Electromagnetic interference shielding for packages and modules
Grant 11,177,223 - Patil , et al. November 16, 2 | 2021-11-16 |
Package Comprising Multi-level Vertically Stacked Redistribution Portions
App 20210351145 - PATIL; Aniket ; et al. | 2021-11-11 |
Package Comprising A Substrate With Interconnect Routing Over Solder Resist Layer
App 20210313266 - PATIL; Aniket ; et al. | 2021-10-07 |
Hybrid Package Apparatus And Method Of Fabricating
App 20210305141 - Patil; Aniket ; et al. | 2021-09-30 |
Stacked Module Package Interconnect Structure With Flex Cable
App 20210296280 - PATIL; Aniket ; et al. | 2021-09-23 |
Integrated Circuit (ic) Packages Employing Split, Double-sided Metallization Structures To Facilitate A Semiconductor Die ("die") Module Employing Stacked Dice, And Related Fabrication Methods
App 20210280523 - We; Hong Bok ; et al. | 2021-09-09 |
Package Comprising A Substrate And A High-density Interconnect Structure Coupled To The Substrate
App 20210272931 - PATIL; Aniket ; et al. | 2021-09-02 |
Through-package partial via on package edge
Grant 11,101,220 - We , et al. August 24, 2 | 2021-08-24 |
Package With Integrated Structure
App 20210249359 - PATIL; Aniket ; et al. | 2021-08-12 |
Substrate comprising recessed interconnects and a surface mounted passive component
Grant 11,075,260 - Kang , et al. July 27, 2 | 2021-07-27 |
Enhanced antenna module with shield layer
Grant 11,043,740 - Hwang , et al. June 22, 2 | 2021-06-22 |
Package Comprising A Double-sided Redistribution Portion
App 20210175178 - WE; Hong Bok ; et al. | 2021-06-10 |
Ultra-low Profile Stacked Rdl Semiconductor Package
App 20210104507 - PATIL; Aniket ; et al. | 2021-04-08 |
Package Comprising A Die And Die Side Redistribution Layers (rdl)
App 20210104467 - PATIL; Aniket ; et al. | 2021-04-08 |
Through-package Partial Via On Package Edge
App 20210066197A1 - | 2021-03-04 |
Enhanced Antenna Module with Flexible Portion
App 20210028539 - WE; Hong Bok ; et al. | 2021-01-28 |
Split conductive pad for device terminal
Grant 10,879,158 - Patil , et al. December 29, 2 | 2020-12-29 |
Double Sided Embedded Trace Substrate
App 20200388573 - KANG; Kuiwon ; et al. | 2020-12-10 |
Passive Device Embedded In A Fan-out Package-on-package Assembly
App 20200381405 - PATIL; Aniket ; et al. | 2020-12-03 |
Split Conductive Pad For Device Terminal
App 20200381344 - PATIL; Aniket ; et al. | 2020-12-03 |
Enhanced Antenna Module With Shield Layer
App 20200365983 - HWANG; Suhyung ; et al. | 2020-11-19 |
Asymmetric Antenna Structure
App 20200212545 - WE; Hong Bok ; et al. | 2020-07-02 |
Substrate Comprising Recessed Interconnects And A Surface Mounted Passive Component
App 20200135839 - KANG; Kuiwon ; et al. | 2020-04-30 |
Spilt Pad For Package Routing And Electrical Performance Improvement
App 20200111758 - PATIL; Aniket ; et al. | 2020-04-09 |
Integrated Circuit Cavity Formation With Multiple Interconnection Pads
App 20200091062 - YEON; Jaehyun ; et al. | 2020-03-19 |
Interface Substrate And Method Of Making The Same
App 20200066964 - ADAY; Jon Gregory ; et al. | 2020-02-27 |
Interface substrate and method of making the same
Grant 10,516,092 - Aday , et al. Dec | 2019-12-24 |
Integrated Circuit Chip Package Having Reduced Contact Pad Size
App 20190371652 - WE; Hong Bok ; et al. | 2019-12-05 |
Air cavity mold
Grant 10,490,472 - Fu , et al. Nov | 2019-11-26 |
Tapered Corner Package For Emi Shield
App 20190341352 - WE; Hong Bok ; et al. | 2019-11-07 |
Thermal and electromagnetic interference shielding for die embedded in package substrate
Grant 10,410,971 - Rae , et al. Sept | 2019-09-10 |
Array type inductor
Grant 10,403,707 - We , et al. Sep | 2019-09-03 |
Air Cavity Mold
App 20190067141 - FU; Jie ; et al. | 2019-02-28 |
Thermal And Electromagnetic Interference Shielding For Die Embedded In Package Substrate
App 20190067205 - RAE; David Fraser ; et al. | 2019-02-28 |
Integrated Circuit Package Comprising Surface Capacitor And Ground Plane
App 20190057880 - SONG; Young Kyu ; et al. | 2019-02-21 |
Integrated circuit package comprising surface capacitor and ground plane
Grant 10,181,410 - Song , et al. Ja | 2019-01-15 |
High density fan out package structure
Grant 10,157,823 - Kim , et al. Dec | 2018-12-18 |
Symmetric Embedded Trace Substrate
App 20180350630 - KANG; Kuiwon ; et al. | 2018-12-06 |
Array Type Inductor
App 20180286562 - WE; Hong Bok ; et al. | 2018-10-04 |
Capacitor structure for power delivery applications
Grant 10,079,097 - Song , et al. September 18, 2 | 2018-09-18 |
Semiconductor package on package structure and method of forming the same
Grant 10,049,977 - We , et al. August 14, 2 | 2018-08-14 |
Substrate block for PoP package
Grant 9,881,859 - We , et al. January 30, 2 | 2018-01-30 |
Low profile reinforced package-on-package semiconductor device
Grant 9,875,997 - We , et al. January 23, 2 | 2018-01-23 |
Interface Substrate And Method Of Making The Same
App 20170323926 - ADAY; Jon Gregory ; et al. | 2017-11-09 |
Stacked package configurations and methods of making the same
Grant 9,799,628 - Kim , et al. October 24, 2 | 2017-10-24 |
Fan-out Wafer-level Packages With Improved Topology
App 20170243845 - Lee; Jae Sik ; et al. | 2017-08-24 |
Polymer crack stop seal ring structure in wafer level package
Grant 9,679,855 - Lee , et al. June 13, 2 | 2017-06-13 |
Package substrate comprising capacitor, redistribution layer and discrete coaxial connection
Grant 9,659,850 - We , et al. May 23, 2 | 2017-05-23 |
Integrated Circuit Package Comprising Surface Capacitor And Ground Plane
App 20170125332 - Song; Young Kyu ; et al. | 2017-05-04 |
Embedded bridge structure in a substrate
Grant 9,642,259 - Kim , et al. May 2, 2 | 2017-05-02 |
Integrated device comprising flexible connector between integrated circuit (IC) packages
Grant 9,633,977 - We , et al. April 25, 2 | 2017-04-25 |
Integrated device comprising flexible connector between integrated circuit (IC) packages
Grant 9,633,950 - We , et al. April 25, 2 | 2017-04-25 |
Embedded multi-terminal capacitor
Grant 9,628,052 - We , et al. April 18, 2 | 2017-04-18 |
Interposer for a package-on-package structure
Grant 9,613,942 - Lee , et al. April 4, 2 | 2017-04-04 |
Embedding Die Technology
App 20170084594 - NA; Jongchil ; et al. | 2017-03-23 |
Substrate with conductive vias
Grant 9,596,768 - We , et al. March 14, 2 | 2017-03-14 |
Semiconductor package with high density die to die connection and method of making the same
Grant 9,595,494 - We , et al. March 14, 2 | 2017-03-14 |
Integrated device package comprising silicon bridge in an encapsulation layer
Grant 9,595,496 - Lee , et al. March 14, 2 | 2017-03-14 |
Damascene re-distribution layer (RDL) in fan out split die application
Grant 9,583,462 - Lee , et al. February 28, 2 | 2017-02-28 |
Integrated device package comprising conductive sheet configured as an inductor in an encapsulation layer
Grant 9,583,433 - Song , et al. February 28, 2 | 2017-02-28 |
Cavity Bridge Connection For Die Split Architecture
App 20160379959 - We; Hong Bok ; et al. | 2016-12-29 |
Capacitor Structure For Power Delivery Applications
App 20160365196 - SONG; Young Kyu ; et al. | 2016-12-15 |
Interposer For A Package-on-package Structure
App 20160358899 - LEE; Jae Sik ; et al. | 2016-12-08 |
Embedded package substrate capacitor
Grant 9,502,490 - We , et al. November 22, 2 | 2016-11-22 |
Semiconductor Package With High Density Die To Die Connection And Method Of Making The Same
App 20160329284 - WE; Hong Bok ; et al. | 2016-11-10 |
Integrated device comprising a heat-dissipation layer providing an electrical path for a ground signal
Grant 9,490,226 - Song , et al. November 8, 2 | 2016-11-08 |
Cavity Bridge Connection For Die Split Architecture
App 20160293572 - WE; Hong Bok ; et al. | 2016-10-06 |
Stacked Package Configurations And Methods Of Making The Same
App 20160293574 - KIM; Dong Wook ; et al. | 2016-10-06 |
Cavity bridge connection for die split architecture
Grant 9,443,824 - We , et al. September 13, 2 | 2016-09-13 |
Integrated Device Package Comprising Conductive Sheet Configured As An Inductor In An Encapsulation Layer
App 20160247761 - Song; Young Kyu ; et al. | 2016-08-25 |
Package-on-package (pop) Structure
App 20160225748 - We; Hong Bok ; et al. | 2016-08-04 |
Damascene Re-distribution Layer (rdl) In Fan Out Split Die Application
App 20160218082 - LEE; Jae Sik ; et al. | 2016-07-28 |
Package-on-package (POP) structure including multiple dies
Grant 9,401,350 - We , et al. July 26, 2 | 2016-07-26 |
Integrated device comprising coaxial interconnect
Grant 9,385,077 - Kim , et al. July 5, 2 | 2016-07-05 |
Substrate Comprising An Embedded Capacitor
App 20160183379 - Song; Young Kyu ; et al. | 2016-06-23 |
Low Profile Reinforced Package-on-package Semiconductor Device
App 20160172344 - WE; Hong Bok ; et al. | 2016-06-16 |
Integrated device package comprising bridge in litho-etchable layer
Grant 9,368,450 - Gu , et al. June 14, 2 | 2016-06-14 |
Package Substrate Comprising Capacitor, Redistribution Layer And Discrete Coaxial Connection
App 20160163628 - We; Hong Bok ; et al. | 2016-06-09 |
Semiconductor package interconnections and method of making the same
Grant 9,355,963 - Kim , et al. May 31, 2 | 2016-05-31 |
Integrated Device Package Comprising Silicon Bridge In Photo Imageable Layer
App 20160141234 - We; Hong Bok ; et al. | 2016-05-19 |
Integrated Device Package Comprising Silicon Bridge In An Encapsulation Layer
App 20160133571 - Lee; Jae Sik ; et al. | 2016-05-12 |
High Density Fan Out Package Structure
App 20160126173 - KIM; Dong Wook ; et al. | 2016-05-05 |
Semiconductor Package Interconnections And Method Of Making The Same
App 20160093571 - KIM; Dong Wook ; et al. | 2016-03-31 |
Flexible Film Electrical-test Substrates With Conductive Coupling Post(s) For Integrated Circuit (ic) Bump(s) Electrical Testing, And Related Methods And Testing Apparatuses
App 20160091532 - Song; Young Kyu ; et al. | 2016-03-31 |
Pattern between pattern for low profile substrate
Grant 9,269,610 - We , et al. February 23, 2 | 2016-02-23 |
Integrated Device Comprising A Heat-dissipation Layer Providing An Electrical Path For A Ground Signal
App 20160049378 - Song; Young Kyu ; et al. | 2016-02-18 |
Semiconductor Package On Package Structure And Method Of Forming The Same
App 20160035664 - WE; Hong Bok ; et al. | 2016-02-04 |
Integrated Device Comprising Coaxial Interconnect
App 20160013125 - Kim; Dong Wook ; et al. | 2016-01-14 |
Integrated device comprising high density interconnects and redistribution layers
Grant 9,230,936 - Kim , et al. January 5, 2 | 2016-01-05 |
Embedded Package Substrate Capacitor
App 20150340425 - We; Hong Bok ; et al. | 2015-11-26 |
SUBSTRATE BLOCK FOR PoP PACKAGE
App 20150325509 - We; Hong Bok ; et al. | 2015-11-12 |
Ceramic Interposer Capacitor
App 20150294791 - Hwang; Kyu-Pyung ; et al. | 2015-10-15 |
Pattern Between Pattern For Low Profile Substrate
App 20150294933 - We; Hong Bok ; et al. | 2015-10-15 |
Integrated Device Comprising High Density Interconnects And Redistribution Layers
App 20150255416 - Kim; Dong Wook ; et al. | 2015-09-10 |
Substrate With Conductive Vias
App 20150257282 - We; Hong Bok ; et al. | 2015-09-10 |
Embedded Multi-terminal Capacitor
App 20150236681 - We; Hong Bok ; et al. | 2015-08-20 |
Integrated Device Comprising Via With Side Barrier Layer Traversing Encapsulation Layer
App 20150228556 - Lee; Jae Sik ; et al. | 2015-08-13 |
Low Cost Connector For High Speed, High Density Signal Delivery
App 20150187731 - KIM; Dong Wook ; et al. | 2015-07-02 |
Embedded Bridge Structure In A Substrate
App 20150116965 - Kim; Chin-Kwan ; et al. | 2015-04-30 |
Display device and method for providing 3D image of the display device
App 20120200680 - So; Won Wook ; et al. | 2012-08-09 |
Black Box For Vehicle And Access Authorization Method Thereof
App 20120161952 - WE; Hong Bok ; et al. | 2012-06-28 |
Resistor And Method Of Forming A Resistor
App 20110279221 - WE; Hong-Bok ; et al. | 2011-11-17 |
Electronic Component-embedded Printed Circuit Board And Method Of Manufacturing The Same
App 20110083891 - WE; Hong Bok ; et al. | 2011-04-14 |
Electronic Component-embedded Printed Circuit Board And Method Of Manufacturing The Same
App 20110083892 - WE; Hong Bok ; et al. | 2011-04-14 |
Printed circuit board including electronic component embedded therein and method of manufacturing the same
App 20100078204 - We; Hong Bok ; et al. | 2010-04-01 |
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