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Patent applications and USPTO patent grants for WANG; Chengfei.The latest application filed is for "filling device and apparatus, electrochemical deposition system and filling method".
Patent | Date |
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Filling Device And Apparatus, Electrochemical Deposition System And Filling Method App 20220290321 - ZHANG; Guocai ;   et al. | 2022-09-15 |
Carrier Liquid Leakage Preventing Device And Electrochemical Deposition Apparatus App 20220170174 - WANG; Chengfei ;   et al. | 2022-06-02 |
Substrate Transfer Device App 20220168888 - WANG; Chengfei ;   et al. | 2022-06-02 |
Electrochemical Deposition Apparatus Set And Electrochemical Deposition Method App 20220170152 - YUAN; Guangcai ;   et al. | 2022-06-02 |
Substrate Carrier And Electrochemical Deposition System App 20220170173 - DONG; Shihao ;   et al. | 2022-06-02 |
Gas-solid Separation Structure, Feeding Device And Electrochemical Deposition Apparatus App 20220097010 - SUN; Shaodong ;   et al. | 2022-03-31 |
Debris Cleaning Device And Electroplating System App 20220098752 - YUAN; Guangcai ;   et al. | 2022-03-31 |
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