Wang; Chen-Jong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wang; Chen-Jong.The latest application filed is for "device crack-stop structure to prevent damage due to dicing crack".

Company Profile

24.84.65

Wang; Chen-Jong - Hsin-Chu TW
Wang; Chen-Jong - Hsinchu County TW
Wang; Chen-Jong - Hsinchu TW
Wang; Chen-Jong - Bao-Shan TW
Wang; Chen-Jong - Hsinchu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Device Crack-stop Structure To Prevent Damage Due To Dicing Crack App 20220246549 - Wu; Tung-Ting ; et al.	2022-08-04
High Density Image Sensor App 20220216262 - Takahashi; Seiji ; et al.	2022-07-07
Device crack-stop structure to prevent damage due to dicing crack Grant 11,348,881 - Wu , et al. May 31, 2	2022-05-31
High density image sensor Grant 11,309,348 - Takahashi , et al. April 19, 2	2022-04-19
Semiconductor arrangement with capacitor and method of fabricating the same Grant 11,222,896 - Hsu , et al. January 11, 2	2022-01-11
High density MIM capacitor structure Grant 11,139,367 - Takahashi , et al. October 5, 2	2021-10-05
Semiconductor Imaging Device Having Improved Dark Current Performance App 20210280620 - Takahashi; Seiji ; et al.	2021-09-09
Semiconductor Arrangement With Capacitor App 20210272964 - Hsu; Chern-Yow ; et al.	2021-09-02
Implant damage free image sensor and method of the same Grant 11,063,080 - Kalnitsky , et al. July 13, 2	2021-07-13
Semiconductor arrangement having capacitor separated from active region Grant 11,037,932 - Hsu , et al. June 15, 2	2021-06-15
Semiconductor arrangement with capacitor Grant 11,011,524 - Hsu , et al. May 18, 2	2021-05-18
Semiconductor imaging device having improved dark current performance Grant 11,004,880 - Takahashi , et al. May 11, 2	2021-05-11
Device Crack-stop Structure To Prevent Damage Due To Dicing Crack App 20210098392 - Wu; Tung-Ting ; et al.	2021-04-01
High Density Image Sensor App 20210074758 - Takahashi; Seiji ; et al.	2021-03-11
Semiconductor Image Sensor App 20210020670 - CHOU; KENG-YU ; et al.	2021-01-21
Semiconductor Imaging Device Having Improved Dark Current Performance App 20210005649 - Takahashi; Seiji ; et al.	2021-01-07
Capacitor and method for making same Grant 10,847,606 - Tu , et al. November 24, 2	2020-11-24
Semiconductor image sensor Grant 10,797,096 - Chou , et al. October 6, 2	2020-10-06
Semiconductor imaging device having improved dark current performance Grant 10,797,091 - Takahashi , et al. October 6, 2	2020-10-06
Implant Damage Free Image Sensor And Method Of The Same App 20200303431 - KALNITSKY; ALEXANDER ; et al.	2020-09-24
Implant damage free image sensor and method of the same Grant 10,692,914 - Kalnitsky , et al.	2020-06-23
High Density Mim Capacitor Structure App 20200135844 - Takahashi; Seiji ; et al.	2020-04-30
Semiconductor Image Sensor App 20200111822 - Chou; Keng-Yu ; et al.	2020-04-09
Semiconductor Arrangement With Capacitor And Method Of Fabricating The Same App 20200075600 - HSU; Chern-Yow ; et al.	2020-03-05
Semiconductor image sensor Grant 10,510,788 - Chou , et al. Dec	2019-12-17
Semiconductor arrangement with capacitor and method of fabricating the same Grant 10,504,904 - Hsu , et al. Dec	2019-12-10
Semiconductor Imaging Device Having Improved Dark Current Performance App 20190371838 - Takahashi; Seiji ; et al.	2019-12-05
Semiconductor Arrangement Having Capacitor Separated From Active Region App 20190252389 - HSU; Chern-Yow ; et al.	2019-08-15
Implant Damage Free Image Sensor And Method Of The Same App 20190139999 - KALNITSKY; ALEXANDER ; et al.	2019-05-09
Semiconductor Image Sensor App 20190131327 - CHOU; KENG-YU ; et al.	2019-05-02
Semiconductor arrangement having capacitor separated from active region Grant 10,269,807 - Hsu , et al.	2019-04-23
Image sensor with reduced optical path Grant 10,269,858 - Ting , et al.	2019-04-23
Capacitor and Method for Making Same App 20190096985 - Tu; Kuo-Chi ; et al.	2019-03-28
Implant damage free image sensor and method of the same Grant 10,177,187 - Kalnitsky , et al. J	2019-01-08
Capacitor and method for making same Grant 10,157,976 - Tu , et al. Dec	2018-12-18
Semiconductor Arrangement With Capacitor App 20180315760 - HSU; Chern-Yow ; et al.	2018-11-01
Image Sensor With Reduced Optical Path App 20180197911 - TING; Shyh-Fann ; et al.	2018-07-12
Semiconductor arrangement with capacitor Grant 10,008,506 - Hsu , et al. June 26, 2	2018-06-26
Semiconductor arrangement with capacitor Grant 9,978,754 - Hsu , et al. May 22, 2	2018-05-22
Hybrid bonding mechanisms for semiconductor wafers Grant 9,960,129 - Liu , et al. May 1, 2	2018-05-01
Semiconductor Arrangement Having Capacitor Separated From Active Region App 20180102368 - HSU; Chern-Yow ; et al.	2018-04-12
Semiconductor Arrangement With Capacitor And Method Of Fabricating The Same App 20180090500 - HSU; Chern-Yow ; et al.	2018-03-29
Image sensor with reduced optical path Grant 9,917,130 - Ting , et al. March 13, 2	2018-03-13
Voltage biased metal shielding and deep trench isolation for backside illuminated (BSI) image sensors Grant 9,871,070 - Hsu , et al. January 16, 2	2018-01-16
Color filter array and micro-lens structure for imaging system Grant 9,853,082 - Chen , et al. December 26, 2	2017-12-26
Semiconductor arrangement with capacitor and method of fabricating the same Grant 9,825,040 - Hsu , et al. November 21, 2	2017-11-21
Method for forming deep trench spacing isolation for CMOS image sensors Grant 9,805,970 - Yang , et al. October 31, 2	2017-10-31
Air trench in packages incorporating hybrid bonding Grant 9,786,628 - Chou , et al. October 10, 2	2017-10-10
Voltage Biased Metal Shielding And Deep Trench Isolation For Backside Illuminated (bsi) Image Sensors App 20170229494 - Hsu; Tzu-Hsuan ; et al.	2017-08-10
Semiconductor Arrangement With Capacitor App 20170133384 - Hsu; Chern-Yow ; et al.	2017-05-11
Capacitor and Method for Making Same App 20170133452 - Tu; Kuo-Chi ; et al.	2017-05-11
Deep Trench Spacing Isolation For Complementary Metal-oxide-semiconductor (cmos) Image Sensors App 20170084646 - Yang; Tai-I ; et al.	2017-03-23
Semiconductor Arrangement With Capacitor App 20170077104 - Hsu; Chern-Yow ; et al.	2017-03-16
Air Trench in Packages Incorporating Hybrid Bonding App 20170069593 - Chou; Bruce C.S. ; et al.	2017-03-09
Deep trench spacing isolation for complementary metal-oxide-semiconductor (CMOS) image sensors Grant 9,559,134 - Yang , et al. January 31, 2	2017-01-31
Capacitor and method for making same Grant 9,553,095 - Tu , et al. January 24, 2	2017-01-24
Semiconductor arrangement with capacitor Grant 9,553,096 - Hsu , et al. January 24, 2	2017-01-24
Image Sensor With Reduced Optical Path App 20160358970 - Ting; Shyh-Fann ; et al.	2016-12-08
Implant Damage Free Image Sensor And Method Of The Same App 20160351604 - KALNITSKY; ALEXANDER ; et al.	2016-12-01
Semiconductor arrangment with capacitor Grant 9,508,722 - Hsu , et al. November 29, 2	2016-11-29
Air trench in packages incorporating hybrid bonding Grant 9,502,396 - Chou , et al. November 22, 2	2016-11-22
Air trench in packages incorporating hybrid bonding Grant 9,443,796 - Chou , et al. September 13, 2	2016-09-13
Color Filter Array And Micro-lens Structure For Imaging System App 20160247854 - Chen; Szu-Ying ; et al.	2016-08-25
Image sensor with reduced optical path Grant 9,425,228 - Ting , et al. August 23, 2	2016-08-23
Metal-insulator-metal capacitor with current leakage protection Grant 9,425,247 - Wang , et al. August 23, 2	2016-08-23
Decoupling MIM capacitor designs for interposers and methods of manufacture thereof Grant 9,401,395 - Tzeng , et al. July 26, 2	2016-07-26
Deep Trench Spacing Isolation For Complementary Metal-oxide-semiconductor (cmos) Image Sensors App 20160163749 - Yang; Tai-I ; et al.	2016-06-09
Air Trench in Packages Incorporating Hybrid Bonding App 20160163684 - Chou; Bruce C.S. ; et al.	2016-06-09
Decoupling MIM Capacitor Designs for Interposers and Methods of Manufacture Thereof App 20160155700 - Tzeng; Kuo-Chyuan ; et al.	2016-06-02
Metal-Insulator-Metal Capacitor with Current Leakage Protection App 20160071920 - Wang; Chen-Jong ; et al.	2016-03-10
Metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layers Grant 9,269,762 - Tzeng , et al. February 23, 2	2016-02-23
Decoupling MIM capacitor designs for interposers and methods of manufacture thereof Grant 9,263,415 - Tzeng , et al. February 16, 2	2016-02-16
Decoupling MIM capacitor designs for interposers and methods of manufacture thereof Grant 9,257,409 - Tzeng , et al. February 9, 2	2016-02-09
Hybrid Bonding Mechanisms For Semiconductor Wafers App 20150357296 - LIU; Ping-Yin ; et al.	2015-12-10
Metal-insulator-metal capacitor with current leakage protection Grant 9,178,008 - Chen , et al. November 3, 2	2015-11-03
Hybrid bonding mechanisms for semiconductor wafers Grant 9,142,517 - Liu , et al. September 22, 2	2015-09-22
Semiconductor Arrangement With Capacitor And Method Of Fabricating The Same App 20150187777 - Hsu; Chern-Yow ; et al.	2015-07-02
Metal-Insulator-Metal (MIM) Capacitor Within Topmost Thick Inter-Metal Dielectric Layers App 20150187866 - Tzeng; Kuo-Chyuan ; et al.	2015-07-02
Image Sensor With Reduced Optical Path App 20150155322 - Ting; Shyh-Fann ; et al.	2015-06-04
Semiconductor Arrangement With Capacitor App 20150145101 - Hsu; Chern-Yow ; et al.	2015-05-28
Semiconductor Arrangment With Capacitor App 20150145100 - Hsu; Chern-Yow ; et al.	2015-05-28
Color Filter Array and Micro-Lens Structure for Imaging System App 20150137296 - Chen; Szu-Ying ; et al.	2015-05-21
1T MIM memory for embedded RAM application in soc Grant 9,012,967 - Lin , et al. April 21, 2	2015-04-21
Method of fabricating metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layers Grant 8,993,405 - Tzeng , et al. March 31, 2	2015-03-31
Metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layers Grant 8,994,146 - Tzeng , et al. March 31, 2	2015-03-31
Air Trench in Packages Incorporating Hybrid Bonding App 20140264948 - Chou; Bruce C.S. ; et al.	2014-09-18
Decoupling MIM Capacitor Designs for Interposers and Methods of Manufacture Thereof App 20140235019 - Tzeng; Kuo-Chyuan ; et al.	2014-08-21
Decoupling MIM Capacitor Designs for Interposers and Methods of Manufacture Thereof App 20140217549 - Tzeng; Kuo-Chyuan ; et al.	2014-08-07
Method Of Fabricating Metal-insulator-metal (mim) Capacitor Within Topmost Thick Inter-metal Dielectric Layers App 20140191364 - Tzeng; Kuo-Chyuan ; et al.	2014-07-10
Method Of Fabricating Metal-insulator-metal (mim) Capacitor Within Topmost Thick Inter-metal Dielectric Layers App 20140193961 - Tzeng; Kuo-Chyuan ; et al.	2014-07-10
Method of manufacturing decoupling MIM capacitor designs for interposers Grant 8,748,284 - Tzeng , et al. June 10, 2	2014-06-10
Method of fabricating metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layers Grant 8,716,100 - Tzeng , et al. May 6, 2	2014-05-06
Hybrid Bonding Mechanisms For Semiconductor Wafers App 20140117546 - LIU; Ping-Yin ; et al.	2014-05-01
Capacitor and Method for Making Same App 20140091426 - Tu; Kuo-Chi ; et al.	2014-04-03
Semiconductor devices with orientation-free decoupling capacitors and methods of manufacture thereof Grant 8,659,121 - Tu , et al. February 25, 2	2014-02-25
Metal-Insulator-Metal Capacitor and Method of Fabricating App 20140042590 - Chen; Kuo-Ji ; et al.	2014-02-13
Capacitor and method for making same Grant 8,617,949 - Tu , et al. December 31, 2	2013-12-31
Metal-Insulator-Metal Capacitor and Method of Fabricating App 20130043560 - Tzeng; Kuo-Chyuan ; et al.	2013-02-21
Decoupling MIM Capacitor Designs for Interposers and Methods of Manufacture Thereof App 20130037910 - Tzeng; Kuo-Chyuan ; et al.	2013-02-14
Semiconductor Devices with Orientation-Free Decoupling Capacitors and Methods of Manufacture Thereof App 20130020678 - Tu; Kuo-Chi ; et al.	2013-01-24
1t Mim Memory For Embedded Ram Application In Soc App 20120139022 - Lin; Yi-Ching ; et al.	2012-06-07
Capacitor and Method for Making Same App 20120091559 - Tu; Kuo-Chi ; et al.	2012-04-19
1T MIM memory for embedded ram application in soc Grant 8,148,223 - Lin , et al. April 3, 2	2012-04-03
Integrating a DRAM with an SRAM having butted contacts and resulting devices App 20080116496 - Tzeng; Kuo-Chyuan ; et al.	2008-05-22
1T MIM memory for embedded ram application in soc App 20070267674 - Lin; Yi-Ching ; et al.	2007-11-22
MIM capacitor structure and method of manufacture Grant 7,282,757 - Tu , et al. October 16, 2	2007-10-16
Dual poly layer and method of manufacture Grant 7,208,369 - Pai , et al. April 24, 2	2007-04-24
MIM capacitor structure and method of manufacture App 20050082586 - Tu, Kuo-Chi ; et al.	2005-04-21
Dual poly layer and method of manufacture App 20050056885 - Pai, Chih-Yang ; et al.	2005-03-17
Single transistor random access memory (1T-RAM) cell with dual threshold voltages Grant 6,670,664 - Tzeng , et al. December 30, 2	2003-12-30
Microelectronic capacitor structure embedded within microelectronic isolation region Grant 6,661,049 - Tzeng , et al. December 9, 2	2003-12-09
Memory cell structure with trench capacitor and method for fabrication thereof Grant 6,661,050 - Tzeng , et al. December 9, 2	2003-12-09
Method of forming a composite spacer to eliminate polysilicon stringers between elements in a pseudo SRAM cell Grant 6,638,813 - Tzeng , et al. October 28, 2	2003-10-28
Memory Cell Structure With Trench Capacitor And Method For Fabrication Thereof App 20030178661 - Tzeng, Kuo-Chyuan ; et al.	2003-09-25
Method to integrate high performance 1T ram in a CMOS process using asymmetric structure Grant 6,620,679 - Tzeng , et al. September 16, 2	2003-09-16
Approach for forming a buried stack capacitor structure featuring reduced polysilicon stringers Grant 6,613,690 - Chang , et al. September 2, 2	2003-09-02
Method and structure for stacked DRAM capacitors and FETs for embedded DRAM circuits Grant 6,538,287 - Wang , et al. March 25, 2	2003-03-25
Microelectronic capacitor structure embedded within microelectronic isolation region App 20030042519 - Tzeng, Kuo-Chyuan ; et al.	2003-03-06
Method of defining a buried stack capacitor structure for a one transistor RAM cell Grant 6,420,226 - Chen , et al. July 16, 2	2002-07-16
Novel method and structure for stacked DRAM capacitors and FETs for embedded DRAM circuits App 20020068401 - Wang, Chen-Jong ; et al.	2002-06-06
Method to define poly dog-bone for word line strapping contact at stitch area in embedded DRAM process Grant 6,376,294 - Tzeng , et al. April 23, 2	2002-04-23
Method to reduce contact hole aspect ratio for embedded DRAM arrays and logic devices, via the use of a tungsten bit line structure Grant 6,271,125 - Yoo , et al. August 7, 2	2001-08-07
Mixed mode process for embedded dram devices Grant 6,242,300 - Wang June 5, 2	2001-06-05
Isolation dielectric deposition in multi-polysilicon chemical-mechanical polishing process Grant 6,218,286 - Su , et al. April 17, 2	2001-04-17
Common gate and salicide word line process for low cost embedded DRAM devices Grant 6,207,492 - Tzeng , et al. March 27, 2	2001-03-27
Method of reducing nitride and oxide peeling after planarization using an anneal Grant 6,025,279 - Chiang , et al. February 15, 2	2000-02-15
Multi-layer silicon nitride deposition method for forming low oxidation temperature thermally oxidized silicon nitride/silicon oxide (no) layer Grant 6,017,791 - Wang , et al. January 25, 2	2000-01-25
Method to increase DRAM capacitor via rough surface storage node plate Grant 6,004,857 - Hsiao , et al. December 21, 1	1999-12-21
Method for making low-topography buried capacitor by a two stage etching process and device made Grant 5,885,865 - Liang , et al. March 23, 1	1999-03-23
Method for increasing DRAM capacitance via use of a roughened surface bottom capacitor plate Grant 5,858,838 - Wang , et al. January 12, 1	1999-01-12
Method for fabricating a DRAM cell with a Y shaped storage capacitor Grant 5,759,888 - Wang , et al. June 2, 1	1998-06-02
Process to fabricate stacked capacitor DRAM and low power thin film transistor SRAM devices on a single semiconductor chip Grant 5,716,881 - Liang , et al. February 10, 1	1998-02-10
Method for fabricating a tub structured stacked capacitor for a DRAM cell having a central column Grant 5,702,989 - Wang , et al. December 30, 1	1997-12-30
One step smooth cylinder surface formation process in stacked cylindrical DRAM products Grant 5,668,038 - Huang , et al. September 16, 1	1997-09-16
Method for fabricating a dual-gate dielectric module for memory with embedded logic technology Grant 5,668,035 - Fang , et al. September 16, 1	1997-09-16
Method for forming buried plug contacts on semiconductor integrated circuits Grant 5,607,879 - Wuu , et al. March 4, 1	1997-03-04
Method for fabricating a DRAM cell with a T shaped storage capacitor Grant 5,607,874 - Wang , et al. March 4, 1	1997-03-04
High resistance polysilicon resistor for integrated circuits and method of fabrication thereof Grant 5,587,696 - Su , et al. December 24, 1	1996-12-24
Process for forming stacked contacts and metal contacts on static random access memory having thin film transistors Grant 5,547,892 - Wuu , et al. August 20, 1	1996-08-20

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