| Patent | Date |
|---|
Mitigation of hot carrier damage in field-effect transistors
Grant 10,566,446 - Wang , et al. Feb | 2020-02-18 |
Mitigation Of Hot Carrier Damage In Field-effect Transistors
App 20190371918 - Wang; Yun-Yu ; et al. | 2019-12-05 |
Liner replacements for interconnect openings
Grant 9,953,927 - Wang , et al. April 24, 2 | 2018-04-24 |
Generating tensile strain in bulk finFET channel
Grant 9,685,553 - Wang , et al. June 20, 2 | 2017-06-20 |
Sram-like Ebi Structure Design And Implementation To Capture Mosfet Source-drain Leakage Eariler
App 20170154687 - Song; Zhigang ; et al. | 2017-06-01 |
Method of producing an un-distorted dark field strain map at high spatial resolution through dark field electron holography
Grant 9,551,674 - Wang , et al. January 24, 2 | 2017-01-24 |
Generating Tensile Strain In Bulk Finfet Channel
App 20160372598 - Wang; Yun-Yu ; et al. | 2016-12-22 |
3D transistor channel mobility enhancement
Grant 9,275,907 - Chan , et al. March 1, 2 | 2016-03-01 |
Method of replacement source/drain for 3D CMOS transistors
Grant 9,105,741 - Chan , et al. August 11, 2 | 2015-08-11 |
3D transistor channel mobility enhancement
Grant 9,023,697 - Chan , et al. May 5, 2 | 2015-05-05 |
Selective Passivation Of Vias
App 20150076695 - Cheng; Tien-Jen ; et al. | 2015-03-19 |
3d Transistor Channel Mobility Enhancement
App 20150041911 - CHAN; KEVIN K. ; et al. | 2015-02-12 |
3d Transistor Channel Mobility Enhancement
App 20150041858 - CHAN; KEVIN K. ; et al. | 2015-02-12 |
Scaling of metal gate with aluminum containing metal layer for threshold voltage shift
Grant 8,901,674 - Wong , et al. December 2, 2 | 2014-12-02 |
FET device with stabilized threshold modifying material
Grant 8,735,243 - Copel , et al. May 27, 2 | 2014-05-27 |
Copper Seed Layer For An Interconnect Structure Having A Doping Concentration Level Gradient
App 20140138832 - Niu; Chengyu ; et al. | 2014-05-22 |
Copper seed layer for an interconnect structure having a doping concentration level gradient
Grant 8,729,702 - Niu , et al. May 20, 2 | 2014-05-20 |
Replacement Source/drain For 3d Cmos Transistors
App 20140070316 - Chan; Kevin K. ; et al. | 2014-03-13 |
Voltage sensitive resistor (VSR) read only memory
Grant 8,536,555 - Kane , et al. September 17, 2 | 2013-09-17 |
Voltage Sensitive Resistor (vsr) Read Only Memory
App 20130189824 - Kane; Terence L. ; et al. | 2013-07-25 |
Method of fabricating a device using low temperature anneal processes, a device and design structure
Grant 8,490,029 - Domenicucci , et al. July 16, 2 | 2013-07-16 |
Voltage sensitive resistor (VSR) read only memory
Grant 8,466,443 - Kane , et al. June 18, 2 | 2013-06-18 |
Post chemical mechanical polishing etch for improved time dependent dielectric breakdown reliability
Grant 8,465,657 - Chanda , et al. June 18, 2 | 2013-06-18 |
Antifuse structure for in line circuit modification
Grant 8,367,483 - Kane , et al. February 5, 2 | 2013-02-05 |
Antifuse structure for in line circuit modification
Grant 8,368,069 - Kane , et al. February 5, 2 | 2013-02-05 |
Antifuse structure for in line circuit modification
Grant 8,368,070 - Kane , et al. February 5, 2 | 2013-02-05 |
Antifuse structure for in line circuit modification
Grant 8,367,484 - Kane , et al. February 5, 2 | 2013-02-05 |
Reducing dislocation formation in semiconductor devices through targeted carbon implantation
Grant 8,343,825 - Domenicucci , et al. January 1, 2 | 2013-01-01 |
Detecting asymmetrical transistor leakage defects
Grant 8,294,485 - Ouyang , et al. October 23, 2 | 2012-10-23 |
Method of fabricating a device using low temperature anneal processes, a device and design structure
Grant 8,236,709 - Domenicucci , et al. August 7, 2 | 2012-08-07 |
Reducing Dislocation Formation In Semiconductor Devices Through Targeted Carbon Implantation
App 20120184075 - Domenicucci; Anthony G. ; et al. | 2012-07-19 |
Method Of Fabricating A Device Using Low Temperature Anneal Processes, A Device And Design Structure
App 20120180010 - DOMENICUCCI; Anthony G. ; et al. | 2012-07-12 |
Antifuse Structure For In Line Circuit Modification
App 20120126366 - Kane; Terence L. ; et al. | 2012-05-24 |
Antifuse Structure For In Line Circuit Modification
App 20120126367 - Kane; Terence L. ; et al. | 2012-05-24 |
Antifuse Structure For In Line Circuit Modification
App 20120129340 - Kane; Terence L. ; et al. | 2012-05-24 |
Antifuse Structure For In Line Circuit Modification
App 20120122280 - Kane; Terence L. ; et al. | 2012-05-17 |
Interconnect structure having enhanced electromigration reliability and a method of fabricating same
Grant 8,138,083 - Yang , et al. March 20, 2 | 2012-03-20 |
Antifuse structure for in line circuit modification
Grant 8,125,048 - Kane , et al. February 28, 2 | 2012-02-28 |
Geometry based electrical hotspot detection in integrated circuit layouts
Grant 8,108,803 - Heng , et al. January 31, 2 | 2012-01-31 |
Voltage Sensitive Resistor (vsr) Read Only Memory
App 20120001140 - Kane; Terence L. ; et al. | 2012-01-05 |
Method of reducing stacking faults through annealing
Grant 7,956,417 - Wang , et al. June 7, 2 | 2011-06-07 |
Geometry Based Electrical Hotspot Detection In Integrated Circuit Layouts
App 20110099529 - Heng; Fook-Luen ; et al. | 2011-04-28 |
Antifuse Structure For In Line Circuit Modification
App 20110079874 - Kane; Terence L. ; et al. | 2011-04-07 |
Method for preventing backside defects in dielectric layers formed on semiconductor substrates
Grant 7,910,484 - Dziobkowski , et al. March 22, 2 | 2011-03-22 |
Stacking fault reduction in epitaxially grown silicon
Grant 7,893,493 - Wang , et al. February 22, 2 | 2011-02-22 |
Method of Fabricating a Device Using Low Temperature Anneal Processes, a Device and Design Structure
App 20110027956 - DOMENICUCCI; Anthony G. ; et al. | 2011-02-03 |
Programmable precision resistor and method of programming the same
Grant 7,881,093 - Domenicucci , et al. February 1, 2 | 2011-02-01 |
Mood-Interacting Shoe Device
App 20100328088 - Lin; Chyi-Cheng ; et al. | 2010-12-30 |
Structure including via having refractory metal collar at copper wire and dielectric layer liner-less interface and related method
Grant 7,859,113 - Edelstein , et al. December 28, 2 | 2010-12-28 |
Compressive nitride film and method of manufacturing thereof
Grant 7,851,376 - Yang , et al. December 14, 2 | 2010-12-14 |
Method Of Reducing Stacking Faults Through Annealing
App 20100283089 - Wang; Yun-Yu ; et al. | 2010-11-11 |
Structure to improve adhesion between top CVD low-K dielectric and dielectric capping layer
Grant 7,820,559 - Clevenger , et al. October 26, 2 | 2010-10-26 |
Decoder for a stationary switch machine
Grant 7,820,501 - Wang , et al. October 26, 2 | 2010-10-26 |
Metal cap for interconnect structures
Grant 7,790,599 - Yang , et al. September 7, 2 | 2010-09-07 |
Detecting Asymmetrical Transistor Leakage Defects
App 20100201376 - Ouyang; Xu ; et al. | 2010-08-12 |
Stacking fault reduction in epitaxially grown silicon
Grant 7,674,720 - Wang , et al. March 9, 2 | 2010-03-09 |
Programmable Precision Resistor And Method Of Programming The Same
App 20100025819 - Domenicucci; Anthony G. ; et al. | 2010-02-04 |
Method Of Fabricating A Gate Structure
App 20090311855 - Bruff; Richard A. ; et al. | 2009-12-17 |
Interconnect Structure Having Enhanced Electromigration Reliabilty And A Method Of Fabricating Same
App 20090289368 - Yang; Chih-Chao ; et al. | 2009-11-26 |
Interconnect structure having enhanced electromigration reliability and a method of fabricating same
Grant 7,569,475 - Yang , et al. August 4, 2 | 2009-08-04 |
Method of forming an interconnect including a dielectric cap having a tensile stress
Grant 7,563,704 - Yang , et al. July 21, 2 | 2009-07-21 |
Integration Scheme For Extension Of Via Opening Depth
App 20090181532 - Colon; David P. ; et al. | 2009-07-16 |
Method For Preventing Backside Defects In Dielectric Layers Formed On Semiconductor Substrates
App 20090181544 - Dziobkowski; Chester T. ; et al. | 2009-07-16 |
Method of TEM sample preparation for electron holography for semiconductor devices
Grant 7,560,692 - Barton , et al. July 14, 2 | 2009-07-14 |
Compressive Nitride Film And Method Of Manufacturing Thereof
App 20090137109 - Yang; Daewon ; et al. | 2009-05-28 |
Method of room temperature growth of SiO.sub.x on silicide as an etch stop layer for metal contact open of semiconductor devices
Grant 7,538,029 - Wang , et al. May 26, 2 | 2009-05-26 |
Advanced Correlation And Process Window Evaluation Application
App 20090119357 - Rice; James P. ; et al. | 2009-05-07 |
Method Of Fabricating A Gate Structure And The Structure Thereof
App 20090101980 - Bruff; Richard A. ; et al. | 2009-04-23 |
Compressive nitride film and method of manufacturing thereof
Grant 7,514,370 - Yang , et al. April 7, 2 | 2009-04-07 |
Methods for forming CMOS devices with intrinsically stressed metal silicide layers
Grant 7,504,336 - Purtell , et al. March 17, 2 | 2009-03-17 |
IC chip uniform delayering methods
Grant 7,504,337 - Barton , et al. March 17, 2 | 2009-03-17 |
Copper contact via structure using hybrid barrier layer
Grant 7,498,256 - Knarr , et al. March 3, 2 | 2009-03-03 |
Back end interconnect with a shaped interface
Grant 7,494,915 - Clevenger , et al. February 24, 2 | 2009-02-24 |
FET Device with Stabilized Threshold Modifying Material
App 20090039447 - Copel; Matthew W. ; et al. | 2009-02-12 |
Method to improve time dependent dielectric breakdown
Grant 7,473,636 - Chanda , et al. January 6, 2 | 2009-01-06 |
Stacking Fault Reduction In Epitaxially Grown Silicon
App 20080268609 - Wang; Yun-Yu ; et al. | 2008-10-30 |
Metal Cap For Interconnect Structures
App 20080254624 - Yang; Chih-Chao ; et al. | 2008-10-16 |
Structure To Improve Adhesion Between Top Cvd Low-k Dielectric And Dielectric Capping Layer
App 20080254643 - Clevenger; Lawrence A. ; et al. | 2008-10-16 |
Ic Chip Uniform Delayering Methods
App 20080233751 - Barton; Keith E. ; et al. | 2008-09-25 |
Barrier Dielectric Stack For Seam Protection
App 20080227247 - Engel; Brett H. ; et al. | 2008-09-18 |
Structure Including Via Having Refractory Metal Collar At Copper Wire And Dielectric Layer Liner-less Interface And Related Method
App 20080203570 - Edelstein; Daniel C. ; et al. | 2008-08-28 |
Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer
Grant 7,402,532 - Clevenger , et al. July 22, 2 | 2008-07-22 |
Barrier dielectric stack for seam protection
Grant 7,397,073 - Engel , et al. July 8, 2 | 2008-07-08 |
Method Of Tem Sample Preparation For Electron Holography For Semiconductor Devices
App 20080156987 - Barton; Keith E. ; et al. | 2008-07-03 |
Interconnect Structure Having Enhanced Electromigration Reliabilty And A Method Of Fabricating Same
App 20080111239 - Yang; Chih-Chao ; et al. | 2008-05-15 |
HDP-based ILD capping layer
Grant 7,372,158 - Wang , et al. May 13, 2 | 2008-05-13 |
Method Of Reducing Stacking Faults Through Annealing
App 20080087961 - Wang; Yun-Yu ; et al. | 2008-04-17 |
Copper Contact Via Structure Using Hybrid Barrier Layer
App 20080042291 - Knarr; Randolph F. ; et al. | 2008-02-21 |
Silicide Cap Structure And Process For Reduced Stress And Improved Gate Sheet Resistance
App 20080020535 - Gulari; Levent ; et al. | 2008-01-24 |
Method for reducing dendrite formation in nickel silicon salicide processes
Grant 7,320,938 - Purtell , et al. January 22, 2 | 2008-01-22 |
Stacking Fault Reduction In Epitaxially Grown Silicon
App 20080006876 - Wang; Yun-Yu ; et al. | 2008-01-10 |
Structure And Method For Forming Cmos Devices With Intrinsically Stressed Silicide Using Silicon Nitride Cap
App 20070269970 - Purtell; Robert J. ; et al. | 2007-11-22 |
Post Chemical Mechanical Polishing Etch For Improved Time Dependent Dielectric Breakdown Reliability
App 20070267386 - Chanda; Kaushik ; et al. | 2007-11-22 |
Compressive Nitride Film And Method Of Manufacturing Thereof
App 20070269992 - Yang; Daewon ; et al. | 2007-11-22 |
Method of forming interconnect structure or interconnect and via structures using post chemical mechanical polishing
Grant 7,287,325 - Chanda , et al. October 30, 2 | 2007-10-30 |
Electroless Cobalt-containing Liner For Middle-of-the-line (mol) Applications
App 20070210448 - Wong; Keith Kwong Hon ; et al. | 2007-09-13 |
Method to Improve Time Dependent Dielectric Breakdown
App 20070158851 - Chanda; Kaushik ; et al. | 2007-07-12 |
Method for depositing a metal layer on a semiconductor interconnect structure having a capping layer
Grant 7,241,696 - Clevenger , et al. July 10, 2 | 2007-07-10 |
Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer
App 20070148958 - Clevenger; Lawrence A. ; et al. | 2007-06-28 |
Method For Enhanced Uni-directional Diffusion Of Metal And Subsequent Silicide Formation
App 20070128867 - Domenicucci; Anthony G. ; et al. | 2007-06-07 |
Transmission electron microscopy sample preparation method for electron holography
Grant 7,214,935 - Bauer , et al. May 8, 2 | 2007-05-08 |
Method for enhanced uni-directional diffusion of metal and subsequent silicide formation
Grant 7,208,414 - Domenicucci , et al. April 24, 2 | 2007-04-24 |
Method And Apparatus For Deposition & Formation Of Metal Silicides
App 20070087541 - Giewont; Kenneth John ; et al. | 2007-04-19 |
Method And Structure Of Forming An Interconnect Including A Dielectric Cap Having A Tensile Stress
App 20070063348 - Yang; Chih-Chao ; et al. | 2007-03-22 |
Bilayer cap structure including HDP/bHDP films for conductive metallization and method of making same
Grant 7,179,760 - Conti , et al. February 20, 2 | 2007-02-20 |
Method For Reducing Dendrite Formation In Nickel Silicon Salicide Processes
App 20070020929 - Purtell; Robert J. ; et al. | 2007-01-25 |
METHOD OF ROOM TEMPERATURE GROWTH OF SIOx ON SILICIDE AS AN ETCH STOP LAYER FOR METAL CONTACT OPEN OF SEMICONDUCTOR DEVICES
App 20070010093 - Wang; Yun-Yu ; et al. | 2007-01-11 |
Improved Hdp-based Ild Capping Layer
App 20070004206 - Wang; Yun-Yu ; et al. | 2007-01-04 |
Back End Interconnect With A Shaped Interface
App 20060292852 - Clevenger; Lawrence A. ; et al. | 2006-12-28 |
BILAYER CAP STRUCTURE INCLUDING HDP/bHDP FILMS FOR CONDUCTIVE METALLIZATION AND METHOD OF MAKING SAME
App 20060270245 - Conti; Richard A. ; et al. | 2006-11-30 |
HDP-based ILD capping layer
Grant 7,138,717 - Wang , et al. November 21, 2 | 2006-11-21 |
Post Chemical Mechanical Polishing Etch For Improved Time Dependent Dielectric Breakdown Reliability
App 20060254053 - Chanda; Kaushik ; et al. | 2006-11-16 |
Method for controlling voiding and bridging in silicide formation
Grant 7,129,169 - Jones , et al. October 31, 2 | 2006-10-31 |
Back end interconnect with a shaped interface
Grant 7,122,462 - Clevenger , et al. October 17, 2 | 2006-10-17 |
Method for reducing dendrite formation in nickel silicon salicide processes
Grant 7,109,116 - Purtell , et al. September 19, 2 | 2006-09-19 |
System and method for improving spatial resolution of electron holography
Grant 7,102,145 - Domenicucci , et al. September 5, 2 | 2006-09-05 |
Method and structure for reduction of contact resistance of metal silicides using a metal-germanium alloy
Grant 7,102,234 - Cabral, Jr. , et al. September 5, 2 | 2006-09-05 |
Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer
Grant 7,102,232 - Clevenger , et al. September 5, 2 | 2006-09-05 |
Method to generate porous organic dielectric
Grant 7,101,784 - Clevenger , et al. September 5, 2 | 2006-09-05 |
Silicide Cap Structure And Process For Reduced Stress And Improved Gate Sheet Resistance
App 20060163671 - Gulari; Levent ; et al. | 2006-07-27 |
Structure for controlling the interface roughness of cobalt disilicide
Grant 7,081,676 - Agnello , et al. July 25, 2 | 2006-07-25 |
Improved Hdp-based Ild Capping Layer
App 20060113672 - Wang; Yun-Yu ; et al. | 2006-06-01 |
Barrier Dielectric Stack for Seam Protection
App 20060108609 - Engel; Brett H. ; et al. | 2006-05-25 |
Nanoscale Defect Image Detection For Semiconductors
App 20060098862 - Demarest; James J. ; et al. | 2006-05-11 |
System and method for improving spatial resolution of electron holography
App 20060097167 - Domenicucci; Anthony G. ; et al. | 2006-05-11 |
Transmission Electron Microscopy Sample Preparation Method For Electron Holography
App 20060065830 - Bauer; Thomas A. ; et al. | 2006-03-30 |
Electron holography method
Grant 7,015,469 - Wang , et al. March 21, 2 | 2006-03-21 |
Structure And Method For Enhanced Uni-directional Diffusion Of Cobalt Silicide
App 20060057844 - Domenicucci; Anthony G. ; et al. | 2006-03-16 |
Nitride and polysilicon interface with titanium layer
App 20060001162 - Schutz; Ronald J. ; et al. | 2006-01-05 |
Method For Controlling Voiding And Bridging In Silicide Formation
App 20050255699 - Jones, Bradley P. ; et al. | 2005-11-17 |
Structure to improve adhesion between top CVD low-k dielectiric and dielectric capping layer
App 20050230831 - Clevenger, Lawrence A. ; et al. | 2005-10-20 |
Method to generate porous organic dielectric
App 20050200024 - Clevenger, Lawrence A. ; et al. | 2005-09-15 |
Method to generate porous organic dielectric
Grant 6,921,978 - Clevenger , et al. July 26, 2 | 2005-07-26 |
Method for forming metal replacement gate of high performance
Grant 6,921,711 - Cabral, Jr. , et al. July 26, 2 | 2005-07-26 |
Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures and method thereof
Grant 6,914,320 - Chen , et al. July 5, 2 | 2005-07-05 |
Back End Interconnect With a Shaped Interface
App 20050112864 - Clevenger, Lawrence A. ; et al. | 2005-05-26 |
Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect structures and method thereof
Grant 6,887,783 - Chen , et al. May 3, 2 | 2005-05-03 |
Site-specific methodology for localization and analyzing junction defects in mosfet devices
Grant 6,884,641 - Bruley , et al. April 26, 2 | 2005-04-26 |
Pre-anneal of CoSi, to prevent formation of amorphous layer between Ti-O-N and CoSi
Grant 6,878,624 - Bruley , et al. April 12, 2 | 2005-04-12 |
Pre-anneal Of Cosi, To Prevent Formation Of Amorphous Layer Between Ti-o-n And Cosi
App 20050070098 - Bruley, John ; et al. | 2005-03-31 |
Method and apparatus for deposition & formation of metal silicides
App 20050067745 - Giewont, Kenneth John ; et al. | 2005-03-31 |
Site-specific Methodology For Localization And Analyzing Junction Defects In Mosfet Devices
App 20050064610 - BRULEY, JOHN ; et al. | 2005-03-24 |
Structure And Method For Metal Replacement Gate Of High Performance
App 20050051854 - Cabral, Cyril JR. ; et al. | 2005-03-10 |
Method To Generate Porous Organic Dielectric
App 20040224494 - Clevenger, Lawrence A. ; et al. | 2004-11-11 |
Method and structure for controlling the interface roughness of cobalt disilicide
Grant 6,809,030 - Agnello , et al. October 26, 2 | 2004-10-26 |
Method and structure for reduction of contact resistance of metal silicides using a metal-germanium alloy
App 20040195695 - Cabral,, Cyril JR. ; et al. | 2004-10-07 |
Electron holography method
App 20040195506 - Wang, Yun-Yu ; et al. | 2004-10-07 |
Bilayer HDP CVD / PE CVD cap in advanced BEOL interconnect structures and method thereof
App 20040173907 - Chen, Tze-Chiang ; et al. | 2004-09-09 |
Method and structure for reduction of contact resistance of metal silicides using a metal-germanium alloy
Grant 6,753,606 - Cabral, Jr. , et al. June 22, 2 | 2004-06-22 |
Method for depositing a metal layer on a semiconductor interconnect structure having a capping layer
App 20040115921 - Clevenger, Larry ; et al. | 2004-06-17 |
Method to enhance epitaxial regrowth in amorphous silicon contacts
Grant 6,740,568 - Wang , et al. May 25, 2 | 2004-05-25 |
Method and structure for controlling the interface roughness of cobalt disilicide
App 20040087160 - Agnello, Paul David ; et al. | 2004-05-06 |
Method for forming crystalline silicon nitride
Grant 6,707,086 - Jammy , et al. March 16, 2 | 2004-03-16 |
Structure for detecting charging effects in device processing
Grant 6,703,641 - Kane , et al. March 9, 2 | 2004-03-09 |
Method to enhance epi-regrowth in amorphous poly CB contacts
App 20040018680 - Wang, Yun Yu ; et al. | 2004-01-29 |
Ti liner for copper interconnect with low-k dielectric
Grant 6,661,097 - Clevenger , et al. December 9, 2 | 2003-12-09 |
Bilayer HDP CVD / PE CVD cap in advanced BEOL interconnect structures and method thereof
App 20030134499 - Chen, Tze-Chiang ; et al. | 2003-07-17 |
Integration scheme for advanced BEOL metallization including low-k cap layer and method thereof
App 20030134495 - Gates, Stephen ; et al. | 2003-07-17 |
Structure for detecting charging effects in device processing
App 20030094609 - Kane, Terence L. ; et al. | 2003-05-22 |
Chromium adhesion layer for copper vias in low-k technology
Grant 6,539,625 - Engel , et al. April 1, 2 | 2003-04-01 |
Method for producing a flat interface for a metal-silicon contact barrier film
App 20020180046 - Wang, Yun-Yu ; et al. | 2002-12-05 |
Method and structure for controlling the interface roughness of cobalt disilicide
App 20020182836 - Agnello, Paul David ; et al. | 2002-12-05 |
Method for improved fabrication of salicide structures
Grant 6,475,893 - Giewont , et al. November 5, 2 | 2002-11-05 |
Method For Improved Fabrication Of Salicide Structures
App 20020142616 - Giewont, Kenneth J. ; et al. | 2002-10-03 |
Method For Forming Crystalline Silicon Nitride
App 20020137362 - JAMMY, RAJARAO ; et al. | 2002-09-26 |
Method and structure for controlling the interface roughness of cobalt disilicide
Grant 6,440,851 - Agnello , et al. August 27, 2 | 2002-08-27 |
Chromium adhesion layer for copper vias in low-k technology
App 20020088117 - Engel, Brett H. ; et al. | 2002-07-11 |
Conversion of amorphous layer produced during IMP Ti deposition
Grant 6,387,790 - Domenicucci , et al. May 14, 2 | 2002-05-14 |
Copper vias in low-k technology
Grant 6,383,929 - Boettcher , et al. May 7, 2 | 2002-05-07 |
Microstructure liner having improved adhesion
Grant 6,380,628 - Miller , et al. April 30, 2 | 2002-04-30 |
Method and structure for reduction of contact resistance of metal silicides using a metal-germanium alloy
App 20020042197 - Cabral,, Cyril JR. ; et al. | 2002-04-11 |
Plasma treatment to enhance inorganic dielectric adhesion to copper
App 20010053591 - Buchwalter, Leena P. ; et al. | 2001-12-20 |
Method and structure for reduction of contact resistance of metal silicides using a metal-germanium alloy
Grant 6,331,486 - Cabral, Jr. , et al. December 18, 2 | 2001-12-18 |
Method for self-aligned formation of silicide contacts using metal silicon alloys for limited silicon consumption and for reduction of bridging
Grant 6,323,130 - Brodsky , et al. November 27, 2 | 2001-11-27 |
Microstructure Liner Having Improved Adhesion
App 20010019884 - MILLER, JOHN A. ; et al. | 2001-09-06 |
Plasma treatment to enhance inorganic dielectric adhesion to copper
Grant 6,261,951 - Buchwalter , et al. July 17, 2 | 2001-07-17 |
Quantum conductive recrystallization barrier layers
Grant 6,194,736 - Chaloux , et al. February 27, 2 | 2001-02-27 |
Method for forming an atomically flat interface for a highly disordered metal-silicon barrier film
Grant 6,022,801 - Domenicucci , et al. February 8, 2 | 2000-02-08 |
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