Watase; Toshihiko
Patent Applications and Registrations
Patent applications and USPTO patent grants for Watase; Toshihiko.The latest application filed is for "abrasive material having a structured surface".
- Watase; Toshihiko - Tokyo JP
| Patent | Date |
|---|---|
| Abrasive Material Having A Structured Surface App 20170008143 - Minami; Hideki ; et al. | 2017-01-12 |
| Abrasive pad for CMP Grant 6,776,699 - Amano , et al. August 17, 2 | 2004-08-17 |
| Abrasive pad for cmp App 20040003895 - Amano, Takashi ; et al. | 2004-01-08 |
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