WANG; CHUN-YAO

Patent Applications and Registrations

Patent applications and USPTO patent grants for WANG; CHUN-YAO.The latest application filed is for "bonding structure of electrical contact, bonding method of electrical contact and battery module".

Company Profile

2.8.13

WANG; CHUN-YAO - Hukou Township TW
Wang; Chun-Yao - Tainan City TW
Wang; Chun-Yao - Tainan TW
Wang; Chun-Yao - Zhubei TW
Wang; Chun-Yao - HsinChu City TW
WANG; Chun-Yao - Hsin Chu City TW
Wang; Chun-Yao - Hsinchu TW
Wang; Chun-Yao - Hsincu City TW
Wang; Chun-Yao - Taipei Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bonding Structure Of Electrical Contact, Bonding Method Of Electrical Contact And Battery Module App 20210408644 - WU; YU-WEN ; et al.	2021-12-30
Method For Fabricating Merging Semiconductor Integrated Circuit App 20190013324 - Shih; Ping-Chia ; et al.	2019-01-10
Method for fabricating merging semiconductor integrated circuit Grant 10,177,165 - Shih , et al. J	2019-01-08
Wafer processing chamber, heat treatment apparatus and method for processing wafers Grant 9,228,260 - Hsiao , et al. January 5, 2	2016-01-05
Checking Method For Mask Design Of Integrated Circuit App 20120216155 - Shih; Ping-Chia ; et al.	2012-08-23
Method for Node Addition and Removal of a Circuit App 20120066542 - Chen; Yung-Chih ; et al.	2012-03-15
Method for Fast Detection of Node Mergers and Simplification of a Circuit App 20110246829 - CHEN; Yung-Chih ; et al.	2011-10-06
Apparatus for clamping large and small disks Grant 7,987,476 - Liu , et al. July 26, 2	2011-07-26
Rewiring Using Irredundancy Removal And Addition App 20110131539 - WANG; Chun-Yao ; et al.	2011-06-02
Method for Preparing Doped Polysilicon Conductor and Method for Preparing Trench Capacitor Structure Using the Same App 20090191686 - Wang; Chun Yao ; et al.	2009-07-30
Apparatus For Clamping Large And Small Disks App 20090077576 - Liu; Chin-Sung ; et al.	2009-03-19
Reversible sequential apparatuses Grant 7,432,738 - Wang , et al. October 7, 2	2008-10-07
Reversible Sequential Element And Reversible Sequential Circuit Thereof App 20080238479 - Wang; Chun Yao ; et al.	2008-10-02
Reversible Sequential Apparatuses App 20080238480 - Wang; Chun Yao ; et al.	2008-10-02
Reversible sequential element and reversible sequential circuit thereof Grant 7,427,876 - Wang , et al. September 23, 2	2008-09-23
Apparatus for aligning and clipping different size compact discs for disc device Grant 7,418,721 - Liu , et al. August 26, 2	2008-08-26
Method for verifying a circuit design by assigning numerical values to inputs of the circuit design Grant 7,302,655 - Wang , et al. November 27, 2	2007-11-27
Apparatus For Aligning And Clippng Different Size Compact Discs For Disc Device App 20070118845 - Liu; Chin-Sung ; et al.	2007-05-24
Device for reducing the backlash of optical pickup head of optical disk device App 20070050789 - Wang; Chun-Yao ; et al.	2007-03-01
Method for verifying a circuit design by assigning numerical values to inputs of the circuit design App 20060282805 - Wang; Chun-Yao ; et al.	2006-12-14
Built-in self verification circuit for system chip design Grant 6,675,337 - Tung , et al. January 6, 2	2004-01-06

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