| Patent | Date |
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Feedback of layer thickness timing and clearance timing for polishing control
Grant 9,496,190 - Xu , et al. November 15, 2 | 2016-11-15 |
Feedback Of Layer Thickness Timing And Clearance Timing For Polishing Control
App 20150194356 - Xu; Kun ; et al. | 2015-07-09 |
Feedback control of polishing using optical detection of clearance
Grant 9,073,169 - Xu , et al. July 7, 2 | 2015-07-07 |
GST film thickness monitoring
Grant 8,989,890 - Xu , et al. March 24, 2 | 2015-03-24 |
Metrology for GST film thickness and phase
Grant 8,639,377 - Xu , et al. January 28, 2 | 2014-01-28 |
Chemical planarization of copper wafer polishing
Grant 8,586,481 - Wang , et al. November 19, 2 | 2013-11-19 |
Slurry For Cobalt Applications
App 20130186850 - Wang; You ; et al. | 2013-07-25 |
Closed loop control of pad profile based on metrology feedback
Grant 8,221,193 - Chang , et al. July 17, 2 | 2012-07-17 |
Dishing and defect control of chemical mechanical polishing using real-time adjustable additive delivery
Grant 8,210,900 - Tu , et al. July 3, 2 | 2012-07-03 |
Feedback Control of Polishing Using Optical Detection of Clearance
App 20120064801 - Xu; Kun ; et al. | 2012-03-15 |
Chemical Planarization Of Copper Wafer Polishing
App 20110294293 - Wang; You ; et al. | 2011-12-01 |
Extended pad life for ECMP and barrier removal
Grant 8,012,000 - Wang , et al. September 6, 2 | 2011-09-06 |
High Sensitivity Real Time Profile Control Eddy Current Monitoring System
App 20110189925 - Iravani; Hassan G. ; et al. | 2011-08-04 |
High Sensitivity Real Time Profile Control Eddy Current Monitoring System
App 20110189856 - Xu; Kun ; et al. | 2011-08-04 |
Composition and method for planarizing surfaces
Grant 7,955,519 - Wang , et al. June 7, 2 | 2011-06-07 |
GST Film Thickness Monitoring
App 20100185314 - Xu; Kun ; et al. | 2010-07-22 |
Slurry Composition For Gst Phase Change Memory Materials Polishing
App 20100130013 - Liu; Feng Q. ; et al. | 2010-05-27 |
Two-line Mixing Of Chemical And Abrasive Particles With Endpoint Control For Chemical Mechanical Polishing
App 20100130101 - WANG; YUCHUN ; et al. | 2010-05-27 |
Metrology For Gst Film Thickness And Phase
App 20100116990 - Xu; Kun ; et al. | 2010-05-13 |
Dishing And Defect Control Of Chemical Mechanical Polishing Using Real-time Adjustable Additive Delivery
App 20100112903 - TU; WEN-CHIANG ; et al. | 2010-05-06 |
Compositions And Methods For Barrier Layer Polishing
App 20100096360 - Wang; You ; et al. | 2010-04-22 |
Closed Loop Control Of Pad Profile Based On Metrology Feedback
App 20100035518 - Chang; Shou-Sung ; et al. | 2010-02-11 |
Pad With Shallow Cells For Electrochemical Mechanical Processing
App 20080293343 - Wang; Yuchun ; et al. | 2008-11-27 |
Extended Pad Life For Ecmp And Barrier Removal
App 20080242202 - Wang; Yuchun ; et al. | 2008-10-02 |
Conductive pad with ion exchange membrane for electrochemical mechanical polishing
Grant 7,344,432 - Chen , et al. March 18, 2 | 2008-03-18 |
Conductive polishing article for electrochemical mechanical polishing
Grant 7,311,592 - Chen , et al. December 25, 2 | 2007-12-25 |
Soft Conductive Polymer Processing Pad And Method For Fabricating The Same
App 20070218587 - Wang; Yuchun ; et al. | 2007-09-20 |
Conductive Pad With Ion Exchange Membrane For Electrochemical Mechanical Polishing
App 20070099552 - Chen; Liang-Yuh ; et al. | 2007-05-03 |
Composition and method for planarizing surfaces
App 20070075040 - Wang; Yuchun ; et al. | 2007-04-05 |
Conductive Polishing Article For Electrochemical Mechanical Polishing
App 20070066201 - Chen; Liang-Yuh ; et al. | 2007-03-22 |
Polishing composition and method for defect improvement by reduced particle stiction on copper surface
App 20060278614 - Wang; Yuchun ; et al. | 2006-12-14 |
Conductive polishing article for electrochemical mechanical polishing
Grant 7,137,879 - Chen , et al. November 21, 2 | 2006-11-21 |
Three dimensional integrated circuits
Grant 7,091,604 - Wylie , et al. August 15, 2 | 2006-08-15 |
Conductive polishing article for electrochemical mechanical polishing
App 20060172671 - Chen; Liang-Yuh ; et al. | 2006-08-03 |
Conductive polishing article for electrochemical mechanical polishing
Grant 7,066,800 - Chen , et al. June 27, 2 | 2006-06-27 |
Conductive polishing article for electrochemical mechanical polishing
Grant 6,988,942 - Chen , et al. January 24, 2 | 2006-01-24 |
Integrated polishing and electroless deposition
Grant 6,984,587 - Wang January 10, 2 | 2006-01-10 |
Three dimensional integrated circuits
App 20050269665 - Wylie, Ian W. ; et al. | 2005-12-08 |
Endpoint detection for non-transparent polishing member
Grant 6,942,546 - Desai , et al. September 13, 2 | 2005-09-13 |
Chemical mechanical polishing apparatus and methods using a flexible pad and variable fluid flow for variable polishing
Grant 6,926,589 - Young , et al. August 9, 2 | 2005-08-09 |
Integrated polishing and electroless deposition
App 20050153554 - Wang, Yuchun | 2005-07-14 |
Chemical mechanical polishing endpoint detection
Grant 6,908,374 - Wang , et al. June 21, 2 | 2005-06-21 |
Electrolyte composition and treatment for electrolytic chemical mechanical polishing
Grant 6,899,804 - Duboust , et al. May 31, 2 | 2005-05-31 |
Chemical mechanical polishing composition and process
Grant 6,872,329 - Wang , et al. March 29, 2 | 2005-03-29 |
Advanced chemical mechanical polishing system with smart endpoint detection
Grant 6,857,947 - Wang , et al. February 22, 2 | 2005-02-22 |
Conductive polishing article for electrochemical mechanical polishing
App 20040266327 - Chen, Liang-Yuh ; et al. | 2004-12-30 |
Additives for pressure sensitive polishing compositions
Grant 6,783,432 - Li , et al. August 31, 2 | 2004-08-31 |
Advanced chemical mechanical polishing system with smart endpoint detection
App 20040023606 - Wang, Yuchun ; et al. | 2004-02-05 |
Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers
App 20040023607 - Talieh, Homayoun ; et al. | 2004-02-05 |
Selective barrier removal slurry
App 20040014399 - Wang, Yuchun ; et al. | 2004-01-22 |
In situ measurement of slurry distribution
Grant 6,657,726 - Wang , et al. December 2, 2 | 2003-12-02 |
Ion exchange materials for chemical mechanical polishing
Grant 6,638,143 - Wang , et al. October 28, 2 | 2003-10-28 |
Chemical mechanical polishing apparatus and methods using a flexible pad and variable fluid flow for variable polishing
App 20030181143 - Young, Douglas W. ; et al. | 2003-09-25 |
In-situ endpoint detect for non-transparent polishing member
App 20030153246 - Desai, Mukesh ; et al. | 2003-08-14 |
Electrolyte composition and treatment for electrolytic chemical mechanical polishing
App 20030116446 - Duboust, Alain ; et al. | 2003-06-26 |
Multi-fluid polishing process
Grant 6,572,453 - Wijekoon , et al. June 3, 2 | 2003-06-03 |
Additives to CMP slurry to polish dielectric films
Grant 6,569,349 - Wang , et al. May 27, 2 | 2003-05-27 |
Method and apparatus for enhanced CMP using metals having reductive properties
Grant 6,561,873 - Tsai , et al. May 13, 2 | 2003-05-13 |
Method and apparatus for enhanced CMP using metals having reductive properties
Grant 6,537,144 - Tsai , et al. March 25, 2 | 2003-03-25 |
CMP slurry for planarizing metals
Grant 6,520,840 - Wang , et al. February 18, 2 | 2003-02-18 |
Additives for pressure sensitive polishing compositions
App 20020182982 - Li, Jui-Lung ; et al. | 2002-12-05 |
Chemical mechanical polishing endpoint detection
App 20020173225 - Wang, Yuchun ; et al. | 2002-11-21 |
Conductive polishing article for electrochemical mechanical polishing
App 20020119286 - Chen, Liang-Yuh ; et al. | 2002-08-29 |
Method and apparatus for enhanced CMP using metals having reductive properties
App 20020098779 - Tsai, Stan D. ; et al. | 2002-07-25 |
Ion exchange materials for chemical mechanical polishing
App 20020077035 - Wang, Yuchun ; et al. | 2002-06-20 |
Chemical mechanical polishing composition and process
App 20020031985 - Wang, Yuchun ; et al. | 2002-03-14 |
Ion exchange pad or brush and method of regenerating the same
App 20020006767 - Wang, Yuchun ; et al. | 2002-01-17 |
Vapor phase deposition
Grant 6,265,026 - Wang July 24, 2 | 2001-07-24 |
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