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WANG; Chengfei Patent Filings

WANG; Chengfei

Patent Applications and Registrations

Patent applications and USPTO patent grants for WANG; Chengfei.The latest application filed is for "filling device and apparatus, electrochemical deposition system and filling method".

Company Profile
2.0.7
  • WANG; Chengfei - Beijing CN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Filling Device And Apparatus, Electrochemical Deposition System And Filling Method
App 20220290321 - ZHANG; Guocai ;   et al.
2022-09-15
Carrier Liquid Leakage Preventing Device And Electrochemical Deposition Apparatus
App 20220170174 - WANG; Chengfei ;   et al.
2022-06-02
Substrate Transfer Device
App 20220168888 - WANG; Chengfei ;   et al.
2022-06-02
Electrochemical Deposition Apparatus Set And Electrochemical Deposition Method
App 20220170152 - YUAN; Guangcai ;   et al.
2022-06-02
Substrate Carrier And Electrochemical Deposition System
App 20220170173 - DONG; Shihao ;   et al.
2022-06-02
Gas-solid Separation Structure, Feeding Device And Electrochemical Deposition Apparatus
App 20220097010 - SUN; Shaodong ;   et al.
2022-03-31
Debris Cleaning Device And Electroplating System
App 20220098752 - YUAN; Guangcai ;   et al.
2022-03-31

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