Wang; Chuei-Tang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wang; Chuei-Tang.The latest application filed is for "semiconductor and circuit structures, and related methods".
Company Profile
118.151.179
- Wang; Chuei-Tang - Taichung TW
- WANG; CHUEI-TANG - TAICHUNG CITY TW
- Wang; Chuei-Tang - Hsin-Chu TW
- Wang; Chuei-Tang - Hsinchu TW
- WANG; Chuei-Tang - Hsinchu City TW
Patent Activity
| Patent | Date |
|---|---|
| Package structure, package-on-package structure and manufacturing method thereof Grant 11,456,249 - Wang , et al. September 27, 2 | 2022-09-27 |
| Semiconductor structure, package structure, and manufacturing method thereof Grant 11,456,251 - Chen , et al. September 27, 2 | 2022-09-27 |
| Package structure including a solenoid inductor laterally aside a die and method of fabricating the same Grant 11,450,628 - Tang , et al. September 20, 2 | 2022-09-20 |
| Semiconductor And Circuit Structures, And Related Methods App 20220293597 - HU; CHANG-FEN ; et al. | 2022-09-15 |
| Package Structure And Manufacturing Method Thereof App 20220285331 - Wang; Chuei-Tang ; et al. | 2022-09-08 |
| Integrated Fan-out Package App 20220270990 - Wang; Chuei-Tang ; et al. | 2022-08-25 |
| Package, package structure with redistributing circuits and antenna elements and method of manufacturing the same Grant 11,424,197 - Wang , et al. August 23, 2 | 2022-08-23 |
| Deep Partition Power Delivery with Deep Trench Capacitor App 20220262778 - Yu; Chen-Hua ; et al. | 2022-08-18 |
| Integrated Circuit Package and Method App 20220262783 - Yu; Chen-Hua ; et al. | 2022-08-18 |
| Semiconductor package and method of forming the same Grant 11,417,698 - Chang , et al. August 16, 2 | 2022-08-16 |
| Semiconductor Package And Method For Manufacturing The Same App 20220254747 - WANG; CHUEI-TANG ; et al. | 2022-08-11 |
| Semiconductor device, integrated fan-out package and method of forming the same Grant 11,410,923 - Tsai , et al. August 9, 2 | 2022-08-09 |
| Methods of Forming Semiconductor Packages Having a Die with an Encapsulant App 20220246559 - Tsai; Chung-Hao ; et al. | 2022-08-04 |
| System, device and methods of manufacture Grant 11,404,316 - Yu , et al. August 2, 2 | 2022-08-02 |
| Polymer layers embedded with metal pads for heat dissipation Grant 11,398,440 - Chuang , et al. July 26, 2 | 2022-07-26 |
| Architecture for Computing System Package App 20220223530 - Yu; Chen-Hua ; et al. | 2022-07-14 |
| Integrated circuit package and method Grant 11,387,222 - Yu , et al. July 12, 2 | 2022-07-12 |
| Die stacks and methods forming same Grant 11,380,655 - Yu , et al. July 5, 2 | 2022-07-05 |
| Memory Packages And Methods Of Forming Same App 20220208735 - Yu; Chen-Hua ; et al. | 2022-06-30 |
| Photonic semiconductor device and method Grant 11,362,077 - Chang , et al. June 14, 2 | 2022-06-14 |
| Package Structure And Method Of Manufacturing The Same App 20220181248 - Wang; Chuei-Tang ; et al. | 2022-06-09 |
| Integrated fan-out package Grant 11,348,886 - Wang , et al. May 31, 2 | 2022-05-31 |
| Package structure and method of fabricating the same Grant 11,335,767 - Yu , et al. May 17, 2 | 2022-05-17 |
| Optical semiconductor package and method for manufacturing the same Grant 11,322,470 - Wang , et al. May 3, 2 | 2022-05-03 |
| Method Of Manufacturing Package Structure App 20220130815 - Huang; Shih-Ya ; et al. | 2022-04-28 |
| Methods of forming semiconductor packages having a die with an encapsulant Grant 11,315,891 - Tsai , et al. April 26, 2 | 2022-04-26 |
| Semiconductor device with shielding structure for cross-talk reduction Grant 11,302,649 - Huang , et al. April 12, 2 | 2022-04-12 |
| Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof Grant 11,289,449 - Wang , et al. March 29, 2 | 2022-03-29 |
| Integrated fan-out package and manufacturing method thereof Grant 11,282,810 - Wan , et al. March 22, 2 | 2022-03-22 |
| Memory packages and methods of forming same Grant 11,282,816 - Yu , et al. March 22, 2 | 2022-03-22 |
| Package structure and method of manufacturing the same Grant 11,264,316 - Wang , et al. March 1, 2 | 2022-03-01 |
| Electronic Apparatus App 20220059450 - Tang; Tzu-Chun ; et al. | 2022-02-24 |
| Package structure and method of forming the same Grant 11,244,939 - Tsai , et al. February 8, 2 | 2022-02-08 |
| Package structure and manufacturing method thereof Grant 11,244,896 - Hsiao , et al. February 8, 2 | 2022-02-08 |
| Package structure and package-on-package structure Grant 11,239,157 - Wang , et al. February 1, 2 | 2022-02-01 |
| Package structure and method of manufacturing the same Grant 11,222,883 - Huang , et al. January 11, 2 | 2022-01-11 |
| Packaged semiconductor devices and packaging methods Grant 11,211,358 - Tang , et al. December 28, 2 | 2021-12-28 |
| Integrated circuit package and method Grant 11,211,371 - Yu , et al. December 28, 2 | 2021-12-28 |
| Semiconductor device Grant 11,211,339 - Wang , et al. December 28, 2 | 2021-12-28 |
| Passive device module, semiconductor package including the same, and manufacturing method thereof Grant 11,211,360 - Huang , et al. December 28, 2 | 2021-12-28 |
| Semiconductor package and manufacturing method thereof Grant 11,195,817 - Huang , et al. December 7, 2 | 2021-12-07 |
| Semiconductor Package Structure Comprising Rigid-flexible Substrate And Manufacturing Method Thereof App 20210375770 - Wang; Chuei-Tang ; et al. | 2021-12-02 |
| Electronic apparatus including antennas and directors Grant 11,171,088 - Tang , et al. November 9, 2 | 2021-11-09 |
| Semiconductor Package And Manufacturing Method Thereof App 20210343651 - Tsai; Chung-Hao ; et al. | 2021-11-04 |
| Embedding Low-K Materials in Antennas App 20210328347 - Liu; Monsen ; et al. | 2021-10-21 |
| Semiconductor device with conductive shielding structure Grant 11,139,206 - Yu , et al. October 5, 2 | 2021-10-05 |
| Package Structure And Method Of Forming The Same App 20210305226 - Tsai; Chung-Hao ; et al. | 2021-09-30 |
| Package Structure App 20210280524 - Lin; Chun-Wen ; et al. | 2021-09-09 |
| Package Structure And Manufacturing Method Thereof App 20210272929 - Tsai; Chung-Hao ; et al. | 2021-09-02 |
| Package Structure, Package-on-package Structure And Manufacturing Method Thereof App 20210272897 - Wang; Chuei-Tang ; et al. | 2021-09-02 |
| Package structure and method of fabricating the same Grant 11,094,682 - Islam , et al. August 17, 2 | 2021-08-17 |
| Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof Grant 11,094,634 - Wang , et al. August 17, 2 | 2021-08-17 |
| Package with thinned substrate Grant 11,094,671 - Yu , et al. August 17, 2 | 2021-08-17 |
| Semiconductor Package And Manufacturing Method Thereof App 20210239902 - Chang; Chih-Chieh ; et al. | 2021-08-05 |
| Heat transfer structures and methods for IC packages Grant 11,075,136 - Hsu , et al. July 27, 2 | 2021-07-27 |
| Package Structure And Method Of Fabricating The Same App 20210225824 - Islam; Rabiul ; et al. | 2021-07-22 |
| Passive Device Module, Semiconductor Package Including The Same, And Manufacturing Method Thereof App 20210225804 - Huang; Shih-Ya ; et al. | 2021-07-22 |
| Memory Packages And Methods Of Forming Same App 20210225809 - Yu; Chen-Hua ; et al. | 2021-07-22 |
| Integrated fan-out package including voltage regulators and methods forming same Grant 11,063,016 - Yu , et al. July 13, 2 | 2021-07-13 |
| Semiconductor package and manufacturing method thereof Grant 11,062,998 - Tsai , et al. July 13, 2 | 2021-07-13 |
| Photonic Semiconductor Device And Method App 20210202453 - Chang; Chih-Chieh ; et al. | 2021-07-01 |
| System, Device And Methods Of Manufacture App 20210202312 - Yu; Chen-Hua ; et al. | 2021-07-01 |
| System on Integrated Chips and Methods of Forming the Same App 20210202398 - Yu; Chen-Hua ; et al. | 2021-07-01 |
| Semiconductor Package And Method Of Forming The Same App 20210202562 - Chang; Chia-Lun ; et al. | 2021-07-01 |
| Encapsulating low-k dielectric blocks along with dies in an encapsulant to form antennas Grant 11,050,153 - Liu , et al. June 29, 2 | 2021-06-29 |
| Package Structure And Method Of Fabricating The Same App 20210183794 - Tang; Tzu-Chun ; et al. | 2021-06-17 |
| Integrated Circuit Package and Method App 20210151408 - Yu; Chen-Hua ; et al. | 2021-05-20 |
| Package structure, package-on-package structure and manufacturing method thereof Grant 11,011,460 - Wang , et al. May 18, 2 | 2021-05-18 |
| Semiconductor structure Grant 11,004,811 - Chen , et al. May 11, 2 | 2021-05-11 |
| Semiconductor Device with Shield for Electromagnetic Interference App 20210134734 - Wang; Chuei-Tang ; et al. | 2021-05-06 |
| Methods of forming semiconductor packages Grant 10,996,410 - Wang , et al. May 4, 2 | 2021-05-04 |
| Semiconductor Package And Manufacturing Method Thereof App 20210125960 - Huang; Shih-Ya ; et al. | 2021-04-29 |
| Integrated Circuit Package and Method App 20210118859 - Yu; Chen-Hua ; et al. | 2021-04-22 |
| Integrated Circuit Package and Method App 20210118858 - Yu; Chen-Hua ; et al. | 2021-04-22 |
| Integrated Circuit Package and Method App 20210118759 - Yu; Chen-Hua ; et al. | 2021-04-22 |
| 3D antenna for integrated circuits Grant 10,978,781 - Hsieh , et al. April 13, 2 | 2021-04-13 |
| Package Assembly And Manufacturing Method Thereof App 20210096310 - Chang; Chih-Chieh ; et al. | 2021-04-01 |
| Semiconductor package and manufacturing method thereof Grant 10,962,711 - Chang , et al. March 30, 2 | 2021-03-30 |
| System on integrated chips and methods of forming the same Grant 10,950,553 - Yu , et al. March 16, 2 | 2021-03-16 |
| Under-Bump-Metallization Structure and Redistribution Layer Design for Integrated Fan-Out Package with Integrated Passive Device App 20210074694 - Huang; Yu-Chih ; et al. | 2021-03-11 |
| Semiconductor Package And Manufacturing Method Thereof App 20210057346 - Tsai; Chung-Hao ; et al. | 2021-02-25 |
| InFO Coil on Metal Plate with Slot App 20210057144 - Wang; Chuei-Tang ; et al. | 2021-02-25 |
| Photonic semiconductor device and method Grant 10,930,628 - Chang , et al. February 23, 2 | 2021-02-23 |
| Die Stacks and Methods Forming Same App 20210043608 - Yu; Chen-Hua ; et al. | 2021-02-11 |
| Method Of Using Integrated Transmitter And Receiver Front End Module App 20210028811 - YEH; En-Hsiang ; et al. | 2021-01-28 |
| Package Structure And Method Of Manufacturing The Same App 20210020560 - Wang; Chuei-Tang ; et al. | 2021-01-21 |
| Semiconductor Structure, Package Structure, And Manufacturing Method Thereof App 20210013140 - Chen; Wei-Ting ; et al. | 2021-01-14 |
| Package Structure And Method Of Manufacturing The Same App 20210013191 - Huang; Shih-Ya ; et al. | 2021-01-14 |
| Antenna Device And Method For Manufacturing Antenna Device App 20200411996 - WANG; Chuei-Tang ; et al. | 2020-12-31 |
| Semiconductor device and method of manufacture Grant 10,879,183 - Wang , et al. December 29, 2 | 2020-12-29 |
| Package Structure And Method Of Forming Thereof App 20200402847 - CHEN; Chih-Lin ; et al. | 2020-12-24 |
| Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof Grant 10,872,878 - Wang , et al. December 22, 2 | 2020-12-22 |
| Package structure Grant 10,867,938 - Tang , et al. December 15, 2 | 2020-12-15 |
| Semiconductor device with shield for electromagnetic interference Grant 10,867,936 - Wang , et al. December 15, 2 | 2020-12-15 |
| Semiconductor Structure App 20200388584 - CHEN; VINCENT ; et al. | 2020-12-10 |
| Package Structure And Package-on-package Structure App 20200381357 - Wang; Chuei-Tang ; et al. | 2020-12-03 |
| InFO coil on metal plate with slot Grant 10,847,304 - Wang , et al. November 24, 2 | 2020-11-24 |
| Package Structure App 20200365517 - Lin; Chun-Wen ; et al. | 2020-11-19 |
| Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device Grant 10,840,227 - Huang , et al. November 17, 2 | 2020-11-17 |
| Manufacturing Method Of A Semiconductor Device App 20200357659 - CHANG; SHOU ZEN ; et al. | 2020-11-12 |
| Stacked coil for wireless charging structure on InFO package Grant 10,825,602 - Yu , et al. November 3, 2 | 2020-11-03 |
| Die stacks and methods forming same Grant 10,818,640 - Yu , et al. October 27, 2 | 2020-10-27 |
| Integrated Fan-out Package And Manufacturing Method Thereof App 20200335477 - Wan; Albert ; et al. | 2020-10-22 |
| Package structure and method of manufacturing the same Grant 10,811,404 - Huang , et al. October 20, 2 | 2020-10-20 |
| Method of using integrated transmitter and receiver front end module Grant 10,804,953 - Yeh , et al. October 13, 2 | 2020-10-13 |
| Semiconductor Device with Shielding Structure for Cross-talk Reduction App 20200321288 - Huang; Shih-Ya ; et al. | 2020-10-08 |
| Die Stacks And Methods Forming Same App 20200321315 - Yu; Chen-Hua ; et al. | 2020-10-08 |
| Semiconductor structure, package structure, and manufacturing method thereof Grant 10,796,990 - Chen , et al. October 6, 2 | 2020-10-06 |
| Package with Thinned Substrate App 20200303342 - Yu; Chen-Hua ; et al. | 2020-09-24 |
| Integrated Fan-out Package App 20200294943 - Wang; Chuei-Tang ; et al. | 2020-09-17 |
| Chip Package And Manufacturing Method Thereof App 20200294927 - Wang; Chuei-Tang ; et al. | 2020-09-17 |
| Semiconductor chip, package structure, and pacakge-on-package structure Grant 10,777,502 - Wang , et al. Sept | 2020-09-15 |
| Package structure and method of manufacturing the same Grant 10,777,518 - Wang , et al. Sept | 2020-09-15 |
| Semiconductor Package And Method For Manufacturing The Same App 20200286845 - WANG; CHUEI-TANG ; et al. | 2020-09-10 |
| Antenna device and method for manufacturing antenna device Grant 10,770,795 - Wang , et al. Sep | 2020-09-08 |
| Package structure with inductor and method of forming thereof Grant 10,763,164 - Chen , et al. Sep | 2020-09-01 |
| Semiconductor structure Grant 10,763,229 - Chen , et al. Sep | 2020-09-01 |
| Method of manufacturing integrated fan-out package Grant 10,756,052 - Wan , et al. A | 2020-08-25 |
| Package Structure, Package-on-package Structure And Manufacturing Method Thereof App 20200258836 - A1 | 2020-08-13 |
| Package structures Grant 10,734,323 - Lin , et al. | 2020-08-04 |
| Package Structure And Manufacturing Method Thereof App 20200243441 - Hsiao; Min-Chien ; et al. | 2020-07-30 |
| Semiconductor device and manufacturing method thereof Grant 10,727,082 - Chang , et al. | 2020-07-28 |
| Antenna Apparatus and Method App 20200220250 - Chih; Lai Wei ; et al. | 2020-07-09 |
| Semiconductor Package Structure And Manufacturing Method Thereof App 20200203280 - Wang; Chuei-Tang ; et al. | 2020-06-25 |
| Semiconductor device with shielding structure for cross-talk reduction Grant 10,692,817 - Huang , et al. | 2020-06-23 |
| Package with thinned substrate Grant 10,679,968 - Yu , et al. | 2020-06-09 |
| Chip package and manufacturing method thereof Grant 10,679,947 - Wang , et al. | 2020-06-09 |
| Heat Transfer Structures And Methods For Ic Packages App 20200176349 - HSU; Ying-Chih ; et al. | 2020-06-04 |
| Semiconductor Package And Manufacturing Method Thereof App 20200174187 - Chang; Chih-Chieh ; et al. | 2020-06-04 |
| Integrated fan-out package Grant 10,672,728 - Wang , et al. | 2020-06-02 |
| Optical semiconductor package and method for manufacturing the same Grant 10,665,560 - Wang , et al. | 2020-05-26 |
| Package structure, package-on-package structure and manufacturing method thereof Grant 10,643,943 - Wang , et al. | 2020-05-05 |
| Semiconductor Device With Shield for Electromagnetic Interference App 20200118938 - Wang; Chuei-Tang ; et al. | 2020-04-16 |
| Packaged Semiconductor Devices and Packaging Methods App 20200118971 - Tang; Tzu-Chun ; et al. | 2020-04-16 |
| Antenna apparatus and method Grant 10,622,701 - Chih , et al. | 2020-04-14 |
| Semiconductor Device App 20200111753 - WANG; CHUEI-TANG ; et al. | 2020-04-09 |
| Integrated Fan-out Package App 20200105687 - Wang; Chuei-Tang ; et al. | 2020-04-02 |
| Methods Of Forming Semiconductor Packages App 20200088960 - Wang; Chuei-Tang ; et al. | 2020-03-19 |
| Stacked Coil for Wireless Charging Structure on InFO Package App 20200090855 - Yu; Chen-Hua ; et al. | 2020-03-19 |
| Semiconductor Structure, Package Structure, And Manufacturing Method Thereof App 20200091063 - Chen; Wei-Ting ; et al. | 2020-03-19 |
| Semiconductor Structure App 20200075516 - CHEN; VINCENT ; et al. | 2020-03-05 |
| Semiconductor Device Structure App 20200075412 - YU; Chen-Hua ; et al. | 2020-03-05 |
| Method Of Using Integrated Transmitter And Receiver Front End Module App 20200067560 - YEH; En-Hsiang ; et al. | 2020-02-27 |
| Semiconductor Chip, Package Structure, And Pacakge-on-package Structure App 20200066631 - Wang; Chuei-Tang ; et al. | 2020-02-27 |
| Heat transfer structures and methods for IC packages Grant 10,559,517 - Hsu , et al. Feb | 2020-02-11 |
| Integrated Fan-Out Package Including Voltage Regulators and Methods Forming Same App 20200043891 - Yu; Chen-Hua ; et al. | 2020-02-06 |
| Package, Package Structure And Method Of Manufacturing The Same App 20200035625 - Wang; Chuei-Tang ; et al. | 2020-01-30 |
| 3D Antenna for Integrated Circuits App 20200028240 - Hsieh; Jeng-Shien ; et al. | 2020-01-23 |
| Semiconductor Device, Integrated Fan-out Package And Method Of Forming The Same App 20200020627 - Tsai; Chung-Hao ; et al. | 2020-01-16 |
| Packaging Methods for Semiconductor Devices, Packaged Semiconductor Devices, and Design Methods Thereof App 20200020666 - Wang; Chuei-Tang ; et al. | 2020-01-16 |
| Photonic Semiconductor Device And Method App 20200006304 - Chang; Chih-Chieh ; et al. | 2020-01-02 |
| Package Structure, Package-on-package Structure And Manufacturing Method Thereof App 20190393149 - Wang; Chuei-Tang ; et al. | 2019-12-26 |
| Semiconductor Device and Method of Manufacture App 20190393153 - Wang; Chuei-Tang ; et al. | 2019-12-26 |
| Method for forming semiconductor device structure with conductive shielding structure Grant 10,515,851 - Yu , et al. Dec | 2019-12-24 |
| Semiconductor package devices integrated with inductor Grant 10,510,660 - Chen , et al. Dec | 2019-12-17 |
| Semiconductor device with shield for electromagnetic interference Grant 10,510,679 - Wang , et al. Dec | 2019-12-17 |
| Packaged semiconductor devices and packaging methods Grant 10,510,714 - Tang , et al. Dec | 2019-12-17 |
| Semiconductor device with shield for electromagnetic interference Grant 10,510,682 - Wang , et al. Dec | 2019-12-17 |
| Semiconductor device Grant 10,510,681 - Wang , et al. Dec | 2019-12-17 |
| Stacked coil for wireless charging structure on InFO package Grant 10,510,478 - Yu , et al. Dec | 2019-12-17 |
| Package structure, semiconductor chip and method of fabricating the same Grant 10,504,835 - Wang , et al. Dec | 2019-12-10 |
| Package Structure And Method Of Manufacturing The Same App 20190371781 - Huang; Shih-Ya ; et al. | 2019-12-05 |
| 3D antenna for integrated circuits Grant 10,498,009 - Hsieh , et al. De | 2019-12-03 |
| Integrated fan-out package including voltage regulators and methods forming same Grant 10,497,668 - Yu , et al. De | 2019-12-03 |
| Method Of Manufacturing Integrated Fan-out Package App 20190355694 - Wan; Albert ; et al. | 2019-11-21 |
| Semicondcutor packages Grant 10,481,351 - Wang , et al. Nov | 2019-11-19 |
| Semiconductor structure Grant 10,475,755 - Chen , et al. Nov | 2019-11-12 |
| Integrated transmitter and receiver front end module, transceiver, and related method Grant 10,461,799 - Yeh , et al. Oc | 2019-10-29 |
| Semiconductor Packages And Methods Of Forming Same App 20190295972 - Tsai; Chung-Hao ; et al. | 2019-09-26 |
| System on Integrated Chips and Methods of Forming the Same App 20190287911 - Yu; Chen-Hua ; et al. | 2019-09-19 |
| Stacked Coil for Wireless Charging Structure on InFO Package App 20190279810 - Yu; Chen-Hua ; et al. | 2019-09-12 |
| Embedding Low-K Materials in Antennas App 20190252783 - Liu; Monsen ; et al. | 2019-08-15 |
| Semiconductor Device with Shielding Structure for Cross-talk Reduction App 20190252326 - Huang; Shih-Ya ; et al. | 2019-08-15 |
| Package structure having connecting module Grant 10,381,309 - Wang , et al. A | 2019-08-13 |
| Hybrid interconnect device and method Grant 10,371,893 - Yu , et al. | 2019-08-06 |
| Method of manufacturing integrated fan-out package Grant 10,366,966 - Wan , et al. July 30, 2 | 2019-07-30 |
| System on integrated chips and methods of forming the same Grant 10,332,841 - Yu , et al. | 2019-06-25 |
| System On Integrated Chips And Methods Of Forming The Same App 20190189562 - Yu; Chen-Hua ; et al. | 2019-06-20 |
| Hybrid Interconnect Device and Method App 20190162901 - Yu; Chen-Hua ; et al. | 2019-05-30 |
| Method of fabricating an integrated fan-out package Grant 10,304,790 - Chang , et al. | 2019-05-28 |
| Stacked coil for wireless charging structure on InFO package Grant 10,304,614 - Yu , et al. | 2019-05-28 |
| Package Structures App 20190157208 - Lin; Chun-Wen ; et al. | 2019-05-23 |
| Heat Transfer Structures And Methods For Ic Packages App 20190157180 - HSU; Ying-Chih ; et al. | 2019-05-23 |
| Package Structures App 20190157206 - Wang; Chuei-Tang ; et al. | 2019-05-23 |
| Chip Package And Manufacturing Method Thereof App 20190157209 - Wang; Chuei-Tang ; et al. | 2019-05-23 |
| Semiconductor device including integrated fan out antenna and method of forming the same Grant 10,297,925 - Wang , et al. | 2019-05-21 |
| Semicondcutor Packages App 20190146166 - Wang; Chuei-Tang ; et al. | 2019-05-16 |
| Optical Semiconductor Package And Method For Manufacturing The Same App 20190131267 - WANG; CHUEI-TANG ; et al. | 2019-05-02 |
| Semiconductor Devices and Methods of Forming the Same App 20190131287 - Huang; Yu-Chih ; et al. | 2019-05-02 |
| 3D shielding case and methods for forming the same Grant 10,276,401 - Liu , et al. | 2019-04-30 |
| Electronic Apparatus App 20190122978 - Tang; Tzu-Chun ; et al. | 2019-04-25 |
| Integrated Fan-Out Package Including Voltage Regulators and Methods Forming Same App 20190123020 - Yu; Chen-Hua ; et al. | 2019-04-25 |
| Method Of Fabricating An Integrated Fan-out Package App 20190123004 - Chang; Shou-Zen ; et al. | 2019-04-25 |
| Stacked coil for wireless charging structure on InFO package Grant 10,269,481 - Yu , et al. | 2019-04-23 |
| Hybrid interconnect device and method Grant 10,267,990 - Yu , et al. | 2019-04-23 |
| Embedding low-k materials in antennas Grant 10,270,172 - Liu , et al. | 2019-04-23 |
| Semiconductor device with shielding structure for cross-talk reduction Grant 10,269,728 - Huang , et al. | 2019-04-23 |
| Info package with integrated antennas or inductors Grant 10,269,732 - Yu , et al. | 2019-04-23 |
| Through-Vias and Methods of Forming the Same App 20190115258 - Tsai; Chung-Hao ; et al. | 2019-04-18 |
| Semiconductor Device With shield for Electromagnetic interference App 20190109096 - Wang; Chuei-Tang ; et al. | 2019-04-11 |
| Stacked Coil for Wireless Charging Structure on InFO Package App 20190096565 - Yu; Chen-Hua ; et al. | 2019-03-28 |
| Package Structure App 20190096829 - Tang; Tzu-Chun ; et al. | 2019-03-28 |
| Semiconductor Device Structure And Method For Forming The Same App 20190088544 - YU; Chen-Hua ; et al. | 2019-03-21 |
| Semiconductor Structure App 20190067222 - CHEN; VINCENT ; et al. | 2019-02-28 |
| Polymer Layers Embedded with Metal Pads for Heat Dissipation App 20190057946 - Chuang; Hao-Hsiang ; et al. | 2019-02-21 |
| Package Structure And Method Of Fabricating The Same App 20190035877 - Yu; Chen-Hua ; et al. | 2019-01-31 |
| System On Integrated Chips And Methods Of Forming The Same App 20190019756 - Yu; Chen-Hua ; et al. | 2019-01-17 |
| InFO Coil on Metal Plate with Slot App 20190006085 - Wang; Chuei-Tang ; et al. | 2019-01-03 |
| Semiconductor Device with Shielding Structure for Cross-Talk Reduction App 20190006289 - Huang; Sylvia ; et al. | 2019-01-03 |
| Semiconductor Device With Shield For Electromagnetic Interference App 20190006288 - Wang; Chuei-Tang ; et al. | 2019-01-03 |
| Heat transfer structures and methods for IC packages Grant 10,163,751 - Hsu , et al. Dec | 2018-12-25 |
| Integrated fan-out package including voltage regulators and methods forming same Grant 10,163,852 - Yu , et al. Dec | 2018-12-25 |
| Semicondcutor package Grant 10,162,139 - Wang , et al. Dec | 2018-12-25 |
| Package structure and method for manufacturing thereof Grant 10,163,854 - Wang , et al. Dec | 2018-12-25 |
| Integrated fan-out package and method of fabricating the same Grant 10,163,824 - Chang , et al. Dec | 2018-12-25 |
| Through-vias and methods of forming the same Grant 10,157,791 - Tsai , et al. Dec | 2018-12-18 |
| Electronic apparatus Grant 10,157,834 - Tang , et al. Dec | 2018-12-18 |
| Antennas and waveguides in InFO structures Grant 10,153,239 - Wang , et al. Dec | 2018-12-11 |
| Packaged Semiconductor Devices and Packaging Methods App 20180350771 - Tang; Tzu-Chun ; et al. | 2018-12-06 |
| Semiconductor Device App 20180350752 - WANG; CHUEI-TANG ; et al. | 2018-12-06 |
| Semiconductor Package Devices Integrated With Inductor App 20180350740 - CHEN; WEI-TING ; et al. | 2018-12-06 |
| Package with Thinned Substrate App 20180337159 - Yu; Chen-Hua ; et al. | 2018-11-22 |
| Package with thinned substrate Grant 10,134,708 - Yu , et al. November 20, 2 | 2018-11-20 |
| Fan-out package structure, antenna system and associated method Grant 10,128,203 - Chen , et al. November 13, 2 | 2018-11-13 |
| Method of manufacturing a semiconductor structure Grant 10,115,685 - Chen , et al. October 30, 2 | 2018-10-30 |
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| Packaging Methods for Semiconductor Devices, Packaged Semiconductor Devices, and Design Methods Thereof App 20150200182 - Wang; Chuei-Tang ; et al. | 2015-07-16 |
| Polymer layers embedded with metal pads for heat dissipation Grant 9,082,761 - Chuang , et al. July 14, 2 | 2015-07-14 |
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| 3d Antenna For Integrated Circuits App 20150130681 - HSIEH; Jeng-Shieh ; et al. | 2015-05-14 |
| Inductor For Semiconductor Integrated Circuit App 20150123759 - Chuang; Hao-Hsiang ; et al. | 2015-05-07 |
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| Through-Vias and Methods of Forming the Same App 20150011083 - Tsai; Chung-Hao ; et al. | 2015-01-08 |
| Through-vias and methods of forming the same Grant 8,916,979 - Tsai , et al. December 23, 2 | 2014-12-23 |
| Polymer Layers Embedded with Metal Pads for Heat Dissipation App 20140353819 - Chuang; Hao-Hsiang ; et al. | 2014-12-04 |
| EMI package and method for making same Grant 8,872,312 - Wang , et al. October 28, 2 | 2014-10-28 |
| 3D Shielding Case and Methods for Forming the Same App 20140262475 - Liu; Monsen ; et al. | 2014-09-18 |
| Rf Choke Device For Integrated Circuits App 20140253262 - Hsieh; Jeng-Shien ; et al. | 2014-09-11 |
| Through-Vias and Methods of Forming the Same App 20140183754 - Tsai; Chung-Hao ; et al. | 2014-07-03 |
| Antenna Apparatus and Method App 20140168014 - Chih; Lai Wei ; et al. | 2014-06-19 |
| Embedding Low-K Materials in Antennas App 20140152509 - Liu; Monsen ; et al. | 2014-06-05 |
| Integrated Transmitter And Receiver Front End Module, Transceiver, And Related Method App 20140128009 - YEH; En-Hsiang ; et al. | 2014-05-08 |
| Inductor With Conductive Trace App 20140111273 - Jou; Chewn-Pu ; et al. | 2014-04-24 |
| Novel Bead For 2.5d/3d Chip Packaging Application App 20130320553 - KUO; Feng Wei ; et al. | 2013-12-05 |
| EMI Package AND METHOD FOR MAKING SAME App 20130082364 - Wang; Chuei-Tang ; et al. | 2013-04-04 |
| Miniaturized multi-chip module and method for manufacturing the same Grant 7,312,518 - Liao , et al. December 25, 2 | 2007-12-25 |
| Miniaturized multi-chip module and method for manufacturing the same App 20060249838 - Liao; Kuo-Hsien ; et al. | 2006-11-09 |
| Planar inverted-F antenna Grant 7,106,259 - Tseng , et al. September 12, 2 | 2006-09-12 |
| Planar inverted-F antenna App 20060038722 - Tseng; Kuo-Hua ; et al. | 2006-02-23 |
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