Watkins; Charles M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Watkins; Charles M..The latest application filed is for "light emitting diodes with enhanced thermal sinking and associated methods of operation".

Company Profile

2.90.84

Watkins; Charles M. - Eagle ID
Watkins; Charles M. - Boise ID
Watkins; Charles M. - Meridian ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Light Emitting Diodes With Enhanced Thermal Sinking And Associated Methods Of Operation App 20220158066 - Tetz; Kevin ; et al.	2022-05-19
Light emitting diodes with enhanced thermal sinking and associated methods of operation Grant 11,239,403 - Tetz , et al. February 1, 2	2022-02-01
Microelectronic Workpiece Processing Systems And Associated Methods Of Color Correction App 20210343892 - Tetz; Kevin ; et al.	2021-11-04
Microelectronic workpiece processing systems and associated methods of color correction Grant 11,075,319 - Tetz , et al. July 27, 2	2021-07-27
Light Emitting Diodes With Enhanced Thermal Sinking And Associated Methods Of Operation App 20190341537 - Tetz; Kevin ; et al.	2019-11-07
Microelectronic Workpiece Processing Systems And Associated Methods Of Color Correction App 20190296183 - Tetz; Kevin ; et al.	2019-09-26
Light emitting diodes with enhanced thermal sinking and associated methods of operation Grant 10,403,805 - Tetz , et al. Sep	2019-09-03
Microelectronic workpiece processing systems and associated methods of color correction Grant 10,319,875 - Tetz , et al.	2019-06-11
Systems And Methods For Forming Apertures In Microfeature Workpieces App 20180304411 - Watkins; Charles M. ; et al.	2018-10-25
Systems and methods for forming apertures in microfeature workpieces Grant 10,010,977 - Watkins , et al. July 3, 2	2018-07-03
Light Emitting Diodes With Enhanced Thermal Sinking And Associated Methods Of Operation App 20170317256 - Tetz; Kevin ; et al.	2017-11-02
Light emitting diodes with enhanced thermal sinking and associated methods of operation Grant 9,748,461 - Tetz , et al. August 29, 2	2017-08-29
Light Emitting Devices With Built-in Chromaticity Conversion And Methods Of Manufacturing App 20170104126 - Basceri; Cem ; et al.	2017-04-13
Systems And Methods For Forming Apertures In Microfeature Workpieces App 20170008129 - Watkins; Charles M. ; et al.	2017-01-12
Light emitting devices with built-in chromaticity conversion and methods of manufacturing Grant 9,530,927 - Basceri , et al. December 27, 2	2016-12-27
Systems and methods for forming apertures in microfeature workpieces Grant 9,452,492 - Watkins , et al. September 27, 2	2016-09-27
Light Emitting Diodes With Enhanced Thermal Sinking And Associated Methods Of Operation App 20160197255 - Tetz; Kevin ; et al.	2016-07-07
Light Emitting Devices With Built-in Chromaticity Conversion And Methods Of Manufacturing App 20160027957 - Basceri; Cem ; et al.	2016-01-28
Light emitting diodes with enhanced thermal sinking and associated methods of operation Grant 9,236,550 - Tetz , et al. January 12, 2	2016-01-12
Light emitting devices with built-in chromaticity conversion and methods of manufacturing Grant 9,184,336 - Basceri , et al. November 10, 2	2015-11-10
Method for forming a light conversion material Grant 8,969,899 - Watkins , et al. March 3, 2	2015-03-03
Light Emitting Devices With Built-in Chromaticity Conversion And Methods Of Manufacturing App 20150004729 - Basceri; Cem ; et al.	2015-01-01
Light emitting devices with built-in chromaticity conversion and methods of manufacturing Grant 8,847,198 - Basceri , et al. September 30, 2	2014-09-30
Microelectronic Workpiece Processing Systems And Associated Methods Of Color Correction App 20140238298 - Tetz; Kevin ; et al.	2014-08-28
Coated color-converting particles and associated devices, systems, and methods Grant 8,816,371 - Watkins August 26, 2	2014-08-26
Systems And Methods For Forming Apertures In Microfeature Workpieces App 20140209582 - Watkins; Charles M. ; et al.	2014-07-31
Method of forming vias in semiconductor substrates and resulting structures Grant 8,786,097 - Watkins , et al. July 22, 2	2014-07-22
Microelectronic workpiece processing systems and associated methods of color correction Grant 8,716,038 - Tetz , et al. May 6, 2	2014-05-06
System and methods for forming apertures in microfeature workpieces Grant 8,686,313 - Watkins , et al. April 1, 2	2014-04-01
Through-wafer interconnects for photoimager and memory wafers Grant 8,669,179 - Akram , et al. March 11, 2	2014-03-11
Systems and methods for forming apertures in microfeature workpieces Grant 8,664,562 - Watkins , et al. March 4, 2	2014-03-04
Light emitting diodes and methods for manufacturing light emitting diodes Grant 8,633,500 - Watkins January 21, 2	2014-01-21
System And Methods For Forming Apertures In Microfeature Workpieces App 20140014635 - Watkins; Charles M. ; et al.	2014-01-16
Through-wafer Interconnects For Photoimager And Memory Wafers App 20130295766 - Akram; Salman ; et al.	2013-11-07
Systems and methods for forming apertures in microfeature workpieces Grant 8,536,485 - Watkins , et al. September 17, 2	2013-09-17
Through-wafer interconnects for photoimager and memory wafers Grant 8,502,353 - Akram , et al. August 6, 2	2013-08-06
Light Emitting Diodes With Enhanced Thermal Sinking And Associated Methods Of Operation App 20130175565 - Tetz; Kevin ; et al.	2013-07-11
Method For Forming A Light Conversion Material App 20130168719 - Watkins; Charles M. ; et al.	2013-07-04
Coated Color-converting Particles And Associated Devices, Systems, And Methods App 20130134460 - Watkins; Charles M.	2013-05-30
Method for forming a light conversion material Grant 8,420,415 - Watkins , et al. April 16, 2	2013-04-16
Light emitting diodes with enhanced thermal sinking and associated methods of operation Grant 8,384,105 - Tetz , et al. February 26, 2	2013-02-26
Light Emitting Diodes And Methods For Manufacturing Light Emitting Diodes App 20130001590 - Watkins; Charles M.	2013-01-03
Light Emitting Devices With Built-in Chromaticity Conversion And Methods Of Manufacturing App 20120298950 - Basceri; Cem ; et al.	2012-11-29
Light emitting diodes and methods for manufacturing light emitting diodes Grant 8,273,589 - Watkins September 25, 2	2012-09-25
Packaged microelectronic imagers and methods of packaging microelectronic imagers Grant 8,053,857 - Akram , et al. November 8, 2	2011-11-08
Light Emitting Diodes And Methods For Manufacturing Light Emitting Diodes App 20110227106 - Watkins; Charles M.	2011-09-22
Light Emitting Diodes With Enhanced Thermal Sinking And Associated Methods Of Operation App 20110227108 - Tetz; Kevin ; et al.	2011-09-22
Method For Forming A Light Conversion Material App 20110217800 - Watkins; Charles M. ; et al.	2011-09-08
Microelectronic Workpiece Processing Systems And Associated Methods Of Color Correction App 20110217794 - Tetz; Kevin ; et al.	2011-09-08
Through-wafer interconnects for photoimager and memory wafers Grant 7,956,443 - Akram , et al. June 7, 2	2011-06-07
Packaged Microelectronic Imagers And Methods Of Packaging Microelectronic Imagers App 20110089539 - Akram; Salman ; et al.	2011-04-21
Method Of Forming Vias In Semiconductor Substrates And Resulting Structures App 20110074043 - Watkins; Charles M. ; et al.	2011-03-31
Packaged microelectronic imagers and methods of packaging microelectronic imagers Grant 7,858,429 - Akram , et al. December 28, 2	2010-12-28
Method of forming vias in semiconductor substrates and resulting structures Grant 7,855,140 - Watkins , et al. December 21, 2	2010-12-21
Methods of redistributing bondpad locations on an integrated circuit Grant 7,795,737 - Watkins September 14, 2	2010-09-14
Microelectronics devices, having vias, and packaged microelectronic devices having vias Grant 7,759,800 - Rigg , et al. July 20, 2	2010-07-20
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers Grant 7,709,776 - Farnworth , et al. May 4, 2	2010-05-04
Through-wafer interconnects for photoimager and memory wafers Grant 7,683,458 - Akram , et al. March 23, 2	2010-03-23
Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies Grant 7,629,250 - Benson , et al. December 8, 2	2009-12-08
Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures Grant 7,598,167 - Watkins , et al. October 6, 2	2009-10-06
Methods for packing microfeature devices and microfeature devices formed by such methods Grant 7,579,684 - Benson , et al. August 25, 2	2009-08-25
Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies Grant 7,575,999 - Benson , et al. August 18, 2	2009-08-18
Microelectronic Imagers With Optical Devices And Methods Of Manufacturing Such Microelectronic Imagers App 20090155949 - Farnworth; Warren M. ; et al.	2009-06-18
Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material Grant 7,521,296 - Wood , et al. April 21, 2	2009-04-21
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers Grant 7,504,615 - Farnworth , et al. March 17, 2	2009-03-17
Microfeature workpieces, carriers, and associated methods Grant 7,498,240 - Hiatt , et al. March 3, 2	2009-03-03
Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same Grant 7,488,618 - Wood , et al. February 10, 2	2009-02-10
Compliant contact structure Grant 7,456,639 - Watkins , et al. November 25, 2	2008-11-25
Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials Grant 7,442,643 - Wood , et al. October 28, 2	2008-10-28
Integrated circuit and methods of redistributing bondpad locations Grant 7,439,169 - Watkins October 21, 2	2008-10-21
Microelectronic imagers and methods of packaging microelectronic imagers Grant 7,419,841 - Farnworth , et al. September 2, 2	2008-09-02
Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices Grant 7,413,979 - Rigg , et al. August 19, 2	2008-08-19
Method of forming compliant contact structures Grant 7,389,581 - Watkins , et al. June 24, 2	2008-06-24
Systems and methods for testing microfeature devices Grant 7,385,412 - Akram , et al. June 10, 2	2008-06-10
Method of testing using compliant contact structures, contactor cards and test system Grant 7,363,694 - Watkins , et al. April 29, 2	2008-04-29
Methods of packaging and testing microelectronic imaging devices Grant 7,341,881 - Watkins , et al. March 11, 2	2008-03-11
Packaged Microelectronic Imagers And Methods Of Packaging Microelectronic Imagers App 20080020505 - Akram; Salman ; et al.	2008-01-24
Method Of Forming Vias In Semiconductor Substrates And Resulting Structures App 20070262464 - Watkins; Charles M. ; et al.	2007-11-15
Packaged microelectronic imagers and methods of packaging microelectronic imagers Grant 7,294,897 - Akram , et al. November 13, 2	2007-11-13
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers Grant 7,265,330 - Farnworth , et al. September 4, 2	2007-09-04
Integrated circuit and methods of redistributing bondpad locations Grant 7,262,121 - Watkins August 28, 2	2007-08-28
Methods of redistributing bondpad locations on an integrated circuit App 20070194458 - Watkins; Charles M.	2007-08-23
Method for fabricating semiconductor components having encapsulated, bonded, interconnect contacts on redistribution contacts Grant 7,256,116 - Hiatt , et al. August 14, 2	2007-08-14
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers App 20070170350 - Farnworth; Warren M. ; et al.	2007-07-26
Methods for packaging a plurality of semiconductor dice using a flowable dielectric material Grant 7,235,431 - Wood , et al. June 26, 2	2007-06-26
Methods And Apparatuses For Releasably Attaching Microfeature Workpieces To Support Members App 20070134471 - Lake; Rickie C. ; et al.	2007-06-14
Microelectronic imagers and methods of packaging microelectronic imagers Grant 7,199,439 - Farnworth , et al. April 3, 2	2007-04-03
Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies App 20070066048 - Benson; Peter A. ; et al.	2007-03-22
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers Grant 7,189,954 - Farnworth , et al. March 13, 2	2007-03-13
Method for fabricating semiconductor components encapsulated, bonded, interconnect contacts on redistribution contacts App 20070048998 - Hiatt; William M. ; et al.	2007-03-01
Microfeature workpieces, carriers, and associated methods App 20070048902 - Hiatt; William M. ; et al.	2007-03-01
Methods for packaging microfeature devices and microfeature devices formed by such methods Grant 7,157,310 - Benson , et al. January 2, 2	2007-01-02
Systems and methods for testing microelectronic imagers and microfeature devices Grant 7,148,715 - Akram , et al. December 12, 2	2006-12-12
Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices App 20060264041 - Rigg; Sidney B. ; et al.	2006-11-23
Microelectronic imagers and methods of packaging microelectronic imagers App 20060261340 - Farnworth; Warren M. ; et al.	2006-11-23
Packaged microelectronic imaging devices and methods of packaging microelectronic imaging device App 20060255418 - Watkins; Charles M. ; et al.	2006-11-16
Systems and methods for testing microelectronic imagers and microfeature devices App 20060255826 - Akram; Salman ; et al.	2006-11-16
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers App 20060243889 - Farnworth; Warren M. ; et al.	2006-11-02
System having semiconductor component with encapsulated, bonded, interconnect contacts Grant 7,129,573 - Hiatt , et al. October 31, 2	2006-10-31
Integrated circuit and methods of redistributing bondpad locations App 20060223298 - Watkins; Charles M.	2006-10-05
Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices Grant 7,115,961 - Watkins , et al. October 3, 2	2006-10-03
Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices App 20060216862 - Rigg; Sidney B. ; et al.	2006-09-28
Integrated circuit and methods of redistributing bondpad locations App 20060214309 - Watkins; Charles M.	2006-09-28
Programmed material consolidation processes for fabricating electrical contacts and the resulting electrical contacts App 20060211313 - Farnworth; Warren M. ; et al.	2006-09-21
Methods for fabricating electronic device components that include protruding contacts and electronic device components so fabricated App 20060205291 - Farnworth; Warren M. ; et al.	2006-09-14
Methods for packaging microfeature devices and microfeature devices formed by such methods App 20060205116 - Benson; Peter A. ; et al.	2006-09-14
Systems and methods for forming apertures in microfeature workpieces App 20060191882 - Watkins; Charles M. ; et al.	2006-08-31
Systems and methods for forming apertures in microfeature workpieces App 20060186097 - Watkins; Charles M. ; et al.	2006-08-24
Electrical contacts with dielectric cores Grant 7,094,117 - Farnworth , et al. August 22, 2	2006-08-22
Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices Grant 7,091,124 - Rigg , et al. August 15, 2	2006-08-15
Microelectronic workpieces and methods for forming interconnects in microelectronic workpieces App 20060177999 - Hembree; David R. ; et al.	2006-08-10
Methods and apparatus for releasably attaching microfeature workpieces to support members App 20060162850 - Lake; Rickie C. ; et al.	2006-07-27
Method of testing using compliant contact structures, contactor cards and test system App 20060137171 - Watkins; Charles M. ; et al.	2006-06-29
Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same App 20060134827 - Wood; Alan G. ; et al.	2006-06-22
Compliant contact structure App 20060125500 - Watkins; Charles M. ; et al.	2006-06-15
Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials App 20060115926 - Wood; Alan G. ; et al.	2006-06-01
Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material App 20060115925 - Wood; Alan G. ; et al.	2006-06-01
Compliant contract structures, contactor cards and test system including same Grant 7,030,632 - Watkins , et al. April 18, 2	2006-04-18
Manufacturing of field emission display screens by application of phosphor particles and conductive binders Grant 7,021,982 - Chadha , et al. April 4, 2	2006-04-04
Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices App 20060043509 - Watkins; Charles M. ; et al.	2006-03-02
Methods for packaging microfeature devices and microfeature devices formed by such methods App 20060046346 - Benson; Peter A. ; et al.	2006-03-02
Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures App 20060046463 - Watkins; Charles M. ; et al.	2006-03-02
Die package, conductive element, semiconductor device including same, microlens, system including same, and methods of manufacture App 20060046347 - Wood; Alan G. ; et al.	2006-03-02
Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies App 20060046461 - Benson; Peter A. ; et al.	2006-03-02
Integrated circuit and methods of redistributing bondpad locations App 20060022350 - Watkins; Charles M.	2006-02-02
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers App 20060011809 - Farnworth; Warren M. ; et al.	2006-01-19
Packaged microelectronic imagers and methods of packaging microelectronic imagers App 20050285154 - Akram, Salman ; et al.	2005-12-29
Microelectronic imagers and methods of packaging microelectronic imagers App 20050275048 - Farnworth, Warren M. ; et al.	2005-12-15
Systems and methods for testing microelectronic imagers and microfeature devices App 20050270055 - Akram, Salman ; et al.	2005-12-08
Apparatus for supporting wafers for die singulation and subsequent handling and in-process wafer structure App 20050255675 - Farnworth, Warren M. ; et al.	2005-11-17
Systems and methods for forming apertures in microfeature workpieces App 20050247894 - Watkins, Charles M. ; et al.	2005-11-10
Compliant contact structures, contactor cards and test system including same, and methods of fabrication and use App 20050202576 - Watkins, Charles M. ; et al.	2005-09-15
Electrical contacts, devices including the same, and associated methods of fabrication App 20050191913 - Farnworth, Warren M. ; et al.	2005-09-01
Semiconductor component having encapsulated, bonded, interconnect contacts Grant 6,906,418 - Hiatt , et al. June 14, 2	2005-06-14
Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices App 20050104228 - Rigg, Sidney B. ; et al.	2005-05-19
Compliant contact structures, contactor cards and test system including same, and methods of fabrication and use App 20050077913 - Watkins, Charles M. ; et al.	2005-04-14
Method and apparatus for supporting wafers for die singulation and subsequent handling App 20050064683 - Farnworth, Warren M. ; et al.	2005-03-24
System having semiconductor component with encapsulated, bonded, interconnect contacts App 20050064695 - Hiatt, William M. ; et al.	2005-03-24
Method of fabricating semiconductor component having encapsulated, bonded, interconnect contacts Grant 6,803,303 - Hiatt , et al. October 12, 2	2004-10-12
Semiconductor component having encapsulated, bonded, interconnect contacts and method of fabrication App 20040018713 - Hiatt, William M. ; et al.	2004-01-29
Focusing electrode and method for field emission displays Grant 6,633,113 - Xia , et al. October 14, 2	2003-10-14
Binders for field emission displays App 20030122477 - Chadha, Surjit J. ; et al.	2003-07-03
Focusing electrode and method for field emission displays App 20020130611 - Xia, Zhongyi ; et al.	2002-09-19
Focusing electrode and method for field emission displays App 20020125478 - Xia, Zhongyi ; et al.	2002-09-12
Faceplates having scrubbed cathodoluminescent layers for field emission displays Grant 6,414,429 - Watkins , et al. July 2, 2	2002-07-02
Low-voltage cathode for scrubbing cathodoluminescent layers for field emission displays and method App 20020031976 - Watkins, Charles M. ; et al.	2002-03-14
Low-voltage cathode for scrubbing cathodoluminescent layers for field emission displays and method App 20020019188 - Watkins, Charles M. ; et al.	2002-02-14
Low-voltage cathode for scrubbing cathodoluminescent layers for field emission displays and method App 20020014830 - Watkins, Charles M. ; et al.	2002-02-07
Low-voltage cathode for scrubbing cathodoluminescent layers for field emission displays and method App 20020014831 - Watkins, Charles M. ; et al.	2002-02-07
Low-voltage cathode for scrubbing cathodoluminescent layers for field emission displays and method App 20020013116 - Watkins, Charles M. ; et al.	2002-01-31
Fiber spacers in large area vacuum displays and method for manufacture of same App 20010012744 - Cathey, David A. ; et al.	2001-08-09
Fiber spacers in large area vacuum displays and method for manufacture of same Grant 6,183,329 - Cathey , et al. February 6, 2	2001-02-06
Field emission display with non-evaporable getter material Grant 6,127,777 - Watkins , et al. October 3, 2	2000-10-03
Display device with grille having getter material Grant 6,054,808 - Watkins , et al. April 25, 2	2000-04-25
Field emission display with non-evaporable getter material Grant 6,033,278 - Watkins , et al. March 7, 2	2000-03-07
Display device with grille having getter material Grant 5,931,713 - Watkins , et al. August 3, 1	1999-08-03
Manufacturing process for high-purity phosphors having utility in field emission displays Grant 5,906,771 - Watkins , et al. May 25, 1	1999-05-25
Low temperature method for evacuating and sealing field emission displays Grant 5,827,102 - Watkins , et al. October 27, 1	1998-10-27
Process for aligning and sealing field emission displays Grant 5,807,154 - Watkins September 15, 1	1998-09-15
Fiber spacers in large area vacuum displays and method for manufacture of same Grant 5,795,206 - Cathey , et al. August 18, 1	1998-08-18
Visible light-emitting phosphor composition having an enhanced luminescent efficiency over a broad range of voltages Grant 5,788,881 - Chadha , et al. August 4, 1	1998-08-04
Field emission display with non-evaporable getter material Grant 5,789,859 - Watkins , et al. August 4, 1	1998-08-04
Specialized phosphors prepared by a multi-stage grinding and firing sequence Grant 5,635,110 - Chadha , et al. June 3, 1	1997-06-03